Group/Presentation Title

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Working with Digital and RF can be as easy as ABC

Convergence of RF & Digital

Technologies

Presented by:

Mohit KhannaR&D Operating Manager

Agilent Technologies

Convergence of RF & Digital Technologies 

Abstract:

With the rapid development of mixed signal technology to fulfill ever growing need to make

newer electronics gadgets smarter, smaller & cheaper throws out a unique challenges for

designers as these technologies pose interesting and often contradictory challenges.

As a recognized market & innovation leader in RF & Mixed Signal Simulation space alongwith

state-of-the-art T&M, Agilent Technologies provides competitive & technological edge to

designers/developers working in ever challenging environment to be successful. During the

course of presentation we shall provide insights on latest design & development challenges with

tools & techniques to be successful.

Presenter’s Profile

Mohit is B.Tech in Electronics and Telecommunication from Allahabad University and M.Tech from IT- BHU in RF. Previous to working in Agilent, Mohit worked with ISRO as Scientist for six years. For last 6 years, Mohit is working with Agilent Technologies. Currently Mohit is working as Operating Manager looking into Software Testing & Quality Assurance of Agilent EEsof software products.

He can be reached at mohit_khanna@agilent.com

What’s the Story?The Digital and the RF World are MERGING

It’s a REALITY: A standalone working Baseband and a standalone working RF front-end does not GAURANTEE a working system!

4

Digital RF

Baseband Designer RF Designer

Challenges for System Designer“Cross the A/D Converter Divide”

(1) Requires both Digital and RF Knowledge to understand the complete “picture”

5

(2) Needs a tool to perform Baseband/RF co-simulation. Design paths has to remain in contact throughout the design process. Continuous cross-verification allows aggressive RF/Baseband partitioning, and reduced design margins with lower project risk.

Digital

RF

Fear Factor“Crossing the A/D Convertor Divide” System engineer

who are RF trained need to learn the digital way

System engineer who are Digital trained need to understand the RF world

6

RF Digital

How do we ensure integration goes smoothly?Baseband and RF Cross verification is a MUST!

Digital

RF

Communication Link where Agilent tools have role to play

PHY ArchitectureResearch Analysis

PartitioningVerification

Instrument Links

MIMO/ChannelFading

JammingNoise

InterferenceArrays/Steering

Baseband DSP Modeling Algorithms

Code-GenerationFixed Point/HDL

Verification

RF SystemArchitecture

Behavioral/NoiseX-parameters

Links from ADS/GG

PHY Reference IPWireless Standards

InteroperabilityVirtual H/W

Coded Test VectorsEDA/Test integration

Overcoming System Design Challenges

Using a Mixed Signal System Design tool which allows Digital/DSP as well as RF system modeling allows designers to partition their designs more accurately

This analysis also allows to mitigate the initial RF + Digital/DSP integration challenges and performance optimization

Mixed Signal PCB Challenges:Higher integration, higher complexity, smaller size

Dig

ital

Syn

the

size

rRF

F

ilte

rs

RF Osc

Digital Controller

RF

Co

nve

rte

r

RF

DigitalDigital

AnalogAnalog

RFRF

Agilent Spectrum Analyzer Mixed Technology RF PCB

More complex multilayer, multifunctional RF-high speed mixed signal boards

More mixed technology (RF, analog, digital) boards

Globally dispersed, isolated design team specialists

Continued pressure to meet an electronic company’s business needs:• Shorter design cycle times• Reduced development and end product costs• More competitive

products• Lower price points

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GPS

RF

S

wit

ch

Advanced Mobile Wireless IC Trends

Radio 2010 Next

Bands 7 >10

Mode Single Dual

Process 65/40nm 28nm

uP 2010 Next

CPU Single Multiple

GPU Tens Hundreds

Clock > 1GHz > 2 GHz

RAM PoP PoP/TSV

Process 45/40nm 28nm LHP

Cellular Radio/FEM

Apps Processor

WiFi+BT

BB 2010 Next

Core ARM9 ARM11, QMSM

Clock 300MHz 600MHz

RAM PoP TSV

Process 65/45/40nm 28nm LHP

Cellular Base Band

PA 2010 Next

Integration Module Si Carrier/3DIC

Process GaAs GaAs + CMOS

Passives 2010 Next

Type Discrete Integrated

Process SMT IPD/Interposer

Wireless Connectivity

2010 Next

Integration WiFi+BT+FM +GPS+NFC

Process 65/40nm 28nm

802.11ad/15.3c Radio-90/65nm Radio + BB65/40/32nm

Higher Levels of Integration, More “Radios”, Advanced Technology

Growth for RFIC Segment

12

Wireless Design ComplexityRadio design challenges associated with increased complexity:• Trend is complex signaling which requires a more complete verification flow:

• Analysis of full RX/TX functional path with “real” signals• System Design and Circuit Realization May Be Misaligned

• Cost is a Verification Bottleneck• Trend is for More Bands and Higher Frequencies:

• Broadband Millimeter Wave ICs are Being Designed in CMOS!• Trend is toward most advanced process technologies for RF

• RF Design Enablement is essential for success• New yield effects require additional verification before tapeout

• Advanced technologies are driving new packaging alternatives

LTE TX Signal

UpconvertedInterferer

LTE RX Band

How Agilent can help?Agilent EEsof Software Solutions….

SystemVue

GoldenGate

ADS

EMPro

Genesys

IC-CAP

DeviceModeling

RFIC MMICRF SiP / Hybrid

RFBoard

SignalIntegrity

CommsESL

Perform Early Verification using Combination of H/W and S/W LTE FDD UL Throughput Test (TS 36.141), or BER/BLER

Filter X

~

Filter A/D 1 2 3 4

DUGainDPDFilterX

~

A/D

RU DU

CPRI

Signal Generator

Signal Analyzer

SystemVue – Generates signal, then closes the loop

VSA 89600 waveform recordingSystemVue – LTE decode

Customer Hardware eNodeB receiver

STEP 1

STEP 2

SystemVue closed a loop to help measure LTE throughput

APP NOTE 5990-6202EN

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Resources:

1. Agilent Website: www.agilent.com2. Agilent EEsof: www.eesof.com3. Agilent EEsof Channel on You Tube: www.youtube.com/user/AgilentEEsof

Thank YouQ&A Session