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GS-401-01A GSM Platform

GSM® PlatformGSM1 single beam (4681A)

GSM2 dual beam (4688A)

Universal Part Number: GS-401-01AReference Configuration: GSM1 - #47576101, 47576102;

GSM2 - #47576501, 47576502 Issued 1/01

GS-401-01AGSM Platform


GSM® Platform

Places the complete range of SMT components, using vision centering.

Features one or two placement heads mounted on an overhead, gantry positioning system.

Includes a user-friendly, graphical interface complete with on-line component database,CAD translation, and machine performance simulator.

Machine Highlights


Contents

Introduction ................................................................................................................ 1Functional Description ............................................................................................... 1Standard Features ...................................................................................................... 2

Base Frame ..................................................................................................... 2Positioning System ......................................................................................... 2Staged Board Handling .................................................................................... 2Vision On-the-Fly ............................................................................................. 2Nozzle Changing ............................................................................................. 2Fiducial Inspection .......................................................................................... 3Multi-Pattern Find ............................................................................................ 3Basic Network Kit ............................................................................................ 3Machine Control System Architecture ............................................................. 3Inspection Cameras ......................................................................................... 3

Universal Platform Software (UPS) ........................................................................ 4Off Line PC Requirements ......................................................................................... 5Optional Features ....................................................................................................... 6

Component Shuttle .......................................................................................... 6Gripper Nozzles ............................................................................................... 6Feeders ........................................................................................................... 6Feeder Bank Changing .................................................................................... 7Feeder Setup Cart ........................................................................................... 7Feeder Storage Cart ........................................................................................ 7Removable Feeder Bank Storage Table .......................................................... 7

Board Handling ....................................................................................................... 8Applied Conveyor Engineering™ Conveyors ................................................... 8Board Support .................................................................................................. 8Dual Lane Board Handling ............................................................................... 8Dual SMEMA................................................................................................... 8

Heads..................................................................................................................... 9Archimedes Metering Valve (GSM1 only) ........................................................ 9Positive Displacement Pump (GSM1 only) ...................................................... 9UFP300+ Head (GSM1 only) ......................................................................... 10FlexJet Head ................................................................................................. 10Flex Head ...................................................................................................... 10High Force Head ............................................................................................ 10

Vision/Inspection ................................................................................................. 11Front and Back Lighting ................................................................................. 11Circular Lighting Camera................................................................................ 11Odd Form Camera ......................................................................................... 11On-Axis Lighting Camera ............................................................................... 12

Coplanarity ........................................................................................................... 13Coplanarity Specifications .................................................................................... 14Software Tools ..................................................................................................... 15

Bar Code Product Changeover ...................................................................... 15GEM .............................................................................................................. 15Platform Setup Validation (PSV) ................................................................... 15Automatic Platform Line Balancer ................................................................. 15Remote Diagnostics ...................................................................................... 15

Electrical/Power Options ...................................................................................... 16Transformer ................................................................................................... 16Uninterruptible Power Supply ......................................................................... 16

Reject Stations .................................................................................................... 17


Contents

Component Reject Station for components up to 50.8mm square: ................ 17Advanced Surface Mount and Semiconductor Assembly Options ....................... 17

Supporting Documents ............................................................................................ 18Positioning System Specifications ....................................................................... 18Global and Local Fiducial Shapes and Dimensions .............................................. 19Overall Fiducial and Bad Mark Sense Recommendations ................................... 19Board Specifications ............................................................................................ 19Board Clearance................................................................................................... 19Board Handling ..................................................................................................... 20Rear Rail Position Location .................................................................................. 20

GSM Footprints ........................................................................................................ 21Installation Considerations ................................................................................... 23

Machine Dimensions: GSM1 ......................................................................... 23Machine Dimensions: GSM2 ......................................................................... 23

Appendix A: GSM Platform Feeders .................................................................... A-25Platform Tray Feeder (PTF), Model 4559A ........................................................... A-25

Introduction ....................................................................................................... A-25Functional Description ....................................................................................... A-26Optional Feature................................................................................................ A-27

Pre-Orient Head .......................................................................................... A-27Configurations ................................................................................................... A-28Standard Features............................................................................................. A-30

Pallets ........................................................................................................ A-30Tray Transport ............................................................................................ A-30Transfer Shuttle .......................................................................................... A-30

Technical Specifications ................................................................................... A-31Supporting Documents ...................................................................................... A-35

Stackable Matrix Tray Feeder, Model 4556A ........................................................ A-36Introduction ....................................................................................................... A-36Standard Features............................................................................................. A-36Functional Description ....................................................................................... A-36

Multi-Pitch Tape Feeders, Model 4697A ............................................................... A-38Introduction ....................................................................................................... A-38Machine Concept .............................................................................................. A-38Standard Features............................................................................................. A-38Functional Description ....................................................................................... A-39Supporting Documents ...................................................................................... A-39Technical Specifications ................................................................................... A-40Pocket Depth and Length Limitations ............................................................... A-42

Pneumatic Tape Feeders, Model 4695A ............................................................... A-43Introduction ....................................................................................................... A-43Machine Concept .............................................................................................. A-43Standard Features............................................................................................. A-43Functional Description ....................................................................................... A-44Supporting Documents ...................................................................................... A-44Technical Specifications for Pneumatic Tape Feeders ..................................... A-45

Track Feeder, Model 4696A ................................................................................... A-47Introduction ....................................................................................................... A-47Machine Concept .............................................................................................. A-47Standard Features............................................................................................. A-47

Track Assembly ......................................................................................... A-47Feeder Base Assembly .............................................................................. A-47


Contents

Functional Description ....................................................................................... A-48Stationary Matrix Tray Platform, Model 4649A .................................................... A-49

Introduction ....................................................................................................... A-49Functional Description ....................................................................................... A-49

Multi-Tube Feeders, Model 4698A ........................................................................ A-50Introduction ....................................................................................................... A-50Standard Features............................................................................................. A-50Functional Description ....................................................................................... A-51

Bulk Track Feeder, Model 4702A .......................................................................... A-52Introduction ....................................................................................................... A-52Machine Concept .............................................................................................. A-52Standard Features............................................................................................. A-52Functional Description ....................................................................................... A-53Component Specifications ................................................................................ A-53Technical Specifications ................................................................................... A-53

Appendix B: Placement Heads ............................................................................. B-55FlexJet Head ..................................................................................................... B-56Flex Head and High Force Head ....................................................................... B-57UFP300+ Head ................................................................................................. B-59Dispense Heads (GSM1 only) ........................................................................... B-60Dispensing Nozzle Tooling Configurations ........................................................ B-61

Appendix C: Cameras ............................................................................................ C-63Technical Specifications ................................................................................... C-63

Appendix D: Board Handling ................................................................................ D-65Dual Lane Board Handling ................................................................................. D-65Technical Specifications .................................................................................... D-66

Appendix E: Odd Form Assembly Capabilities ................................................... E-67Introduction ....................................................................................................... E-67Applications ...................................................................................................... E-67Components ...................................................................................................... E-68Component Tolerances ..................................................................................... E-69High Force Head ............................................................................................... E-69UFP 300+ Head (GSM1 only) ........................................................................... E-69Speed................................................................................................................ E-70Vision ................................................................................................................ E-70Feeders ............................................................................................................. E-70Cameras ........................................................................................................... E-70Passive Clinch Option ....................................................................................... E-70

Appendix F: GSM Platform Traceability .............................................................. F-71Bar Code Changeover Option ............................................................................... F-71

Introduction ....................................................................................................... F-71Restrictions/Limitations ..................................................................................... F-71Barcode Types .................................................................................................. F-72

Platform Setup Validation (PSV) Option .............................................................. F-73Introduction ....................................................................................................... F-73PSV Specifications ........................................................................................... F-73


All specifications are subject to periodic review and may be changed withoutnotice. Illustrations may not be drawn to scale.

© Universal Instruments Corporation, 2000. All rights reserved.

Universal, the circle "U", the Universal logo, GSM platform and Applied ConveyorEngineering are registered trademarks for products and services of UniversalInstruments Corporation. GSM1, GSM2, and FlexJet are trademarks forproducts of Universal Instruments Corporation.

Ethernet is a trademark of Xerox Corporation. Intel is a trademark of IntelCorporation. OS/2 is a registered trademark of International Business MachinesCorporation.

Acronym/Term MeaningAC Alternating Current: type of electrical power generationAPE Advanced Product Editor (Universal brand name)ASCII American National Standard Code for Information InterchangeAWG American Wire Gauge: wire size standardBEC Board Error Correction (Universal brand name)BHS Board Handling System: means of transporting PCBsCAD Computer-Aided DesignCD-ROM Compact Disc-Read Only MemoryCE Conformité Europeanne: European safety standardCFM Cubic Feet per Minute: measurement of air flowCPH Components per HourCTA Component Transfer AssemblyDC Direct Current: type of electrical power generationERV Expanded Range Component Verifier (Universal brand name)GEM Generic Equipment ModelGS General Specification (Universal brand name)GUI Graphical User InterfaceHSMS High Speed SECS Message Service: implements SECS2 messaging over a network linkHz Hertz (cycles per second): measurement of electrical frequencyI/O Input/OutputIP Index of Protection: resistance of machine to contamination by foreign objectsLED Light Emitting Diode: electrical componentM I T Machine Interface Translator (VME to I/O bus)MMIT Mini Machine Interface Translator (VME to I/O bus)OS/2® Operating System 2 (IBM Corp. brand name)PAC Positive Axis ControlP.C. Personal ComputerPCB (or PC board) Printed Circuit BoardPPM Parts Per Million: measurement of machine performanceSCFM Standard Cubic Feet per Minute: measurement of air flowSECS Semiconductor Equipment Communications Standard: interface between host computer and

assembly machinesSEMI Semiconductor Equipment & Materials InternationalSMC Surface Mount ComponentsSMEMA Surface Mount Equipment Manufacturers AssociationTCP/IP Transfer Control Protocol/Internet Protocol: network communication protocolUICS Universal Instruments Control Software (Universal brand name)UPS Universal Platform Software (Universal brand name)VA Volt-Amps: measurement of electrical power consumptionVAC Volts Alternating CurrentVDC Volts Direct CurrentVGA Video Graphics Array: type of CRT monitor standardVME® Versa Module Eurocard (Motorola brand name): industry standard for 32-bit computer bus

Glossary of Acronyms and Specialized Terms

GS-401-01A

Introduction

Universal's GSM® platform is a flexible placement system thathandles a wide range of surface mount and odd form compo-nents, as well as a variety of dispensing applications. It is amember of the Universal Instruments family of integrated assem-bly solutions.

In consideration of essential health and safety requirements, theGSM platform is CE-marked. Select the ECC Closeout Kit.

Functional Description

For the single-beam GSM platform (GSM1), components aretypically picked from various feeder locations, vision inspectedon-the-fly, and placed on the board. See Technical Specificationsfor details on the configuration options currently available.

For the dual-beam GSM platform (GSM2), the head on eachbeam picks components from various feeder locations. The firsthead, mounted on the inside of the rear beam, has access tofeeders located on the rear feeder bank; the second head ismounted on the inside of the front beam and has access to com-ponents located on the front feeder bank. The components arevision inspected on-the-fly, and placed on the board. While onehead is placing components, the other head is picking compo-nents. See Technical Specifications for details on the configura-tion options currently available.

GS-401-01A

Base Frame

Vision On-the-Fly

For components up to 32mm square (1.25"), the GSM platformperforms vision inspection on-the-fly. The GSM platform canpick components and pass over an upward-looking (P2P®, Part-to-Pad-Matching) camera at 20" per second. While the headpasses over the camera, the vision system captures componentimages. The head then places the components at the vision-ad-justed coordinates.

For components that do not fit into a single field of view, the headstops over an upward-looking camera, then captures multiplefields of view to acquire the entire component image.

Nozzle Changing

Programmed nozzle changes accommodate components of vari-ous sizes and with different vacuum requirements.

Staged Board Handling

Standard FeaturesBase Frame

The frame is designed to minimize tolerance accumulation fromsubassembly to subassembly. All major subassemblies are edge-justified and dowel-pin registered to precision-milled, datum sur-faces machined into the base frame. This ensures that the posi-tional relationships are held mechanically, not through adjustment.

Positioning System

The overhead, gantry-style system utilizes one or two X-axisbeams and linear scale encoders. The drive system usesbrushless, DC servo motors for optimum acceleration and decel-eration.

Staged Board Handling

While one board is being populated, the next board is bufferedwithin the lane. Board handling features automatic width controlbased on programmed board parameters. Board transfer capabili-ties include left-to-right, pass through, and right-to-left. Mechani-cal board stops are standard and accommodate unique boardshapes.

GS-401-01A

Machine Control System Architecture

• Intel® Pentium-based embedded P.C. (64 MB RAM), with onboard Ethernet controller

• 2 GB useable partition

• Motorola 68030-based machine controller

• Motorola 68000 series-based motion controllers

• 8X CD-ROM drive

Inspection Cameras

The GSM platform supports two upward-looking cameras, one inthe front feeder area and one in the rear. Two cameras reducethe travel distance to the camera and allow the GSM platform toefficiently handle a greater range of components.

Refer to Appendix C for information on selecting the appropri-ate cameras.

Component Shape

Patterns

Fiducial Inspection

Fiducials register the board in the machine and compensate forlinear board distortions (stretch, shrink and non-orthogonality).Local fiducials are used to measure local board distortion. Thedownward-looking (P.E.C., pattern error correction) fiducial in-spection camera is mounted under the beam. The field of viewfor this camera is approximately 12.7mm x 9.53mm (0.50" x0.375") and can also utilize a Bad Mark Sense feature (program-mable in the Product Editor).

See Technical Specifications section for more information aboutfiducials and the Bad Mark Sense feature.

Multi-Pattern Find

This vision tool expands the ability of the GSM platform to findand orient components for placement. It uses pattern recognitionto center components. The patterns, in decreasing order of accu-racy, are circle, square, Swiss cross, diamond, and corner. Threepatterns toward the extremities of the component are recom-mended.

GS-401-01A

Universal Platform Software (UPS)

Basic features of Universal Platform Software:• Graphical Windows-style multi-tasking IBM OS/2

operating system.• Configurable user interface with icons and machine

status messages.• Graphical pattern programming tools.• Networkable component and nozzle databases.• User configurable optimization aid.• Comprehensive data import/export.• Powerful query tools.• Programmable feeder templates.• On-the-fly vision inspection, using cutting-edge ESI™

vision engine technology.• Enhanced product set-up, simplifying component and

board programming by teaching images.• Powerful diagnostic and manual axis control tools.• Process management data collection and reporting, to

monitor feeders and nozzles.• On-line documentation for programming, maintenance,

and set-up.

Enhancements to UPS 4.2• Tact time control expands component range.• Mixed heads, with common database for FlexJet and

Flex heads.• Pitch inspection and all-ball count for ball grid array

components.• Management data includes detection and reporting of

pick and vision inspection performance.• Ceramic nozzle support.• Software installation and upgrade improvements.• GSM Platform can measure its own accuracy and

repeatability data and provide statistical informationback through the user interface.

• On-Axis lighting camera support.

UPS offers a Windows-style look and feel for all GSM-based applications. It is a powerful software tool combiningspecific customer requests with previous developments andnumerous software enhancements, as well as new func-tional and operational improvements.

GS-401-01A

Off-Line PC Requirements

Minimum Recommended

Pentium® -based system Pentium® I I I 500MHz

32 MB RAM 64 MB RAM

200 MB Free HD SpaceWarp 3.0 operat ing system

6.4 GB HD\500 MB Free IBMOS/2 Warp Connect 4.0

GS-401-01A

Component Shuttle

Optional FeaturesComponent Shuttle

The shuttle increases total available feeder slots to 116 from thestandard 64 available slots. It provides 64 slots, while using 12slots on the base machine for mounting, for a net gain of 52feeder slots. The component shuttle is installed on the left rearcorner of the base machine.

A second shuttle can be mounted in the front of the GSM plat-form, adding a net of 52 more slots to provide a total of 168 avail-able feeder slots.

In addition to increased feeder capacity, throughput may increaseby providing multiple components for gang-picking by the four-spindle placement head.

Components Used on the Component Shuttle1

All chips, except 0201, 0402 and 0603

All SOT

All SOIC

All SOJ

Up to and including 84 pin PLCC

Tape fed TSOP

Tape fed QFP up to 31.8mm (1.25")

No MELFs1 See Technical Specifications for GSM platform component range.

Gripper Nozzles

Gripper tooling is used for components with no flat surface forvacuum picking. Ribbon cable connectors, inter-board headers,and potting forms are examples of the components handled bythis tooling. The gripping action is accomplished using the samevacuum and air kiss as the standard nozzle tips. An adjustablegripper nozzle is also available to handle various componentwidths. The gripper tooling is compatible with optional nozzlechangers. Each application requires specific tooling.

Contact a Universal Sales Engineer for evaluation of your appli-cation.

Feeders

Feeder options include bulk feeders, tape feeders, track feeders,multi-tube feeders, and matrix tray feeders.

Refer to Appendix A for detailed information.

Gripper Nozzles

GS-401-01A

Feeder InputNumber of Feeder Slots Used

(Total Available = 64)

Multi-Pitch and Pneumatic 8mm & 12 mm 1 1 slotTape Feeders 16mm, 24 mm, 32mm 1 2 slots

44 mm 1 3 slots56mm 1 4 slots72mm 2 5 slots88mm 2 6 slots104mm 2 6 slots120mm 2 7 slots

Track Feeder 1 3 slots

Multi-Tube Feeder (MTF) 40mm 1 2 slots50mm 1 3 slots

Platform Tray Feeder (PTF) 8 slots

Stackable Matrix Tray 8, 9 or 12 slots

Stationary Matrix Tray Feeder 8 or 9 slots

Odd Form Feeders 2-8 slots

Component Reject Station 3 slots

Coplanarity Test Station 2 slots

Component Shuttle 12 slots1 Can be mounted on the Component Shuttle, component

restrictions apply.2 Not compatible with the Component Shuttle due to a change in pick

point.

Feeder Storage Cart

Feeder BankStorage Table

Feeder Setup Cart

This cart reduces production delays associated with feeder replen-ishment since feeders are easily prepared for use off-line. IncreasesGSM platform utilization by allowing off-line feeder setup on theCE-compliant feeder setup cart.

Feeder Storage Cart

This cart reduces product changeover delays and improves work-place appearance by storing idle 8mm tape feeders in one conve-nient location. Each cart holds up to 132 feeders.

Removable Feeder Bank Storage Table

The table provides off-line storage setup for two removablefeeder banks, with or without feeders.

Feeder Bank Changing

A rolling cart reduces changeover time by swapping 16 feedersat one time by one operator. It is configured with the requiredfeeder bank for the base machine or the component shuttle. Eachis provided with 2 styles of handles, “shopping cart” and “luge.”Feeder Bank Changing

(with “luge” style handles)

GS-401-01A

Dual SMEMA

Universal’s latest board handling software development, DualSMEMA, is designed to enhance dual lane board handling flex-ibility and control. With Dual SMEMA, you can choose theboard handling features that best meet your production needs.

Conveyors transport the board between individual machineswithin a system.

While one board is being populated, another board is bufferedwithin an alternate lane. After a board is populated, processingimmediately begins on the alternate lane’s board. This actionminimizes board transfer time.

See Appendix D for detailed information on Dual Lane BoardHandling.

Board Support

This equipment minimizes the effects of board warp, sag, and/orflex by supporting the board during component placement. Theboard support uses a grid pattern containing removable pins.

Dual Lane Board Handling

Dual Lane BoardHandling

Board Handling

Applied Conveyor Engineering™Conveyors

Ace Conveyors

GS-401-01A

Archimedes Metering Valve (GSM1 only)

The Archimedes Metering Valve (AMV) features direct drivetechnology, which effectively eliminates uneven clutch applicationtimes resulting in dot diameter variations. The AMV is based onrotary screw technology, offering precise control that enablesmultiple dot sizes with one spindle. It is the ideal choice for sol-der paste and silver filled epoxies and other particle suspensions.

The AMV offers excellent flexibility in dot size and materialrange, and is the perfect choice for high mix, high changeoverproduction lines where constant dot adjustments are occurring.

ArchimedesMetering Valve

(GSM1 only)

The single dispense head uses four independently controlledpumps, each fed by its own syringe to accurately dispense mate-rial onto the board. Positive displacement pumps ensure highquality, repeatable dots in a variety of ambient conditions. Astandard nozzle selection dispenses for 0603 to 50mm squareICs.

To change dot volume, adjust the length of the pump stroke, in-crease the number of pump strokes per site, or use an alternatenozzle selection. Pumps and syringe holder assemblies arequickly removed for easy maintenance, at a programmable loca-tion. Dispensing head processing requires a board support tomaintain the integrity of the adhesive dot.

• A compliant Z axis and board support combine to mini-mize the effects of board warpage, sag, and/or flex duringdispensing.

• Low Material Sense warns the operator of a low materiallevel while still dispensing a preprogrammed number of dotsonto the board.

PositiveDisplacementPump Head(GSM1 only)

Positive Displacement Pump (GSM1 only)

Heads

GS-401-01A

UFP300+ Head (GSM1 only)

The UFP 300+ Placement Head assembly is the machine’s op-tional ultra-fine pitch placement head. It is a single spindle headcomprised of two major subassemblies: The Theta-Module as-sembly, and the Z-axis assembly. The spindle accepts a varietyof different nozzles, allowing pick-up and transport of variouscomponent sizes and types. It is capable of accurately placingcomponents with up-to or more-than 300 leads and at rotationalincrements as small as 0.001°. The single-spindle UFP (UltraFine Pitch) Head can be mounted to achieve insertion force up to10,000 grams.

UFP300+ Head(GSM1 only)

Flex Head (GSM1 and/or GSM2)

This general purpose 4-spindle head has 40mm spacing betweeneach spindle. It offers added flexibility by placing odd form aswell as most standard surface mount components.

High Force Head (GSM1 and/or GSM2)

The High Force Head assembly is the component pick-up andplacement mechanism, with required enhancements to accommo-date C4 or odd form type components. It is a four spindle headwith each spindle having vertical and rotational movement capa-bility. The spindles are driven in the vertical direction by a singleZ-axis motor (with each spindle individually clutched) for compo-nent pick-up and placement. Each spindle accepts a variety ofdifferent nozzles, allowing pick-up and transport of various com-ponent sizes and types.

FlexJetHead

Flex Head

High Force Head

FlexJet® Head (GSM1 and/or GSM2)

This general purpose 7-spindle head, with 20mm spacing be-tween each spindle and on-the-head camera, handles the broad-est range of surface mount components. It offers the best mixof flexibility and speed for most surface mount applications.

GS-401-01A

Vision/Inspection

Front and Back Lighting

The GSM platform comes standard with front and back lightingfor component inspection. For front lighting, the inner LEDbanks are strobed as the vision system captures the front imageof the component. For back lighting, the back light towers strobethe two outer LED banks, illuminating the special back lightingnozzle.

The vision system captures the silhouette of the component.Back lighting is recommended for components with highly-reflec-tive component leads, and any component that does not imagewell. It cannot be used with components that require multiplefields of view.

Circular Lighting Camera

This camera provides a 360° low angle lighting scheme for opti-mal illumination of component features, such as PLCC socketleads, BGA bumps, and standard through hole leads. Circularlighting applications should be reviewed by the GSM ApplicationEngineering Group due to the following issues:

• Elimination of component back lighting capability.

• Elimination of 2 feeder slots, 1 on either side of the camera.

Circular LightingCamera

Odd Form Camera

This camera offers vision-assisted placement of odd form andlight electromechanical assembly components. Available in astandard magnification of four mils/pixel, it employs a special“cone” cover. The cone helps direct the light in such a way thatthe ends of the leads of odd form components can be seen. Thecone opening is only 1-1/8" wide.

See Appendix E for detailed information on Odd Form Assem-bly Capabilities.

GS-401-01A

On-Axis Lighting Cameras

On-Axis Lighting (OAL) upward-looking cameras build upon thecapabilities of existing front and circular lighting cameras by in-corporating illumination and software specifically designed to en-hance the imaging of highly specular packages, such as CCGAs(Ceramic Column Grid Arrays) and palladium-leaded compo-nents.

From a hardware standpoint, the new OAL cameras provide on-axis illumination to obtain crisp images. From a software stand-point, three (3) enhancements aid in processing CCGA compo-nents:

• Missing Column Inspection: inspects various area-arraypackages for missing columns.

• Pitch Inspection: verifies the distances between componentcolumns or bumps.

• “Sweet Spot” Lighting: provides maximum illumination ofthe component area being inspected.On-Axis Lighting Camera

GS-401-01A

4 Mil Pass/Fail Criteria

7.8

98.5

0102030405060708090

100

1 2 3 4 5 6

Height of Lead Number 105 in mils

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Detector

Motion

Laser

Coplanarity

The coplanarity assembly is a screening tool for compromisedcomponents, not a metrology tool for component lead measure-ment or incoming inspection.

The coplanarity option measures the deviation of all leads of agiven gull-wing surface mount component, with or withoutbumpers, lying within the same plane. Leads that are coplanarwithin a small tolerance produce fewer defects when massreflow soldered. If a component fails any specified inspection,the component will be rejected into the appropriate reject station.

The laser lead locator (LLL) sensor uses four separate laserbeams to inspect each lead to determine its respective position inthe Z-axis. These positions are used to determine the colinearityand/or the coplanarity of the component leads. The module oc-cupies two feeder positions and is typically installed in the frontleft feeder bank or the rear right feeder bank, adjacent to the up-ward-looking camera station. A front-installed module requires afront-mounted head. Likewise, a rear-installed module requires arear-mounted head.

• The performance model is based on a 208-pin QFP with allleads coplanar except lead number 105, which is set abovethe plane defined by the remaining leads. The model assumes a four mil pass/fail criteria for coplanarity. Varyingthe height of lead number 105 yields the results shown inthe graph.

• This model indicates that components above the pass/failcriteria are rejected with high confidence.

• Verified performance repeatability [(one σ) <0.6 mils] ismeasured utilizing a precision machined 208-pin QFP glassslug.

GS-401-01A

Coplanarity Specifications

Component Types 2 & 4 sided gull wing lead configurations withbilateral symmetry and evenly spaced leads

Feeder Slots A coplanarity test station consumes 2 feederslots

Component Size Minimum 3.50mm (0.138")1 + 1/2(tip to tip) nozzle diameter

Maximum 50.8mm (2.00")

Lead Pitch Minimum 0.30mm (0.012")Maximum 1.27mm (0.050")

Lead Width Minimum 0.15mm (0.006")Maximum 0.76mm (0.030")

Lead Count 1 to 250 per side (maximum 1000 leads total)

Lead Length 0.0635mm (0.25") [Minimum for component(body to tip thickness < 4.57mm (0.180")]after form) 2.23mm (0.88") [Minimum for component

thickness > 4.57mm (0.180")]

Foot Length Minimum 0.38mm (0.015")Component Maximum 6.35mm (0.250")Thickness

Coplanarity 1 side up to a 208-pin QFP (52 leads): 0.578Inspection Time seconds(sensor time only) 4 sides up to 208-pin QFP (208 leads): 2.312

seconds

Throughput (12) 208-pin QFPs (2 on the head)(including camera with Coplanarity enabled, no error: 64.00and travel time) seconds

with Coplanarity disabled, no error: 21.23seconds

Scan Inset 0.20mm (0.008") from programmed componenttip to tip dimension

1Components must comply with JEDEC registered outlines. Vision lead inspection tolerance values should be programmed to meet JEDEC tolerance specifications.

GS-401-01A

Bar Code Product Changeover

The Bar Code Product Changeover option allows for seamlessproduct changeover without requiring the user to manually loadthe product data or press the start button.

See Appendix F for more information about Bar Code ProductChangeover.

Software Tools

The Generic Equipment Model (GEM) software license providesa set of communication, data collection, command, and controltools for GSM platforms. Based on the Semiconductor Equip-ment and Materials International standard, SEMI E30-93, thissoftware opens the system architecture for integration into fac-tory data collection and automation systems.

Platform Setup Validation (PSV)

This feature ensures correct component-to-feeder slot relation-ship for tape feeders with an integrated bar code validation pro-cess, which provides component level tracking through a historyfile.

See Appendix F for more information on PSV.

Automatic Platform Line Balancer

This off-line software tool automatically or manually balancesproduction time across a line consisting of up to 10 GSM plat-forms, thereby reducing the product build cycle and simplifyingproduct setup processes.

Remote Diagnostics

Remote diagnostics allows Universal support personnel to view aUPS (Universal Platform Software) screen from company head-quarters in Binghamton, New York, USA. This feature providesan enhanced level of technical support and decreases trouble-shooting cycle times for GSM platforms.

GEM

GS-401-01A

Transformer

This item allows for the conversion of input power sources to themachine requirements.

Uninterruptible Power Supply

This feature ensures precisely controlled, continuous power to theGSM platform for at least 10 minutes after losing the mainpower.

Electrical/Power Options

GS-401-01A

Conveyor: Two modes of operation move rejectedcomponents away from the GSM platform placement head:

• Programmable indexing cycles components until the sensor is interrupted, stopping the machine.

• The belt moves continuously, moving components off the end.

Vibratory Reject: Components are moved away from the GSMplatform placement head for manual removal.

Matrix Tray: The stationary matrix tray feeder can beused as a reject matrix for valuable components.

Advanced Surface Mount andSemiconductor Assembly Options

Universal’s GSM platform meets the accuracy requirements nec-essary for the placement of area array components and somesemiconductor assembly applications.

Because these processes often require an advanced level ofcomponent and application process engineering, the hardware/software package of each GSM platform purchased for or up-graded to use in area array and semiconductor applications mustbe evaluated by Universal Instruments.

For more information on GSM platform area array and semicon-ductor assembly capabilities, please consult your Universal SalesEngineer.

Reject Stations

Component Reject Stationfor components up to 50.8mm square:(GSM2 requires 2 stations—front and rear)

GS-401-01A

Supporting DocumentsAppendix A GSM Platform FeedersAppendix B Placement HeadsAppendix C CamerasAppendix D Board HandlingAppendix E Odd Form AssembliesAppendix F GSM Platform TraceabilitySMEMA Surface Mount Equipment Manufacturers

Association

Positioning System SpecificationsX Axis Travel 727.46mm (28.640")

Y Axis Travel 1073.15mm (42.250")

Resolution 0.0025mm (0.0001")(2.5 micron scale)

GS-401-01A

D1

D2

D1

D2

D1

D2

D1

D1

D2

D1

Global and Local Fiducial Shapes and DimensionsShape D1 D2Disc Min=0.762mm (0.030") —

Max=6.35mm (0.250")

Swiss Min=1.02mm (0.040") Min=0.508mm (0.020" )Cross Max=6.35mm (0.250") Max=5.84mm(0.230")

Rectangle Min=0.762mm (0.030") Min=0.762mm (0.030"(Square) Max=6.35mm (0.250") Max=6.35mm (0.250")

Double Min=0.762mm (0.030") Min=1.02mm (0.040" )Box Max=6.35mm (0.250") Max=6.35mm (0.250")Left orRight

Diamond Min=1.27mm (0.050") —Max=4.45mm (0.175")

Plus Min=0.762mm (0.030") Min=0.762mm (0.030")Max=N/A Max=N/A

Recommended Fiducial and Bad Mark SenseUniversal recommends that a minimum of three global fiducials beused for boards assembled on the GSM platform—two to six fiducialsdepending on the process. Although the GSM platform handles arange of fiducial types, the most reliable fiducial recommendationsfollow:

Shape Disc (solid, filled circle)

Size Minimum -- 1.00mm (0.040")Maximum -- 3.00mm (0.118")

Tolerance 0.025mm (0.001")

Clearance The fiducial clearance area must be at least twotimes the diameter of the fiducial

Material Bare copper or copper covered with either clearanti-oxidation coating, nickel plating, tin plating,or hot air leveled solder coating.

Flatness The fiducial surface should be flat within0.015mm (0.0006" )

Mask Solder resist coatings should not cover a fiducialmark or its clearance area.

GS-401-01A

Board SpecificationsMinimum Maximum1

Length 50.8mm (2.00") 584.2mm (23.00")

Width 50.8mm (2.00")2 508.0mm (20.00")3

Thickness 0.508mm (0.020") 5.08mm (0.200")

Weight — 2.72 kg (6 pounds)4

Allowable Warp For board transfer: 5.537mm (0.218") minusboard thickness

For placement: 0.75% of board length(as per IPC-2221), notto exceed 3.175mm(0.125") total

1 The GSM platform has populated boards up to 25" x 20". Consult aUniversal Sales Engineer for details.

2 The component reject bin must be relocated and mechanical board stopsmust be removed.

Board ClearanceTop Side Clearance 12.7mm (0.500")

3 A maximum board width of 457.2mm (18.00") includes nozzle changersmounted between the rear feeder plate and the staged board handlingsystem.

4 Represents the sum of all board weights within the GSM platform boardhandling system.

Note: For other sizes, consult a Universal Sales Engineer

Bottom Side See illustrationClearance

Board HandlingMinimum Maximum

Transfer Height 899mm (35.4") 965.2mm (38.00")

Transfer Time 0.0 sec1 2.5 sec2

1 With Staged Board Handling.2 With Dual Lane Board Handling.

25.4mm (1.0")

12.7mm (0.5")clearance underboard

Fixed front railRear rail P.C. boardsection

P.C. boardrails

component

com

pone

nt

25.4mm (1.0")clearance underboard Edge Clearance Standard: 5mm (0.195"), ±0.4mm (0.02")

toleranceOptional: 3mm (0.117"), ±0.4mm (0.02")tolerance

Rear Rail Position LocationThere are currently two mounting positions for the rear feeder baseplate on a GSM1 and three on the GSM2 to optimize throughput.

• The outbound position maximizes board width at 457mm (18").

• The inbound position mounts the rear feeder base plate closer tothe center of the GSM1. This position reduces the board widthallowed, and also the head travel between the feeder pick pointsand the circuit board being populated. Reduced travel optimizesdistance and time, increasing throughput.

Rear Feeder Bank Position Maximum Board Width

Outbound 457mm (18.00")

127mm (5") inbound 330mm (13.00")

216mm (8.5") inbound 305mm (12.00") (GSM2 only)

GS-401-01A

GSM1 shown with Component Shuttle, Platform Tray Feeder,Tape Feeders, and Board Flow Conveyor

GSM Footprints: GSM1

D

Board flow

GSM1

559mm

(22")

Belt

1676mm(66.0")

P

E

857.3mm(33.75")

254mm(10.0")

Rear beam

Rear feeder bank

Front feeder bank

Nozzles

Pneumatic Connection

Electrical Connection

"D" varies with feeder type: Up to 406mm (16") for tape feeders

PE

686mm(27")

152mm(6")

2540mm(100")

P

E

(70.0")

1041mm(41.0")

D

Feeders

(63.35")

2305mm(90.75")

Component Shuttle

914mm (36") PTFConveyor

PlatformTray Feeder(PTF)

76mm(3.0")

1778mm

1609mm

2184mm(86")

GS-401-01A

GSM2 shown with Component Shuttle, Platform Tray Feeder,Tape Feeders, and Board Flow Conveyor

D

Board flow

GSM2

559mm

(22")

Belt

1676mm(66.0")

P

E

857.3mm(33.75")

254mm(10.0")

Rear beam

Front beam

Rear feeder bank

Front feeder bank

Nozzles

914mm(36") PTFConveyor


76mm(3.0")

1778mm(70.0")

1041mm(41.0")

D

Feeders

1609mm(63.35")

2305mm(90.75")

Component Shuttle

2540mm (100")



"D" varies with feeder type: Up to 406mm (16") for tape feeders

PE

686mm(27")

152mm(6")

P

E

(Beam 1)

(Beam 2)

2184mm (86")

GSM Footprints: GSM2

GS-401-01A

Installation Considerations

Machine Dimensions: GSM1Length1 Depth Height 2 Weight

GSM1 Base 1676mm 2184mm 2540mm 2614kgMachine (66") (86") (100") (5762 lbs)

Domestic 1905mm 2591mm 1854mm 2772kgShipping (75") (102") (73") (6112 lbs)

Air Freight 1930mm 2616mm 1854mm 2986kg(76") (103") (73") (6582 lbs)

Sea Freight 1930mm 2616mm 1854mm 3056kg(76") (103") (73") (6738 lbs)

Component 2305mm 1041mm 1473mm 953 kgShuttle (90") (41") (58") (2100 lbs)

Air Freight 2767mm 1245mm 1803mm 1112 kg(109") (49") (71") (2450 lbs)

Sea Freight 2767mm 1245mm 1803mm 1112 kg(109") (49") (71") (2450 lbs)

Floor Space A minimum clear area of one meter (three feet)around the machine perimeter is recommended formachine operation and servicing.

1 Length is in the direction of board flow.2 Machine light tower and monitor shipped separately.

Machine Dimensions: GSM2Length1 Depth Height 2 Weight

GSM2 Base 1676mm 2184mm 2540mm 2795kgMachine (66") (86") (100") (6162 lbs)

Domestic 1905mm 2591mm 1854mm 2954kgShipping (75") (102") (73") (6512 lbs)

Air Freight 1930mm 2616mm 1854mm 3167kg(76") (103") (73") (6982 lbs)

Sea Freight 1930mm 2616mm 1854mm 3238kg(76") (103") (73") (7138 lbs)

Component 2305mm 1041mm 1473mm 953 kgShuttle (90") (41") (58") (2100 lbs)

Air Freight 2767mm 1245mm 1803mm 1112 kg(109") (49") (71") (2450 lbs)

Sea Freight 2767mm 1245mm 1803mm 1112 kg(109") (49") (71") (2450 lbs)


1 Length is in the direction of board flow.2 Machine light tower and monitor shipped separately.

GSM Platform Pad LocationsOverhead View

8x 4.640"Overall Pad Diameter

45.98mm(1.81")

38.1mm(1.5")

608mm(23.94")

1014.5mm(39.94")

1500mm(59.06")

GS-401-01A

Service RequirementsElectrical 230 VAC, nominal

Frequency 50 or 60 Hz (49-51 or 59-61 Hz).Frequency must be stated at time of order.

Phases 3

Number of 4 (three phase lines and ground)Wires

Service Service must be grounded DeltaConfiguration

Branch Circuit 30 ampsSize

Distortion <10% total harmonic distortion

Average Power 5000 watts

Electrical 76.2mm (3") from frontConnection 686mm (27") from floor

Pneumatics (clean air)

Air flow requiredto base machine1

GSM1 212.4 liters/minute @6.21 bar (7.5 cfm @90psi)GSM2 424.8 liters/minute @6.21 bar (15.0 cfm @90psi)

Clean Air Clean air is defined as: dew point must be 20°F.(11°C.) below ambient temperature; oil at0.08ppm at 82°F. (28°C.); input air filtered to 5microns particle size.

Pneumatic 254mm (10") from front,152.4mm (6") from floor.Connection Internal thread connenection is 9.65mm (3/8")

NPT and provided with the machine.Equipment is adequately protected againstingress of solid and liquid contaminants.

1 Air flow value is used to calculate the input air line which mightsupply several machines. The flow value is measured in litersper minute (liters/min) or cubic feet per minute (cfm).

Environmental RequirementsMinimum Maximum

Operating 4.4° C (40° F) 35° C (95° F)Temperature

Operating — 6° C/hourTemperature (10.8° F/hour)Change Tolerance

Storage -20° C (-4° F ) 65° C (149° F)Temperature

Operating Humidity 10% non-condensing 90% non-condensing

Operating Altitude — 2500 meters (8202 feet)

Noise level 70.5 dbA in accordance with National MachineToolbuilders Assoc. Noise MeasurementTechnique Standard — June 1986.

A - 25Appendix A: GSM Platform Feeders - GS-401-01A

Appendix A: GSM Platform Feeders

Platform Tray Feeder (PTF), Model 4559A

Introduction

Universal’s optional Platform Tray Feeder (PTF), Model 4559A,is a 58-input stackable matrix tray feeder for GSM platforms,which increases flexibility, improves line performance, and maxi-mizes throughput.

The PTF is flexible. It features 29 pallets, each configurable withup to two unique component types. Up to 58 different leaded andarea-array components can be fed to the GSM platform. If de-sired, one of the pallets can be defined for component purge orreject, reducing usable pallets to 28 x 56 inputs. While a singlePTF provides all these benefits, a second PTF expands flexibilityeven further. Beyond the additional 58 inputs gained from a sec-ond PTF, dual PTFs provide several modes of operation to matchproduction requirements.

The PTF is efficient. Rather than just one matrix tray at a time,the PTF can support stacks of matrix trays. This capability sig-nificantly reduces tray replenishment requirements and increasesthroughput. And, the unique side-mounting scheme of the PTFmaximizes floor space utilization without interfering with adjacentproduction lines. The PTF may be optionally configured topresent components at rotations of 0°, 90°, 180°, or 270° for pickby the GSM platform to increase machine throughput.

The PTF is fast. While many other matrix tray feeders wastetime by presenting the entire tray or just a couple of componentsto the pick and place head, the PTF can present up to 7 compo-nents to the GSM head. The independent PTF pick and placeaxes buffer components for the next cycle in the GSM platform.In parallel, the GSM platform gang picks components (simulta-neously picks multiple components) previously queued on thePTF transfer belt. The PTF features user programmable servo-controlled pallet and transfer belt motions to provide optimal com-ponent handling speed.

In consideration of essential health and safety requirements, thePTF is CE-marked.

Transfer Shuttleto GSM

Door to accesselevator and refillpallets with matrixtrays

Platform Tray Feeder (PTF)

PTF

PTF transfer shuttle

GSM

A - 26 GS-401-01A - Appendix A: GSM Platform Feeders


The primary function of the PTF is to provide components frommatrix trays for gang picking by the GSM platform. To accom-plish this, the component and matrix trays are defined using thefeeder and component databases in the Product Editor duringsetup.

There are 3 modes of operation applicable to dual PTFs:

Independent Mode allows the two PTFs configured on aGSM platform to act as two unique matrix tray feeders.This configuration provides 116 matrix tray inputs. For ex-ample Components 1-58 are fed by one PTF and Compo-nents 59-116 are fed by the second PTF. In this mode,neither PTFcan act as an alternate to the other; however,a GSM platform-mounted feeder can be an alternatefeeder to either PTF.

Backup Mode allows the two PTFs configured on a GSMplatform to serve as backup feeders to each other. Thebackup PTF will not deliver components unless the primaryPTF is out of a specific component or the primary PTF isin the load feeder state. Once the primary PTF is reloaded,the component will be accessed by the primary PTF. Forexample, Component A is depleted from the primary PTF,so the backup PTF supplies Component A until the primaryPTF is reloaded. Both primary and backup PTFs must beaccessible by the same beam. As with the IndependentMode, a GSM platform-mounted feeder can act as an al-ternate PTF feeder. The goal is to produce boards asquickly as possible, based on component availability. Thebackup PTF will maximize throughput.

Exchange Mode allows the two PTFs configured on aGSM platform to act as alternate feeders. In this mode,the primary and secondary PTFs switch when a singlecomponent is no longer available in the primary PTF. Forexample, once Component A is depleted in the PrimaryPTF, all components will be picked from the alternate PTF.Component A will continue to be picked from the alternatePTF until Component A is no longer available, then allcomponents will once again be picked from the primaryPTF. Both PTFs must be accessible by the same beam.This mode is suggested when the primary and secondaryPTF magazines are balanced.

Platform Tray Feeder (PTF)(reverse view)


After setup configuration, the operator loads matrix trays in thedefined pallets of the elevator using the feeder load procedure.During loading, matrix trays can be stacked to the top of the pal-let, and then the pallet is easily pushed into place in the magazineslot. When all pallets are loaded, the feeder door is closed andthe start button is pushed to begin operation.

During operation, the feeder uses multiple servo-controlled axesto accurately move matrix trays and components to the PTF andGSM platform pick points at user-defined transfer speeds. Thesoftware signals the servo-controlled tray transport to extend theselected pallet out of the magazine. While the pallet is extended,the servo-controlled feeder head assembly picks the componentfrom the matrix tray. For those opting to configure the PTF withthe optional theta head, a rotation of 0°, 90°, 180°, or 270° occursbefore the component is placed on the PTF Transfer Shuttle.Once a component is sensed, it is placed on the transfer shuttle.Up to 7 components are placed on the transfer belt and moved tothe GSM platform for gang pick.

As a matrix tray is emptied, the PTF head assembly automati-cally removes the matrix tray from the pallet to a customer-sup-plied tray bin. When an empty stack or pallet is determined byUPS, the corresponding LED illuminates, thus indicating whichpallet to address. The operator loads the pallet(s) as required,and returns the PTF to the run sequence without stopping theGSM platform.

Optional Features

Pre-Orient Head

The optional PTF Pre-Orient Head allows components to be ro-tated prior to transfer into the GSM platform. Each of the compo-nents picked by the PTF can be rotated 0°, 90°, 180°, or 270°based on the information held within the UPS Component Data-base. The PTF Pre-Orient Head increases throughput by elimi-nating time required for a GSM Placement Head to rotate com-ponents. With the PTF Pre-Orient Head, theta rotations are com-pleted before the GSM platform picks the component from thePTF Transfer Belt.

Pre-Orient Head

PTF Head


Configurations

PTF

RearRight

PTF

FrontLeft

PTF

FrontRight

PTF

FrontLeft

PTF

RearLeft

PTF

FrontRight

PTF

RearRight

PTF

RearLeft

FrontFront

FrontGSM1 only

FrontGSM1 only

Rear Rear

Rear Rear

Single PTF can bemounted as such:

Dual PTFs can bemounted as such:

Front Right (GSM1 only) Front Right and Front Left(GSM1 only)

Front Left Front Right and Rear Left(GSM1 only)

Rear Left Rear Right and Rear Left

Rear Right Front Left and Rear Right


PTF shown installed on GSM platform (GSM1 & 2)(platforms with side entrance holes)

Rear

Front

Available PTF Mounting Locations

GSM1

914mm (36")

PTF Conveyor

914mm (36")

PTF ConveyorBoard flow

P

E



PE





1676mm (66.0")

813mm (32")

356mm (14") GSM1419mm (16.5") GSM2

E

356mm (14") 356mm (14")

2540mm (100")

279mm (11")

610mm (24")

229mm (9")

876mm (34.5")

2553mm (100.5")

Installation in this location for the GSM1 only

GSM2

ApplicableGSM

Platform

PTFMountingLocation

GSMRear RailPosition

PTFTransferShuttle

Location

PTFTransferShuttle

Entrance

GSM1Max.

BoardWidth

GSM2Max.

BoardWidth

GSMFeederSlots

Consumed

GSM 1 Only Front Right Outbound Feeder Bank GSM Frame 457.2mm(18.0")

N/A 8

GSM 1/GSM 2 Rear Left Outbound Feeder Bank GSM Frame 457.2mm(18.0")

457.2mm(18.0")

8

GSM 1/GSM 2 Rear Left Outbound Nzle Changer Brd Handling 368.3mm(14.5")

419.1mm(16.5")

0

GSM 1/GSM 2 Rear Left Inbound Nzle Changer Brd Handling 241.3mm(9.5")

304.8mm(12.0")

0

GSM 1/GSM 2 Rear Left Inbound Feeder Bank GSM Frame 330.2mm(13.0")

368.3mm(14.5")

8

GSM 1 Only Front Right Inbound Feeder Bank GSM Frame 330.2mm(13.0")

N/A 8

GSM 2 Only Rear Left Dbl Inbound Feeder Bank Brd Handling N/A 304.8mm(12.0")

8

GSM 1/GSM 2 Front Left Outbound Feeder Bank GSM Frame 457.2mm(18.0")

457.2mm(18.0")

8

GSM 1/GSM 2 Rear Right Outbound Feeder Bank GSM Frame 457.2mm(18.0")

457.2mm(18.0")

8

GSM 1/GSM 2 Rear Right Outbound Nzle Changer Brd Handling 368.3mm(14.5")

419.1mm(16.5")

0

GSM 1/GSM 2 Rear Right Inbound Nzle Changer Brd Handling 241.3mm(9.5")

304.8mm(12.0")

0

GSM 1 Only Front Left Inbound Feeder Bank GSM Frame 330.2mm(13.0")

N/A 8

GSM 2 Only Front Left Dbl Inbound Feeder Bank GSM Frame N/A 304.8mm(12.0")

8

GSM 2 Only Rear Right Dbl Inbound Feeder Bank Brd Handling N/A 304.8mm(12.0"

8


The tray transport automates the pallet selection and matrix traydisposal through user-programmable transport speed. Softwaresignals the servo-controlled tray transport to move the selectedpallet out of the magazine. While the pallet is extended, thefeeder head assembly, also servo-controlled, picks the componentfrom the matrix tray and places it on the transfer shuttle moving itinto the GSM platform. When the matrix tray is empty, the feederhead assembly automatically removes the matrix tray from thepallet to a customer-supplied empty tray bin. If the user does notwant automatic disposal of empty matrix trays, the UPS can beconfigured to force manual removal.

Pallets

Small-, medium-, or large-depth pallets accommodate most of theleaded and area array components packaged in matrix trays. Pal-lets are selected separately or in a standard configuration, andhold one or two unique component IDs for up to a total of 58 ma-trix tray component IDs. The various depths of the pallets allowsmall to large stacks of matrix trays, optimizing production needs.The standard configuration includes five small pallets, three me-dium pallets, five large pallets, and one small purge pallet. An op-erator can load a stack of matrix trays within 20 seconds, andpallets easily slide into any one of the 29 magazine slots.

Tray Transport

Transfer Shuttle

The servo-controlled transfer shuttle moves components from thefeeder to the pick point of the GSM for placement through user-programmable transfer speed. Transfer time from one tray to thepick point is only six seconds. Transfer shuttle movement is par-allel to board transfer in the GSM platform.

Tray Transport

Transfer Shuttle Assembly

Medium Pallet with fullMatrix Trays

GSM

PTF

Components

Standard Features


Technical Specifications

ConfigurationGSM Software The PTF is controlled by Universal Platform

Software (UPS). The UPS processes diagnosticmessages, and optimization of one product.Included is a graphic interface for definingcomponents, matrix trays, magazine slots andfeeder configuration from the feeder andcomponent database.

Configuration The base platform has side entrance holes forinstalling the PTF transfer shuttle in the rightrear, left rear, and left front. The right frontinstallation is supported on the GSM1 only. ThePTF transfer shuttle can be mounted in otherlocations. Consult a Universal SalesEngineer.

A manual slide-width 914mm (36") PTFConveyor is supplied with the PTF.

Required 8 slots when installed in side entranceSlots holes.

Empty Tray Bin Use to collect empty matrix trays, customersupplied.

Component Pick and Transfer SpecificationsTact Time1 1.5 seconds per component

Transfer Time1 4 components from one tray: 6.25 seconds4 components from 4 adjacent pallets: 9 seconds

Shuttle Transfer 899mm to 965.2mm (35.4" to 38.00")Height1 Based on average moves across an entire matrix tray over variouspallet types.

Suggested configurationsfor a PTF installation on the

feeder bank of the GSM

Platform front

36" PTFConveyor

Board flow

PTF TransferShuttle

æ

GSM

Feeders

Platform front

Boardflow

PTF GSM

36" PTFConveyor

TransferShuttle

Feeders

æ

Platform front

22"Conveyor

Board flow

PTFæ

GSM

36" PTFConveyor

TransferShuttle

Feeders


ComponentsType Leaded and area array

Dimensions 6.4mm to 51mm (0.25" to 2.0") square, manualnozzle change may be required for a full rangeof component picking.

Thickness 1.0mm to 12.7mm (0.04" to 0.50"), flat andsmooth surface for vacuum retention.

Weight Up to 35 grams each.1

1 Heavier components up to 50 grams can be handled when pre-orient isdisabled.

Matrix TrayDimensions • 102mm x 102mm x 3mm (4" x 4" x 0.1"),

minimum• 330mm x 292mm x 12.7mm (13.0" x 11.5" x

0.5"), one component ID, or• 330mm x 140mm x 12.7mm (13.0" x 5.5" x

0.5") for one or two component IDs (twomatrix trays) in one pallet.

Height Height of trays and components cannot exceedthe top of the pallet.

Weight (Maximum) 300 grams maximum empty weight. Trays thatdo not meet IEC 286 standards can be manuallyremoved.

Pick Area, Empty Tray vacuum pick-up method requires aminimum-walled pick up area that allowsvacuum retention and therefore removal of anempty matrix tray. Reference IEC specificationsfor requirements. [Based on IEC specification,minimum 28mm x 28mm (1.1" x 1.1") walled-offarea. IEC specification does not specify amaximum walled-off. Platform Tray FeederREQUIRES a maximum 45mm x 70mm (1.75" x2.75") walled-off area.]*

*An optional tray removal kit, for larger pocket areas up to 50mm x88mm (2.00" x 3.50") walled-off area, is available.


PalletsSmall Medium Large

(Type 1) (Type 2) (Type 4)

Pallet Depth 12.7mm (0.50") 26.7mm (1.05") 64.8mm (2.55")

Pallet Capacity

Number of stacks 1 or 2 1 or 2 1 or 2

Number of trays 2 4 10per stack1

Magazine slots 1 2 4required per pallet

Load Time 20 to 30 seconds to load a stack of trays andclamp each stack flush with the palletleading edge.

Pallet Weight (Full) 7.26 kg (16 lbs.), maximum combinedweight of pallet and full matrix trays.

Pallet Weight (Empty) Large 3.18 kg (7 lbs.)Medium 2.61 kg (5.75 lbs.)Small 2.18 kg (4.8 lbs.)Purge 2.18 kg. (4.8 lbs.)

1 Based on IEC thin tray specification of 6.35mm (0.25"). If thicker traysare used, the stack height will be less. Stack height cannot exceed thetop of the pallet (including components). See “Pallet Depth,” above.

MagazineMagazine Capacity 29 pallet slots

Standard magazine package includes 5small, 3 medium, and 5 large pallets, plusone purge pallet. A large pallet is placed inthe bottom magazine slot to accommodatethis pallet mix.

Capacity 61.3 kg (135 pounds), including pallets,matrix trays, and components. See examplebelow:

Loaded Elevator Example — Standard Pallet Configuration

5 large (type 4) pallets x 3.18 kg (7 lbs.) = 15.88 kg (35 lbs.)3 medium (type 2) pallets x 2.61 kg (5.75 lbs.) = 7.82 kg (17.25 lbs.)

5 small (type 1) pallets x 2.18 kg (4.8 lbs.) = 10.89 kg (24 lbs.)1 purge pallet x 2.18 kg (4.8 lbs.) = 2.18 kg (4.8 lbs.)

Total = 36.74 kg (81 lbs.)

Total Weight (incl. pallets, parts, and trays) = 61.23 kg (135 lbs.)– Standard Pallet Configuration = 36.74 kg (81 lbs.)

Component/Tray Weight = 24.49 kg (54 lbs.)

Optional Payload Kit

2 magazine slots

Full matrix traysPartially full matrix trays

Medium size pallet

Component ID #1 Component ID #2

1 magazine slot

Small size pallet

Partially full matrix trays


4 magazine slots

Full matrix traysPartially full matrix trays

Large size pallet

Full matrix traysFull matrix trays


Total Weight (incl. pallets, parts, and trays) = 90.70 kg (200 lbs.)– Standard Pallet Configuration = 36.74 kg (81 lbs.)

Component/Tray Weight = 53.96 kg (119 lbs.)


Installation ConsiderationsLength 1 Depth Height Weight

Overall 813mm 1524mm 1575mm 524 kg(32") (60") (62") (1155 lbs.)

Domestic 1067mm 1753mm 1702mm 568 kgShipping (42") (69") (67") (1250 lbs.)

Air Freight 1092mm 1753mm 1753mm 615 kg(43") (69") (69") (1355 lbs.)

Sea Freight 1092mm 1753mm 1753mm 624 kg(43") (69") (69") (1375 lbs.)


1 Length is in the direction of board flow.

PTF Service RequirementsElectrical 230 VAC, provided by the GSM platform

250 Watts RMS400 Watts PeakElectrical interface is needed for existing GSMplatform installations. Consult a UniversalSales Engineer.

Pneumatic Provided by the GSM platform

Air Flow 17 liters/[email protected] bar (0.6 cfm@90 psi)

Vacuum Generated internally by PTF feeder

PTF Conveyor Service Requirements100 to 130 VAC, 50/60 Hz, 5 amperes200 to 260 VAC, 50/60 Hz, 5 amperes.Separate drop required.

Environmental RequirementsMinimum Maximum

Operating 4.4° C (40° F) 35° C (95° F)Temperature

Operating — 6° C/hourTemperature (10.8° F/hour)Change Tolerance

Storage -20° C (-4° F) 65° C (149° F)Temperature

Operating Humidity 10% non-condensing 90% non-condensing

Operating Altitude — 2500 meters (8202 feet)

Noise 70 dbA in accordance with National Machine


Supporting Documents

International Electrotechnical Commission (IEC) Standards,286-5, revision 1995-02 for Packaging of Components forAutomatic Handling

SMEMA Software/Communications Interface Standard 2.0


Stackable Matrix Tray Feeder

Stackable Matrix Tray Feeder, Model 4556A

IntroductionThe Stackable Matrix Tray Feeder, Model 4556A, moves astack of matrix trays all loaded with components of one partnumber to the pick position of the GSM platform. Empty traysare discarded. Vacuum pickup requires trays with a smooth sur-face and solid-backed pockets near the center of the tray.

Standard FeaturesThe simple, compact feeder will move up to a 95.25mm (3.75"),6.80kg (15.0 lbs.) stack of matrix trays to the pick position. Twosize feeders are available. For other than stated matrix traysizes, consult a Universal Sales Engineer.

• 6.1 Feeder: 135.9mm to 154.9mm (5.35" to 6.10") wide by266.7mm to 330.2mm (10.5" to 13") long matrix trays. Totalfeeder width: 177.8mm (7.00").

• 8.3 Feeder: 135.9mm to 212.9mm (5.35" to 8.38") wide by266.7mm to 330.2mm (10.5" to 13") matrix trays. Totalfeeder width: 238.0mm (9.37").

Functional DescriptionA stack of matrix trays is presented to the GSM platform forcomponent pickup. The GSM platform picks from the top tray.When the top tray is empty, the stack moves to the discard posi-tion. The empty tray is picked, uncovering the next full matrixtray. The remaining loaded stack returns to the pick area, whilethe empty tray is discarded, manually or automatically. A fullstack of matrix trays is manually loaded as needed.


Technical SpecificationsLength Width Height Weight

Overall 930mm 177.8mm- 800.2mm 22.7kg(36.62") 238.0mm (31.50") (50 lbs.)

(7"-9.37")

Elevator N/A N/A 412.8mm 15.9kg(16.25") (35 lbs.)

Electrical N/A N/A 387.4mm 6.8kgEnclosure (15.25") (15 lbs.)Assembly

Floor Clearance 356.6mm (14"), approximately

Altitude Up to 1000m above mean sea level

Ambient Air +5°C to +40°CTemperature Range

Average Ambient Not to exceed +35°C in 24 hours.Air TemperatureRange

Free Air Operating +5°C to +55°CTemperature

Average Free Air Not to exceed +50°C in 24 hours.OperatingTemperature

Humidity Range 30% to 95%, non-condensing.

Noise 65 dbA

Transportation -25°C to +55°C., up to +70°C. in 24 hoursand Storage Store in shipping carton, Universal # M00067900

or mounted on Feeder Cart Assembly,Universal # 45577701.

Required Feeder 6.1 Feeder: 9 feeder slotsPositions 8.3 Feeder: 12 feeder slots

Service Requirements

Electrical Power is provided by the Universal Platform.IEC-type connector, 120VAC, 50-60 Hz.,1.6 ampere. Voltage fluctuation, 10%.

Pneumatic Air is provided by the Universal Platform at84.95 liters/minute at 5.52 bar (3 cfm at 80 psi)with a 6.35mm (0.25") hose.

Vacuum Generated internal to the feeder.

Safety Bottom panel provided.

Moving 27.22 kgs (60 lbs.) pallet jack, and 15 minutes touncrate. To lift uncrated Feeder, disassembleand use lift points shown in illustration.


32mmEmbossed Carrier

16mmCarrier Tape

32mm Feeder

Multi-Pitch Tape Feeders, Model 4697A

Introduction

The Multi-Pitch Tape Feeder, Model 4697A, is available to pro-cess a wide range of embossed component tapes. Reel loaderfeeders can be kept ready for installation on the GSM platform.

Machine Concept

Each feeder is dedicated to a tape width with adjustable pitch se-lections, depending on desired tape pitch. The tape advancementis stepper motor driven, capable of forward and reverse tape ad-vancement control. Electrical connections are engaged when thefeeder is mounted to the GSM platform.

Standard Features

Feeder units are adjustable for pitch settings from 4mm - 44mm.Select a dedicated multi-pitch tape feeder based on tape width.

• 8mm (2mm - 8mm pitch)1


• 16mm (4mm - 20mm pitch)









1 Supports tape splicing. Requires Universal-supplied tools andmaterials.2 Larger pitch can be handled. Consult a Universal SalesEngneer.

Feeder design is based on EIA-481 standard. Embossed carriertapes, reels and components meeting the above standards areprocessed by these feeders. Reference Technical Specificationssection where limitations apply.

Multi-Pitch Tape Feeder


Handle

ComponentReel Holder

1

Latch 7Control Panel6

Mylar Cover TapeTake-Up Reel

4

Front Tape Chute32Tape Window

Component Pick UpPosition

4Tape Window Latch5

(7) The Latch locks and releases the feeder from the GSM plat-form.


EIA-481 Electronic Industries Association Standard - Taping ofSurface Mount Components for Automatic Placement.


The following sequence of events describe the Multi-Pitch TapeFeeder functions. The numbers in parentheses relate to thecallouts in the illustration above.

(1) A tape reel is mounted on the Component Reel Holder.

(2) The Tape Window is released and rotated upwards.

(3) The component tape is routed through the rear channel of thefeeder, over the top of the inside and outside guides, and di-rected into the Front Tape Chute.

(4) Eight inches of the cover tape is peeled back from the com-ponent tape and pulled through the Tape Window. Be surethe end of the carrier tape is secured to the Take Up Reel.

(5) The component tape is secured under the Tape Window withthe Tape Window Latch.

(6) The pitch setting is selected from the Pitch Selector switchon the Control Panel.


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8mm

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24m

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MPTF: 16mm-120mmPitch Swing Setting Tape Advance Distance (mm) Index Rate in Seconds

1 4 0.130

2 8 0.212

3 12 0.318

4 16 0.424

5 20 0.530

6 24 0.660

7 28 0.761

8 32 0.870

9 36 0.979

10 40 1.095

11 44 1.188

4 4 0.115

8 8 0.175

12 12 0.235

Spliceable MPTF: 8mm-12mmManual Setting Tape Advance Distance (mm) Index Rate in Seconds

2 2 0.085

4 4 0.115

8 8 0.175

12 12 0.235


Pocket Depth and Length Limitations1

Tape Feeder Width Tape Max Pocket Max Part ComponentPitch Depth Length2 Pick Height

8 2-8 2.49 N/A N/A

12 3 4-12 6.5 N/A N/A

16 4-20 14 16 139.7

24 4-20 14 24 139.7

24 24 13.8 24 139.7

24 28 13.4 24 139.7

32 4 4-20 14 31.5 139.7

32 4 24 13.8 31.5 139.7

32 4 28 13.4 31.5 139.7

32 4 32 12.9 31.5 139.7

32 4 36 12.4 31.5 139.7

44, 56 4 4-20 14 40 139.7

44, 56 4 24 13.8 40 139.7

44, 56 4 28 13.4 40 139.7

44, 56 4 32 12.9 40 139.7

44, 56 4 36 12.4 40 139.7

44, 56 4 40 11.7 40 139.7

44, 56 4 44 11 40 139.7

72, 88, 104, 120 4-40 20 44 139.7

72, 88, 104, 120 44 19.5 44 139.71 All dimensions are in millimeters.2 Maximum part length due to a peeler opening limitation.3 A kit is available to allow pocket depths of 6.5mm on 12mm feeders.4 Deep pocket feeders available for 32mm-56mm feeder widths (maximum depth: 18mm).

5.6mm

16mm, 24mm, 32mm, 44mm, or 56mm

5.0mm

15mm 18mm

3mm

Tape Pocket View


Pneumatic Tape Feeders, Model 4695A

Introduction

The Tape Feeder, Model 4695A, is available to process a widerange of punched or embossed component tapes. Reel loadedfeeders can be kept ready for installation on the GSM platform.

Machine Concept

Each feeder is dedicated to a tape width and index pitch. Kitsare available to convert dedicated index pitch feeders to anotherdedicated index pitch. The electrical and pneumatic connectionsare engaged when the feeder is mounted to the GSM platform.

Refer to the Machine Support Documents for specific informa-tion.

Standard Features

Select a dedicated tape feeder for the following tape sizes and index.

• 8mm (2mm, 4mm, or 8mm index)

• 12mm (4mm, 8mm, or 12mm index)

• 16mm (4mm, 8mm, 12mm, or 16mm index)

• 24mm (4mm, 8mm, 12mm, 16mm, 20mm, or 24mm index)

• 32mm (4mm, 8mm, 12mm, 16mm, 20mm, 24mm, 28mm, or32mm index)

• 44mm (4mm, 8mm, 12mm, 16mm, 20mm, 24mm, 28mm,32mm, 36mm, or 40mm index)

• 56mm (4mm, 8mm, 12mm, 16mm, 20mm, 24mm, 28mm,32mm, 36mm, or 40mm index)

Feeder design is based on EIA-481 standards. Punched carrier,embossed carrier tapes, reels and components meeting the abovestandards are processed by these feeders.

Refer to the Technical Specifications section where limitationsapply.

32mmEmbossed Carrier

8mmCarrier Tape

12mm Feeder


Handle

Latch

ComponentReel Holder

1 5a Scrap CarrierTape Exit

6

Component Pick UpPosition

4This End to the GSM

2 Mylar Cover TapeTake-Up Reel

5Peeler Blade

3 Manual FeederIndex Tool


The following sequence of events describe the Tape Feederfunctions. The numbers in parentheses relate to the callouts inthe illustration above.

(1) A component tape reel is mounted on the Component ReelHolder.

(2) The component tape is routed beneath the Take-Up Reel tothe index wheel.

(3) The component tape is advanced through the feeder usingthe Feeder Index Tool.

(4) Pins on the index wheel engage holes in the component tapeadvancing components to the Pickup Position.

(5) The top mylar cover tape is threaded back over the PeelerBlade to the Take-Up Reel while the empty component car-rier tape is routed out through the carrier tape scrap guide.

(6) The Latch locks and releases the feeder on the GSM plat-form.


EIA-481 Electronic Industries Association Standard - Tapingof Surface Mount Components for Automatic Place-ment.


Technical Specifications for Pneumatic Tape Feeders

Tape Width 8mm 12mm 16mm and 24mm 32mm and 44mm 56mm

Electrical Provided by GSM Provided by GSM Provided by GSM Provided by GSM Provided by GSM

Pneumatic Provided by GSM Provided by GSM Provided by GSM Provided by GSM Provided by GSM

MaximumReel Size

330mm (15.00") 330mm (15.00") 381mm (15.00") 381mm (15.00") 609mm (23.98")

RequiredNumber ofFeederPositions

One One Two Three Four

Tape Type Punched andEmbossedCarrier

Embossed Carrier Embossed Carrier Embossed Carrier Embossed Carrier

Tape Leader 203mm (8") 203mm (8") 203mm (8") 203mm (8") 203mm (8")

Take-UpCapacity

3810cm of 0.10mm(1500" of 0.004")

3810cm of 0.10mm(1500" of 0.004")

3810cm of0.10mm(1500" of 0.004")

3810cm of0.10mm(1500" of 0.004")

3810cm of0.10mm(1500" of 0.004")

IndexingIncrement

2mm to 8mm(0.079" to 0.314")in 2mm (0.079")increments





Index Rate inSeconds forSelected TapeIndex1

2mm 0.250 — — — —

4mm 0.250 0.350 1.0 1.0 1.0

8mm 0.250 0.350 1.0 1.0 1.0

12mm — 0.350 1.0 1.0 1.0

16mm — — 1.0 1.0 1.0

20mm — — 1.0 1.0 1.0

24mm — — 2.02 2.02 2.02

28mm — — — 2.02 2.02

32mm — — — 2.02 2.02

36mm — — — 2.02 2.02

40mm — — — 2.02 2.02

Notes:1 The feeder index cycle begins when the Z-axis (spindle) reaches the up position. The default time to

index the next part to the pick position is 0.40, 1.0, or 2.0 seconds, dependent on the feeder model.2 Indicates a double stroke cylinder.


Tape Pocket Depth LimitationsTape Width Pocket Length 1 Pocket Depth

8mm N/A 2.49mm (0.098")

12mm N/A 6.5mm (0.256")

16mm to 24mm N/A 10mm (0.394")

32mm to 56mm Up to 28.9mm (1.140") 10mm (0.394")Between 28.9mm and 35mm 9.14mm (0.360")(1.140" and 1.378" )

1 Tapes with pocket lengths longer than 35mm (1.378") must be evaluated by Universal.

Shown is the maximum distance from thetop of the tape to the top of thecomponent.

Pocket Length

Tape

Pocket

Component

5.8mm (0.23")


Track Feeder, Model 4696A

Introduction

The Track Feeder, Model 4696A, supports and positions compo-nent tubes for component transport to the pick position for pre-sentation. Tracks and feeder bases are sold separately. TheTrack Application Listing contains the component types and di-mensions that can be used on the track feeder.

Consult a Universal Sales Engineer for the Track ApplicationListing.

Machine Concept

The track assembly and the feeder base assembly make up thetrack feeder.

The component-specific track accommodates a maximum of fourtubes. Track assemblies, with or without isolator assemblies, canbe installed on the base assembly.

Modular design of the track feeder permits quick feeder change-over on the GSM platform.

Standard Features

Track Assembly

The component track assembly, with or without an isolator as-sembly, is application specific. Tracks are available for SOIC,LCC, PLCC, SOJ, and MOD DIP components. Select the re-quired track from the Track Application Listing. Tracks with iso-lators are used for the most common component packages. Atrack load assembly or wireform supports the component tubes.

Feeder Base Assembly

The feeder base assembly, with GSM platform mounting, in-cludes the interface and shutter assembly.


Technical SpecificationsRequired Feeder 3 feeder slotsPositions

Service Requirements

Electrical Power is provided by the GSM platform.

Pneumatic Air is provided by the GSM platform.

Feeder Base

2 Track Assembly withIsolator Assembly

1 ComponentTube

3 Interface Assembly (Usedwith Isolator-equipped trackassembly. Removed wheninstalling all others.)

3a Shutter


The following sequence of events describes the Track Feederfunctions. The numbers in parentheses relate to the callouts inthe illustration above.

(1) Components are loaded:

• Automatically from Component Tube.

• Manually from a Component Tube. Nonstandard tubes mayrequire a manual method.

(2) The components move through the Track Assembly to thepickup position. An Isolator relieves component back-pres-sure for ease of component pickup.

(3) The Interface, between the Track and the Feeder Base, in-cludes a Shutter. Components remain in the Track, capturedby the Shutter until the component is picked.


Stationary Matrix Tray Platform, Model 4649A

Introduction

The Stationary Matrix Tray Platform, Model 4649A, is a base forup to 177.8mm x 330.2mm (7" x 13") matrix trays. The matrixtray platform requires no power and has no options.


The matrix tray support clamp assembly secures matrix trays forcomponent pickup by the GSM platform.

Technical SpecificationsMaximum 25.4mm (1.0")Component andTray Height

Weight 11.8 kg (26 lbs.)

Required Feeder 8 feeder slotsPositions

Service None required.Requirements

Matrix Tray Pick Limitations (Available axis travel to reach Matrix Tray pockets)GSM Platform Configuration Head/Beam Feeder Bank Outbound 5" Inbound 8.5" Inbound

Standard

GSM 1 Head 1 Front 14.40" N/A N/AGSM 1 Head 1 Rear 4.15" 9.15" N/AGSM 1 Head 2 Front 4.15" N/A N/AGSM 1 Head 2 Rear 14.40" 19.40" N/AGSM 2 Head 1/Beam 1 Front N/A N/A N/AGSM 2 Head 1/Beam 1 Rear 5.24" 10.24" 13.74"GSM 2 Head 2/Beam 2 Front 5.24" N/A N/AGSM 2 Head 2/Beam 2 Rear N/A N/A N/AThis table notes the distances of Y-axis travel from the feeder interface dowel pins to the limit. When configuring therear feeder plate position, users should consider the trade-off between maximum board width, Matrix Tray picklimitations (available travel to reach Matrix Tray pockets), and machine throughput. These limitations do not apply tothe Platform Tray Feeder.


Multi-Tube Feeders, Model 4698A

Introduction

The Multi-Tube Feeder, Model 4698A, delivers a variety of com-ponents from tubes to the pick position on the GSM. The feederis loaded with multiple tubes of the same component type andpart number. It automatically ejects empty tubes and continuesfeeding components. The feeder can be manually loaded withfull tubes while the GSM is operating.

The General Application Placement Head can gang-pick fromthe Multi-Tube Feeders that require two feeder slots.

Standard Features

Each feeder is dedicated to a component style. Universal Instru-ments offers several Multi-Tube Feeders for integration to theGSM platform, including custom designs.


The following sequence of events describe the Multi-TubeFeeder functions. The numbers in parentheses relate to thecallouts in the illustration at left.

(1) Tubes are stacked, one on top of the other and at anangle, for gravity feed of components to the singulator/track assembly.

(2) The Singulator retains the second component in line, whileallowing the first component in line to advance to the con-veyor. When the Singulator returns, the line of compo-nents advance by one component length.

(3) The Conveyor indexes the component to the end stop forpick up by the GSM platform head.

(4) An empty tube ejects from the bottom of the feeder andthe next one in the stack drops into position for feeding tothe Singulator.

2

4

1

Technical SpecificationsElectrical Power is provided by the GSM platform.

Pneumatic Air is provided by the GSM platform.

Required Feeder 2 feeder slots for a 40mm feeder track.Positions 3 feeder slots for a 50mm feeder track.

Tube Length 501.6mm to 558.8mm (19.75" to 22.00")

Tube Stack Height 101.6mm (4.00"), maximum

Index Rate Programmable. Recommended minimumsetting is 1.300 seconds.

3


Tube Stacker

TubeEjector

Singulator

Conveyor


Bulk Track Feeder, Model 4702A

Introduction

The Bulk Track Feeder, Model 4702A, is designed to process avariety of bulk packaged chips. Bulk feeding components pro-vides several benefits:

Maximize Production Time: Since bulk cassettes hold sub-stantially more components than taped reels, production delaysare reduced and productivity is increased.Decrease Replenishment Requirements: Reloading a typi-cal tape feeder can take approximately 5 minutes; however, thebulk cases simply slide into place in less than 15 seconds.Eliminate Feeder Waste: Bulk cases are refillable, or at leastrecyclable. Tape feeding creates excessive non-recyclablewaste including reels, carrier tape, and cover tape.

Machine Concept

A Bulk Track Feeder is dedicated to a specific chip size. Theelectrical and pneumatic connections are engaged when thefeeder is mounted to the GSM platform through the standardfeeder interface.

Standard Features

Select a Bulk Track Feeder for the following chip sizes:

• 0603 Capacitor and Resistor• 0805 Capacitor and Resistor

Feeder design is based on the EIAJ-ET-7201 and IEC-286-6standards, respectively. Bulk packaged chips conforming to theabove standard are processed by the Bulk Track Feeder family.

Refer to the Technical Specifications section where limitationsapply.

Note: The FlexJet Head does not support Bulk Track Feeders.


Technical SpecificationsElectrical Power is provided by the GSM

platform

Pneumatic Air is provided by the GSMplatform

Required Feeder Slots One

Index Rate 250 milliseconds

Compatibility Flex Head, High Force Head


The following sequence of events describes the BulkTrack Feeder functions.

(1) Cassette is locked into the bulk cassette mount.(2) Case is mounted to the bulk feeder cassette.(3) Cassette aligns the chips end-to-end.(4) Chips are pneumatically transported to the pick

position via the track.(5) A vacuum nozzle is engaged to separate a com-

ponent from the next component in line.

ConnectorAssembly

VacuumNozzle

Bulk CassetteCaseTrack

Bulk Cassette

Lever

ComponentLabel

Base

LoadButton

Latch

Bulk Cassette

Mount

Metric Size L +/- L W +/-W T +/-T

1608C 1.6000 0.0708 0.8000 0.0700 0.8000 0.0700

1608R 1.6250 0.0750 0.8500 0.0500 0.4400 0.0400

2012C 2.0000 0.1000 1.2500 0.1000 0.6000 0.1000

2012R 2.0000 0.1000 1.2500 0.1000 0.5500 0.0500

Component SpecificationsThe following table lists the component specifications for all BulkTrack Feeders.

Inch Size L +/- L W +/-W T +/-T

0603C 0.0630 0.0028 0.0315 0.0028 0.0315 0.0028

0603R 0.0640 0.0030 0.0335 0.0020 0.0173 0.0016

0805C 0.0787 0.0039 0.0492 0.0039 0.0236 0.0039

0805R 0.0787 0.0039 0.0492 0.0039 0.0217 0.0020


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B - 55Appendix B: Placement Heads - GS-401-01A

Component HandlingCapabilities

FlexJet 1 Flex High Force UFP 300

mm inch mm inch mm inch mm inch

Maximum(without thetarotation in thecamera housing)

Length 25.400 1.000

Each of these GSM Platform placement heads require the use of anUpward-Looking Camera for image acquisition. Refer to Appendix C,“Cameras,” for applicable component considerations.

Width 25.400 1.000

Height 11.68 0.460

Maximum(with theta rotationin the camerahousing)

Length 17.960 0.707

Width 17.960 0.707

Height 11.68 0.460

Minimum(0201 capabilitypending)

Length 0.500 0.020

Width 1.000 0.040

Height 0.150 0.006

Maximum(Camera SelectionDependent)

Length 50.800 2.000 50.800 2.000 50.800 2.000 50.800 2.000

Width 50.800 2.000 50.800 2.000 50.800 2.000 50.800 2.000

Height 12.700 0.5004 12.700 0.500 12.700 0.500 12.700 0.500

Minimum(Camera SelectionDependent)

Length 0.500 0.020 0.500 0.020 0.500 0.020 0.500 0.020

Width 1.000 0.040 1.000 0.040 1.000 0.040 1.000 0.040

Height 0.150 0.006 0.150 0.006 0.150 0.006 0.150 0.006

Minimum LeadWidth

Upward-Looking Camera Selection DependentRefer to Appendix C, “Cameras,” for details.

Minimum LeadPitch

Minimum BumpDiameter

Minimum BumpPitch

Task Block Thickness Range 5 6.35 0.250 N/A N/A N/A

Placement Force Range (10gincrements)

150 to 1,000 125 to 450 175 to 2,500 6 150 to 10,000

Maximum Component Weight 7 35 35 35 35

Practical Component Range

Standard SMcomponents from chipsto large leaded & area

array components,including a limitedrange of Odd Form

surface mountpackages 8

Mid to large leaded andarray components,

including Odd Form IMor SM packages

requiring up to 450gplacement pressure

Mid to large leaded andarray components,including advancedpackaging and Odd

Form packagesrequiring up to 2,500gplacement pressure

Ultra-fine pitch SM andadvanced packaging,such as flips chips ordie, and Odd Form

packages requiring upto 10,000g placement

pressure

Appendix B: Placement Heads

1 Vacuum pick surface MANDATORY for FlexJet heads. Additional considerations for the FlexJet head include the lack of backlighting capability, co-planarity support, and gripper nozzles. The FlexJet nozzle changers cannot be configured in the Feeder Bank. Finally, there is no support for thin filmapplicator or wafer array feeders; however, support is planned for a future software release.2 Actual component dimensions will vary depending on the pick tolerance applied.3 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM platform has placed a146.1mm (5.75") x 12.95mm (0.510") SM connector with special considerations.4 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM platform has placed a25.4mm (1.0") tall electrolytic capacitor with special considerations.5 This thickness range is for imaging parts in the same FlexJet task block and is necessary to ensure all components are centered within the specifiedfocal plane of the camera.6 Requires the optional Heavy Spring Kit and Transformer Readout Assembly for calibration and maintenance.7 Special situations exist where specified constraints can be alleviated to accommodate non-standard applications. The GSM platform has placed a 56gram CCGA using a specific vacuum nozzle.

8 The FlexJet component range is continually expanding. Consult GSM Applications Engineer for a review of specific components.

Notes:

On-

the-

Hea

d C

amer

a 2U

pwar

d-Lo

okin

gC

amer

a 3

Com

pone

nt C

hara

cter

istic

s

B - 56 GS-401-01A - Appendix B: Placement Heads

X, Y: ±62µm with Cpk >1.33, using Upward-Looking Camera(CP >1.67)

X, Y: ±75µm with Cpk >1.33, using On-the-Head Camera(CP >1.67)

θ: ±0.2° with Cpk >1.33, using either camera

Note: Components of 0.5mm pitch or finer should be placed using Upward-Looking Camera.

1

1

1 Verified with all components of variation included: all spindles at all rotations overentire placement area for multiple boards and for each head and camera combination.Glass slugs placed on glass plate. Data analyzed by placement site.

Placement Performance Specification for Chips

X, Y: ±100µm with Cpk >1.33, using either camera(CP >1.67)

Component 150g to 1,000g, in 10g incrementsPlacement ForceRange

Final Placement 50 defects per million (dpm)Performance

Intrinsic Availability 98%

FlexJetHead

This general purpose 7-spindle head, with 20mm spacing betweeneach spindle and on-the-head camera, handles the broadest rangeof surface mount components. This head offers the best mix ofaccuracy and speed for most surface mount applications.

Adding a second FlexJet head to a GSM platform reduces thenumber of nozzle changes when building a product. In addition,full access to matrix tray feeders is gained from all feeder banks.

In addition, GSM platform software offerings have increased toinclude FlexJet Optimization and Simulation programs. Roundingout FlexJet technology is a Nozzle Changer that accomodates 28nozzles and allows for programmed, one second, gang nozzlechanges.

FlexJet® Head

Placement Performance Specification for Leaded and ArrayComponents


The Mean is the arithmeticaverage of a set ofmeasurements.

Standard Deviation is ameasure of the variability of aprocess output.

Accuracy is the distancebetween the mean and thetarget value.

Repeatability is one standarddeviation.

Cp is a capability index whichcompares the spread of theprocess to the distancebetween the upper and lowerspecifications.

Cpk is the process capabilityindex, which is a measure ofthe process's ability to produceproduct within specifications.

75% lead-to-pad @ 6σ by placement

X, Y: ±50µm @ ±5σ (CP > 1.67)θ: ±0.2° @ ±5σ(CP > 1.67)

X, Y: Repeatability < 10µmθ: Repeatability < 0.04°

X, Y, θ: Cpk > 1.5

1 Assumes: Lead Width = Pitch x 0.5, Pad Width = LeadWidth x 1.25, Span = 38.1mm (1.5").2 Verified with all components of variation included: allspindles at all rotations over entire placement area for mul-tiple boards and for each head and camera combination.Glass slugs placed on glass plate.

Cp= Upper Spec Limit - Lower Spec Limit

6σwhere σ = the standard deviation

of the sample

Cpk=

min(x - Lower Spec Limit, Upper Spec Limit - x )

3σ

where σ= the standard deviation of the sample and x is the sample mean

2

LSL USL

Target

Mean

Accuracy

±1σ±2σ±3σ

Flex Head and High Force Head

The Flex Head is a general purpose 4-spindle head, with 40mmspacing between each spindle. This head offers added flexibilityby placing odd form as well as most standard surface mountcomponents.

Adding a second Flex Head reduces the number of nozzlechanges when building a product. In addition, full access to ma-trix tray feeders is gained in all feeder banks of the GSM plat-form.

Universal’s High Force Head is essentially the same as theFlex Head, but it expands the placement force from 175 grams to2,500 grams with a force verification unit. It also provides a highvolume die placement solution for applications such as flip chipand bare die attach, in addition to flexible fine pitch placement.

Placement Performance Specification1


GSM throughput specifications have been achieved by running benchmarkproducts with the following significant characteristics. All throughputspecifications exclude board transfer, fiducial inspection, and bad board sensetimes. Actual product throughput may vary with each application.1 Based on (48) Chip-1206 component placements from 8mm tape feeders on a

457.2mm x 406.4mm (18" x 16") board with feeder duplication, gang-picking,and On-the-Head Centering (FlexJet Head) or 4.0 mil/pixel Upward LookingCamera Station (Flex or High Force Heads). Can be verified using 1206 SpeedVerification Kit, part number 48884501.2 Based on (42) PLCC44 component placements from 32mm Multi-Pitch TapeFeeders on a 254.0mm x 203.2mm (10" x 8") board with feeder duplication,gang-picking, and On-the-Head Centering (FlexJet Head) or 4.0 mil/pixelUpward Looking Camera Station (Flex or High Force Heads). Can be verifiedusing PLCC44 Speed Verification Kit, part number 48884601.3 Based on (36) PLCC84 component placements from 44mm Multi-Pitch TapeFeeders on a 254.0mm x 203.2mm (10" x 8") board with feeder duplication andOn-the-Head Centering (FlexJet Head) or 4.0 mil/pixel Upward Looking CameraStation (Flex or High Force Heads). Can be verified using PLCC84 SpeedVerification Kit, part number 48884701.4 Application dependency is related to component type and size, feederpackaging, accessory feeders such as PTF or shuttle, component featuresprogrammed, and any requirements for special nozzles.

GSM Platform: Placement Specifications

GSM1 Tact Time CPH

w/ FlexJet Head (front) & High Force Head (rear)

1Components < 12mm 0.36-0.80 second 4500-10000 cph

2Components > 12mm – < 25mm 0.51-1.03 seconds 3500-7000 cph

3Components > 25mm – < 32mm 1.00-1.80 seconds 2000-3600 cph

4Components > 32mm Application dependent

w/ FlexJet Head (front)

1Components < 12mm 0.36 second 10000 cph

2Components > 12mm – < 25mm 0.51 second 7000 cph



w/2 Flex Heads



3Components > 25mm – < 32mm 1.64 seconds 2200 cph


GSM2 Tact Time CPH

w/2 FlexJet Heads





w/2 Flex Heads






UFP300+ Head (GSM1 only)

Compatible Features and OptionsConfiguration The UFP300+ Head accesses the camera,

feeders, nozzle changer and coplanarity on thesame side as the head installation.

Components are picked from feeder slotpositions 2 to 35 and 38 to 71.

GSM1 machines with the rear feeder bank in theinbound (127mm/5") board configurationrequire the UFP300+ Head be installed on the frontof the beam.

UFP300+ HighAccuracy

Head

X YLengthWidth

Placement Specifications (UFP300+ head)Placement Rate 800 cph1

Final Placement 50 defects per million (dpm)Performance

Intrinsic Availability 98%1 Based on picking 304-pin glass slugs from a matrix tray using a highmagnification (1.3 mil/pixel) camera.

X, Y: ±38µm @ ±5σ (CP > 1.67)θ: ±0.1° @ ±5σ (CP > 1.67)

X, Y: Repeatability < 7.6µmθ: Repeatability < 0.02°

X, Y, θ: Cpk > 1.5

1 Verified with all components of variation included: all rotations over en-tire placement area for multiple boards and for each head and cameracombination. Glass slugs placed on glass plate.

Placement Performance Specification1


Dispense Specifications 1

Cartridges 10cc and 30cc, customer supplied

Dispense Rate Both numbers contingent uponDispense Tact Time application. Contact a

Universal Sales Engineer.

Intrinsic 98%Availability

Nominal: 1, 2

X, Y Accuracy 0.020mm (±0.0008")

X, Y Repeatability (σ) 0.018mm (<0.0007")

Diameter 0.013mm (<0.0005")Repeatability (σ)

Verified to: 1, 2

X, Y Accuracy 0.076mm (±0.003")

X, Y Repeatability (σ) 0.051mm (<0.002" )

Diameter 0.038mm (<0.0015")Repeatability (σ)

1 Using a Universal Instruments certified adhesive. Resultsvary with material, axis moves and Z-stroke requirements.2 Based on 0.508mm ( 0.020") dot at 2.54mm (0.100") X, Y,and Z.

Dispense Heads (GSM1 only)

PositiveDisplacementPump Head

ArchimedesMetering Valve


Spindle 1 Small Minimum Dot Size Requirement is 0.508mmSingle Dot (0.020")

Spindle 2 Dual Dot Minimum Dot Size Requirement is 0.762mmat 0° (0.030")

Spindle 3 Dual Dot Minimum Dot Size Requirement is 0.762mmat 90° (0.030")

Spindle 4 Large Minimum Dot Size Requirement is 1.016mmSingle Dot (0.040")

Notes: Standard nozzles are only intended for dispensing adhesivebetween component pads that do not have solder paste printed onthem.

The 4 Standard Nozzles that ship with the GSM dispense head cannotbe exchanged for other special nozzles. If it is determined that specialnozzles are required, the customer must purchase them.

Dispensing Nozzle ToolingConfigurationsStandard Nozzle Tooling Configurations are included with thepurchase of either the Piston Positive Displacement Style Pump or theArchimedes Metering Valve Style Pump.

Standard Nozzle Tooling encompasses the following:

C - 63Appendix C: Cameras - GS-401-01A

Appendix C: Cameras


Circular Lighting Camera

LensCover

Camera Cover

Odd Form Camera

RequiredPixels

Circular and Standard Lighting Upward-Looking Cameras On-AxisLightingCamera

Odd FormLightingCamera

FlexJetOptics1

5.3 mpp 4.0 mmp 3.0 mpp 2.6 mpp 1.0 mpp 0.5 mpp 4.0 mpp 4.0 mpp 2.6 mpp

mm inch mm inch mm inch mm inch mm inch mm inch mm inch mm inch mm inch

Maximum Component2

(Single Field of View)n\a 45.436 1.789 33.358 1.313 24.067 0.948 20.348 0.801 8.270 0.326 0.836 0.033 33.358 1.313 20.193 0.795 25.400 1.000

Leadless Components

Length 10.0 1.346 0.053 1.016 0.040 0.762 0.030 0.660 0.026 0.330 0.013 0.127 0.005 1.016 0.040 1.016 0.040 0.838 0.033

Width 5.0 0.673 0.027 0.508 0.020 0.381 0.015 0.330 0.013 0.165 0.007 0.064 0.003 0.508 0.020 0.508 0.020 0.419 0.017

Leaded Components

Pitch3 4.0 0.538 0.021 0.406 0.016 0.305 0.012 0.264 0.010 0.132 0.005 0.051 0.002 .0406 0.016 0.406 0.016 0.335 0.013

Width-WithoutInspection

2.0 0.269 0.011 0.203 0.008 0.152 0.006 0.132 0.005 0.066 0.003 0.025 0.001 0.203 0.008 0.203 0.008 0.168 0.007

Width-With Inspection 2.5 0.337 0.013 0.254 0.010 0.191 0.008 1.651 0.065 0.083 0.003 0.032 0.001 0.254 0.010 0.254 0.010 0.210 0.008

Multi-PatternComponents

Length 25.0 3.366 0.133 2.540 0.100 1.905 0.075 1.651 0.065 0.826 0.033 0.318 0.013 2.540 0.100 2.540 0.100 2.096 0.083

Width 25.0 0.337 0.013 0.254 0.010 0.191 0.008 1.651 0.065 0.083 0.003 0.032 0.001 0.254 0.010 0.254 0.010 0.210 0.008

BGA & C44

Components

Pitch 8.0 1.077 0.042 0.813 0.032 0.610 0.024 0.528 0.021 0.264 0.010 0.102 0.004 0.813 0.032 0.813 0.032 0.671 0.026

Bump Diameter 4.0 0.538 0.021 0.406 0.016 0.305 0.012 0.264 0.010 0.132 0.005 0.051 0.002 0.406 0.016 0.406 0.016 0.335 0.013

1 Actual component dimensions will vary depending on pick tolerance applied.

2 Assumes a default ±1.905mm (0.075") pick tolerance.

3 Assumes a 2.0 pixel minimum separation distance between leads.

4 Maximum number of bumps is 2,500.

C - 64 GS-401-01A - Appendix C: Cameras


D - 65Appendix D: Board Handling - GS-401-01A

Appendix D: Board Handling

Dual Lane Board Handling

There are six zones within the dual lane option. Zones A, C, D,and F are used for input / output board stationing. Zones B and Eare used for board populating.

Up to three boards are staged in the GSM at one time. Typically,two boards are in zones B and E and one board is in any of theother four input / output stations.

The dual lane software follows the first in, first out model. Thefirst board entering the GSM is also the first board exiting themachine. Both lanes utilize the same GSM product.

A

B

C

D

E

F

D - 66 GS-401-01A - Appendix D: Board Handling


Maximum Board Width Configuration2

Nozzle Changer Rear Feeder Maximum BoardLocation Plate Position Width 1

Between rails outbound 216.0mm (8.5")1 Board edge clearance of 5mm (0.195") is standard; optional

3mm (0.117") edge clearance reduces maximum board widthby 6.35mm (0.250").

2 Other configurations available. Consult a UniversalSales Engineer.

Dual Lane Board Handling:

• This configuration supports a 12.7mm (0.5") maximumbottomside clearance for the first inch measured from thefront of the board. See illustration below.

• Board widths less than 89.0mm (3.5") require the removal ofa board stop from each lane.

Fixed front railRear rail

12.7mm (0.5")clearance under board

P.C. board section

Maximum Underboard Clearance Area

component

com

pone

nt

25.4mm (1.0")

25.4mm (1.0") clearance under board

P.C. board rails

E - 67Appendix E: Odd Form Assembly - GS-401-01A

Appendix E: Odd Form Assembly Capabilities

Introduction

The flexibility of the GSM platform offers manufacturers a highthroughput alternative to manual assembly for odd form throughhole and surface mount components. By automating odd form as-sembly, manufacturers produce cost-effective products while im-proving product quality.

To help customers automate their odd form and light electrome-chanical assembly, Universal’s Surface Mount Division providesknowledge-based services to resolve viability issues. These ser-vices include evaluating components, packaging formats, andfeeders; and design guidelines for printed circuit board lead-to-hole ratios, component density, and insertion forces.

Applications

This Appendix covers the odd form capabilities of the GSM plat-form. Included is a list of components that have been inserted bythe GSM platform. If you have questions or concerns relative toyour specific application, it is recommended that you meet with aUniversal Sales Engineer to discuss your application.

E - 68 GS-401-01A - Appendix E: Odd Form Assembly

Components

The GSM platform has been configured to readily handle the fol-lowing odd form components:

Odd form components vary from vendor to vendor. Retentionfeatures and their respective hole sizes need to be analyzed, aswell as tooling clearances between components.

If your component type does not appear on this list, please con-tact a Universal Sales Engineer.

Audio Jacks PLCC Sockets

Card Edge Connectors Power Headers

Crystal Oscillators Radial Lead Components

DIMM Connectors Relays

DIN Connectors Shrouded Headers

Displays SIMM Connectors

D-Shell Connectors Speakers

Headers Transformers

LEDS USB Connectors

Phone Jacks ZIF (Socket 7) Connectors

E - 69Appendix E: Odd Form Assembly - GS-401-01A

The UFP 300+ Placement Head assembly is the machine’s op-tional ultra-fine pitch placement head. It is a single spindle headand is comprised of two major subassemblies: the Theta-Moduleassembly, and the Z-axis assembly. The spindle accepts a varietyof different nozzles, allowing pick-up and transport of variouscomponent sizes and types. It is capable of accurately placingcomponents with up-to or more-than 300 leads, and at rotationalincrements as small as 0.001°. The single-spindle UFP (UltraFine Pitch) Head can be mounted on a GSM1 to achieve inser-tion force up to 10,000 grams.

Component Tolerances

Maximum Component RangeLength 127 mm (5.0")Width 63.5 mm (2.5")Overall Height (body + lead) 21 mm (0.825")Height above board - staged 15.7 mm (0.620")Height above board - non-staged 17.8 mm (0.700")

High Force Head

The High Force Head assembly is the component pick-up andplacement mechanism, with required enhancements to accommo-date C4 or odd form type components. It is a four spindle headwith each spindle having vertical and rotational movement capa-bility. The spindles are driven in the vertical direction by a singleZ-axis motor (with each spindle individually clutched) for compo-nent pick-up and placement. Each spindle accepts a variety ofdifferent nozzles, allowing pick-up and transport of various com-ponent sizes and types.

High Force Head

UFP 300+ Head (GSM1 only)

UFP 300+ HighAccuracy Head

E - 70 GS-401-01A - Appendix E: Odd Form Assembly

Passive Clinch Option

The optional feeder clinch plate is dedicated to a specific boardapplication. This device ensures that radial leaded componentsare secured to the board, allowing for transport or flipping ofPCB during assembly.

Speed

Actual throughput will typically be between 2 and 4 seconds percomponent, depending on force requirements, opportunities togang pick, and field of view requirements.

Vision On-the-Fly

The GSM platform is equipped with Vision On-the-Fly forthrough hole components. It also allows for lead inspection andregistration. Its inherent flexibility eliminates the need for feederregistration of components.

Feeders

The following are available odd form component feeders for usewith the GSM platform:

Consult with a Universal Sales Engineer for component-specificfeeder tooling.

Cameras

A specialized camera offers vision-assisted placement of oddform and light electromechanical assembly components. Avail-able in a standard magnification of four mils/pixel, this cameraemploys a special “cone” cover. The cone helps direct the light insuch a way that the ends of the leads of odd form componentscan be seen. The cone opening is only 1-1/8" wide.OFA Camera

LensCover

Camera Cover

Radial Tape Feeder GPAX Feeder

Multi-Tube Feeder Matrix Tray Platform

Connector Feeder(SIMM/DIMM)

Vibratory Bowl

F - 71Appendix F: GSM Platform Traceability - GS-401-01A

Appendix F: GSM Platform Traceability

Bar Code Changeover Option

Introduction

The GSM platform is capable of handling bar code changeovers ifit is equipped with the Bar Code Changeover option. This optionallows for seamless product changeovers without requiring the userto manually load product data or press the start button. Thechangeover is accomplished based on a bar code string being pre-sented to bar code reading hardware mounted to one of the boardhandling lane’s upline conveyors. Once the bar code string is re-ceived, a lookup is performed in a cross-reference lookup table toverify what product should be executed for the given bar code.

This option is completely local to the GSM platform. No externalhost machine is required. It is a separate purchased option to theUPS software.

Restrictions/Limitations

The Bar Code Changeover option is only supported on StagedBoard Handling hardware with the SMEMA protocol. Each boardhandling lane requires bar code reading hardware mounted on theupline conveyor. Additionally, each bar code reader requires a se-rial line to the ISIO board. Dual Lane Board Handling requires twicethe scanning hardware as Staged Board Handling.

Only printed circuit boards for the current product will be allowedin the machine. Any board requiring a product changeover will bemaintained outside the machine until all current boards have exitedthe machine and the product changeover has been performed.

Before the GSM platform can be placed into either Line Monitor orChangeover mode, it must be powered up and the amplifiers en-abled by pressing the “hard” start button. If pallets are utilized, onlyone bar code in the set is used as the main product identification.

ACE conveyors and Universal-supplied bar code readers are recom-mended. Should different conveyors or scanners be desired, therewill be additional fees for integration consulting and required parts/labor.

F - 72 GS-401-01A - Appendix F: GSM Platform Traceability

Bar Code Types

The scanner is a high density 0.127mm (0.005") line width, ca-pable of reading the following bar code types:

Code 39; UPC; Codabar; Code 128; Interleaved 2 of 5.

The scanner selected must scan fast enough to obtain good readsfor the speed rate of the input conveyor. The customer will need toplace the bar code labels in a location which will allow the scannerto read the label successfully without adjusting the scanner location.The GSM platform must be able to support UPS 3.0 level softwareand hardware (or higher).

Narrow Bar Width Read Range Maximum Scan WidthHigh Density, Right Angle Down

0.127mm (0.0050") 50.8mm to 78.7mm (2" to 3.1") 53.3mm (2.1")0.191mm (0.0075") 50.8mm to 102mm (2" to 4") 91.4mm (3.6")

0.191mm (0.0075") 63.5mm to 140mm (2.5" to 5.5") 102mm (4")0.254mm (0.0100") 50.8mm to 165mm (2" to 6.5") 127mm (5")0.381mm (0.0150") 50.8mm to 190mm (2" to 7.5") 152mm (6")0.508mm (0.0200") 50.8mm to 254mm (2" to 10") 178mm (7")0.762mm (0.0300") 50.8mm to 254mm (2" to 10") 178mm (7")1.02mm (0.0400") 50.8mm to 254mm (2"to 10") 178mm (7")

Right Angle Down0.191mm (0.0075") 31.8mm to 102mm (0.25" to 4") 102mm (4")0.254mm (0.0100") 25.4mm to 127mm (1" to 5") 127mm (5")0.381mm (0.0150") 25.4mm to 152mm (1" to 6") 152mm (6")0.508mm (0.0200") 25.4mm to 216mm (1" to 8.5") 178mm (7")0.762mm (0.0300") 25.4mm to 216mm (1" to 8.5") 178mm (7")1.02mm (0.0400") 25.4mm to 216mm (1" to 8.5") 178mm (7")

Direction of label travel

Scan Line

Direction of label travel

Scan Line

Low Density

F - 73Appendix F: GSM Platform Traceability - GS-401-01A

Platform Setup Validation (PSV) Option

Introduction

The GSM platform also supports Platform Setup Validation(PSV), which prevents operator-related errors during feedersetup or reloading by verifying the correct components are loadedinto the correct feeder slots. PSV minimizes product costs by re-ducing rework, thereby improving product yield while providing avalidation log, which tracks each feeder dismount, scan, andmount routines. Minimal operator training is required due to thesimple closed-loop operation and common look of the graphicalWindows®-based user interface.

Incorporating PSV provides numerous benefits:• Prevents operator related loading errors: The closed-

loop feedback system ensures the correct feeders and com-ponents are loaded into the appropriate feeder slot whenevera tape feeder is mounted on the GSM platform.

• Eliminates costly rework: Since PSV will never enable amismatched component and feeder slot, the wrong compo-nents are simply not picked, thus preventing any associatedrework.

• Improves product yield: Again, PSV ensures correct com-ponent usage. This means you will never be forced to reworkboards because the wrong part was placed. Hence, your firstpass product yield may increase.

• Minimizes product costs: PSV always ensures the correctcomponent is loading in its corresponding slot. In doing so,you can rest assured the GSM platform will not place incor-rect parts onto your boards. Since this type of rework isavoided, less labor and materials are needed during boardproduction.

Bottom line, Universal’s closed-loop bar code scanning optionsaves time and money, while ensuring the production of highquality boards.

PSV Specifications• At least UPS 3.1 hardware and software.• Supported Bar Code Label Formats:

Codes 11, 39, 93, and 128; UPC-A and E (not expanded);EAN/JAN; Standard 2 of 5; Interleaved 2 of 5; Codabar.

F - 74 GS-401-01A - Appendix F: GSM Platform Traceability
