half-stave assembly
DESCRIPTION
Half-stave assembly. Gluing procedure & glue characteristics Status of dummy components. Half-stave a ssembly. Carrier Bus. Gluing A. Extender Bus. Grounding Foil. Ladder 2. MCM+ optical fiber. Gluing B. Ladder 1. Carbon fiber sector. Gluing C. - PowerPoint PPT PresentationTRANSCRIPT
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group
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Half-stave assemblyHalf-stave assembly
Gluing procedure & glue characteristicsStatus of dummy components
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 2
Half-stave assembly Carrier Bus
MCM+ optical fiber
Ladder 1
Extender Bus
Gluing A
Gluing B
Carbon fiber sectorGluing C
Ladder 2
- Schematic view of half-stave components and assembling
- Draft version of a Glue Requirement Document ready
Grounding Foil
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 3
Gluing AMCM and Ladders to Carrier-bus
Electrical insulating
Thermal conductive
Removable ?Proper gluing underneath wire bonding pads and module planarity
Elasticity modulus to reduce mechanical stress
No Pressure required for gluing
Max cure temperature <100°C
Thickness < 100 µm
Gluing A: glue characteristics
Carrier BusLadder 2
Ladder 1
MCM+ optical fiber
Extender Bus
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 4
Gluing A Assembly procedure
Step 2-A1 glue deposition layer
Step 1-Alignment
Step 3- Carrier-bus + A support alignment and contact
Multilayer Carrier-bus + A support
Ladder 2 Ladder 1 MCM
5V. Manzari for Bari SPD-Group CERN SPD meeting, 4/06/2002
Step 4- A support separation and A2 glue layer deposition
Extender (LV & Bias)
Supporto B
Step 6- B support clumpingLadder2 Ladder1
MCM
Optical fiber
Multilayer Carrier bus Extender (L
V &
Bias)
Multilayer Carrier bus Extender (L
V &
Bias)
Step 5- Extender alignment and contact
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 6
Gluing BAssembly A to Grounding-foil
Electrical conductive
Thermal conductive
Removable ?
Proper gluing on whole interface and good planarity
Elasticity modulus to reduce mechanical stress
Thickness, temperature step and required pressure as gluing A
Glue B characteristics:
Currier Bus
Grounding FoilMCM + optical
fiber Ladder 1
Extender BusLadder 2
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 7
Gluing BAssembly A to Grounding-foil
Good glue control to avoid FE chip wet (bumps and pads)
possible solution (under-filling, mechanical protection …..)
Grounding-foil equipped with sensor temperature ? (1 for FE chip)
To be studied
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 8
Gluing CHalf-stave to Sector
Electrical insulating
Thermal conductive
Extremely smooth for a good thermal coupling
Good gluing rigidity for a good clamping between the half-stave and carbon fiber sector
Necessary removable for reworking
Glue A characteristics:
Padova competence
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 9
Glue Overview
Producer name Glue Name Application / description
PropertiesThermal Conductivity
(W/m°C)gluing type Status
AAVID Thermalloy
thermalbond Epoxyelectrical insulating
1,34 gluing A available
paltier technik NEE001 siliconelectrical insulating
0,2 gluing A available
Ciba-Geigy Araldite 2001Epoxy with Boron-
Nitrideelectrical insulating
0,87 gluing A available
Eccobond 45 flexible
Epoxyelectrical insulating
0,35 gluing A to cantact
Ablefilm 5025film thick
50,75,100 micronelectrical
conductivegluing B to cantact
Cookson Electronics
Staystik 541 Thermoplasticelectrical insulating
gluing A-B to cantact
AIT gluing A-B to cantact
Emerson cuming
Technical consult with minute that explain the
half-stave assembly requirement.
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 10
Thermoplastic filmsCookson (Staystic)
TYPICAL PROPERTIES 541 642 442 842Filler Material Silver AIN NONE ALUMINIA
Attach Temparautre Range 100°C 150°C 100°C 150°C 100°C 150°C 100°C 150°C
Continuous Range -65°C 100°C -65°C 100°C -65°C 100°C -65°C 100°C
Max Excursion Temperature 200°C 200°C 200°C 200°C
Thrmal Conductivity (W/m°K) >3.0 >1.0 <0.25 <0.6
Volume Resistivity (ohm*cm) <5x10 -̂2 >1x10 9̂ >1x10 9̂ >1x10 9̂
Die Shear Adhesion @25°C >1000psi >1000psi >1000psi >1000psi
Elastic Modulus (psi) >400000 >400000 >400000 >400000
Glass Transition Temp. (Tg) >16°C >16°C >16°C >16°C
Shelf Life @25°C 1 Year 1 Year 1 Year 1 Year
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 11
Dummies production statusfor glue test
Ladders
MCM ?
Carrier bus
Extender Bus
Grounding foil
several glass samples 150 and 300 μm thick
silicon sensor ladders 300 μm thick + FE chips 750 μm thick
multilayer Al foils
ordered AP 9121 ( kapton foil 50 μm thick with a copper layer on each side 35 μm thick)
To be defined
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 12
Glass dummies production for glue studies
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 13
Glass dummies production for gluestudies
Diamond saw
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 14
Micrometric measurement system
Mitutoyo Apex 9166(Fully dedicated to ALICE- SPD activities)
Suitable to be equipped with a Vision Probe device for no-contact measurements in all 3 axis.
CERN SPD meeting, 4/06/2002V. Manzari for Bari SPD-Group 15
What next?
Define the missing dummies Bump-bonded ladders MCM Grounding foil
Contact glue producer Available glues:
Araldite 2011, Thermalbond, NEE001……. Next: thermoplastic adhesive films and paste
Start a campaign of tests with dummies and different glues