hardware technologies for robust personal communication

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Hardware Technologies for Robust Personal Communication Transceivers Integrated Circuits & Systems Laboratory Electrical Engineering Department University of California Los Angeles, CA 90024-1594 Henry Samueli Asad A. Abidi Gregory J. Pottie Yahya Rahmat-Samii

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Hardware Technologies for RobustPersonal Communication Transceivers

Integrated Circuits & Systems LaboratoryElectrical Engineering DepartmentUniversity of CaliforniaLos Angeles, CA 90024-1594

Henry SamueliAsad A. Abidi

Gregory J. PottieYahya Rahmat-Samii

UCLA Low-Power Transceiver Program

∑ Low-Voltage Custom Analog & Digital CMOS∑ Monolithic CMOS 915 MHz Receive/Transmit Path∑ Two-chip Design; Minimum Discrete Components

Low Power Dissipation

Up to 160 kb/s ∑ Space Diversity with Multiple Antennas∑ Frequency Diversity with Spread-Spectrum∑ Time Diversity with ECC/Interleaving

Robustness

Means: Investigate analog, digital, and antennatechnologies, coupled tightly to system design

Objective: Low-power, handheld, robust transceivers forindoor and mobile personal communications

The UCLA Frequency-HoppedSpread-Spectrum CMOS Transceiver

Digital AnalogFSKDetector

BPF

BPF

Frequency Control Logic

DDFS

DDFS

915 MHzLocal Oscillator

SSB Select

Freq

uenc

y & T

imin

g Ac

quis

itio

n

Base

band

Dat

a Ou

t

Baseband Data In

10b

10b

PA

Power Control

LNA

LPF

LPF

LPF

LPF

90˚

LNA90˚

Limiter

Limiter

Limiter

Limiter

Performance Specifications of Handset

Power Dissipation of Handset

225 mW in receive, 300 mW in transmit

F

r

e

q

u

e

n

c

y

B

a

n

d

902-928 MHz (unlicensed ISM band)

Radiated Power

20 mW (max); 20 µW (min)

D

a

t

a

R

a

t

e

2 to 160 kb/s (variable)

Duplexing

T

i

m

e

D

i

v

i

s

i

o

n

D

u

p

l

e

x

b

e

t

w

e

e

n

T

X

a

n

d

R

X

Multiple Access Method

F

r

e

q

u

e

n

c

y

-

H

o

p

p

e

d

S

p

r

e

a

d

-

S

p

e

c

t

r

u

m

C

D

M

A

Coding

R

a

t

e

-

½

C

o

n

v

o

l

u

t

i

o

n

a

l

C

o

d

e

(

k

=

6

)

Modulation

B

i

n

a

r

y

o

r

Q

u

a

t

e

r

n

a

r

y

F

S

K

P

o

w

e

r

S

u

p

p

l

y

3 V (max)

IC Technology

1-µm bulk CMOS

Receive Antennas

M

u

l

t

i

p

l

e

m

i

n

i

a

t

u

r

e

e

m

b

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p

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y

Spread-Spectrum Systems:Hardware Implications

n Frequency Diversity by making chip-rate >> symbol rate

n Equalization at chip-rate High-speed signal processing required

n Coherent receiver most common

n Main advantage: SNR gain withcoherent detection, optimummodulation

n Limitation: High complexity

n Covers wide bandwidth with lowhop-rate

n Equalization at hop-rate only

n Simple binary FSK modulation maybe used

n Non-coherent receiver is simple

n Main advantage: Low-power receiver

n Limitation: Sub-optimal channelcapacity

Direct Sequence Frequency Hopped

Diversity Techniques

n Antennas receive uncorrelated signals

n Use space and polarization diversity

n Code-Division Multiple Access (CDMA); Direct SequenceOR Frequency Hop

n Time-Division Multiple Access (TDMA); Equalization

n Coding

n Interleaving

e Power Control

e Multiple Antennas

e Time Diversity

e Frequency Spreading

Power Amplifier

• Amplifier attains 42% power conversion efficiencyat +15 dBm output power

• Binary-weighted array of FETs gives 36 dB ofpower control (6-b word)

• Inductively-loaded preamp drives FETs above 3-Vsupply

• Off-chip matching network filters out harmonics

Switched Selection FETs

DRF

100WAntenna

0.7pF

13nH

75nH

75µm

8µm16µm

32µm

256µm64µm128µm

3V3V

3V

1-µHChoke

Othe

r ha

lf o

fqu

asi-

diff

eren

tial

pow

er a

mpl

ifier

902-928 MH

zfrom

modulator

Frequency-Hopped Synthesizer

• DDFS produces samples of a sinewave at a frequency selected by 11-b word;instantly agile frequency source

• DDFS output range is 013 MHz; adding up-converted outputs produces SSB915928 MHz; subtracting them produces 902915 MHz

• 8-b matching required between channels for adequate image suppression

Phas

e Ac

cum

ulat

or (11

b) SINE ROM

COSINE ROM

10b DAC

Direct Digital Frequency Synthesizer

I

915 MHz Local Osc

I

Q

Q

10b DAC

Sign Select Control

Anti-alias Filter

Circuits implemented on this prototype

Freq

uenc

y Co

ntro

l W

ord

(11b

)

F/H

S/S

SSB

Anti-alias Filter

10-b, 80 MHz D-A Converter

LSB

LSB

3 bits (Word N)3b (N)

1b(N)

MSB

MSB

Pipeline Delay DataRegisters

1

1

φ2

φ2 φ1

φ1

φ2

φ2

φ2

φ3

φ3

++

CM

CM

0.5 pF

Charge Redistribution DAC Q-to-V Buffer

I & Q DDFS/DAC27 mA at 3V, 80 MHz

• Low-power through differential implementation usingquasi-passive charge-redistribution pipelines

• Linearity limited by capacitance mismatch, voltage-dependent parasitics

• Glitch free!

φ1

φ2

φ3

Measured DDFS/DAC Spectral Outputs

62 dB

50 MHz Sample Rate3 V Supply

0 5 MHz 0 25 MHz

50 MHz Sample Rate3 V Supply

16.715 MHz

57 dB

–57 dBc

• Spurious level as predicted• set by capacitor mismatch

• Inter-cell capacitance causesnon-linearity at high frequency

Baseband Tone-Select Filter

Low-Order Anti-alias

Filter

Fifth-Order Elliptic Lowpass Filter

To D

igita

l FS

K D

etec

tor

RF In

Tracking Hopped Local Oscillator

+13 MHz

LPF Response

–13 MHz+13 MHz

Downconverted Spectrum

–13 MHz

0 1000Frequency, kHz

0

-120

• 5th-order Elliptic LPF with 200-kHz cutoffimplemented as SCF; dissipates 15 mW from 3-V at 5 MHz sample rate. Operates up to 20 MHz.60 dB stopband attenuation.

• LPF sets noise bandwidth of entire system

50dB at13 MHz>40 dB

50 dB

LNA

Dow

nconve

rt

2nd-Order Butter-worth Prefilter

BQ1Q = 0.65Gain = 4

BQ2Q = 8.1

Gain = 4

BQ3Q = 1.9

Gain = 1

6th-Order Elliptic Channel Filter

f RF/16

f RF/64

620 kHz230 kHz

320 kHz

24dB

26 M

Hz

915 MHz

0dB

Lowpass Channel-Select Filter

+13 MHz

LPF Response

–13 MHz+13 MHz

Downconverted Spectrum

–13 MHz

Measured Filter Performance

· 70 nV/Hz in passband

· 4.6 mA from 3V

· 200 pF total on-chipcapacitance

Digital Tone Detector

I&D

I&D

I&D

I&D

|A|+|B|

|A|+|B|

|A|+|B|

|A|+|B|

Max Select

MUX9b

MSBcoswt

(1b)

sinwt

(1b)

• 1-bit oversampled correlator (programmable oversample rate)

• Multipliers are switches, integrators are accumulators

• 1.9 sq mm active area implementation will dissipate 2 mW

Rationale Underlying UCLALow-Power Transceiver

• Radio paging receiver is the most evolved low-energy wireless devicetoday. Receives 500 to 1000 b/s at 400 MHz to 900 MHz.

• Long battery life obtained through very high level of integration (twochips) and optimized system design

• UCLA transceiver uses this as a model. Key extensions are:

♦ Binary FSK modulation of carrier (like pager)

♦ Frequency-hopped spread-spectrum

♦ Simple demodulation after de-hopping (like pager)

♦ Two-chip transceiver (like paging receiver)

Two-way communication

Much higher data rate 160 kb/s (programmable)

Robust operation in multipath environment Diversity

Large multi-user capacity CDMA spread-spectrum

Features

New Technology for Etching Inductors

Need fast etchant in p+ doped substrates

Should minimally etch exposed metallization

Xenon DiFluoride (XeF2) gas-phase etchant

• Etches hemispherical pitsanisotropically through array of smallholes in oxide

• Depth of etching may be visuallymonitored through semi-transparentnitride

1 GHz Continuous-Time LNA and Mixer

A demonstration of the fundamental capability of MOSFETs to attainlow noise and wide dynamic range, at low power

1-µm CMOS operating at 3V; matched to 50W at input

Drain 8 mA from 3V

50nH

VG

VC

RF In+ RF In–

M31000µm

M1300µm

M2

M480µm

3µm

M10

M6 M9

960µm

300µm

M5RF+

LO+

IF+ IF–

LO+LO–

RF–

LNA Design Rationale

Gain Q R gC R R

s ms s

T= ¥ =¥

ªFHG

IKJFHG

IKJ

2

02

0

21

50

50

( )wwwW

W

0.1 0.2 0.3 0.4 0.51

2

3

4

5

VGS-Vt, V

50 nH on-chip inductor load

Rs ..... 50V

23 dB gain requires bias at (VGS–Vt)=0.6Vfor sufficiently high fT

LNA + mixer drain 8 mA from 3 V

Measured fT vs VGS-Vt

Channel-Select Filter

Current drain of active filter ~ 3.5 mA

Input-referred noise ~ 40 nV/!!!!!Hz

Capacitor spread = 108

Input capacitor ~ 0.45 pF

Output compression point ~ 2 V ptp

54dB at14 MHz

>40 dB

50 dB

LNA 2nd-Order Butter-worth Prefilter

6th-Order Elliptic Channel Filter

620 kHz230 kHz

320 kHz

24dB

0.5dB

915 MHz

12dB

Increasing DDFS/DAC Clock Frequency

• Eliminate two clock phases, fffff4 and fffff5, in buffer drivingon-chip capacitive load

• Rescale DDFS. Carry-select adder in accumulator.

• Use open-loop buffer to drive polyphase filter throughfour-FET switch upconversion mixers

• 3rd-order distortion, including buffer < —45 dB

600 µm

100 WW

–+100

Ω

Ω

(

f5

f5

f2f2

f2

f3

f3

CM

CM

f4

500µm

–+

1

1

–+

Polyphase Filter for Sideband Selection

LO

I

Q0˚

90˚

DesiredDesired

Imag

eIm

age

LO

O Hz LO

–+

IIIII

IIIII

QQQQQ

QQQQQ

~0˚

~180˚

~270˚

~90˚

600 WWWWW0.3 pF

• Extension of the RC-CR phase-shift network,with four-phase inputs and outputs

• Reinforces one sequence of quadrature phases(clockwise, say), while attenuating the other

• Robust against component mismatches (order-of-magnitude better than single-phase network)

• Similarly selects one sideband afterupconversion (60 dB rejection with 10° phaseerror in LO)

Transmitter Test Chip6×3.8 mm active area

65 mA active current

Transmitter Output Spectra

No off-chip filter at power amplifier output

Measurements at mid-range level +5 dBm

Current Drain in Transceiver Parts

30 mA 8 mA8 mA

14 mA

15 mA7 mA

7 mA

7 mA

2 mA

13 mA

20 mA

0 0

Filt VCO

–+

÷32

PD

Channel Filter

Channel Filter

Limiting Amplifier

Limiting Amplifier

Measured Performance of Front-End

0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2

-16-14-12-10

-8-6-4-20

Frequency, GHz