hbl power systems limited

HBL Power Systems Limited

Hyderabad – TS, India

Electronics Group

Procedure for PCB Assembly

Procedure No.: EG-PP-PR-03, Rev. No.: 0

Details Name Signature Date

Prepared By K Shiva krishna

04/06/2020

Approved By R S Sudhakar

04/06/2020

CONTROL OF CONFIDENTIALITY

The information contained in this document is the property of HBL, which reserves the

right for distribution, application or reproduction for any usage.


Procedure No. EG-PP-PR-03

Revision No. 0

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Revision History

Rev.

No

Date of

Revision

Details of

Changes Reason for Change

Rev.No

From To

0 04/06/2020 All Pages Initial Improvement - 0

Distribution List

This Documented Information will be uploaded in QMS Portal for necessary reference.

List of Abbreviations

Sl. No Abbreviation Expansion

1. BOM Bill of Material

2. Dept Department

3. EG Electronics Group

4. FG Finished Goods

5. FT Format

6. PPC Production Planning and Control

7. PP Production and Planning

8. PR Production

9. PMM Permanent Magnet Machines

10. QC Quality Control

11. QMS Quality Management System

12. RE Railway Electronics

13. IE Industrial Electronics

14. STPO Stock Transfer Purchase Order

15. MRN Material Return Note



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Table of Contents

1 Purpose ............................................................................................................................4

2 Scope ...............................................................................................................................4

3 Related Documents ..........................................................................................................4

4 Organization chart ............................................................................................................5

5 Roles, Responsibilities and Authorities ............................................................................6

6 Process flow chart ............................................................................................................7

7 Procedure .......................................................................................................................12

7.1 Sale Order/STPO .....................................................................................................12

7.2 Production Plan ........................................................................................................12

7.3 Production Realization Process ................................................................................12

7.4 Production Process Verification ................................................................................13

7.5 Production Documentation ........................................................................................13

7.6 Control of Production Process Changes ...................................................................13

7.7 Control of Production Equipment ..............................................................................14

7.8 Rejection in Production Process ...............................................................................14

8 Documented Information ................................................................................................15

List of Tables

Table 1: Related Documens ....................................................................................................4

Table 2: Roles, Responsibilities and Authorities .....................................................................6

Table 3: Documented Information .........................................................................................15

List of Figures

Figure 1: Organization Chart ...................................................................................................5

Figure 2: Process Flow Chart ..................................................................................................7



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1 Purpose

This procedure describes the process used to provide controlled conditions under which the

key product realization processes are performed.

2 Scope

This production procedure will cover all activities and process steps (right from the receipt of

material from stores to Dispatch).

3 Related Documents

# Title Document Number Rev No

1 PCB Route Card EG-PP-FT-101 2

2 Stencil Printer EG-PP-FT-102 1

3 Automatic Pick & Place

Machine EG-PP-FT-103 1

4 Reflow Production Report EG-PP-FT-104 1

5 AOI Inspection Report EG-PP-FT-105 0

6 X-Ray Production Report EG-PP-FT-106 0

7 In-Circuit-Test (ICT) Report EG-PP-FT-107 0

8 Manual Assembly Report EG-PP-FT-108 0

9 Wave Soldering Production

Report EG-PP-FT-109 0

10 Post Soldering Work Report EG-PP-FT-110 0

11 Tested Ok Label EG-PP-FT-111 0

12 Preventive Maintenance –

Stencil Printer Machine EG-PP-FT-112 1

13

Preventive Maintenance -

Automatic Pick & Place

Machine

EG-PP-FT-113 1

14 Preventive Maintenance -

Reflow Oven EG-PP-FT-114 1

15 Preventive Maintenance – X-

Ray Machine EG-PP-FT-116 0



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16 Preventive Maintenance –In-

Circuit-Tester EG-PP-FT-117 0

17 Preventive Maintenance –Wave

Soldering Machine EG-PP-FT-118 0

18 Daily Test Report EG-PP-FT-119 1

19 PCB Test Report EG-PP-FT-120 0

20 Factory Sales Register EG-PP-FT-121 0

21 SPI Route Card EG-PP-FT-122 0

22 SPI Power Card PCB Test


23 SPI Control Card PCB Test


24 SPI Display PCB Test Report EG-PP-FT-125 0

25 SPI GSM PCB Test Report EG-PP-FT-126 0

26 SPI In-Process & Final Visual

Inspection Check Sheet EG-PP-FT-127 0

27 SPI System Level Test Report EG-PP-FT-128 0

28 PCB Visual Inspection Report EG-PP-FT-129 0

Table 1: Related Documents

4 Organization chart

Figure 1: Organization Chart



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5 Roles, Responsibilities and Authorities

Production Head

Responsibilities:

1. Ensuring the timely completion of relevant projects.

2. Provide overall Management of the on going Production operations including Troubleshooting, Planning, Scheduling, Documentation, Equipment Maintenance, Non-conformance analysis.

3. Assist in creation of efficient processes through hands-on development and training.

4. Track quality of all processes through analysis of recorded data and formation of additional test-points. Correlate results with requirements / specifications.

5. Identify the training needs to the personnel and coordinate with HRD for organizing the same.

6. Ensure product and personal safety.

7. Ensure configuration management appropriate to the product.

8. Maintaining the respective records

9. Identification of risks and implementation of mitigation plan

Authorities

1. Taking decision in shop-floor to improve productivity.

2. Approving indents.

3. Sanction of leaves

Production

Supervisor

Responsibilities:

1. To coordinate & execute the assigned jobs by meeting the customer requirement as specified, ensure the timely completion.

2. Guide and train the trainees


4. Develop innovative ideas to improve production and quality

Authorities:

1. Approving Indent

2. Leave Authorization

Production

Engineer

Responsibilities:

1. To coordinate & execute the assigned jobs by meeting the customer requirement as specified, ensure the timely completion.

2. Guide and train the trainees




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Operator

Responsibilities:

1. To execute the assigned jobs by meeting the customer requirement

as specified, ensure the timely completion.

2. Ensure product and personal safety

Table 2: Roles, Responsibilities and Authorities

6 Process flow chart

SMD Components Through hole Components

Blank PCB's

Load the SMD Components on pick and place Machines

Preform the material for Add-on

C

Manually mount the TH components

D

A

B

Kit verification & material

segregation.

Receipt of material from store



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Preheating of PCB Blanks at

110 C for 2 hours

Inspection AOI - Top

side

E

Re-flow Oven

B

Not OK

OK

A

(Stencil Printer) Solder paste printing on

top side of the PCB

Component Placement Top side

OK

Not OK

Visual Inspectio

n

Clean the PCBs with

IPA

Clean the PCBs with

IPA

C


OK

Rework



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Stencil for Glue application on bottom

side of the PCB

Visual Inspecti

on

Not Ok

OK

Clean the PCBs

with IPA

E

Inspection AOI - Top

side

Rework

C

Re-flow Oven

B

OK

Component Placement Bottom side

OK

Not OK

Clean the PCBs with

IPA




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C

Forming of all Thro-hole components

Visual Inspection

Top / Bottom

side

Not OK

OK

First PCB inspection by QC

Wave soldering

Post Soldering works such as Height down, lead cutting , Touch up

F


Rework

Components insertion



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Rework

OK

Not OK

Functional testing for

PCB’S Final

inspection

Clean the PCBs

with IPA

Not OK

OK

Add-on component Assembly

Rework

D

In process inspectio

n

F

Continue in next page

Cleaning

Testing



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Figure 2: Process Flow Chart

7 Procedure

7.1 Sale Order/STPO

PPC will released the sale order/STPO from customer.

7.2 Production Plan

PPC will circulate the production plan based on the customer requirement.

7.3 Production Realization Process

Production Realization Process involves the activities for Rail Electronics (RE), Permanent

magnet machines (PMM) and Industrial Electronics(IE) as Processes are performed under

controlled conditions and include the following:

Conformal Coating

PCB’s Serial number Sticker

Final QC Sample test

Rework

Not OK

OK

Packing in Anti Static Covers

Handed over to stores



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7.4 Production Process Verification

Use a representative item from the first production run to verify that the process and tooling

are capable of producing conforming product.

Planned work instructions such as Work Instructions, Route Cards are to ensure product

requirements/characteristics are identified, verified, and documented.

7.4.1 Engineering Department approves all processes and equipment by approving all

process and equipment quality plans, procedures, or work instructions.

7.4.2 Route Cards and Quality Records provide evidence that all manufacturing, test, and

inspection operations have been completed as planned.

7.4.3 Prevention, detection, and removal of loose foreign objects is performed according to

work instructions and Inspection instructions as applicable prior to final product

acceptance.

7.4.4 Utilities and supplies are monitored to assure they meet process, environmental, and

product quality requirements.

7.4.5 Criteria for workmanship, expressed as product specifications/characteristics are

documented in the quality plan for the product.

7.5 Production Documentation

7.5.1 Production documentation consists of documentation packages which include:

7.5.2 Route Cards, process flow charts that define the sequence of operations required to

assemble, test, inspect, and accept product

7.5.3 Specific or non-specific tools and numerical control machine programs required, along

with instructions for use.

7.6 Control of Production Process Changes

7.6.1 Identified changes communicate to engineering team through engineering change

request.

7.6.2 Engineering reviews and approves all changes to production processes and gives

engineering change note to production.

7.6.3 Production Process changes are verified following implementation by inspection and/or

test to assure changes have been implemented and the changes meet the desired

effect, without adverse effect on product quality.



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7.7 Control of Production Equipment

7.7.1 Production equipment, tools and Software programs are validated periodically.

7.7.2 Test equipment and controlled tools (such as calipers, gages, etc.) are validated as

specified by Calibration Laboratory procedures. These items are stored, maintained,

and inspected periodically by established recall system.

7.7.3 Software Programs used for product testing are verified by IV&V Dept prior to issue to

manufacturing. Revised/updated programs are controlled by Configuration

Management procedures.

7.8 Rejection in Production process

7.8.1 The material rejected at production due to the following reasons shall be submitted to

stores with an MRN duly approved by QC

7.8.1.1 Excess Stock

7.8.1.2 Revision Change

7.8.1.3 Design Change

7.8.1.4 Failure in Testing (Components/Sub-System)

7.8.2 In case of Excess stock, the stores shall issue the same for the future job requirements.

7.8.3 In case of Revision Change and Design Change a replacement material shall be

collected from stores.

7.8.4 Components failed during testing are indicated as scrap and moved to scrap yard for

disposal.

7.8.5 Sub Systems failed during testing are reworked as per the respective procedures in

product manuals.

7.8.6 Separate Register shall be maintained for MRN items to support for analysis of failure.

8 Documented Information

# Documented Information

(Records) Retention Time

Person

Responsible Storage location

1. Route Card 3 Years K Shiva krishna Respective

Production area

2. Dispatch Register 3 Years K Shiva krishna Respective

Production area



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Table 3: Documented Information