hcal tpg and readout

17
USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 1 HCAL TPG and Readout CMS HCal meeting at Rochester Oct. 19-20 Oct 2001 Tullio Grassi, Drew Baden University of Maryland Jim Rohlf Boston University

Upload: radwan

Post on 15-Jan-2016

31 views

Category:

Documents


0 download

DESCRIPTION

HCAL TPG and Readout. CMS HCal meeting at Rochester Oct. 19-20 Oct 2001 Tullio Grassi, Drew Baden University of Maryland Jim Rohlf Boston University. Level 1 Trigger. Detector Front End. Readout Crates. Online Controls. Event Manager. Event Builder. Level 2/3 Filter Units. - PowerPoint PPT Presentation

TRANSCRIPT

Page 1: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 1

HCAL TPG and Readout

CMS HCal meeting at Rochester Oct. 19-20 Oct 2001

Tullio Grassi, Drew BadenUniversity of Maryland

Jim RohlfBoston University

Page 2: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 2

CMS TriDAS Architecture

• Data from CMS FE to T/DAQ Readout Crates

• Level 1 “primitives”– Crossing determined

– Summing

– Tx to Level 1 Trigger

– Data is pipelined waiting decision

• Level 1 accepts cause– Tx raw data to

concentrators

– Buffered and wait for DAQ readout

• System communication via separate path (TTC)– Clock, resets, errors, L1

accepts…

Event BuilderEvent

Manager

Level 1Trigger

Detector Front End

OnlineControls

Computing Services

ReadoutCrates

Level 2/3 FilterUnits

Page 3: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 3

HCAL Contribution to T/DAQ

• Includes:– Receiver cards ( including fiber input receivers and deserializers)

– Cables to Level 1 Trigger system

– Concentrators

– VME crate CPU module

– VME crates and racks

• Everything between but not including:– Fibers from QIE FEs

– DAQ cables

Level 1Trigger

HCAL DataQIE Fibers Level 2

and DAQ

CMSHCAL

Trigger/DAQ Front End Readout Crate - Level 1 Buffer - Level 2 Concentrator - Crate CPU

Page 4: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 4

HCAL FE/DAQ Overview

Shield Wall

CPU

DAQRUI

HPD

FE MODULE

DAQ DATASLINK64 [1 Gbit/s]

18 HTRs perReadout Crate

FRONT-ENDRBXReadout Box (On detector)

READ-OUT Crate(in UXA)

Trigger Primitives

Fibers at 1.6 Gb/s3 QIE-channels per fiber

QIE

QIE

QIE

QIE

QIE

QIE

CC

A

GOL

DCC

TTC

GOL

CC

A

HTR

HTR

HTR

CAL

REGIONAL

TRIGGER

32 bits@ 40 MHz

16 bits@ 80 MHz

CC

A

Page 5: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 5

Readout Crate Components

• “BIT3” board – Commercial VME/PCI Interface to CPU– Slow monitoring

• FanOut board– FanOut of TTC stream– FanOut of RX_CK & RX_BC0

• HTR (HCAL Trigger and Readout) board– FE-Fiber input– TPs output (SLBs) to CRT– DAQ/TP Data output to DCC– Spy output

• DCC (Data Concentrator Card) board– Input from HTRs– Output to DAQ– Spy output

DCC

20 m CopperLinks 1 Gb/sDAQ

Calorimeter Regional Trigger

BIT3

Gbit Ethernet @ 1.6 Gb/s

FanOut

HTR

Front End Electronics

HTR

DCC

HTR

HTR ...

TTC fiber

Page 6: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 6

HCAL TRIGGER and READOUT Card

• I/O on front panel: – Inputs: Raw data:

• 16 digital serial fibers from QIE, 3 HCAL channels per fiber = 48 HCAL channels

– Inputs: Timing (clock, orbit marker, etc.)• LVDS

– Outputs: DAQ data output to DCC• Two connector running LVDS

• TPG (Trigger Primitive Generator, HCAL Tower info to L1) via P2/P3– Via shielded twisted pair/Vitesse– Use aux card to hold Tx daughterboards

• FPGA logic implements:– Level 1 Path:

• Trigger primitive preparation• Transmission to Level 1

– Level 2/DAQ Path:• Buffering for Level 1 Decision• No filtering or crossing determination necessary• Transmission to DCC for Level 2/DAQ readout

Page 7: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 7

HTR – “Dense” scheme

P1

DeSDeSDeS

DeS

DeS

DeS

DeS DeS

OPTICALRx

(8 LC)

P2LVDS Tx

LVDS Tx

P3

SLB -PMC

SLB -PMC

SLB -PMC

SLB -PMC

SLB -PMC

SLB -PMC

Trig

ger o

utp

ut

48 Trig

ger T

ow

ers

9U Board

DeSDeSDeS

FPGAXilinx

Vertex-2

DeS

DeS

DeS

DeS DeS

8 FE fibers24 QIE-ch’s

to DCC

OPTICALRx

(8 LC)

8 FE fibers24 QIE-ch’s

to DCC

FPGAXilinx

Vertex-2

Throughput: 17 Gb/sLatency: + 2 TCK

Page 8: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 8

“Dense” HTR

• Strong reasons to push to dense scheme– Money

• Fewer boards!

– Programmable logic vs. hardware• Avoid hardware MUXs• Maintain synchronicity

– Single FPGA per 8 channels• Both L1/TPG and L1A/DCC processing• Xilinx Vertex-2 PRO will have deserializer chips built in!

– Saves $500/board– Many fewer connections– ~20 DeS->FPGA connections replaced by 1 1.6 GHz line– Challenges:

» Layout of 1.6 GHz signals» Schedule implications for final production may have to slip ~6 months to wait for Vertex-2 PRO

• What do we give up?– Each board much more epensive– More difficult layout– Need transition board to handle TPG output

• So does ECAL – common solution will be used

– Need 2 DCC/crate (but half the number of crates!)

Page 9: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 9

Changes from HTR Demo to Final

• Front-end input– From 800MHz HP G-Links to 1600MHz TI Gigabit ethernet

• Timing– TTC daughterboard to TTC ASIC

• Core logic– Altera to Xilinx

• Trigger output– Moved to transition board

• Form factor– 6U to 9U

Output to DCC? Unchanged!!!

Page 10: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 10

Status

• Front-end emulator HTR demonstrator DCC S-Link CPU– Successful operation of each individual link

• Integration underway - Tullio goes to Boston next week

• Pre-prototype board layout– Complete, board is now being stuffed– Will have only 1 FPGA with full complement of associated parts

• Will use the TI Deserializers – not the Vertex 2 PRO

– Internal use only

• Prototype layout– Should be complete in November

• Some changes from pre-prototype, but minor

• Maryland activity is in prep for source tests and 9U board design– Preparation for testbeam summer 02 not yet started– Trying hard to meet March 02 deadline for decision on which HTR to use

for testbeam

• Energy filters still undefined

Page 11: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 11

Current HTR Timeline

Page 12: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 12

DATA CONCENTRATOR CARD

Motherboard/daughterboard design:– Build motherboard to accommodate

• PCI interfaces (to PMC and PC-MIP)

• VME interface

– PC-MIP cards for data input• 3 LVDS inputs per card

• 6 cards per DCC (= 18 inputs)

• Engineering R&D courtesy of D– 1 PMC cards for

• Buffering:

– Transmission to L2/DAQ via CERN S-Link Tx

• http://hsi.web.cern.ch/HSI/s-link/D

ata

fro

m 1

8 H

TR

car

ds

6 P

C-M

IP m

ezz

ani

ne

car

ds

- 3

LV

DS

Rx

pe

r ca

rd

CERN S-LinkInterface with DAQ

To DAQ

PMC Logic BoardBuffers 1000 Events

PCI Interfaces

P2

P0

P1

Page 13: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 13

Project Status Details DCC@BU

• VME Motherboard– Two prototypes working; 5 more

boards being built

• Link Receiver Board (LRB)– 10 second-generation boards

working

• DCC Logic Board– PCB Design complete; being

fabricated– FPGA coding underway

• Test Stand Hardware Complete– Pentium/Linux computer, TTC

System Working– Link Transmitters to simulate HRC

working– S-Link cards available

Companion LVDS Serial Link Transmitter

(for testing only)

DCC Logic Board

TTCRx

Xilinx VirtexII XC2V1000

2Mx32 DDRSDRAM

S-Link Source Card (optical fibre to DAQ)

3-Channel LVDS Serial Link Receiver

(6 used in final DCC)

PC-MIP PCI standard

Page 14: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 14

• Fanout of TTC info:– Both TTC channels fanout to each HTR and DCC– Separate fanout of clock/BC0 for TPG synchronization

• “daSilva” scheme

• Single width VME module

HCAL TIMING FANOUT Module

Page 15: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 15

Current Project Timeline

2001 2002 20032000

Prototype

New I/Os

Simple Algorithms

Pre-Prod

Corner cases, HF heavy ions

Production

Test bench

Slice Test I

FNAL source calib.

Cern Test

Beam

2004

Slice Test II

Pre-prod too short: not usefulTest bench before production ?Slice Test I with pre-production ?Vertex-2 PRO?

Demonstrator

Requirements

Resources

Links

6U board

STILL SOME UNCERTAINTIES…

Page 16: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 16

Manpower

• All Engineering/technical identified and on board.

Drew BadenPhysicist

University of MarylandLevel 3 Manager

Drew BadenPhysicist

University of MarylandHTR Task

Jim RohlfPhysicist

Boston UniversityDCC Task

Mark AdamsPhysicist

Univ. of Ill, ChicagoHRC Task

Weiming QianEngineer

Univ. of Ill, ChicagoFull-time

Eric HazenSenior Engineer

BU50%

Shouxiang WuSenior Engineer

BU100%

Chris TullyPhysicist

Princeton University

Sarah EnoPhysicist

UMD

Suichi KunoriPhysicist

UMD

Salavat Abdoulinne

UMD

Post-Doc

Silvia Arcelli

UMD 30%

Post-Doc

Rob BardSenior Engineer

UMD50%

John GigantiSenior Engineer

UMDPart-time

Hans BredenEngineer

UMD

Rich BaumEngineer

UMD

Jack TouartEngineer

UMD

Tullio GrassiEngineer/Integration

UMD

Hardware Simulation

Page 17: HCAL TPG and Readout

USCMS/Rochester. Oct 20, 2001 HCAL TriDAS 17

Project Status Summary• HTR (Maryland):

– 6U Demonstrator built and under test

• 800 Mbps G-Links works fine• Integration with FEE and DCC

underway

– 9U pre-Prototype layout done– 9U Prototype layout underway

• Still a few issues to decide– 1.6 Mbps link– FPGA choice (Vertex-2 vs Vertex-

2 PRO)– Link to Level 1 trigger

• Plan to have this board on the test bench by Dec ’01

• “HRC”– UIC engineer onboard April ‘01– Requirements have decreased,

card will be easy to complete

• DCC (BU)– DCC 9U motherboard built and

tested finished• PCI meets 33MHz spec• Card is done!

– Link Receiver Cards built and tested

• Done

– PMC logic board• First version complete• FPGA and etc. underway