high voltage ceramic capacitors - engineering center · 2020-04-23 · high voltage product...
TRANSCRIPT
© KEMET Electronics Corporation. All Rights Reserved.
High Voltage Ceramic Capacitors
June, 2019
© KEMET Electronics Corporation. All Rights Reserved.
Agenda
• What is High Voltage
• MLCC Design
• Creepage vs Clearance
• Arcing and KEMET’s ArcShieldTM
• KEMET HV Portfolio
© KEMET Electronics Corporation. All Rights Reserved.
What is High Voltage?
High Voltage Product Portfolio
10,000V1,000V100V10V1V1V
DC: >250Vdc
AC: ≥250VacCeramics
© KEMET Electronics Corporation. All Rights Reserved.
MLCCs
C = Design Capacitance
K = Dielectric Constant
A = Overlap Area
d = Ceramic Thickness
n = Number of Electrodes
C = e0KA(n-1)
d
Detailed Cross Section
Inner Electrode
End Termination
Barrier Layer
Termination Finish
Dielectric Material
© KEMET Electronics Corporation. All Rights Reserved.
What is MLCC Surface Arcing?
Electrical breakdown between the two MLCC terminations or
between one of the terminations and the internal electrodes of
the capacitor within the ceramic body.
Influences• Humidity
• Surface Contamination
• Creepage Distance
© KEMET Electronics Corporation. All Rights Reserved.
Creepage vs Clearance
Clearance
Creepage
Creepage – Spacing between conductive elements through an insulating surface
Clearance – Spacing between conductive elements through air
© KEMET Electronics Corporation. All Rights Reserved.
Creepage vs Clearance
Clearance = Creepage
© KEMET Electronics Corporation. All Rights Reserved.
The Phenomenon of Surface Arcing
Opposing
Terminations
Alternating layers create opposing
electrodes
© KEMET Electronics Corporation. All Rights Reserved.
The Phenomenon of Surface Arcing
First Counter
Electrode
Ionization of AirElectric Field
High field concentration
© KEMET Electronics Corporation. All Rights Reserved.
The Phenomenon of Surface Arcing
Electric Arc
Inception voltage < Rate Voltage
© KEMET Electronics Corporation. All Rights Reserved.
Surface Arcing Between MLCC Termination and the Internal Electrode Structure
© KEMET Electronics Corporation. All Rights Reserved.
Surface Arcing Failure Modes
Carbon Traces
Voltage Breakdown Failures
Terminal-to-Terminal Arcing Terminal-to-Active Arcing
© KEMET Electronics Corporation. All Rights Reserved.
Solutions for MLCC Surface Arcing
• Reduce electric field strength
• Reduce ionization of air at MLCC surface
• Maximizes available capacitance in a MLCC package size
Surface Coatings Serial Electrode Designs ArcShield Designs
• MLCC Coating
– Added by MLCC supplier
– Additional process step
– Critical that there is no damage to
or air gap under the coating
• PCB Coating
– Added after PCB assembly
– Additional process step
– Added cost
– Cannot rework
• Reduce electric field strength
– Available capacitance in a MLCC package
size is lowered
– Allows for higher voltage capability
– Reduces the probability of MLCC failure due
to flex crack
© KEMET Electronics Corporation. All Rights Reserved.
The Benefits of Coating Technology
Ionization of Air
Creepage Distance
© KEMET Electronics Corporation. All Rights Reserved.
Issues With Coating Technologies
Damaged CoatingElectric Arc
© KEMET Electronics Corporation. All Rights Reserved.
Serial Electrode DesignReduction of Electric Field
1uF 1000V
0.22uF 5000V
Single MLCC
Five Series MLCCs
Single Monolithic Structure
(Serial Design)0.22uF 5000V
Electric Field Distributed Across Individual MLCCs
Electric Field Distributed Across Each Serial Design
1000V
1000V 1000V 1000V 1000V 1000V
1000V 1000V 1000V 1000V 1000V
1
𝐶𝑒𝑓𝑓=
1
𝐶𝑁
© KEMET Electronics Corporation. All Rights Reserved.
Serial Electrode Design
Also known as “Serial Electrode” or “Floating Electrode” designs
Capacitive
AreaCapacitive
Area
Separation Between
Series Elements
© KEMET Electronics Corporation. All Rights Reserved.
“Serial” to “Shield” Design Comparison
“Serial” Design • With capacitors (N) in series, the
acting voltage on each capacitor is
reduced by the reciprocal of the
number of capacitors (1/N).
• Effective Capacitance is reduced:
“Shield” Design • Larger electrode area overlap A so
higher capacitance while retaining
high voltage breakdown.
• Thickness d between opposing
electrodes increased:
V/2 V/2
C =ϵoKNA
d
1
𝐶𝑒𝑓𝑓=
1
𝐶𝑁
© KEMET Electronics Corporation. All Rights Reserved.
KEMET ArcShield Technology
Shield
Electrodes
Shield
Electrodes
© KEMET Electronics Corporation. All Rights Reserved.
Explanation of Shield DesignReduction of Electric Field
Terminal-to-Terminal Arcing
Standard Design
Opposite Field extends close to terminal of opposed polarity so low energy barrier
Terminal-to-Terminal Arcing
ArcShield Design
Opposite Field is longer distance from terminal of opposed polarity increasing size of energy barrier
+-
E
+-
E
© KEMET Electronics Corporation. All Rights Reserved.
Explanation of Shield DesignDesigned for Higher Voltage
Consider a Standard Design
• In a standard overlap X7R MLCC there are 3 ways of
failing high voltage:
1. Arcing between terminal and 1st electrode of
opposite polarity
2. Arcing between terminals
3. Internal breakdown
Shield designs solve these voltage breakdown
issues by:
a. Adding a shield to prevent 1.
b. The shield also creates a barrier to 2.
c. Thicker actives for higher breakdown 3.
1.
2.
3.
+- a.b.
c.
© KEMET Electronics Corporation. All Rights Reserved.
ArcShield Key Features and Benefits
Shield Electrode Technology
Built Inside the MLCC
Patented Electrode Design • Suppresses an arc-over event while increasing available capacitance
Permanent protection!
• Competitive versions often use a non-permanent surface coating
BME X7R Dielectric
500, 630 and 1,000Vdc
0603 - 2225 Case Sizes
1.0nF – 560nF
Flexible Termination Available
“The World’s Smallest
High Voltage MLCC’s”
© KEMET Electronics Corporation. All Rights Reserved.
High Voltage Product Portfolio
20,000V10,000V5,000V3,000V2,000V1,000V630V500V
SMD Comm & Auto
SMD Mil Screened
KPS SM Series
KPS
Radial Leaded
Goldmax
HS Series
VRR/VCR Series
Pulse discharge Discharge voltage
SMD Comm
Arc-Shield
KC-LINK
© KEMET Electronics Corporation. All Rights Reserved.
HIGH VOLTAGEC900 Safety Disc
Safety SMD
ER Safety Disc
Class and Voltage Ratings:
• X1 400 VAC / Y2 250 VAC
• X1 440 VAC / Y2 300 VAC
• X1 760 VAC / Y1 500 VAC
• X1 400 VAC / Y1 250 VAC
• X1 400 VAC / Y1 400 VAC
Class and Voltage Ratings
• X1 250 VAC / Y2 250 VAC
• X2 250 VAC
• Up to 5 kV Pulse Capable
• Industrial Grade
Case Sizes:
• 1808-2225
Lead Styles:
• Straight
• Outside
• Vertical
Class and Voltage Ratings:
• X1 440 VAC / Y2 250 VAC
• X1 440 VAC / Y2 300 VAC
• X1 760 VAC / Y1 500 VAC
Lead Styles:
• Straight
• Outside
• Vertical
AC, AS, AH ERO, ERK, ERP
KJ Safety DiscClass and Voltage Ratings:
• X1 440 VAC / Y1 400 VAC
• X1 400 VAC / Y1 250 VAC
Lead Styles:
• Straight
• Outside
• Vertical
KJN, KJY
COMING
SOON
© KEMET Electronics Corporation. All Rights Reserved.
Creepage vs Clearance
Clearance
Creepage
© KEMET Electronics Corporation. All Rights Reserved.
Creepage vs Clearance
Clearance
CreepageClearance
Creepage
© KEMET Electronics Corporation. All Rights Reserved.
More InformationComponent Edge
https://search.kemet.com/component-edge/#/
© KEMET Electronics Corporation. All Rights Reserved.
More InformationComponent Edge
https://search.kemet.com
© KEMET Electronics Corporation. All Rights Reserved.
MAKING THE WORLD A BETTER, SAFER,
MORE CONNECTED PLACE TO LIVE.
KEMET100.COM #KEMET100
Thank you!
Mark Laps Technical Product Manager - Ceramics
KEMET Electronics