div class=ts-pagebutton class=gotoPage data-page=1Page 1button div class=ts-imageimg data-url=hipca-journal-no-16-figure-3-comparison-of-process-operating-window-for-haslhtmlpage=1 data-page=1 class=ts-thumb lazyload alt=Page 1: HIPCA Journal No 16 Figure 3 Comparison of process operating window for HASL with different alloys With tin-lead solder the copper concentration must be maintained below 03% loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader031vdocumentinreader031viewer20220418125e589bc51b51530af81e245dhtml5thumbnails1jpg width=140 height=200 divdivdiv class=ts-pagebutton class=gotoPage data-page=2Page 2button div class=ts-imageimg data-url=hipca-journal-no-16-figure-3-comparison-of-process-operating-window-for-haslhtmlpage=2 data-page=2 class=ts-thumb lazyload alt=Page 2: HIPCA Journal No 16 Figure 3 Comparison of process operating window for HASL with different alloys With tin-lead solder the copper concentration must be maintained below 03% loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader031vdocumentinreader031viewer20220418125e589bc51b51530af81e245dhtml5thumbnails2jpg width=140 height=200 divdivdiv class=ts-pagebutton class=gotoPage data-page=3Page 3button div class=ts-imageimg data-url=hipca-journal-no-16-figure-3-comparison-of-process-operating-window-for-haslhtmlpage=3 data-page=3 class=ts-thumb lazyload alt=Page 3: HIPCA Journal No 16 Figure 3 Comparison of process operating window for HASL with different alloys With tin-lead solder the copper concentration must be maintained below 03% loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader031vdocumentinreader031viewer20220418125e589bc51b51530af81e245dhtml5thumbnails3jpg width=140 height=200 divdivdiv class=ts-pagebutton class=gotoPage data-page=4Page 4button div class=ts-imageimg data-url=hipca-journal-no-16-figure-3-comparison-of-process-operating-window-for-haslhtmlpage=4 data-page=4 class=ts-thumb lazyload alt=Page 4: HIPCA Journal No 16 Figure 3 Comparison of process operating window for HASL with different alloys With tin-lead solder the copper concentration must be maintained below 03% loading=lazy src=data:imagegifbase64iVBORw0KGgoAAAANSUhEUgAAAAIAAAACCAQAAADYv8WvAAAAD0lEQVR42mP8X8AwAgiABKBAv+vAXklAAAAAElFTkSuQmCC data-src=https:reader031vdocumentinreader031viewer20220418125e589bc51b51530af81e245dhtml5thumbnails4jpg width=140 height=200 divdiv