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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.

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Electronic Costing & Technology Experts

www.systemplus.fr21 rue la Nouë Bras de Fer44200 Nantes – France Phone : +33 (0) 240 180 916 email : [email protected]

June 2015 – Version 1 – Written by Romain Fraux

http://www.systemplus.fr/index.php?lang=ge&page=home.php

http://www.systemplus.fr/index.php?lang=ge&page=home.php

mailto:[email protected]

mailto:[email protected]

STMicroelectronics LSM6DS3 6-Axis IMU

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Glossary1. Overview / Introduction 4

– Executive Summary

– Reverse Costing Methodology

2. Company Profile 7– STMicroelectronics

– LSM6DS3 Characteristics

3. Physical Analysis 15– Synthesis of the Physical Analysis

– Physical Analysis Methodology

– Package 18

– Package Views & Dimensions

– Package Pin Out

– Package Opening

– Wire Bonding Process

– Package Cross-Section

– ASIC Die 37

– View, Dimensions & Marking

– Delayering

– Main Blocks Identification

– Cross-Section

– Process Characteristics

– MEMS Die 52

– View, Dimensions & Marking

– Bond Pad Opening & Bond Pads Details

– Cap Removed & Cap Details

– Sensing Areas Details (Gyro & Accelerometer)

– Cross-Section (Sensor, Cap & Sealing)

– Process Characteristics

– Comparison with ST LSM6DS0 6-Axis IMU

4. Comparison with IMU from Bosch and InvenSense 92

5. Manufacturing Process Flow 100– Global Overview

– ASIC Front-End Process

– ASIC Wafer Fabrication Unit

– MEMS Process Flow

– MEMS Wafer Fabrication Unit

– Packaging Process Flow

– Package Assembly Unit

6. Cost Analysis 118– Main steps of economic analysis

– Yields Hypotheses

– ASIC Front-End Cost

– ASIC Back-End 0 : Probe Test & Dicing

– ASIC Wafer & Die Cost

– MEMS Front-End Cost

– MEMS Back-End 0 : Probe Test & Dicing

– MEMS Front-End Cost per process steps

– MEMS Wafer & Die Cost

– Back-End : Packaging Cost

– Back-End : Packaging Cost per Process Steps

– Back-End : Final Test Cost

– LSM6DS3 Component Cost

7. Estimated Price Analysis 144– Manufacturer Financial Ratios

– Estimated Selling Price

8. Cost & Price Comparison with Bosch and InvenSense 149


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• This full reverse costing study has been conducted to provide insight on technology data,

manufacturing cost and selling price of the STMicroelectronics LSM6DS3 6-Axis IMU.

• By achieving 50% footprint reduction and decreasing considerably the power consumption

compared to ST’s previous generation IMU, the LSM6DS3 is ready to attack the mobile market

where the competition on price is stronger than ever.

• In order to obtain this size of only 2.5x3x0.85mm, STMicroelectronics introduced many new

features to its device.

Indeed, the classical LGA 2-layer PCB has been replaced by an uncommon 3-layers PCB

The MEMS gyro and accelerometer have also been redesigned to be able to shrink the die

size.

On the processes side, new techniques borrowed from competitors products has been

introduced in the MEMS fabrication and also a whole new process for the ASIC is now used

allowing to embed 8KB of FIFO memory.

• The LSM6DS3 is targeted for battery-powered smart sensor systems to be embedded in mobile and

wearable devices and innovative objects for the Internet of Things (IoT).

• The report includes a detailed technology and cost comparison with ST’s previous generation

LSM6DS0 and with leading edge 6-Axis IMUs from Bosch Sensortec (BMI160) and InvenSense (MPU-

6500).


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The reverse costing analysis is conducted in 3 phases:

Teardown analysis

• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.

Costing analysis

• Setup of the manufacturing environment• Cost simulation of the process steps

Selling price analysis

• Supply chain analysis• Analysis of the selling price


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• Package: LGA 16-pin

• Dimensions: 2.5 x 3.0 x 0.85mm

• Pin Pitch: 0.5mm

Orientation of Axes (from datasheet)

Package top view Package bottom view

Package Side View

2.5mm

0.85mm

3.0mm

• Marking:

S2

438


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• The die marking includes the logo of STMicroelectronics and:

VA59A

2014

ASIC Die Marking


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• The die marking includes the logo of STMicroelectronics and:

CK436A

2014

MEMS Die Marking


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Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.

Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).

These results are open for discussion. We can reevaluate this circuit with your information. Please contact us:

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