hong xiao, ph. d. k.htm 1 chapter 2 introduction of ic fabrication hong xiao, ph. d....

Hong Xiao, Ph. D. www2.austin.cc.tx.us/HongXiao/Book.htm

1

Chapter 2Introduction of IC

Fabrication Hong Xiao, Ph. D.

[email protected]


2

Objectives

• Define yield and explain its importance • Describe the basic structure of a cleanroom.• Explain the importance of cleanroom protocols• List four basic operations of IC processing• Name at least six process bays in an IC fab• Explain the purposes of chip packaging• Describe the standard wire bonding and flip-chip

bump bonding processes


3

Wafer Process Flow

Materials

Design

Masks

IC Fab

Test

Packaging

Final Test

Thermal Processes

Photo-lithography

Etch PR strip

Implant PR strip

Metallization CMPDielectric deposition

Wafers


4

Fab Cost

• Fab cost is very high, > $1B for 8” fab

• Clean room

• Equipment, usually > $1M per tool

• Materials, high purity, ultra high purity

• Facilities

• People, training and pay


5

Wafer Yield

total

goodW Wafers

WafersY


6

Die Yield

total

goodD Dies

DiesY


7

Packaging Yield

total

goodC Chips

ChipsY


8

Overall Yield

YT = YWYDYC

Overall Yield determines whether a fab is making profit or losing money


9

How Does Fab Make (Loss) Money

• Cost: – Wafer (8”): ~$150/wafer*

– Processing: ~$1200 ($2/wafer/step, 600 steps)– Packing: ~$5/chip

• Sale:– ~200 chips/wafer– ~$50/chip (low-end microprocessor in 2000)

*Cost of wafer, chips per wafer, and price of chip varies, numbers here are choosing randomly based on general information.


10

How Does a Fab Make (Loss) Money

• 100% yield: 150+1200+1000 = $2350/wafer• 50% yield: 150+1200+500 = $1850/wafer• 0% yield: 150+1200 = $1350/wafer

• 100% yield: 20050 = $10,000/wafer• 50% yield: 10050 = $5,000/wafer• 0% yield: 050 = $0.00/wafer

• 100% yield: 10000 2350 = $7650/wafer• 50% yield : 5000 1850 = $3150/wafer• 0% yield : 0 1350 = $1350/wafer

Cost:

Sale:

Profit Margin:


11

Question

• If yield for every process step is 99%, what is the overall processing yield after 600 process steps?


12

Answer

• It equals to 99% times 99% 600 times

• 0.99600 = 0.0024 = 0.24%

• Almost no yield


13

Throughput

• Number of wafers able to process– Fab: wafers/month (typically 10,000)– Tool: wafers/hour (typically 60)

• At high yield, high throughput brought


14

Defects and Yield

nDAY

)1(

1


15

Yield and Die Size

Y = 28/32 = 87.5% Y = 2/6 = 33.3%

Killer Defects


16

Illustration of a Production Wafer

Test die

Die


17

Illustration of a Production Wafer

Scribe Lines

Dies

TestStructures


18

Clean Room

• Artificial environment with low particle counts

• Started in medical application for post-surgery infection prevention

• Particles kills yield

• IC fabrication must in a clean room


19

Clean Room

• First used for surgery room to avoid bacteria contamination

• Adopted in semiconductor industry in 1950

• Smaller device needs higher grade clean room

• Less particle, more expensive to build


20

Clean Room Class

• Class 10 is defined as less than 10 particles with diameter larger than 0.5 m per cubic foot.

• Class 1 is defined as less than 1 such particles per cubic foot.

• 0.18 mm device require higher than Class 1 grade clean room.


21

Cleanroom Classes

0.1

1

10

100

1000

10000

100000

Class 100,000Class 10,000Class 1,000

Class 100

Class 10Class 1

# of

par

ticle

s /

ft3

0.1 1.0 10

Particle size in micron

Class M-1


22

Definition of Airborne Particulate Cleanliness Class per Fed. Std. 209E

Class

Particles/ft3

0.1 m 0.2 m 0.3 m 0.5 m 5 m

M-1 9.8 2.12 0.865 0.28

1 35 7.5 3 1

10 350 75 30 10

100 750 300 100

1000 1000 7

10000 10000 70


23

Effect of Particles on Masks

Particles on Mask

Stump on +PR

Hole on PR

Film Film

Substrate Substrate


24

Effect of Particle Contamination

Partially Implanted Junctions

Particle

Ion Beam

Photoresist

Screen Oxide

Dopant in PR


25

Cleanroom Structure

Process Area

Equipment AreaClass 1000

Equipment AreaClass 1000

Raised Floor with Grid Panels

Return Air

HEPA Filter

Fans

Pump, RF and etc.

Process Tool

Process Tool

Makeup Air Makeup Air

Class 1


26

Mini-environment

• Class 1000 cleanroom, lower cost

• Boardroom arrangement, no walls between process and equipment

• Better than class 1 environment around wafers and the process tools

• Automatic wafer transfer between process tools


27

Mini-Environment Cleanroom

Class 1000

Class 1000

Raised Floor with Grid Panels

Return Air

HEPA Filter

Fans

Pump, RF and etc.

Process Tool

Makeup Air Makeup Air

Process Tool

HEPA Filter

< Class 1


28

Gowning Area

Gown Racks

Benches

Shelf of Gloves, Hair and Shoe Covers Disposal Bins

Wash/Clean Stations

Storage

Shelf of Gloves

Shelf of Gloves

Entrance

To Cleanroom


29

IC Fabrication Process Module

Photolithography

Thin film growth, dep. and/or CMP

Etching

PR Stripping PR Stripping

Ion Implantation

RTA or Diffusion


30

Illustration of Fab FloorProcess Bays

Gowning Area

Corridor

Equipment Areas

Sliding Doors

Service Area


31

Mini-environment Fab Floor

Gowning AreaEmergency Exits

Service Area

Process and metrology tools


32

Wet Processes

DryDryEtch, PR strip, or clean Rinse


33

Horizontal Furnace

Center Zone

Flat Zone

Distance

Temperature

Heating Coils

Quartz Tube Gas flow

Wafers


34

Vertical FurnaceProcess Chamber

Wafers

Tower

Heaters


35

Schematic of a Track Stepper Integrated System

Hot Plates

Prep Chamber

Chill Plates

Chill PlatesSpin Coater

Developer

Stepper

Wafer Movement

Wafer


36

Cluster Tool with Etch and Strip Chambers

Transfer Chamber

PR Strip Chamber

Loading Station

Etch Chamber

PR Strip Chamber

Etch Chamber

Unloading Station

Robot


37

Cluster Tool with Dielectric CVD and Etchback Chambers

Transfer Chamber

Loading Station

PECVD Chamber

O3-TOES Chamber

Unloading Station

Robot

Ar Sputtering Chamber


38

Cluster Tool with PVD Chambers

Transfer Chamber

Loading Station

Ti/TiN Chamber

AlCu Chamber

Unloading Station

Robot

AlCu Chamber

Ti/TiN Chamber


39

Dry-in Dry-out CMP System

Wafer Loading and Standby

Post-CMP Clean

Rinse

Dryer and Wafer Unloading

Multi-head Polisher

Polishing Pad

Clean Station

Polishing Heads


40

Process Bay and Equipment Areas

Process Area

Equ

ipm

ent A

rea

Equ

ipm

ent A

rea

Process Tools

Tab

les

For

PC

and

M

etro

logy

Too

lsService Area

Sliding Doors

Wafer Loading Doors


41

Test Results

Failed die


42

Chip-Bond Structure

Chip (Silicon)Chip Backside Metallization

SolderSubstrate Metallization Substrate (Metal or Ceramic)

Microelectronics Devices and Circuits

Melt and Condense


43

Wire Bonding

Metal Wire

Formation of molten metal ball

Bonding Pad Bonding Pad Bonding Pad

Press to make contact

Head retreat

Wire Clamp


44

Wire Bonding

LeadBonding Pad Bonding Pad Lead

Lead contact with pressure and heat

Clamp closed with heat on to break the wire


45

IC Chip with Bonding Pads

Bonding Pads


46

IC Chip Packaging

Pins

Chip

BondingPad


47

Chip with Bumps

Bumps


48

Flip Chip Packaging

Chip

Bumps

Socket Pins


49

Bump Contact

Chip

Bumps

Socket Pins


50

Heating and Bumps Melt

Chip

Bumps

Socket Pins


51

Flip Chip Packaging

Chip

Socket Pins


52

Molding Cavity for Plastic Packaging

Bonding Wires IC Chip

Lead Frame

PinsChip Bond Metallization

Top Chase

Bottom Chase

Molding Cavity


53

Ceramic Seal

Ceramic Cap

Bonding Wires IC Chip

Lead Frame, Layer 1

Pins

Cap Seal Metallization

Chip Bond Metallization

Layer 2Layer 2


54

Summary

• Overall yield • Yield determines losing money or making

profit• Cleanroom and cleanroom protocols • Process bays• Process, equipment, and facility areas• Die test, wafer thinning, die separation, chip

packaging, and final test

hong xiao, ph. d. k.htm 1 chapter 2 introduction of ic fabrication hong xiao, ph. d....

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