how eliminating flying lead igbt driver interconnect improves performance and reliability
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CONFIDENTIAL (c) 2012 AgileSwitch, LLC
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How Eliminating Flying Lead IGBT Driver Interconnect
Improves Performance and Reliability
Renewable Energy Trends
• Solar/PV installations to reach 24 GW, up from 19 GW in 2010. (IMS Research)
• Wind power installations will increase from 236 GW in 2011 to 563 GW in 2017. (Pike Research, 2011)
• 5 million cars manufactured in 2016 will be full HEV, plug-in HEV or EV. (Yole Développement, 2011)
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Renewable Energy Applications Have Increased Performance Requirements For IGBTs
• Decreased $/Watt • Higher current and voltage requirements• Faster switching speeds• Increased heat sensitivity• Higher efficiencies• Reducing switching
losses
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“Tuning” Drivers To IGBTs Help Address These Requirements
• IGBT Driver requirements will vary across IGBT manufacturers and within their product line.
• Optimizing driver design includes adjusting:– Gate resistor values– Desat requirements– Cross over timing– Soft turn off and/or Active HV Clamping
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• Increased requirements to continuously monitor the performance and functionality of the driver and overall system
• IGBT driver designs should account for monitoring the following fault scenarios and conditions:– Separate Hi/Lo fault signals– Desat timing and levels– UVLO– IGBT temperature– Ambient temperature
Increasing Fault Detection Further Enables Safe And Secure Operation
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Plug And Play Improves Manufacturability
• A much more efficient mechanical footprint• Integrating the IGBT module and driver into a
single subassembly – Dramatic increase in producibility and
serviceability• Combined offering allows a more compact and
robust design
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Direct Connection To The IGBT Lowers Inductance And Improves Overall Performance
Measurable benefits include:–Higher frequency operation– Faster driver transitions–Reduced Heat– Improved lifetime reliability
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Plug and Play vs. Flying Lead: Direct
Gate Drive with 1.8 Ohm Resistor - Direct Connection; 1700V/1000A Fuji PrimePack
Note: 1.0 usec turn on after rising edge
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Plug and Play vs. Flying Lead: Flying Lead
Gate Drive with 1.8 Ohm Resistor - 6 inch lead; 1700V/1000A Fuji PrimePACK
Note: 1.1 usec turn on after rising edge
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Plug and Play vs. Flying Lead: Direct
Gate Drive with 1.8 Ohm Resistor - Direct Connection; 1700V/1000A Fuji PrimePack
Note: IGBT turns off 4.15 us after the falling edge.
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Plug and Play vs. Flying Lead: Flying Lead
Gate Drive with 1.8 Ohm Resistor - 6 inch lead; 1700V/1000A Fuji PrimePACK
Note: IGBT turns off 4.3 us after the falling edge.
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Lead Length Correlation to Gate Resistors
The previous slides indicate that flying leads have a real effect on the switching speed of the IGBT.
This slowing is the equivalent of increasing the Gate Resistor from 1.8 Ohms to 3.0 Ohms in a direct connect system using the same gate driver.
How does this affect performance?
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Power Dissipation of the IGBT: Direct Connection
Note: Tj ave is 107.7 C . Inverter loss is 184W and 304W ON/OFF.
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Power Dissipation of the IGBT: Flying Lead
Note Tj ave is 113.4 C. (+6C) Inverter loss is 277W (+93W) and 322W (+18W) ON/OFF (111W total).
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Direct Connect = Increased Efficiency
This indicates that there is additional wattage lost in the slower turn on/off times and reflected in higher junction temperature.This translates to better performance with improved Long Term Life and Reliability.
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• Increased monitoring of the performance and functionality of the driver and IGBT can lead to better reliability.
• Next generation IGBT driver designs should account for monitoring the following fault scenarios and conditions:– Separate Hi/Lo fault signals– Desat timing and levels– UVLO– High Voltage monitoring– IGBT temperature– Ambient temperature
Future: Increasing Fault Detection Further Enables Safe And Secure Operation
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Designing for Plug And Play is Challenging, But Worth It
• The electrical performance and isolation requirements for a gate driver are the same for a plug and play design and a flying lead design.
• However, Plug and play design is more demanding since the ambient temperature of the Driver may be higher due to the close proximity to the IGBT.
• And, additional mechanical requirements and a smaller PCB footprint can make it longer to design and more costly to manufacture.
How to Reach Us
Rob WeberAlbert Charpentier
1650 Arch StreetSuite 1905
Philadelphia, PA [email protected]
484-483-3256
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