Low Stringing Thermal Stability

Fast Set Speed

Temperature Resistance

Adhesion

5

4

3

2

1

0

KizenMETEVA

As the next generation hot melt adhesive for case and carton sealing, Kizen offers enhanced performance over current metallocene and EVA options. The following chart compares the three adhesive technologies based on five key performance indicators.

How Kizen® Compares toMetallocenes and EVAs

For more information on how Kizen can improve performance on your production lines, call 800-7-BOSTIK, or visit www.bostik.com/kizen today.

KIZEN PERFORMANCE COMPARISON CHART

By having a fast set speed, Kizen streamlines operational processes and enables manufacturers to meet high output demands more easily. It can also handle different machine compression timing, enabling seemless conversion to one adhesive across production lines.

FAST SET SPEED

Because of its good thermal stability, Kizen is low charring and prevents nozzle clogging. This helps reduce equipment issues and enables the adhesive to work seamlessly with melt-on-demand and intermittent dispensing systems.

THERMAL STABILITY

Kizen's temperature resistance range helps prevent pop-opens once packages leave the production line. Also, by being able to withstand end-use temperature fluctuations, Kizen contributes to less package returns.

TEMPERATURE RESISTANCE

With low viscosity, Kizen provides good wet out to various substrates, including difficult ones like highly recycled board stock. Additionally, it offers specific adhesion and excellent fiber tearing bonds.

ADHESION

Kizen's low stringing properties facilitate the use of intermittent coating systems and reduce adhesive consumption. Also, by lowering overspray, it allows for less clean up and improved overall packaging aesthetics.

LOW STRINGING

The information, data, and recommendations made herein are based on Bostik’s research only, are not guaranteed to be accurate or warranted in any way, and are provided AS-IS. The performance of the products, their shelf life, and application characteristics will depend on many variables, including but not limited to the kind of materials to which the product will be applied, the environment in which the product is stored or applied, and the equipment used for application. Any change in any of these variables can a�ect the products’ performance. Since the conditions and methods of use of the products are beyond our control, Bostik expressly disclaims any and all warranties, liabilities and damages that may arise from any use of the products, the results therefrom, or your reliance on the information contain herein. It is the buyer’s obligation, prior to using the products, to test the suitability of the products for an intended use under the conditions that will exist at the time of the intended use. Bostik does not warrant the product’s suitability for any particular application. The information provided herein relates only to the speci�c products designated and may not be applicable when such products are used in combination with other materials or in any process. Bostik encourages you to always read and understand the TDS and SDS for all products before use. Nothing contained herein constitutes a license to practice under any patent, and it should not be construed as an inducement to infringe any patent.