hp z2 mini workstation - gc3.de · hp external ultra-slim dvd-rw drive description exte rn a l 9.5m...

Q u i c k S pe c s HP Z2 Mini Workstation

Ov e rv i e w

c 05262508 DA 15679Wo rl d w i d e V e rsi o n 1 No v e m b e r15,2016 P a g e 1

HP Z2 Mini Workstation

Front View

1.P o w e rB u tto n

2.H e a d se t

3.U S B 3.0c h a rg i n g d a ta po rt

4.U S B 3.0d a ta po rt


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HP Z2 Mini Entry, back view

1. H DD L ED 6. RJ-45(Eth e rn e t)

2. S e c u ri ty slo t 7. (2)U S B 3.0po rts

3. (1) 8. DC c a b l e c l i p

4. C o v e rl a tc h 9.

5. S e ri a l po rt(o pti o n a l) 10. DC In


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HP Z2 Mini Performance, back view

1. H DD L ED 7. (2)U S B 3.0po rts

2. S e c u ri ty slo t 8.

3. 9. DC c a b l e c l i p

4. C o v e rl a tc h 10.

5. S e ri a l po rt(o pti o n a l) 11.DC In

6. RJ-45(Eth e rn e t)


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HP Z2 Mini Entry, Internal View

1. S A T A H DD/S S D (9.5m m ) 1. M .230m m WL A N/B T

2. C P U h e a tsi n k 2. (2)S ODIM M m e m o ry slo ts

3. C P U b l o w e r

4. M .280m m (P C Ie S S D)


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HP Z2 Mini Performance, Internal View

1. 1. GP U h e a tsi n k (u n d e rn e a th H DD/S S D c a g e )

2. C P U h e a tsi n k 2. M .230m m WL A N/B T

3. C P U b l o w e r 3. (2)S ODIM M m e m o ry slo ts

4. M .280m m (P C Ie S S D) 4. GP U b l o w e r


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Form Factor M i n i Fo rm Fa c to r

Operating Systems P re i n sta l l e d :Wi n d o w s10P ro 641

Wi n d o w s7P ro f e ssi o n a l 64(a v a i l a b l e th ro u g h d o w n g ra d e ri g h tsf ro m Wi n d o w s10P ro )2

H P L i n u x ®-re a d yRe d H a t®En te rpri se L i n u x Wo rk sta ti o n (1y e a rpa pe rl i c e n se a v a i l a b l e ;P re i n sta l l n o ta v a i l a b l e )

S u ppo rte d :Re d H a t®En te rpri se L i n u x D e sk to p6.7,7.2S U S E L i n u x ®En te rpri se D e sk to p11S P 4,12S P 1

Notes: Fo rd e ta i l e d O S /h a rd w a re su ppo rti n f o rm a ti o n f o rL i n u x ,se e :h ttp://w w w .h p.c o m /su ppo rt/l i n u x_h a rd w a re _m a tri x

1. No ta l l f e a tu re sa re a v a i l a b l e i n a l l e d i ti o n so rv e rsi o n so f Wi n d o w s.S y ste m sm a y re qu i reu pg ra d e d a n d /o rse pa ra te l y pu rc h a se d h a rd w a re ,d ri v e rs,so f tw a re o rB IO S u pd a te to ta k ef u l l a d v a n ta g e o f Wi n d o w sf u n c ti o n a l i ty .Wi n d o w s10i sa u to m a ti c a l l y u pd a te d ,w h i c h i sa l w a y se n a b l e d .IS P f e e sm a y a pply a n d a d d i ti o n a l re qu i re m e n tsm a y a ppl y o v e rti m e f o ru pd a te s.S e e h ttp://w w w .w i n d o w s.c o m

2. T h i ssy ste m i spre i n sta l l e d w i th Wi n d o w s7P ro f e ssi o n a l so f tw a re a n d a lso c o m e sw i th al i c e n se a n d m e d i a f o rWi n d o w s10P ro so f tw a re .Y o u m a y o n l y u se o n e v e rsi o n o f th eWi n d o w sso f tw a re a ta ti m e .S w i tc h i n g b e tw e e n v e rsi o n sw i l l re qu i re y o u to u n i n sta l l o n ev e rsi o n a n d i n sta l l th e o th e rv e rsi o n .Y o u m u stb a c k u pa l l d a ta (f i l e s,ph o to s,e tc .)b e f o reu n i n sta l l i n g a n d i n sta l l i n g o pe ra ti n g sy ste m sto a v o i d l o sso f y o u rd a ta .


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Processors*

Name CoresClockSpeed(GHz)

Intel® TurboBoost

Technology1

Cache(MB)

MemorySpeed(MT/s)

Hyper-Threading

IntegratedGraphics

Featuring

Technology

TDP(W)

Z2 Mini G3 Performance base unit

In te l®X e o n ®pro c e sso rE3-1245v5

4 3.5 3.9 8 2133 YIn te l H D Gra ph i c s

P 530Y 80W

In te l®X e o n ®pro c e sso rE3-1225v5

4 3.3 3.7 8 2133 NIn te l®H D Gra ph i c s

P 530Y 80W

In te l®C o re T M i 7-6700pro c e sso r

4 3.4 4.0 8 2133 YIn te l®H D Gra ph i c s

530Y 65W



530Y 65W


2 3.7 N/A 3 2133 NIn te l®H D Gra ph i c s

530N 51W

Z2 Mini G3 Entry base unit


4 3.4 4.0 8 2133 YIn te l®H D Gra ph i c s

530Y 65W



530Y 65W


2 3.7 N/A 3 2133 NIn te l®H D Gra ph i c s

530N 51W

1T h e spe c i f i c a ti o n ssh o w n i n th i sc o l u m n re pre se n tth e m a x i m u m tu rb o f re qu e n c y w i th o n e c o re a c ti v e .T u rb o b o o stste ppi n g o c c u rsi n 100M H zi n c re m e n ts.P ro c e sso rsth a td o n o th a v e tu rb o f u n c ti o n a l i ty a re d e n o te d a sN/A .

NOTES:In te g ra te d In te l®H D g ra ph i c sP 530i ssu ppo rte d o n a l l In te l ®X e o n ®E3pro c e sso rsIn te l®X e o n ®E3,In te l C o re i 3a n d In te l P e n ti u m pro c e sso rsc a n su ppo rte i th e rEC C o rn o n -EC C m e m o ry ;In te l®C o re i 5/i 7pro c e sso rso n ly su ppo rtn o n -EC C m e m o ry .

*M u lti c o re i sd e si g n e d to i m pro v e pe rf o rm a n c e o f c e rta i n so f tw a re pro d u c ts.N o ta l l c u sto m e rso rso f tw a re a ppl i c a ti o n sw i l ln e c e ssa ri l y b e n e f i tf ro m u se o f th i ste c h n o l o g y .P e rf o rm a n c e a n d c l o c k f re qu e n c y w i l l v a ry d e pe n d i n g o n a ppl i c a ti o n w o rk l o a d a n d

Color S pa c e g re y w i th b l a c k c h ro m e a c c e n ts

Convertibility T h e Z 2M i n i G3c a n e i th e rb e pl a c e d f l a to n th e d e sk to po rm o u n te d b e h i n d a d i spl a y *o ru n d e ra d e sk .

* A d d i ti o n a l H P H a rd w a re i sn e e d e d f o rth e VES A M o u n tf o rth e d i spl a y .Expansion Slots(se e sy ste m b o a rd se c ti o nf o rm o re d e ta i l s)

180m m M .2slo t(P C Ie Ge n 3x 4)130m m M .2slo t(P C Ie Ge n 3x 1)*

*Fo rWL A N/B T M .2m o d u l e o n l y

Expansion Bays (se esy ste m b o a rd se c ti o n f o rm o re d e ta i ls)

1i n te rn a l 2.5"b a y (f o rFo rS A T A H DDs&S S Dso n ly o n ly )

Front I/O P o w e rb u tto n


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Slide I/O 1U S B 3.0C h a rg i n g D a ta P o rt,1U S B 3.0d a ta po rt,c o m b o h e a d se t/m i c ro ph o n e po rt

Rear I/O Z2 Mini Entry: 3Di spl a y P o rt (DP 1.2)o u tpu tsf ro m In te l ®H D g ra ph i c s,2U S B 3.0po rts,1se ri a l po rt(o pti o n a l),RJ-45(L o M )Z2 Mini Performance1: 4 (DP 1.2)o u tpu tsf ro m NVIDIA ®Q u a d ro ®M 620g ra ph i c s,2U S B3.0po rts,2U S B 3.1G1T y pe -C po rts,1se ri a l po rt(o pti o n a l),RJ-45(L o M )

NOTE 1: C a pa b l e o f su ppo rti n g 6d i spl a y s.6d i spl a y so l u ti o n i sa c h i e v e d u si n g a c o m b i n a ti o n o f In te l®H D g ra ph i c sa n d NVIDIA Q u a d ro ®g ra ph i c si sON L Y su ppo rte d o n Wi n d o w s10.

Chassis Dimensions(H x W x D)

S ta n d a rd d e sk to po ri e n ta ti o n :58x 216x 216m m (2.28x 8.5x 8.5i n )

Weight Ex a c tw e i g h tsd e pe n d u po n c o n f i g u ra ti o n ;

M i n i m u m We i g h t:2.04k g (4.50l b )T y pi c a l We i g h t*:2.08k g (4.59l b )M a x i m u m We i g h t:2.11k g (4.65l b )

M a x S u ppo rte d We i g h t(d e sk to po ri e n ta ti o n ):35k g (77l b )

*C o n f i g u re d w i th 12.5"h a rd d ri v e ,1P C Ie S S D,WL A N m o d u l e ,2DIM M sa n d 1NVIDIA ®Q u a d ro ®g ra ph i c sc a rd

Temperature Ope ra ti n g :40°to 95°F (5°to 35°C )No n -o pe ra ti n g :-40°to 140°F (-40°to 60°C )

Notes: De ra te th e m a x i m u m o pe ra ti n g te m pe ra tu re b y o n e d e g re e C (1.8d e g re e sF)f o re v e ry 305m(1,000f t)a lti tu d e o v e r1,524m (5,000f t).

Humidity Ope ra ti n g :8%to 85%No n -o pe ra ti n g :8%to 90%

Maximum Altitude(non-pressurized)

Ope ra ti n g :3,000m (10,000f t)No n -o pe ra ti n g :9,100m (30,000f t).

Power Supply Z 2M i n i G3En try :135W88%Ef f i c i e n c y a t115Va c

Z 2M i n i G3P e rf o rm a n c e :200W89%Ef f i c i e n c y a t230Va c

NOTES: C u sto m e rspl a c i n g th e i rsy ste m i n a n e n c l o su re sh o u l d d e si g n th e i rso l u ti o n to a c c o m m o d a teth e si z e o f th e e x te rn a l po w e rsu pply f o rth e Z 2M i n i

Chipset In te l®C 236c h i pse t

Memory 2S ODIM M slo ts,su ppo rti n g u pto 32GB EC C /n o n -EC C ,DDR42133M T /s

T h e C P U sd e te rm i n e th e spe e d a tw h i c h th e m e m o ry i sc l o c k e d .If a 2133M T /sc a pa b l e C P U i su se d i n th e sy ste m ,th e m a x i m u mspe e d th e m e m o ry w i l l ru n a ti s2133M T /sre g a rd l e sso f th e spe c i f i e d spe e d o f th e m e m o ry .Note: T ra n sf e rra te su pto 2133M T /sWorkstation ISVCertifications

S e e th e l a te stl i sto f c e rti f i c a ti o n sa th ttp://w w w .h p.c o m /u n i te d -sta te s/c a m pa i g n s/w o rk sta ti o n s/pa rtn e rsh i ps.h tm l


S u ppo rte d C o m po n e n ts


Processors FactoryConfigured Option Kit

Intel® Xeon® processor E3-1200 v5 family

In te l®X e o n ®E3-1225v 53.321334C C P U 1 Y N

In te l®X e o n ®E3-1245v 53.521334C C P U 1 Y N

In te l®C o re i 7-67003.421334C C P U 3 Y N



NOTE 1:On ly su ppo rte d o n Z 2M i n i P e rf o rm a n c e B a se U n i tNOTE 2: T h e se pro c e sso rsu ppo rte i th e rEC C o rn o n -EC C m e m o ryNOTE 3: T h e se pro c e sso rssu ppo rto n ly n o n -EC C m e m o ryNOTE: In te l®In te g ra te d Gra ph i c sP 530f o rX e o n ®pro c e sso rssu ppo rtsw o rk sta ti o n -spe c i f i c g ra ph i c sd ri v e rsf o ri m pro v e d c o m pa ti b i l i ty a n d pe rf o rm a n c e o n se l e c tpro f e ssi o n a l a ppl i c a ti o n s,c o m pa re d toIn te l®H D Gra ph i c s530.

Monitors / Displays FactoryConfigured

Option Kit Option Kit PartNumber

H P Dre a m C o l o rZ 24x P ro f e ssi o n a l D i spl a yH P Dre a m C o l o rZ 27x P ro f e ssi o n a l D i spl a yH P Z 22n N a rro w B e z e l IP S D i spl a yH P Z 23n N a rro w B e z e l IP S D i spl a yH P Z 24n N a rro w B e z e l IP S D i spl a yH P Z 24n f N a rro w B e z e l IP S D i spl a yH P Z 24n qNa rro w B e z e l IP S D i spl a yH P Z 24sIP S U H D 4K Di spl a yH P Z 25n N a rro w B e z e l IP S D i spl a yH P Z 27n N a rro w B e z e l IP S D i spl a yH P Z 27n N a rro w B e z e l IP S D i spl a y

NotesS u ppo rte d b y a l l O pe ra ti n g S y ste m sa v a i l a b l e f ro m H P

S c re e n S i z e D i a g o n a l l y M e a su re d

SATA Hard Drives FactoryConfigured


500GB S A T A 7200rpm 6Gb /sS FF H DD Y Y T 0K73A A

1T B S A T A 7200rpm 6Gb /sS FF H DD Y Y T 0K74A A

SATA Solid State Drives H P 256GB S A T A 6Gb /sS S D Y Y A 3D26A A




PCIe SSDs PCIe SSDs for HP Workstations FactoryConfigured


H P Z T u rb o Dri v e G2256GB M L C (Z 2M i n i ) Y Y Y 7B 58A A

H P Z T u rb o Dri v e G2256GB T L C (Z 2M i n i ) Y Y Y 7B 60A A

H P Z T u rb o Dri v e G2512GB M L C (Z 2M i n i ) Y Y Y 7B 58A A

*P C Ie c a rd i n sta l l e d i n sta n d a rd P C Ie x 4slo t**In sta l l e d i n n a ti v e M .2slo to n Z 2M i n i m o th e rb o a rd

T h e H P Z T u rb o Dri v e G2(NVM e )i sn o tsu ppo rte d w i th Wi n d o w s732-b i t.

NOTE: Fo rsto ra g e d ri v e s,GB =1b i l l i o n b y te s.T B =1tri l l i o n b y te s.A c tu a l f o rm a tte d c a pa c i ty i sl e ss.U pto 36GB (f o rWi n d o w s10)o f sy ste m d i sk i sre se rv e d f o rsy ste m re c o v e ry so f tw a re .

Graphics FactoryConfigured Option Kit

Option Kit PartNumber

Supported #of cards

Integrated Graphics Integrated Intel® HD Graphics (Z2)

In te l®H D Gra ph i c sP 530 Y N 1

In te l®H D Gra ph i c s530 Y N 1

GraphicsCable Adapters

H P T o DVI-D A d a pte r Y Y FH 973A A

H P T o VGA A d a pte r Y Y A S 615A A

H P to Du a l L i n k DVIA d a pte r Y Y NR078A A

Entry 3D NVIDIA ®Q u a d ro ®M 6202GB Gra ph i c s1 Y N 1

Notes NOTE 1: On ly o f f e re d o n Z 2M i n i P e rf o rm a n c e b a se u n i tNOTE: In te rm i x i n g i n te g ra te d In te l®H D g ra ph i c sa n d d i sc re te g ra ph i c sc a rd si n o rd e rto d ri v e m o re th a nth re e d i spl a y sc a n b e e n a b l e d u si n g th e C o m pu te r(F10)S e tu pU ti l i ty .H o w e v e r,H P re c o m m e n d su si n go n l y d i sc re te g ra ph i c sw h e n f o u ro rm o re d i spl a y sa re re qu i re d to b e su ppo rte d .6d i spl a y so l u ti o n i sa c h i e v e d u si n g a c o m b i n a ti o n o f In te l®H D g ra ph i c sa n d NVIDIA Q u a d ro ®g ra ph i c si sON L Y su ppo rte d o nWi n d o w s10.




Memory DDR4-2400 ECC Unbuffered SODIMMs - CTO

H P 8GB (1x8GB )DDR4-2400EC C RA M

H P 16GB (2x 8GB )DDR4-2400EC C RA M

H P 32GB (2x 16GB )DDR4-2400EC C RA M

DDR4-2400 non-ECC Unbuffered SODIMMs - CTO

H P 4GB (1x4GB )DDR4-2400n EC C RA M

H P 8GB (2x4GB )DDR4-2400n EC C RA M

H P 8GB (1x 8GB )DDR4-2400n EC C RA M



NOTES: In te l®X e o n ®E3,In te l ®C o re T M i 3a n d In te l®P e n ti u m ®pro c e sso rsc a n su ppo rte i th e rEC C o rn o n -EC C m e m o ry ;In te l®C o re T M i 5/i 7pro c e sso rso n ly su ppo rtn o n -EC C m e m o ry .

T w o c h a n n e lso f DDR4m e m o ry a re su ppo rte d .T o re a l i z e f u l l pe rf o rm a n c e a tl e a sto n e DIM M m u stb ei n se rte d i n to e a c h c h a n n e l.

T h e C P U sd e te rm i n e th e spe e d a tw h i c h th e m e m o ry i sc l o c k e d .If a 2133M T /sc a pa b l e C P U i su se d i nth e sy ste m ,th e m a x i m u m spe e d th e m e m o ry w i l l ru n a ti s2133M T /sre g a rd l e sso f th e spe c i f i e d spe e do f th e m e m o ry .

T ra n sf e rra te su pto 2133M T /sw i th In te l S k y l a k e pro c e sso rs.

AMO Option Kit PartNumber

DDR4-2400 ECC Unbuffered DIMMs - AMO

H P 8GB (1x8GB )DDR4-2400EC C RA M Y 7B 56A A

H P 16GB (1x 16GB )DDR4-2400EC C RA M Y 7B 53A A

H P 4GB (1x4GB )DDR4-2400n o n -EC C RA M Y 7B 55A A

H P 8GB (1x8GB )DDR4-2400n o n -EC C RA M Y 7B 57A A

H P 16GB (1x 16GB )DDR4-2400n o n -EC C RA M Y 7B 54A A

NOTE: O n ly u n b u f f e re d DDR4DIM M sa re su ppo rte d .

Multimedia and AudioDevices

FactoryConfigured Option Kit


In te g ra te d Re a lte k H D A L C 221-VB A u d i o Y N

Optical and RemovableStorage



HP SlimTray Optical Drives

H P Ex te rn a l U ltra -S l i m DVD-RWDri v e N Y Y 3T 76A A




A c tu a l spe e d sm a y v a ry .Do e sn o tpe rm i tc o py i n g o f c o m m e rc i a l l y a v a i l a b l e DVD m o v i e so ro th e rc o py ri g h tpro te c te d m a te ri a ls.In te n d e d f o rc re a ti o n a n d sto ra g e o f y o u ro ri g i n a l m a te ri a l a n d o th e rl a w f u l u se s.Do u b l e L a y e rd i sc sc a n sto re m o re d a ta th a n si n g l e l a y e rd i sc s.H o w e v e r,d o u b l e -l a y e rd i sc sb u rn e d w i th th i sd ri v e m a y n o tb e c o m pa ti b l e w i th m a n y e x i sti n g si n g l e -l a y e rDVD d ri v e sa n d pl a y e rs.Wi th B l u -ra y ,c e rta i n d i sc ,d i g i ta l c o n n e c ti o n ,c o m pa ti b i l i ty a n d /o rpe rf o rm a n c e i ssu e sm a y a ri se ,a n d d on o tc o n sti tu te d e f e c tsi n th e pro d u c t.Fl a w l e sspl a y b a c k o n a l l sy ste m si sn o tg u a ra n te e d .In o rd e rf o rso m e B l u -ra y ti tl e sto pl a y ,th e y m a y re qu i re a DVIo rH DM Id i g i ta l c o n n e c ti o n a n d y o u rd i spl a y m a yre qu i re H DC P su ppo rt.H D-DVD m o v i e sc a n n o tb e pl a y e d o n th i sw o rk sta ti o n .

Networking andCommunications

FactoryConfigured


In te g ra te d In te l®I219L M P C Ie Gb E C o n tro l l e r(In te l®v P ro w i th In te l A M T 11.0)

Y N

In te l®8265Wi re l e ssL A N (802.11a c )a n d B l u e to o th ®4.2M o d u l e

Y N

NOTE 1: T h e i n te g ra te d n e tw o rk c o n n e c ti o n i sre qu i re d to su ppo rtIn te l® T e c h n o l o g y .NOTE 2: If A M T i spro v i si o n e d ,th e n n e tw o rk te a m i n g w i th th e i n te g ra te d L A N po rti sn o tpo ssi b l e .NOTE 3: "Gi g a b i t"Eth e rn e ti n d i c a te sc o m pl i a n c e w i th IEEE sta n d a rd 802.3a b f o rGi g a b i tEth e rn e t,a n dd o e sn o tc o n n o te a c tu a l o pe ra ti n g spe e d o f 1Gb /se c .Fo rh i g h spe e d tra n sm i ssi o n ,c o n n e c ti o n to aGi g a b i tEth e rn e tse rv e ra n d n e tw o rk i n f ra stru c tu re i sre qu i re d .

Racking and PhysicalSecurity



H P Ke y e d C a b l e L o c k 10m m N Y T 1A 62A A

Input Devices FactoryConfigured Option Kit


H P U S B 1000d pi L a se rM o u se Y Y Q Y 778A A

H P U S B O pti c a l M o u se Y Y Q Y 777A A

H P U S B C C ID S m a rtC a rd Ke y b o a rd Y Y B V813A A

H P U S B B u si n e ssS l i m Ke y b o a rd Y Y N3R87A A

H P Wi re l e ssB u si n e ssS l i m Ke y b o a rd Y Y Q Y 449A A

Other Hardware FactoryConfigured Option Kit


H P S e ri a l P o rtA d a pte r Y N P A 716A

Z 2M i n i A rm /Wa l l VES A M o u n tS o l u ti o n N Y Y 7B 61A A

Z 2M i n i Z D i spl a y VES A M o u n tS o l u ti o n -C u rre n tDi spl a y s N Y N6N 00A A *

Z 2M i n i Z D i spl a y VES A M o u n tS o l u ti o n -L e g a c y D i spl a y s N Y E5J35A A **

*C u rre n t:"n "d i spl a y s.T h i sm o u n ti n g k i tsu ppo rtsth e f o l l o w i n g d i spl a y s:Z 22n /Z 23n /Z 24n /Z 25n /Z 27n .

**L e g a c y :"I"d i spl a y s.T h i sm o u n ti n g k i tsu ppo rtsth e f o l l o w i n g d i spl a y s:Z 24i /Z 27i /Z 30i .




Software FactoryConfigured Option Kit

SupportNotes

H P P e rf o rm a n c e A d v i so r Y N S e e No te 1

H P Re m o te Gra ph i c sS o f tw a re (RGS )7.1 Y N

H P P C H a rd w a re D i a g n o sti c sU EFI Y N S e e No te 2

H P C l i e n tS e c u ri ty S o f tw a re Y N

NOTE 1:S u ppo rts,a n d pre i n sta l l e d w i th Wi n d o w s10o n ly .A lso a v a i l a b l e a sa f re e d o w n l o a d f ro mh ttp://w w w .h p.c o m /g o /pe rf o rm a n c e a d v i so rNOTE 2: Wi n d o w sO S o n ly

Operating Systems Wi n d o w s10P ro 64

Wi n d o w s7P ro f e ssi o n a l 64(a v a i l a b l e th ro u g h d o w n g ra d e ri g h tsf ro m Wi n d o w s10P ro 64)

Re d H a t®En te rpri se L i n u x ®(RH EL )Wo rk sta ti o n -P a pe rL i c e n se (1y r)

S e e h ttp://w w w .m i c ro so f t.c o m /w i n d o w s/w i n d o w s-7/f o rsu ppo rtd e ta i ls.S e e h ttp://w w w .re d h a t.c o m /rh e l/d e sk to p/


S y ste m T e c h n i c a l S pe c i f i c a ti o n s


System BoardSystem Board FormFactor

En try :200m m x 200m m (7.9x 7.9i n c h e s)P e rf o rm a n c e :200m m x 200m m (7.9x 7.9i n c h e s)

Processor Socket S i n g l e L GA 1151

CPU Bus Speed DM Il i n k b e tw e e n C P U &P C H :P e rf o rm a n c e c o m pa ra b l e to P C Ie Ge n 3x 4

Chipset In te l®P C H C 236

Memory Expansion Slots 2S ODIM M DDR4m e m o ry slo ts

Memory Type Supported DDR4,U DIM M (U n b u f f e re d ),EC C &n o n -EC C

Memory Modes No n -In te rl e a v e d f o rsi n g l e c h a n n e l.In te rl e a v e d w h e n b o th c h a n n e lsa re po pu l a te d .

Memory Speed Supported 2133M H z DDR4f o rS k y l a k e pro c e sso rs;pre -e n a b l e d f o r2400M H z DDR4

Memory Protection EC C a v a i l a b l e o n d a ta

*Re qu i re sEC C DIM M sto b e i n sta l l e d ,a sw e l l a sa C P U th a tsu ppo rtsEC C

Maximum Memory 32GB

Memory Configuration(Supported)

4GB ,8GB a n d 16GB n o n -EC C /8GB a n d 16GB EC C u n b u f f e re d DIM M sa re su ppo rte d .EC C a n d n o n -EC C m e m o ry DIM M sc a n n o tb e m i x e d o n th e sa m e sy ste m .

Notes M a x i m u m m e m o ry c a pa c i ti e sa ssu m e 64-b i to pe ra ti n g sy ste m s,su c h a sWi n d o w s®7P ro f e ssi o n a l 64-B i to rRe d H a tL i n u x 64-b i t.

Supported DriveInterfaces

SATA In te g ra te d (1)S e ri a l A T A i n te rf a c e s(6Gb /sS A T A ).

Integrated Graphics In te l®H D Gra ph i c s530(o n C o re i 3/i 5/i 7-6x x x pro c e sso rs);In te l®H D Gra ph i c sP 530f o rX e o n ®E3pro c e sso rsb a se d o n U n i f i e dM e m o ry A rc h i te c tu re (U M A ).

A re g i o n o f sy ste m m e m o ry i sre se rv e d a n d d e d i c a te d to th e g ra ph i c sd i spl a y .

S u ppo rtf o rM i c ro so f tDi re c tX 12.1,O pe n GL 4.4a n d Ope n C L 2.0o n In te l®H D Gra ph i c sP 530.

(3)DP 1.2g ra ph i c spo rtsi n te g ra te d o n m o th e rb o a rd ;S u ppo rtsu ptoth re e si m u lta n e o u sd i spl a y sa c ro ssDP o u tpu ts.M a x .re so l u ti o n su ppo rte d :4096x 2160@60H z

Network Controller In te g ra te d Eth e rn e tP H Y C o n n e c ti o n I219L M .M a n a g e m e n tc a pa b i l i ti e s:WO L ,P X E 2.1a n d A M T 11.0

Serial 1re a rpo rt(c o n f i g u ra b l e o pti o n )

IEEE 1394 Connector(s)




USB Connector(s) Front S i d e I/O:2U S B 3.0T y pe -A

Rear 2U S B 3.0T y pe -A2U S B 3.1G1T y pe -C (Z 2M i n i P e rf o rm a n c e o n l y )

HD Integrated Audio Y e s;su ppo rtsC T IA h e a d se t

Flash ROM Y e s

Chassis Fan Header Y e sA d d i ti o n a l C P U /GFX C o o l e r(Z 2M i n i P e rf o rm a n c e o n l y )

Front ControlPanel/Speaker Header

S i d e I/O:Y e s

CMOS Battery Holder -Lithium

Y e s

Integrated TrustedPlatform Module

In te g ra te d T P M 2.0

Power Supply Headers Y e s,si n g l e DC -i n j a c k f o re xte rn a l po w e rsu ppl i e s

Power Switch, Power LED& Hard Drive LED Header

1.T h e po w e ra n d f a i l u re L ED a re c o m b i n e d i n th e f ro n tpo w e rsw i tc h .

2.T h e H DD L ED &DC -i n L ED a re c o m b i n e d w i th i n o n e po rto n th e Re a rI/O.T h e L ED w i l l b e l i to n c e th eA C po w e ri spl u g g e d i n .A sso o n a sth e sy ste m i sb o o te d u p,th e L ED w i l l f u n c ti o n a sa sta n d a rd H DDa c ti v i ty L ED.

Clear Password Jumper Y e s

Keyboard/Mouse U S B

Power Supply Z 2M i n i G3En try :135W,88%e f f i c i e n c y ,w i d e -ra n g i n g ,a c ti v e P FC P o w e rS u pply

Z 2M i n i G3P e rf o rm a n c e :200W,89%e f f i c i e n c y ,w i d e -ra n g i n g ,a c ti v e P FC P o w e rS u pplyT h e Z 2M i n i P S U Ef f i c i e n c y Re po rtc a n b e f o u n d a tth i sl i n k :T B D

Operating Voltage Range 115-230VA C

Rated Voltage Range 100240VA C

Rated Line Frequency 50-60H z

Operating Line FrequencyRange

4763H z

Rated Input Current Z 2M i n i G3En try :1.9A @90Va cZ 2M i n i G3P e rf o rm a n c e :2.9A @90Va c

Heat Dissipation T y pi c a l:T B D b tu /h r(T B D k c a l /h r)M a x i m u m :T B D b tu /h r(T B D k c a l/h r)

ENERGY STAR® qualified(Config Dependent)

Y e s

FEMP Standby PowerCompliant

Y e s,w i th Wa k e -o n -L A N d i sa b l e d :<1Wi n S 5-P o w e rO f f

Surge Tolerant FullRanging Power Supply

Y e s




(withstands powersurges up to 2000V)

System Configurations

Z2 Mini Configuration

#1

ENERGY STAR

QUALIFIED

P ro c e sso rIn f o 1x In te l®X e o n ®E3-1245v53.58M GT 24C

M e m o ry In f o 32GB (2x 16GB )DDR4-2400EC C S O-DIM M

Gra ph i c sIn f o NVIDIA ®Q u a d ro ®M 620GP U

D i sk s/Opti c a l/Fl o ppy 1x 1T B 7200RP M S A T A H DD /1x Z T u rb o Dri v e G2512GB P C Ie 1stS S D

P o w e rS u pply 200WEP S

Oth e r Eth e rn e tC a pa b l e

En e rg y C o n su m pti o n

(Wa tts)

115VA C 230VA C 100VA C

L A N En a b l e d L A N D i sa b l e d L A N En a b l e d L A N D i sa b l e d L A N En a b l e d L A N D i sa b l e d

Wi n d o w sl o n g Id l e (S 0) 23.61W 23.01W 22.95W

Wi n d o w ssh o rtId l e (S 0) 25.24W 25.2W 25.56W

Wi n d o w sB u sy T y p(S 0) 112.64W 112.76W 113.67W

Wi n d o w sB u sy M a x (S 0) 157.71W 155.95W 159.22W

S l e e p(S 3) 2.52W 2.47W 2.55W 2.47W 2.51W 2.5W

O f f (S 5) 1.27W 1.25W 1.36W 1.24W 1.34W 1.25W

Z e ro P o w e rM o d e (ErP ) 0.31W 0.33W 0.31W

H e a tDi ssi pa ti o n

(B tu /h r)

115VA C 230VA C 100VA C

L A N En a b l e d L A N D i sa b l e d L A N En a b l e d L A N En a b l e d L A N D i sa b l e d L A N En a b l e d

Wi n d o w sl o n g Id l e (S 0) 80.56b tu /h r 78.51b tu /h r 78.31b tu /h r

Wi n d o w ssh o rtId l e (S 0) 86.12b tu /h r 85.99b tu /h r 87.21b tu /h r

Wi n d o w sB u sy T y p(S 0) 384.34b tu /h r 384.75b tu /h r 387.86b tu /h r

Wi n d o w sB u sy M a x (S 0) 538.13b tu /h r 532.12b tu /h r 543.28b tu /h r

S l e e p(S 3) 8.6b tu /h r 8.43b tu /h r 8.7b tu /h r 8.43b tu /h r 8.56b tu /h r 8.53b tu /h r

O f f (S 5) 4.33b tu /h r 4.27b tu /h r 4.64b tu /h r 4.23b tu /h r 4.57b tu /h r 4.27b tu /h r

Z e ro P o w e rM o d e (ErP ) 1.06b tu /h r 1.13b tu /h r 1.06b tu /h r


#2

P ro c e sso rIn f o 1x In te l®X e o n ®E3-1225v53.38M GT 24C

M e m o ry In f o H P 8GB (2x 4GB )DDR4-2400EC C S O-DIM M


D i sk s/Opti c a l/Fl o ppy 1x 1T B 7200RP M S A T A H DD




(Wa tts)

115VA C 230VA C 100VA C






S l e e p(S 3) 1.78W 1.7W 1.83W 1.75W 1.79W 1.71W

O f f (S 5) 1.16W 1.14W 1.2W 1.19W 1.16W 1.14W






(B tu /h r)

115VA C 230VA C 100VA C










#3

ENERGY STAR

QUALIFIED

P ro c e sso rIn f o 1x In te l®C o re i 7-67003.48M 4C

M e m o ry In f o 32GB (2x 16GB )DDR4-2400n EC C S O-DIM M

Gra ph i c sIn f o In te l®H D Gra ph i c s530

Di sk s/Opti c a l/Fl o ppy 1x 1T B 7200RP M S A T A H DD /1x Z T u rb o Dri v e G2512GB P C Ie 1stS S D




(Wa tts)

115VA C 230VA C 100VA C






S l e e p(S 3) 2.29W 2.24W 2.35W 2.34W 2.3W 2.27W

O f f (S 5) 1.25W 1.22W 1.37W 1.33W 1.41W 1.37W



(B tu /h r)

115VA C 230VA C 100VA C










#4

ENERGY STAR

QUALIFIED


M e m o ry In f o 32GB (2x 16GB )DDR4-2400n EC C S O-DIM M


D i sk s/Opti c a l/Fl o ppy 1x 1T B 7200RP M S A T A H DD /1x Z T u rb o Dri v e G2512GB P C Ie 1stS S D




(Wa tts)

115VA C 230VA C 100VA C









S l e e p(S 3) 2.49W 2.47W 2.48W 2.48W 2.49W 2.45W

O f f (S 5) 1.48W 1.14W 1.3W 1.13W 1.29W 1.26W



(B tu /h r)

115VA C 230VA C 100VA C










#5


M e m o ry In f o 4GB (1x 4GB )DDR4-2400n EC C S O -DIM M

Gra ph i c sIn f o In te l®H D Gra ph i c s530

Di sk s/Opti c a l/Fl o ppy 1x 1T B 7200RP M S A T A H DD




(Wa tts)

115VA C 230VA C 100VA C






S l e e p(S 3) 1.8W 1.67W 1.87W 1.77W 1.78W 1.66W

O f f (S 5) 1.19W 1.18W 1.27W 1.26W 1.17W 1.15W



(B tu /h r)

115VA C 230VA C 100VA C












Declared Noise Emissions(En try -l e v e l a n d H i g h -e n dc o n f i g u ra ti o n s)

System Configuration(Entry level)

Processor Info

Memory Info

Graphics Info

Disks/Optical

EnvironmentalRequirements

Temperature Ope ra ti n g :40°to 95°F (5°to 35°C )No n -o pe ra ti n g :-40°to 140°F (-40°to 60°C )

Humidity Ope ra ti n g :8%to 85%RH ,n o n -c o n d e n si n gNo n -o pe ra ti n g :8%to 90%RH ,n o n -c o n d e n si n g

Maximum Altitude Ope ra ti n g :10,000f e e t(3,000m )No n -o pe ra ti n g :30,000f e e t(9,100m )

Dynamic (n e w ) ShockOpe ra ti n g :½-si n e :40g ,2-3m sNo n -o pe ra ti n g :

½-si n e :160c m /s,2-3m s(~100g )squ a re :422c m /s,20g

VibrationOpe ra ti n g ra n d o m :0.5g (rm s),5-300H zNo n -o pe ra ti n g ra n d o m :2.0g (rm s),10-500H z

Notes: Va l u e sre pre se n ti n d i v i d u a l sh o c k e v e n tsa n d d o n o ti n d i c a tere pe ti ti v e sh o c k e v e n ts.Va l u e sd o n o ti n d i c a te c o n ti n u o u sv i b ra ti o n .

Cooling A b o v e 5,000f t(1524m )a lti tu d e ,m a x i m u m o pe ra ti n g te m pe ra tu re i sd e -ra te d b y 1.8°F (1°C )pe r1,000f t(305m )e l e v a ti o n i n c re a se




Physical Security and ServiceabilityAccess Panel T o o l-l e ss

In c l u d e ssy ste m b o a rd a n d m e m o ry i n f o rm a ti o n

Hard Drives H DD c a g e re qu i re sth e u se o f a sc re w d ri v e rto re m o v e th e H DD

Expansion Cards M .2m o d u l e re qu i re sa sc re w d ri v e rto se rv i c e a n d re pl a c e .

Processor Socket T o o l-l e ss,e x c e ptf o rth e pro c e sso rh e a tsi n k .

Color-coordinated Cablesand Connectors

Y e s

Memory T o o l-l e ss

System Board S c re w -In

Dual Color Power and HDLED on Front of Computer

T h e P o w e rL ED i so n th e f ro n to f th e sy ste m ,b u tth e H DD L ED i slo c a te d o n th e Re a ro f th e sy ste m

Configuration Record SW Y e s

Over-Temp Warning onScreen

Y e s

Restore CD/DVD Set C o n si stso f a n o pe ra ti n g sy ste m DVD (OS DVD)a n d a d ri v e rDVD (DRDVD).OS DVD re sto re sth e o ri g i n a lo pe ra ti n g sy ste m .DRDVD w i l l pro v i d e a l l d ri v e rsf o rth e sy ste m .T h e DRDVD m a y a lso c o n ta i na ppl i c a ti o n sth a to ri g i n a l l y sh i ppe d w i th th e sy ste m f o ro pti o n a l i n sta l l a ti o n .A ppl i c a ti o n sc a n a lso b eo b ta i n e d f ro m H P .c o m .OS DVD a n d DRDVD a re o rd e ra b l e w i th th e sy ste m a n d a v a i l a b l e f ro m H PS u ppo rt.

Dual Function FrontPower Switch

Y e s,c a u se sa f a i l -sa f e po w e ro f f w h e n h e l d f o r4se c o n d s(d e f a u lt)o r15se c o n d s(c a n b e c o n f i g u re d b yF10B IO S se tu p\A d v a n c e d \S y ste m O pti o n s\P o w e rb u tto n o v e rri d e )

Cable Lock Support Y e s,Ke n si n g to n C a b l e L o c k (o pti o n a l):L o c k sto pc o v e rf ro m b e i n g o pe n e d a n d se c u re sc h a ssi stof u rn i tu re to pre v e n tth e f t3m m x 7m m slo ta tre a ro f sy ste m

Serial, Parallel, USB,Audio, Network,Enable/Disable PortControl

Y e s,e n a b l e so rd i sa b l e sse ri a l,U S B ,a u d i o ,a n d n e tw o rk po rts(pa ra l l e l po rti sn o tsu ppo rte d o n th e Z 2M i n i G3)

Removable MediaWrite/Boot Control

Y e s,pre v e n tsa b i l i ty to b o o tf ro m re m o v a b l e m e d i a o n su ppo rte d d e v i c e s(a n d c a n d i sa b l e w ri te stom e d i a )

Power-On Password Y e s,pre v e n tsa n u n a u th o ri z e d pe rso n f ro m b o o ti n g u pth e w o rk sta ti o n

Setup Password Y e s,pre v e n tsa n u n a u th o ri z e d pe rso n f ro m c h a n g i n g th e w o rk sta ti o n c o n f i g u ra ti o n




NIC LEDs (integrated)(Green & Amber)

Y e s

CPUs and Heatsinks A T -15T o rx o rf l a tb l a d e sc re w d ri v e ri sn e e d e d to re m o v e th e C P U h e a tsi n k b e f o re th e C P U c a n b ere m o v e d .C P U re m o v a l i sto o l -l e ss

Power Supply DiagnosticLED

Y e s;th i si slo c a te d o n th e Re a ro f th e c h a ssi sa n d c o m b i n e d w i th th e H DD L ED.Wh e n th e P S U a d a pte ri spl u g g e d i n ,a n d th e u n i ti spo w e re d o f f ,th e P o w e rOK L ED w i l l g l o w .

Front Power LED Y e s,w h i te (n o rm a l),re d (f a u lt)

Internal Speaker Y e s,o n th e si d e o f th e c h a ssi s

System/Emergency ROMFlash Recovery

Re c o v e rsc o rru pte d sy ste m B IO S .

Cooling Solution A i rc o o l e d f o rc e d c o n v e c ti o n

CPU Heatsink Fan Z 2M i n i En try &P e rf o rm a n c e C P U b l o w e rso l u ti o n :11.1m m x 65m m x 82.1m m

Z 2M i n i P e rf o rm a n c e GP U b l o w e rso l u ti o n :29m m x 103.6m m x 102.2m m

Chassis Fan Z 2M i n i G3En try :S i n g l e sy ste m b l o w e rZ 2M i n i G3P e rf o rm a n c e :Du a l sy ste m b l o w e r

Memory Heatsink Fan No

HP PC HardwareDiagnostics UEFI

H P P C H a rd w a re D i a g n o sti c s(U EFI)e n a b l e sh a rd w a re l e v e l te sti n g o u tsi d e th e o pe ra ti n g sy ste m o nm a n y c o m po n e n ts.T h e d i a g n o sti c sc a n b e i n v o k e d b y pre ssi n g F2a tP O S T ,a n d i sa v a i l a b l e a sad o w n l o a d f ro m H P S u ppo rt.

Access Panel Key Lock T h e Ke n si n g to n lo c k slo to n th e c h a ssi sse rv e sth i spu rpo se

ACPI-Ready Hardware A d v a n c e d C o n f i g u ra ti o n a n d P o w e rM a n a g e m e n tIn te rf a c e (A C P I).

lo w -po w e ro rpo w e re d -o f f sta te w i th o u ta f f e c ti n g o th e re l e m e n tso f th e sy ste m

Trusted Platform ModuleChip

Y e s

M.2 Card Retention Y e s,a l l M .2m o d u l e sa re re ta i n e d b y a si n g l e sc re w

Flash ROM Y e s

Diagnostic Power SwitchLED on board

Y e s

Clear Password Jumper Y e s

Clear CMOS Jumper Y e s




CMOS Battery Holder Y e s:Z 2M i n i G3En tryY e s:Z 2M i n i G3P e rf o rm a n c e

DIMM Connectors Y e s

BIOSBIOS 32-bit Services S ta n d a rd B IO S 32-b i tS e rv i c e D i re c to ry P ro po sa l v 0.4

PCI 3.0 Support Fu l l B IO S su ppo rtf o rP C IEx pre ssth ro u g h i n d u stry sta n d a rd i n te rf a c e s.

ATAPI A T A P IRe m o v a b l e M e d i a D e v i c e B IO S S pe c i f i c a ti o n Ve rsi o n 1.0.

BBS B IO S B o o tS pe c i f i c a ti o n v 1.01.P ro v i d e sm o re c o n tro l o v e rh o w a n d f ro m w h a td e v i c e sth e w o rk sta ti o n w i l l b o o t.

WMI Support WM Ii sM i c ro so f t'si m pl e m e n ta ti o n o f We b -B a se d En te rpri se M a n a g e m e n t(WB EM )f o rWi n d o w s.WM Ii sf u l l y c o m pl i a n tw i th th e D i stri b u te d M a n a g e m e n tT a sk Fo rc e (DM T F)C o m m o n In f o rm a ti o n M o d e l (C IM )a n d WB EM spe c i f i c a ti o n s.

BIOS Power On U se rsc a n d e f i n e a spe c i f i c d a y -o f -w e e k a n d ti m e f o rth e sy ste m to po w e ro n .

ROM Based ComputerSetup Utility (F10)

Re v i e w a n d c u sto m i z e sy ste m c o n f i g u ra ti o n se tti n g sc o n tro l l e d b y th e B IO S .

System/Emergency ROMFlash Recovery withVideo

Re c o v e rssy ste m B IO S i n c o rru pte d Fl a sh RO M .

Replicated Setup S a v e sB IO S se tti n g sto U S B f l a sh d e v i c e i n h u m a n re a d a b l e f i l e .Re pse t.e x e u ti l i ty c a n th e n re pl i c a teth e se se tti n g so n m a c h i n e sb e i n g d e plo y e d w i th o u te n te ri n g C o m pu te rC o n f i g u ra ti o n U ti l i ty (F10S e tu p).

SMBIOS S y ste m M a n a g e m e n tB IO S 2.7.1,f o rsy ste m m a n a g e m e n ti n f o rm a ti o n .

Boot Control Di sa b l e sth e a b i l i ty to b o o tf ro m re m o v a b l e m e d i a o n su ppo rte d d e v i c e s.

Memory Change Alert A l e rtsm a n a g e m e n tc o n so l e i f m e m o ry i sre m o v e d o rc h a n g e d .

Thermal Alert M o n i to rsth e te m pe ra tu re sta te w i th i n th e c h a ssi s.T h re e m o d e s:-n o rm a l te m pe ra tu re ra n g e s.-e x c e ssi v e te m pe ra tu re sa re d e te c te d .Ra i se sa f l a g so a c ti o n c a n b e ta k e n to a v o i d

sh u td o w n o rpro v i d e f o ra sm o o th e rsy ste m sh u td o w n .-e x c e ssi v e te m pe ra tu re sa re e n c o u n te re d .A u to m a ti c a l l y sh u tsd o w n th e c o m pu te r

w i th o u tw a rn i n g b e f o re h a rd w a re c o m po n e n td a m a g e o c c u rs.

Remote ROM Flash P ro v i d e sse c u re ,f a i l -sa f e RO M i m a g e m a n a g e m e n tf ro m a c e n tra l n e tw o rk c o n so l e .U pd a te sc a n b e pe rf o rm e d b e f o re sta rti n g th e O S .U pd a te sc a n b e pe ri o d i c a l l y sc h e d u l e d .




ACPI (AdvancedConfiguration and PowerManagement Interface)

A l l o w sth e sy ste m to e n te ra n d re su m e f ro m lo w po w e rm o d e s(sl e e psta te s).En a b l e sa n o pe ra ti n g sy ste m to c o n tro l sy ste m po w e rc o n su m pti o n b a se d o n th e d y n a m i c w o rk l o a d .M a k e si tpo ssi b l e to pl a c e i n d i v i d u a l c a rd sa n d pe ri ph e ra lsi n a l o w -po w e ro rpo w e re d -o f f sta te w i th o u ta f f e c ti n g o th e re l e m e n tso f th e sy ste m .S u ppo rtsA C P I4.0f o rf u l l c o m pa ti b i l i ty w i th 64-b i to pe ra ti n g sy ste m s.

Ownership Tag A u se r-d e f i n e d stri n g sto re d i n n o n -v o l a ti l e m e m o ry th a ti sd i spl a y e d i n th e B IO S spl a sh sc re e n .

Remote Wakeup/RemoteShutdown

S y ste m a d m i n i stra to rsc a n po w e ro n ,re sta rt,a n d po w e ro f f a c l i e n tc o m pu te rf ro m a re m o te l o c a ti o n .

ASF 2.0 Compliant Y e s.

Instantly Available PC(Suspend to RAM - ACPIsleep state S3)

A l l o w sf o rv e ry lo w po w e rc o n su m pti o n w i th qu i c k re su m e ti m e .

Remote SystemInstallation via F12 (PXE2.1) (Remote Boot fromServer)

A l l o w sa n e w o re x i sti n g sy ste m to b o o to v e rth e n e tw o rk a n d d o w n l o a d so f tw a re ,i n c l u d i n g th eo pe ra ti n g sy ste m .

ROM revision levels Re po rtsth e sy ste m B IO S re v i si o n l e v e l i n C o m pu te rC o n f i g u ra ti o n U ti l i ty (F10S e tu p).Ve rsi o n i sa v a i l a b l e th ro u g h a n i n d u stry sta n d a rd i n te rf a c e (S M B IO S )so th a tm a n a g e m e n tS Wa ppl i c a ti o n sc a nu se a n d re po rtth i si n f o rm a ti o n .

System board revisionlevel

A l l o w sm a n a g e m e n tS Wto re a d re v i si o n l e v e l o f th e sy ste m b o a rd .Re v i si o n l e v e l i sd i g i ta l l y e n c o d e d i n to th e H Wa n d c a n n o tb e m o d i f i e d .

Start-up Diagnostics(Power-on Self-Test)

A sse sse ssy ste m h e a lth a tb o o tti m e w i th se l e c ta b l e l e v e lso f te sti n g .

Auto Setup when newhardware installed

S y ste m a u to m a ti c a l l y d e te c tsa d d i ti o n o f n e w h a rd w a re .

Keyboard-less Operation T h e sy ste m c a n b e b o o te d w i th o u ta k e y b o a rd .

Localized ROM Setup C o m m o n B IO S i m a g e su ppo rtsS y ste m C o n f i g u ra ti o n U ti l i ty (F10S e tu p)m e n u si n 12l a n g u a g e sw i thl o c a l k e y b o a rd m a ppi n g s.

Asset Tag T h e u se ro rIT a d m i n i stra to rto se ta u n i qu e ta g stri n g i n n o n -v o l a ti l e m e m o ry .

Per-slot Control A l l o w sI/O slo tpa ra m e te rs(o pti o n RO M e n a b l e /d i sa b l e )to b e c o n f i g u re d i n d i v i d u a l l y .

Adaptive Cooling C o n tro l pa ra m e te rsa re se ta c c o rd i n g to d e te c te d h a rd w a re c o n f i g u ra ti o n f o ro pti m a l a c o u sti c s.

Pre-boot Diagnostics (P re -v i d e o )c ri ti c a l e rro rsa re re po rte d v i a b e e psa n d b l i n k so n th e po w e rL ED.

Digitally andCryptographically SignedBIOS

H e lpsto pre v e n tth e i n sta l l a ti o n o f u n a u th o ri z e d v e rsi o n so f a B IO S (a ro g u e B IO S )f ro m a v i ru s,m a l w a re ,o ro th e rc o d e th a tc o u l d l e a d to c o m pro m i se d sy ste m se c u ri ty ,d a ta a c c e ss,ph y si c a l se rv i c e ,o re v e n sy ste m b o a rd re pl a c e m e n t.




Master Boot RecordProtection

A f e a tu re i n th e H P B IO S th a tpre v e n tsc h a n g e sa n d /o ri n f e c ti o n sto th e M a ste rB o o tRe c o rd .U se f u l i npro te c ti n g f ro m v i ru se s.

Boot Block EmergencyRecovery Mode (BIOSRecovery)

T h e H P B IO S o f f e rsa w ri te -pro te c te d b o o tb lo c k ROM th a tpro v i d e sre c o v e ry f ro m a f a i l e d f l a sh i n g o fth e c o m pu te rB IO S .T h i sspe c i a l re c o v e ry m o d e pre v e n tsth e sy ste m f ro m b e c o m i n g u n u sa b l e o r

Industry StandardSpecification Support

Industry Standard Re v i si o n S u ppo rte d b y th e B IO S

UEFI SpecificationRevision

U EFI2.4.0

ACPI A d v a n c e d C o n f i g u ra ti o n a n d P o w e rM a n a g e m e n tIn te rf a c e ,Ve rsi o n 4.0

ASF A l e rtS ta n d a rd Fo rm a tS pe c i f i c a ti o n ,Ve rsi o n 2.0

EDD -En h a n c e d D i sk Dri v e S pe c i f i c a ti o n Ve rsi o n 1.1-B IO S En h a n c e d D i sk Dri v e S pe c i f i c a ti o n Ve rsi o n 3.0

PCI Express P C IExpre ssB a se S pe c i f i c a ti o n ,Re v i si o n 2.0;P C IExpre ssB a se S pe c i f i c a ti o n ,Re v i si o n 3.0.

PMM P O S T M e m o ry M a n a g e rS pe c i f i c a ti o n ,Ve rsi o n 1.01

SATA -S e ri a l A T A S pe c i f i c a ti o n ,Re v i si o n 1.0a-S e ri a l A T A II:Ex te n si o n sto S e ri a l A T A 1.0,Re v i si o n 1.0a-S e ri a l A T A IIC a b l e sa n d C o n n e c to rsVo l u m e 2Go l d-S A T A -IO S A T A Re v i si o n 3.0S pe c i f i c a ti o n

SPD P C S DRA M S e ri a l P re se n c e D e te c t(S P D)S pe c i f i c a ti o n ,Re v i si o n 1.2B

TPM T ru ste d C o m pu ti n g Gro u pT P M S pe c i f i c a ti o n Ve rsi o n 2.0

USB U n i v e rsa l S e ri a l B u sRe v i si o n 1.1S pe c i f i c a ti o nU n i v e rsa l S e ri a l B u sRe v i si o n 2.0S pe c i f i c a ti o nU n i v e rsa l S e ri a l B u sRe v i si o n 3.0S pe c i f i c a ti o n




Social and Environmental ResponsibilityEco-Label Certifications &Declarations

T h i spro d u c ti sl o w h a l o g e n e x c e ptf o rpo w e rc o rd s,c a b l e sa n d pe ri ph e ra ls.S e rv i c e pa rtso b ta i n e da f te rpu rc h a se m a y n o tb e L o w H a l o g e n .

ENERGY S T A R®(e n e rg y -sa v i n g f e a tu re sa v a i l a b l e o n se l e c te d c o n f i g u ra ti o n s Wi n d o w s®o n ly )U S Fe d e ra l En e rg y M a n a g e m e n tP ro g ra m (FEM P )C h i n a En e rg y C o n se rv a ti o n P ro g ra m (C EC P )IT EC O d e c l a ra ti o n

Batteries T h e b a tte ry i n th i spro d u c tc o m pl i e sw i th EU D i re c ti v e 2006/66/ECB a tte ry si z e :C R2032(c o i n c e l l)B a tte ry ty pe :L i th i u m M e ta l

T h e b a tte ry i n th i spro d u c td o e sn o tc o n ta i n :

M e rc u ry g re a te rth a n 5ppm b y w e i g h tC a d m i u m g re a te rth a n 10ppm b y w e i g h tL e a d g re a te rth a n 40ppm b y w e i g h t

Restricted Material Usage T h i spro d u c tm e e tsth e m a te ri a l re stri c ti o n sspe c i f i e d i n H P 'sGe n e ra l S pe c i f i c a ti o n f o rth eEn v i ro n m e n t.h ttp://w w w .h p.c o m /h pi n f o /g l o b a l c i ti z e n sh i p/e n v i ro n m e n t/pd f /g se .pd fH P In c .i sc o m m i tte d to c o m pl i a n c e w i th a l l a ppl i c a b l e e n v i ro n m e n ta l l a w sa n d re g u l a ti o n s,i n c l u d i n gth e Eu ro pe a n U n i o n Re stri c ti o n o f H a z a rd o u sS u b sta n c e s(Ro H S )Di re c ti v e .H P 'sg o a l i sto e x c e e dc o m pl i a n c e o b l i g a ti o n sb y m e e ti n g th e re qu i re m e n tso f th e Ro H S D i re c ti v e o n a w o rl d w i d e b a si s.

Low Halogen Statement T h i spro d u c ti sl o w h a l o g e n e x c e ptf o rpo w e rc o rd s,c a b l e sa n d pe ri ph e ra ls,a sw e l l a sth e f o l l o w i n gc u sto m e r-c o n f i g u ra b l e i n te rn a l c o m po n e n ts:C re a ti v e Re c o n 3D P C Ie A u d i o C a rd i sn o tL o w H a l o g e n .S e rv i c e pa rtso b ta i n e d a f te rpu rc h a se m a y n o tb e L o w H a l o g e n .

End-of-Life Managementand Recycling

H P In c .o f f e rse n d -o f -l i f e H P pro d u c tre tu rn a n d re c y c l i n g pro g ra m si n m a n y g e o g ra ph i c a re a s.T ore c y c l e y o u rpro d u c t,pl e a se g o to :h ttp://w w w .h p.c o m /re c y c l e o rc o n ta c ty o u rn e a re stH P sa l e so f f i c e .P ro d u c tsre tu rn e d to H P w i l l b e re c y c l e d ,re c o v e re d o rd i spo se d o f i n a re spo n si b l e m a n n e r.T h i spro d u c ti sg re a te rth a n 90%re c y c l a b l e b y w e i g h tw h e n pro pe rly d i spo se d o f a te n d o f l i f e .

HP Inc. CorporateEnvironmentalInformation

Fo rm o re i n f o rm a ti o n a b o u tH P 'sc o m m i tm e n tto th e e n v i ro n m e n t:L i v i n g P ro g re ssRe po rth ttp://w w w .h p.c o m /h pi n f o /g l o b a l c i ti z e n sh i p/g c re po rt/i n d e x .h tm l

Ec o -l a b e l c e rti f i c a ti o n sh ttp://w w w .h p.c o m /h pi n f o /g l o b a l c i ti z e n sh i p/e n v i ro n m e n t/pro d u c td e si g n /e c o l a b e ls.h tm l

IS O 14001c e rti f i c a te s:h ttp://w w w .h p.c o m /h pi n f o /g l o b a l c i ti z e n sh i p/e n v i ro n m e n t/o pe ra ti o n s/e n v m a n a g e m e n t.h tm l

Additional Information T h i sH P pro d u c ti sd e si g n e d to c o m ply w i th th e Wa ste El e c tri c a l a n d El e c tro n i c Equ i pm e n t(WEEE)Di re c ti v e -2002/96/EC .P l a sti c pa rtsw e i g h i n g o v e r25g ra m su se d i n th e pro d u c ta re m a rk e d pe rIS O 11469a n dIS O1043.T h i spro d u c ti s>90%re c y c l e -a b l e w h e n pro pe rly d i spo se d o f a te n d o f l i f eEP EA T ®Go l d re g i ste re d i n th e U .S .EP EA T re g i stra ti o n v a ri e sb y c o u n try .S e eh ttp://w w w .e pe a t.n e tf o rre g i stra ti o n sta tu sb y c o u n try .

Packaging H P Wo rk sta ti o n pro d u c tpa c k a g i n g m e e tsth e H P Ge n e ra l S pe c i f i c a ti o n f o rth e En v i ro n m e n ta th ttp://w w w .h p.c o m /h pi n f o /g l o b a l c i ti z e n sh i p/so c i e ty /g e n _spe c i f i c a ti o n s.h tm l

Do e sn o tc o n ta i n re stri c te d su b sta n c e sl i ste d i n H P S ta n d a rd 011-1Ge n e ra l S pe c i f i c a ti o n f o rth e En v i ro n m e n t




Do e sn o tc o n ta i n o zo n e -d e pl e ti n g su b sta n c e s(ODS )Do e sn o tc o n ta i n h e a v y m e ta l s(l e a d ,m e rc u ry ,c a d m i u m o rh e x a v a l e n tc h ro m i u m )i n e x c e sso f100ppm su m to ta l f o ra l l h e a v y m e ta lsl i ste dM a x i m i z e sth e u se o f po st-c o n su m e rre c y c l e d c o n te n tm a te ri a lsi n pa c k a g i n g m a te ri a lsA l l pa c k a g i n g m a te ri a l i sre c y c l a b l eA l l pa c k a g i n g m a te ri a l i sd e si g n e d f o re a se o f d i sa sse m b l yRe d u c e d si z e a n d w e i g h to f pa c k a g e sto i m pro v e tra n spo rta ti o n f u e l e f f i c i e n c yP l a sti c pa c k a g i n g m a te ri a lsa re m a rk e d a c c o rd i n g to IS O 11469a n d DIN 6120sta n d a rd sf o rm a tti n g

Packaging MaterialsInternal C u sh i o n sm a d e f ro m f a b ri c a te d re c y c l e d e x pa n d e d -po ly e th y l e n e (EP E)o rre c y c l e d e x pa n d e d -

po ly pro py l e n e (EP P ).M a y a lso b e m a d e f ro m re c y c l e d m o l d e d pa pe r-pu lp(M P P ).External C a rto n m a d e f ro m c o rru g a te d f i b e rb o a rd w i th a tl e a st25%re c y c l e d c o n te n t.




ManageabilityIntel®Active ManagementTechnology (A M T )

T h e H P Z 2M i n i G3w o rk sta ti o n su ppo rtsIn te l®v P ro te c h n o l o g y w h e n pu rc h a se d w i th a v P rote c h n o l o g y c a pa b l e C P U :In te l ®X e o n ®pro c e sso rf a m i l y o r6th Ge n e ra ti o n In te l®C o re i 5/i 7pro c e sso rsw i th In te l®VT -d /VT -x a n d In te l®T X T te c h n o l o g y .

Remote ManageabilitySoftware Solutions

Vi si t:h ttp://w w w .h p.c o m /g o /e a sy d e plo y

System SoftwareManager

Vi si t:h ttp://w w w .h p.c o m /g o /ssm

Service, Support, andWarranty

P ro g ra m to pro a c ti v e l y c o m m u n i c a te P ro d u c tC h a n g e No ti f i c a ti o n s(P C Ns)a n d C u sto m e rA d v i so ri e sb y e m a i l to c u sto m e rs,b a se d o n a u se r-d e f i n e d pro f i l e .P C Nspro v i d e a d v a n c e n o ti f i c a ti o n o f h a rd w a re a n d so f tw a re c h a n g e sto b e i m pl e m e n te d i n th ef a c to ry pro v i d i n g ti m e to pl a n f o rtra n si ti o n .C u sto m e rA d v i so ri e spro v i d e c o n c i se ,e f f e c ti v e pro b l e m re so l u ti o n ,g re a tly re d u c i n g th e n e e dto c a l l te c h n i c a l su ppo rt.


S ta b l e &C o n si ste n tOf f e ri n g s


A spa rto f i tsc o m m i tm e n tto h a rd w a re ,so f tw a re ,a n d so l u ti o n i n n o v a ti o n ,H P i spro u d to i n tro d u c e th i sb re a k th ro u g h pl a tf o rmc o n f i g u ra ti o n sta b i l i ty to H P Wo rk sta ti o n c u sto m e rs.H P S ta b l e &C o n si ste n tO f f e ri n g sa re b u i lto n th e f o u n d a ti o n o f a c a re f u l l yc h o se n se to f h a rd w a re a n d so f tw a re d e si g n e d a n d te ste d to w o rk w i th a l l H P Z Wo rk sta ti o n pl a tf o rm sth ro u g h th e i re n d o f l i f e .T h e se c o m po n e n tsa n d th e i rc o rre spo n d i n g H P Wo rk sta ti o n pl a tf o rm c o m pa ti b i l i ty a re o u tl i n e d i n th i sse c ti o n .

H P S ta b l e &C o n si ste n tO f f e ri n g sa re a v a i l a b l e w o rl d w i d e to a l l H P Wo rk sta ti o n c u sto m e rs-n o spe c i a l pro g ra m s,n o a d d i ti o n a lc o st,n o k i d d i n g .S i m ply se l e c ty o u rh a rd w a re a n d so f tw a re c o m po n e n tsw h e n y o u c u sto m i z e y o u rH P Wo rk sta ti o n a n d b e a ssu re dth a ty o u 'l l b e a b l e to b u y th a tsa m e c o n f i g u ra ti o n th ro u g h o u tth e l i f e c y c l e o f th e pro d u c t.

Processors Product # Offering

X 8V05A V In te l®X e o n ®E3-1225v 53.3GH z C P U

X 8V06A V In te l®X e o n ®E3-1245v 53.5GH z C P U

Hard Drives Product # Offering

X 8U 91A V H DD 500GB 7200RP M S A T A 2.5

X 8U 90A V H DD 1T B 7200RP M S A T A 2.5

Memory Product # Offering

X 8V29A V RA M 8GB (1x 8GB )DDR42400EC C U n b u f f e re d

X 8V24A V RA M 16GB (2x8GB )DDR42400EC C U n b u f f e re d


T e c h n i c a l S pe c i f i c a ti o n s-P ro c e sso rs


Intel® Xeon® processor E3-1200 v5 family

In te l®X e o n ®E3-1245v 53.521334C C P UIn te l®X e o n ®E3-1225v 53.321334C C P U

In te l®C o re i 7-67003.421334C C P UIn te l®C o re i 5-65003.221334C C P U

In te l®C o re i 3-61003.721332C C P U


T e c h n i c a l S pe c i f i c a ti o n s-H a rd Dri v e s


SATA Hard Drives for HPWorkstations

500GB SATA 7200 rpm6Gb/s 3.5" HDD

Capacity 500GB

Protocol S A T A

Form Factor S FF (2.5")

Controller A H C I

Rated for 24/7/365operation

NO

Physical Size (H e i g h t) 0.28i n ;.7c m

Physical Size (Wi d th ) 2.75i n ;6.99c m

Media Diameter 2.5i n ;6.36c m

Interface S e ri a l A T A (6Gb /s),NC Q e n a b l e d

Synchronous TransferRate (M a x i m u m )

U pto 600M B /s

Operating Temperature 32°to 140°F (0°to 60°C )

1TB SATA 7200 rpm6Gb/s SFF HDD

Capacity 1T B

Protocol S A T A

Form Factor S FF (2.5")

Controller A H C I

Rated for 24/7/365operation

NO

Physical Size (H e i g h t) 0.28i n ;.7c m


Media Diameter 2.5i n ;6.36c m

Interface S e ri a l A T A (6Gb /s),NC Q e n a b l e d


U pto 600M B /s


SATA SSDs for HPWorkstations

HP 256GB SATA 6Gb/sSSD

Capacity 256GB

Protocol S A T A

Form Factor 2.5"

Controller A H C I

NAND Type M L C

Endurance 200T B W(T B Wri tte n )

Reliability (M T T F) 1.5M h o u rs

Physical Size (H e i g h t) 0.28i n ;0.7c m


Interface S A T A 6Gb /s


U pto 600M B /s


Performance Sequential Read 560M B /s(m a x)

Sequential Write 510M B /s(m a x)

Random Read 100K IOP S (m a x)

Random Write 88K IOP S (m a x)


T e c h n i c a l S pe c i f i c a ti o n s-Gra ph i c s


Integrated Intel® HDGraphics (Z2)

Form Factor In te g ra te d i n se l e c tIn te l ®X e o n ®E3,In te l®C o re T M i 7,In te l®C o re T M i 5,a n dIn te l®C o re T M i 3pro c e sso rs.

C h e c k spe c i f i c pl a tf o rm spe c i f i c a ti o n sf o rse l e c ti o n s.

Graphics Controller In te l®H D Gra ph i c s

Memory U n i f i e d M e m o ry A rc h i te c tu re (U M A )f ra m e b u f f e r.Gra ph i c sm e m o ry i ssh a re d w i th sy ste m m e m o ry .S i z e se l e c ta b l e b e tw e e n 32M B to 1024M Bv i a B IO S se tti n g .De f a u ltsi z e i s128M B .A d d i ti o n a l m e m o ry i sa l l o c a te d f o rg ra ph i c sa sn e e d e d u si n g In te l'sDy n a m i c V i d e o M e m o ry T e c h n o l o g y (In te l®DVM T ),to pro v i d e a n o pti m a l b a l a n c e b e tw e e n g ra ph i c sa n d sy ste mm e m o ry u se .

Connectors C h e c k sy ste m pl a tf o rm spe c i f i c a ti o n sw h e re In te l®H D Gra ph i c sa rea v a i l a b l e .

Maximum Resolution Di spl a y P o rtT M 1.2:-u pto 4096x2160x 30b pp@60H z-su ppo rtsH i g h B i tRa te 2(H B R2)a n d M u lti -S tre a m T ra n spo rt(M S T )

H DM I2.0o u tpu t:-u pto 4096x2160x 30b pp@60H z

Du a l L i n k DVI(I)o u tpu t:-u pto 2560x 1600x 32b pp@60H z

S i n g l e L i n k -DVI(I)o u tpu t:-u pto 1920x 1200x 32b pp@60H z

VGA o u tpu t:-2048×1536×32b pp@85H z

No te :Fo rH DM I,DVI,a n d VGA o u tpu ts,se pa ra te a d a pte rsre qu i re d .

Shading Architecture S h a d e rM o d e l 5.0

Supported Graphics APIs Ope n GL 4.0Di re c tX 11.1

Available GraphicsDrivers

Wi n d o w s10Wi n d o w s7

*In te g ra te d g ra ph i c sw i l l d e pe n d o n pro c e sso r.H D c o n te n tre qu i re d to v i e w H D i m a g e s


T e c h n i c a l S pe c i f i c a ti o n s-Gra ph i c s


NVIDIA®Quadro® M6202GB Graphics

Maximum Resolution Di spl a y P o rt1.2:-u pto 4096x2160x 30b pp@60H z-su ppo rtsH i g h B i tRa te 2(H B R2)a n d M u lti -S tre a m T ra n spo rt(M S T )

H DM I2.0o u tpu t:-u pto 4096x2160x 30b pp@60H z

Image Quality Features S te re o sc o pi c 3D d i spl a y3D DL P ,In te rl e a v e d ,a n d pa ssi v e ste re o

Display Output M a x i m u m n u m b e ro f d i spl a y s:-4d i re c ta tta c h e d m o n i to rs

M a x i m u m n u m b e ro f d i spl a y spo ssi b l e pe ro u tpu t(M u lti pl e d i spl a y sd a i sy -c h a i n e d f ro m o n e 1.2po rtre qu i re s 1.2M S T c a pa b l e d i spl a y so rDP 1.3M S T c a pa b l eh u b ):-41920x 1200@60H z-22560x 1600@60H z-14096x 2160@60H z

M a x i m u m n u m b e ro f m o n i to rsa c ro ssa l l a v a i l a b l e Q u a d ro M 620o u tpu tsi s4.

Supported Graphics APIs Ope n GL 4.5Di re c tX 12

A P Isu ppo rti n c l u d e s:C U DA C ,C U DA C ++,Di re c tC o m pu te 5.0,Ope n C L ,Ja v a ,P y th o n ,a n d Fo rtra n

Available GraphicsDrivers

M i c ro so f tWi n d o w s10M i c ro so f tWi n d o w s7L i n u x -Fu l l Ope n GL i m pl e m e n ta ti o n ,c o m pl e te w i th NVIDIA a n d A RBe x te n si o n s

H P qu a l i f i e d d ri v e rsm a y b e pre l o a d e d o ra v a i l a b l e f ro m th e H P su ppo rtWe b si te :h ttp://w e l c o m e .h p.c o m /c o u n try /u s/e n /su ppo rt.h tm l


T e c h n i c a l S pe c i f i c a ti o n s-Opti c a l a n d Re m o v a b l e S to ra g e


HP External Ultra-SlimDVD-RW Drive

Description Ex te rn a l 9.5m m h i g h ,tra y -lo a d

Mounting Orientation Ei th e rh o ri zo n ta l o rv e rti c a l

Interface Type U S B 2.0

Dimensions (Wx H x D) 144x 14x 137.5m m

Supported Media Types DVD-RA MDVD+RDVD+RWDVD+RDLDVD-RDLDVD-RDVD-RWC D-RC D-RW

Disc Capacity DVD-ROM 8.5GB DL o r4.7GB sta n d a rd

Access Times Full Stroke DVD 160m s(ty pi c a l f o rRa n d o m S tro k e )

Full Stroke CD 140m s(ty pi c a l f o rRa n d o m S tro k e )

Maximum Data TransferRates

CD ROM Read C D-ROM ,C D-R U pto 24XC D-RW U pto 24X

DVD ROM Read DVD-RA M U pto 8XDVD+RW U pto 8XDVD-RW U pto 8XDVD+RDL U pto 8XDVD-RDL U pto 8XDVD-ROM U pto 8XDVD-ROM DL U pto 8XDVD+R U pto 8XDVD-R U pto 8X

Power Source U S B 2.0DC po w e r

DC Power Requirements 5VDC ±5%-100m V ri ppl e p-p

DC Current 5VDC -<800m A ty pi c a l,<1600m A m a x i m u m

Operating Environmental(a l l c o n d i ti o n sn o n -c o n d e n si n g )

Temperature 41°to 104°F (5°to 40°C )

Relative Humidity 15%to 80%

Maximum Wet BulbTemperature

84°F (29°C )

Operating SystemsSupported

Wi n d o w s1032-b i ta n d 64-b i t,Wi n d o w s832-b i ta n d 64-b i t,Wi n d o w s7P ro f e ssi o n a l 32-b i ta n d 64-b i t,Wi n d o w sVi sta B u si n e ss64*,Wi n d o w sVi staB u si n e ss32*,Wi n d o w sVi sta H o m e B a si c 32*,Wi n d o w s2000,Wi n d o w sX PP ro f e ssi o n a l o rWi n d o w sX P H o m e 32*.Re d H a tEn te rpri se L i n u x (RH EL )WS 4**,5,6De sk to p/Wo rk sta ti o n ,Re m o v e d re f e re n c e to "No v e l l"b e c a u se o f a c qu i si ti o n a n d c h a n g e d pro d u c tre f e re n c e to "S U S E L i n u x En te rpri se D e sk to p10&11",

No d ri v e ri sre qu i re d f o rth i sd e v i c e .N a ti v e su ppo rti spro v i d e d b y th eo pe ra ti n g sy ste m .

Kit Contents H P Ex te rn a l U ltra -S l i m DVD-RWDri v e DVD Wri te rd ri v e ,U S B 2.0ty pe A tom i n i -B c a b l e .©C o py ri g h t2016H P De v e l o pm e n tC o m pa n y ,L .P .


T e c h n i c a l S pe c i f i c a ti o n s-Opti c a l a n d Re m o v a b l e S to ra g e


T h e o n l y w a rra n ti e sf o rH P pro d u c tsa n d se rv i c e sa re se tf o rth i n th ee x pre ssw a rra n ty sta te m e n tsa c c o m pa n y i n g su c h pro d u c tsa n d se rv i c e s.No th i n g h e re i n sh o u l d b e c o n stru e d a sc o n sti tu ti n g a n a d d i ti o n a l w a rra n ty .H P sh a l l n o tb e l i a b l e f o rte c h n i c a l o re d i to ri a l e rro rso ro m i ssi o n sc o n ta i n e d h e re i n .T h e i n f o rm a ti o n c o n ta i n e d h e re i n i ssu b j e c tto c h a n g ew i th o u tn o ti c e .


T e c h n i c a l S pe c i f i c a ti o n s-Ne tw o rk i n g a n d C o m m u n i c a ti o n s


Integrated Intel® I219LMPCIe GbE Controller(Intel® vPro with Intel®AMT 11.0)

Connector RJ-45

Controller In te l®I219L M Gb E pl a tf o rm L A N c o n n e c tn e tw o rk i n g c o n tro l l e r

Memory 3KB T x a n d 3KB Rx FIFO pa c k e tb u f f e rm e m o ry

Data Rates Supported 10/100/1000M b ps

Compliance 802.1a s/1588,802.1p,802.1Q ,802.3,802.3a b ,802.3a z,802.3i ,802.3u ,802.3z

Bus Architecture P C IExpre ssa n d S M B u s

Data Transfer Mode P C Ie -b a se d i n te rf a c e f o ra c ti v e sta te o pe ra ti o n (S 0sta te )a n d S M B u sf o rh o sta n d m a n a g e m e n ttra f f i c (S x l o w po w e rsta te )

Power Requirement Re qu i re s3.3V (i n te g ra te d re g u l a to rsf o rc o re V d c )

Boot ROM Support Y e s

Network Transfer Mode Fu l l-d u pl e x ;H a l f -d u pl e x (n o tsu ppo rte d f o rth e 1000B A S E-T tra n sc e i v e r)

Network Transfer Rate 10B A S E-T (h a l f -d u pl e x )10M b ps10B A S E-T (f u l l -d u pl e x )20M b ps100B A S E-T X (h a l f -d u pl e x )100M b ps100B A S E-T X (f u l l-d u pl e x )200M b ps1000B A S E-T (f u l l-d u pl e x )2000M b ps

Management Capabilities v P ro ,WOL ,a u to M DIc ro sso v e r,P X E,i S C S IB o o t,M u ti -po rtte a m i n g ,RS S ,A C P I,A d v a n c e d c a b l e d i a g n o sti c ,lo o pb a c k m o d e s,A M T 11.0su ppo rt,C i rc u i tB re a k e r,VL A N,M u lti c a stL i ste n e rDi sc o v e ry(M L D)

Intel® 8265 Wireless LAN(802.11ac) and Bluetooth4.2 Module

Connector M .2(S u ppo rts2230f o rm f a c to r;E Ke y )M o th e rb o a rd In te rf a c e

Controller In te l®Du a l B a n d Wi re l e ss-A C 8260

Compliance Wi re l e ssL A N:IEEE 802.11a b g n ,802.11a c ,802.11d ,802.11e ,802.11i ,802.11h ,802.11w ,C C X 4.x /C C X L i te ,WM M ,WP A ,WP A 2,A P S ,WP S 2.0,P ro te c te d M a n a g e m e n tFra m e sB l u e to o th ®:Du a l M o d e B l u e to o th ®2.1,2.1+EDR,3.0,4.0,B L E,a n d 4.2

Bus Architecture P C IExpre ssGe n 3x 1a n d U S B 2.0

Power Requirement Re qu i re s3.3V ;1.65WT DP

Management Capabilities Wa k e o n WL A N (i n a l l sl e e psta te s,e x c l u d i n g M a x P o w e rS a v i n g sm o d e ),WFA M a n a g e m e n tFra m e P ro te c ti o n (802.11w ),v P ro /Wi A M T No tC u rre n tlyS u ppo rte d ,F10B IO S M e n u o pti o n to d i sa b l e /e n a b l e WL A N a n d B l u e to o th ®ra d i o s,su ppo rtsse a m l e ssro a m i n g b e tw e e n 802.11w i re l e ssa c c e sspo i n ts

Throughput M a x P H Y th ro u g h pu t887M b ps(802.11a c )f o rWL A N


S u m m a ry o f C h a n g e s


Date of change: Version History: Description of change:

Fro m v 1to v 2



©2016H P D e v e l o pm e n tC o m pa n y ,L .P .T h e i n f o rm a ti o n c o n ta i n e d h e re i n i ssu b j e c tto c h a n g e w i th o u tn o ti c e .T h e o n l y w a rra n ti e sf o rH P pro d u c tsa n d se rv i c e sa re se tf o rth i n th e e x pre ssw a rra n ty sta te m e n tsa c c o m pa n y i n g su c h pro d u c tsa n d se rv i c e s.No th i n gh e re i n sh o u l d b e c o n stru e d a sc o n sti tu ti n g a n a d d i ti o n a l w a rra n ty .H P sh a l l n o tb e l i a b l e f o rte c h n i c a l o re d i to ri a l e rro rso ro m i ssi o n sc o n ta i n e d h e re i n .In te l,In te l C o re ,P e n ti u m ,T h u n d e rb o lta n d X e o n a re tra d e m a rk so f In te l C o rpo ra ti o n i n th e U .S .a n do th e rc o u n tri e s.M i c ro so f ta n d Wi n d o w sa re e i th e rre g i ste re d tra d e m a rk so rtra d e m a rk so f M i c ro so f tC o rpo ra ti o n i n th e U n i te dS ta te sa n d /o ro th e rc o u n tri e s.ENERGY S T A R®i sa re g i ste re d tra d e m a rk o w n e d b y th e U .S .En v i ro n m e n ta l P ro te c ti o n A g e n c y .L i n u x ®i sth e re g i ste re d tra d e m a rk o f L i n u sT o rv a l d si n th e U .S .a n d o th e rc o u n tri e s.NVIDIA ®,Q u a d ro a n d th e NVIDIA l o g o a retra d e m a rk sa n d /o rre g i ste re d tra d e m a rk so f NVIDIA C o rpo ra ti o n i n th e U .S .a n d o th e rc o u n tri e s.Re d H a t®i sa re g i ste re d tra d e m a rko f Re d H a t,In c .i n th e U n i te d S ta te sa n d o th e rc o u n tri e s.B l u e to o th i sa tra d e m a rk o f i tspro pri e to ru se d b y H P In c .u n d e rl i c e n se .

S ta n d a rd sA sso c i a ti o n (VES A ®)i n th eU n i te d S ta te sa n d o th e rc o u n tri e s.

hp z2 mini workstation - gc3.de · hp external ultra-slim dvd-rw drive description exte rn a l 9.5m...

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