hpc2014 leaflet

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6th CIRP Conference on High Performance Cutting (HPC2014) More information at http://hpc2014.berkeley.edu/ Overview The 6 th CIRP HPC Conference will be co-hosted by the Berkeley and Davis campuses of the University of California. It will continue a tradition of providing an international forum for machining researchers and users to review and discuss the latest innovations and developments in cutting and manufacturing technology. Venue The conference will be held in Berkeley, CA within the San Francisco Bay Area, which is well known for its natural beauty, entrepreneurship, liberal politics, and concentration of advanced manufacturing companies Key Conference Dates June 23 rd to 25 th Technical Sessions June 24 th (Afternoon) DMG/Mori Seiki Tour June 24 th (Evening) Conference Banquet Organizers Professor David Dornfeld, UC Berkeley, Chair Professor Kazuo Yamazaki, UC Berkeley/UC Davis, Co-Chair Professor Barbara S. Linke, UC Davis Professor Masakazu Soshi, UC Davis Dr. Moneer Helu, UC Berkeley (Local Organization) Submission Deadlines September 30, 2013 Abstract submission October 28, 2013 Notification of abstract acceptance November 25, 2013 Full paper submission February 17, 2014 Notification of paper acceptance March 10, 2014 Camera-ready paper submission Contact Email: [email protected] Tel.: (+1) 510-6434439 June 23-25, 2014 University of California Berkeley, California, USA Second Announcement © UC Berkeley

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  • 6th CIRP Conference on High

    Performance Cutting (HPC2014)

    More information at http://hpc2014.berkeley.edu/

    Overview

    The 6th CIRP HPC Conference will be co-hosted by the

    Berkeley and Davis campuses of the University of California. It

    will continue a tradition of providing an international forum for

    machining researchers and users to review and discuss the

    latest innovations and developments in cutting and

    manufacturing technology.

    Venue

    The conference will be held in Berkeley, CA within the San

    Francisco Bay Area, which is well known for its natural beauty,

    entrepreneurship, liberal politics, and concentration of

    advanced manufacturing companies

    Key Conference Dates

    June 23rd to 25th Technical Sessions

    June 24th (Afternoon) DMG/Mori Seiki Tour

    June 24th (Evening) Conference Banquet

    Organizers

    Professor David Dornfeld, UC Berkeley, Chair

    Professor Kazuo Yamazaki, UC Berkeley/UC Davis, Co-Chair

    Professor Barbara S. Linke, UC Davis

    Professor Masakazu Soshi, UC Davis

    Dr. Moneer Helu, UC Berkeley (Local Organization)

    Submission Deadlines

    September 30, 2013 Abstract submission

    October 28, 2013 Notification of abstract acceptance

    November 25, 2013 Full paper submission

    February 17, 2014 Notification of paper acceptance

    March 10, 2014 Camera-ready paper submission

    Contact

    Email: [email protected]

    Tel.: (+1) 510-6434439

    June 23-25, 2014

    University of California

    Berkeley, California, USA

    Second Announcement

    UC Berkeley

  • Topics (not exclusive):

    Technology Machining of metallic and non-metallic

    materials

    Micromanufacturing processes Die cutting Abrasive processes Mechanics and dynamics of material

    removal processes

    Hybrid machining Sheet metal cutting Precision machining Die and mold machining Additive manufacturing processes Nontraditional processes (e.g., EDM, ECM,

    CMP, laser, abrasive jet machining)

    Simulation

    Virtual cutting, simulation CAD/CAM systems and strategies for high

    performance cutting

    Second Announcement

    6th CIRP Conference on High

    Performance Cutting (HPC2014)

    June 23-25, 2014

    University of California

    Berkeley, California, USA

    More information at http://hpc2014.berkeley.edu

    Machine Tools and Tooling Systems

    Machine design for micromachining High speed spindle technology, models,

    tuning, and testing

    Control of multi-axis machine tools Energy efficient machine tools Design methodology of multi-axis machine

    tools

    Cutting tool materials, design, and performance

    Intelligent tooling Metrology and measurement High speed machine tool structures and

    configurations

    Beyond the Process

    Sustainable manufacturing processes Interoperability, monitoring, and control of

    machining operations

    Residual stress and damage of finished surfaces

    Scientific Committee:

    E. Abele / DE

    S.-H. Ahn / KR

    Y. Altintas / CA

    T. Aoyama / JP

    P.-J. Arrazola / ES

    H. Attia / CA

    J. Aurich / DE

    M. Balazinski / CA

    J. Barry / IE

    K. Bouzakis / GR

    E. Brinksmeier / DE

    G. Byrne / IE

    A. Chandra / US

    T. Childs / GB

    M. Davies / US

    B. Denkena / DE

    D. Dornfeld / US

    K. Erkorkmaz / CA

    C. Evans / US

    G. Goch / DE

    C. Guo / US

    Y. Guo / US

    F. Hashimoto / US

    I. Inasaki / JP

    I. Jawahir / US

    K. Jemielniak / PL

    B. Kaftanoglu / TR

    B. Karpuschewski / DE

    Y. Kakinuma / JP

    F. Klocke / DE

    P. Koshy / CA

    B. Kruszynski / PL

    J.-P. Kruth / BE

    B. Lauwers / BE

    G. Levy / CH

    S. Liang / US

    B. Linke / US

    D. Lucca / US

    R. MSaoubi / SE

    S. Melkote / US

    S. Min / US

    L. Monostori / HU

    M. Mori / JP

    T. Moriwaki / JP

    B. Mullany / US

    R. Neugebauer / DE

    J. Oliveira / BR

    T. zel / US

    S. Park / CA

    F. Pfefferkorn / US

    M. Rahman / SG

    V. Schulze / DE

    S. Smith / US

    M. Soshi / US

    J. Sutherland / US

    R. Teti / IT

    J. Webster / US

    K. Wegener / CH

    R. Wertheim / IL

    B. Winfough / US

    H. Yamaguchi / US

    K. Yamazaki / US