huawei tecal e9000 blade server pre-sales … · 1 1 market overview and positioningclick to add...
TRANSCRIPT
Version: V1.0(2014-3-21)
HUAWEI Tecal E9000 Blade Server
Pre-sales Specialist Training
1
1 Click to add Title Market Overview and Positioning
Click to add Title 2 Product Specifications and Highlights
4 Product Comparison
Click to add Title 3 Application Scenarios
Agenda
5 Ordering Guide
6 How to Get Resources
2
X86 Blade Server Market Overview
In 2011, the total server market revenue reached $52.8 billion, among which Unix server revenue reached $17.2 billion (32.6%) and x86 server revenue
$35.6 billion (67.4%).
In 2011, the shipment of x86 blade servers took 12.8% (1.195 million PCS) of that of all x86 servers, with the revenue share reaching 21% ($7.53 billion).
In 2014, the total server market revenue will reach $56 billion, among which, the market revenue of x86 servers will be $42 billion (75%), and the
shipment of blade servers will take 26% of that of all x86 servers, with the revenue reaching $10.92 billion.
HP, IBM, Dell, and Cisco take 82.2% global market share of blade servers.
Blade servers are accepted by more and more customers. The market share of Cisco blade server burgeons and
encroaches the market shares of other server vendors.
43.9%
20.5%
12.5%
9.6%
8.2% 1.8%
1.7% 0.9% 0.9% Global market share of blade servers in 2011 HP Total
IBM Total
others
HP 47%
IBM 25%
Dell 10%
Other Vendors
6% Cisco 3% Oracle
2% Fujitsu 2%
NEC 1%
Hitachi 1%
SGI 1%
Dawning 1%
Groupe Bull 1%
Inspur Electronics
1%
Global market share of blade server s in 2010
3
1st-generation carrier-grade
blade server T8000 (out of
production)
Keep step with the industry
and applies to China's
Internet industry.
2003 2005 2006 2009 2012
T8000 (out of production)
widely substitute the
midrange computer platform
in the telecom industry and
applies to China's Internet
industry.
1st-generation enterprise-
level blade server E6000
Provide an efficient, unified
computing platform for
telecom operation,
enterprise applications, and
midrange and high-end
applications in the Internet
industry.
Converged architecture blade server
E9000
Consolidate storage, computing,
and network resources to meet
cloud computing, HPC, and high-
end enterprise application
requirements.
Huawei Blade Server Development History
2nd-generation enterprise-level
blade server E6000H
Provide superior computing
performance and density, and
meet requirements for high-
density and cluster deployments.
4
E9000 Positioning
Market positioning System Structure Features
Provide comprehensive high
performance computing
support for IT large-scale
and high-density deployment
industries such as cloud
computing, high-end
enterprise applications,
Internet service platform,
and HPC.
Adopt the fully redundant design
for power supply, heat
dissipation, management, and
switching subsystems based on
the 12 U/16 blades architecture;
use the latest Intel E5 series
CPUs; achieve best balance
between performance, density,
and energy consumption.
High performance, supporting
service development
High reliability, ensuring
proper running
Low power consumption,
reducing the OPEX.
Easy management,
simplifying the O&M
5
1 Click to add Title Market Overview and Positioning
Click to add Title 2 Product Specifications and Highlights
4 Product Comparison
Click to add Title 3 Application Scenarios
Agenda
5 Ordering Guide
6 How to Get Resources
6
E9000 Product Panorama
c
hassis
E9000 chassis
chassis
Com
putin
g n
ode
CH121
Sw
itch m
odule
Switch module
CH220 CH221 CH140
HW 2S Node
High density
Large memory
• Adopts the modular design for compute nodes, storage nodes, switch modules, fan
modules, and power supply modules
• 12U high chassis, providing 8 full width or 16 half width slots
• Support next 3 generation Intel processors
• Support evolution of next decade network technology
Computing node
CH222 CH240 CH242
HW 2*2P Twin Node
Ultra high density
high performance
FW IO Expansion Node
Large memory
Strong expansion
FW IO Expansion Node
Large memory
Strong expansion
FW Storage Node
Large memory
Ultra large storage
FW 4P Node
High performance
Ultra large memory
FW 4P Node
High performance
Large memory
CX110 CX310 CX311 CX116
GE switch module
CX317 CX611 CX911/CX912
GE pass-thru module 10GE converged
switch module
10GE/FCoE converged
switch module 10GE pass-thru module QDR/FDR
switch module
10GE/FC Multiplane
switch module
CH242 V3
FW 4P E7 v2 Node
High performance
Strong Expansion
7
E9000 Chassis
E9000 c
hassis
specific
atio
n
• Installed in a standard 19-inch rack, the E9000 is 12 U high. Its dimensions are: 530.2 mm x 442 mm x 840 mm (H x W x D)
• An E9000 chassis houses 16 half-width slots or 8 full-width slots
• Management modules support 1+1 redundancy and management protocols and interfaces such as IPMI 2.0, SOL, SSL,
SSH, and web
• Supports up to 6 Platinum PSMs (AC 3000 W/DC 2500 W) in N+N/N+1 redundancy with up to 95% efficiency under 50%
load and supports dynamic management for PSMs in the hibernation state
• Provides 14 fan modules(3 groups) and every group supports single-fan failures
Half width slot
Full width slot
Management
module
Switch
module
Power
supply module
Fan
module
Front view Rear view
Chassis specification
2X
3X
4E
E4
E1
X3
X2
Half width half
hight slot
8
Form factor Half-width 2-socket computing node
Number of CPUs 1 or 2
Processor model Intel Xeon E5-2600 or E5-2600 v2 Series CPU
Number of DIMMs 24 DDR3 DIMMs, providing a maximum capacity of 768G
Number of HDDs 2 2.5 inch SSDs or SAS/SATA HDDs
RAID support Support RAID 0 and 1
PCIe expansion 2 PCIe x16 MEZZ modules
1 standard PCIe x8 full-height half-length card
Operating systems
supported
Microsoft Windows Sever 2008/2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
……
Operating temperatures 5℃-40℃
Dimensions 215 mm(8.46 in.)*525mm(20.67 in.)*60.46mm(2.38 in.)
CH
121 p
roduct v
iew
CH121 Half Width Computing Node Front view
Isometric view
• High performance: Half slot provides a dissipation capacity of 700W, supporting 2 E5-2690 processors • Cost-effective large-memory: Provides 24 DIMMs at 1.5 times the usual height that apply mainstream granules to double capacity with a total of
up to 768 GB DDR3 memory capacity (most cost-effective for large-memory applications) • Flexible PCIe expansion: support 1 standard FHHL PCIe card,users can choose proper PCIe acceleration solution for service optimization
Hig
hlig
hts
9
CH
140 p
roduct v
iew
CH140 Half Width Twin Computing Node
• High performance : CH140 support 4 maximum 130W E5-2600 processors(E5-2680, 8 cores at 2.7GHz)
• Ultra-high computing density: One chassis supports 32*2P notes、64*Romley EP 130W CPU, industry highest density
• Single node maintenance
Hig
hlig
hts
4DIMMs
1*2
.5in
ch
HD
D S
SD
4DIMMs
Front view
Top view
Form factor Half-width 2*2-socket computing node
Number of CPUs 2*(1 or 2 )
Processor model Intel Xeon E5-2600 or E5-2600 v2 Series CPU
Number of DIMMs Each 2S node provides 8 DDR3 DIMMs
Number of HDDs 1 2.5 inch SSD/SAS/SATA
PCIe expansion Each node provides 2 PCIe x8 MEZZ modules
Operating systems
supported Microsoft Windows Sever 2008 /2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
……
Operating temperatures 5℃-35℃
Dimensions 215 mm(8.46 in.)*525mm(20.67 in.)*60.46mm(2.38 in.)
10
CH
220/C
H221 p
roduct v
iew
CH220/CH221 Full Width IO Expansion Node Front view
Isometric view
• Strong expansion capability: support standard PCIe card, a maximum of 4 PCIe cards are supported in one full width slot, industry No.1 PCIe expansion capability
• High performance: full width slot provides a dissipation capacity of 1400W, adoption of FHFL GPU cards can greatly improve HPC application performance
• Cost-effective large-memory: Provides 24 DIMMs at 1.5 times the usual height, most cost-effective for large-memory applications
Hig
hlig
hts
Form factor Full-width 2-socket computing node
Number of CPUs 1 or 2
Processor model Intel Xeon E5-2600 or E5-2600 v2 Series CPU
Number of DIMMs 24 DDR3 DIMMs, providing a maximum capacity of 768G
Number of HDDs 2 2.5 inch SSDs or SAS/SATA HDDs
RAID support Support RAID 0 and 1
PCIe expansion 1 PCIe x16 MEZZ modules
4 PCIe x8 FHHL(CH220)or 2 PCIe x6FHHL(CH221)
Operating systems
supported
Microsoft Windows Sever 2008 /2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
……
Operating temperatures 5℃-40℃
Dimensions 423 mm(16.65in.)*525mm(20.67 in.)*60.46mm(2.38 in.)
11
CH
222 p
roduct v
iew
CH222 Full Width Storage Expansion Node
• Ultra-Large storage: Full width slot provides 15 2.5 inch HDD bays, providing a maximum capacity of 15T, very suitable for applications of big data and distributed computing
• Flexible PCIe expansion: support 1 standard FHHL PCIe card,users can choose proper PCIe acceleration solution for service optimization • Cost-effective large-memory: Provides 24 DIMMs at 1.5 times the usual height, most cost-effective for large-memory applications
Hig
hlig
hts
Form factor Full-width 2-socket computing node
Number of CPUs 1 or 2
Processor model Intel Xeon E5-2600 or E5-2600 v2 Series CPU
Number of DIMMs 24 DDR3 DIMMs, providing a maximum capacity of 768G
Number of HDDs 15 2.5 inch SSDs or SAS/SATA HDDs
RAID support Support RAID 0,1,10,5,50,6,60, 1GB RAID cache
PCIe expansion 2 PCIe x16 MEZZ modules
1 PCIe x8 FHHL card
Operating systems
supported
Microsoft Windows Sever 2008 / 2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
……
Operating temperatures 5℃-40℃
Dimensions 423 mm(16.65in.)*525mm(20.67 in.)*60.46mm(2.38 in.)
Front view
Isometric view
12
CH
240 p
roduct v
iew
CH240 Full Width Computing Node
• High performance: full width slot supports 4 E5-4600 processors and 48 DDR3 DIMMs, providing a maximum memory capacity of 1.5TB • Large storage: full slot provides 8 2.5 inch HDDs bays, suitable for database applications requiring both computing performance and local
storage capacity • Cost-effective large-memory: Provides 48 DIMMs at 1.5 times the usual height, most cost-effective for large-memory applications
Hig
hlig
hts
Form factor Full-width 4-socket computing node
Number of CPUs 2 or 4
Processor model Intel Xeon E5-4600/core options: 4,6 or 8
Number of DIMMs 48 DDR3 DIMMs, providing a maximum capacity of 1.5TB
Number of HDDs 8 2.5 inch SSDs or SAS/SATA HDDs
RAID support Support RAID 0,1,10,5,50,6,60, 512MB/1GB RAID cache
PCIe expansion 2 PCIe x16 mezz modules
Operating systems
supported
Microsoft Windows Sever 2008 /2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
……
Operating temperatures 5℃-40℃
Dimensions 423 mm(16.65in.)*525mm(20.67 in.)*60.46mm(2.38 in.)
Front view
Isometric view
13
CH
242 p
roduct v
iew
CH242 Full Width Computing Node
•High performance: full width slot supports 4 E7-4800 processors and 32 DDR3 DIMMs, providing a maximum memory capacity of 1TB •Large storage: full slot provides 8 2.5 inch HDDs bays, suitable for database applications requiring both computing performance and local storage capacity •Flexible PCIe expansion: support 1 standard FHHL PCIe card,users can choose proper PCIe acceleration solution for service optimization
Hig
hlig
hts
Form factor Full-width 4-socket computing node
Number of CPUs 2 or 4
Processor model Intel Xeon E7-4800/core options: 6,8 or 10
Number of DIMMs 32 DDR3 DIMMs, providing a maximum capacity of 1TB
Number of HDDs 8 2.5 inch SSDs or SAS/SATA HDDs
RAID support Support RAID 0,1,10,5,50,6,60, 1GB RAID cache
PCIe expansion 4 PCIe x8 mezz modules, 1 PCIe x16 FHHL standard card
Operating systems
supported
Microsoft Windows Sever 2008 / 2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
……
Operating temperatures 5℃-40℃
Dimensions 423 mm(16.65in.)*525mm(20.67 in.)*60.46mm(2.38 in.)
Front view
Isometric view
14
CH
242 V
3 p
roduct v
iew
CH242 V3 Full Width Computing Node
•High performance: full width slot supports 4 E7-4800 v2 processors and 32 DDR3 DIMMs, supporting Max. Intel memory buffer width •Large storage: provides 8 2.5 inch HDDs bays, suitable for database applications requiring both computing performance and local storage capacity •Flexible PCIe expansion: support Max. 3 standard PCIe card,supporting GPU and PCIe SSD cards, suitable for large data sets and transaction-intensive database like HANA, Oracle DB etc. .
Hig
hlig
hts
Form factor Full-width 4-socket computing node
Number of CPUs 2 or 4
Processor model Full series of Intel Xeon E7-4800/core options: 8 ,10 or 15
Number of DIMMs 32 DDR3 DIMMs, support Intel Max. memory buffer width
Number of HDDs 8(8 HDDs version) or 4(4HDDs version) 2.5 inch SSDs or
SAS/SATA HDDs
RAID support Support RAID 0,1,10,5,50,6,60
PCIe expansion 4 PCIe x16 mezz modules
2 PCIe x16 FHHL PCIe cards, 8HDDs version support 1 PCIe
x16 FH ¾ L PCIe card additionaly
Operating systems
supported
Microsoft Windows Sever 2008 / 2012
Red Hat Enterprise Linux
SUSE Linux Enterprise Server
Citrix XenServer
VMware ESX
Operating temperatures 5℃-40℃
Dimensions 423 mm(16.65in.)*525mm(20.67 in.)*60.46mm(2.38 in.)
Front view
Top view
15
E9000 Switch Modules
Enables data center TRILL large layer 2 network construction
Supports DCB lossless Ethernet to bear FCoE and iSCSI
Supports a converged network, virtual paths, and flexible Ethernet and FC configuration
Hig
hlig
hts
Sw
itch M
odule
s
Switch Modules
CX110 CX310 CX311 CX116 CX317 CX611 CX911/CX912
Uplink :
12*GE and 4*10GE
Downlink:
32*GE
Uplink:
32*GE
Downlink:
32*GE
Uplink:
16*10GE
Downlink:
32*10GE
Uplink:
16*10GE and 8*8GFC
Downlink:
32*10GE
Uplink:
32*10GE
Downlink:
32*10GE
Uplink:
18*QDR/FDR IB
Downlink:
16*QDR/FDR IB
Uplink:
16*10GE and 8*8GFC
Downlink:
32*10GE and 16*8GFC
GE switch module GE pass-thru module 10GE converged
switch module
10GE/FCoE converged
switch module
10GE pass-thru
module
QDR/FDR switch
module
10GE/FC Multi plane
switch module
16
MEZZ Modules
ME
ZZ
Module
s
Models
Front view Isometric view
Mainboard connecter
Backplane
highspeed connecter
Model Description Specification
GE MZ110 MEZZ1/2 NIC mezz module with 4 x GE ports
10GE MZ510 MEZZ1/2 CNA mezz module with 2 x 10GE ports Supports FCoE, and FCoE supports NPIV and NPAR. A physical port can be split up to 4 NPARs.
MZ512 MEZZ1/2 CNA mezz module with 4 x 10GE ports Supports FCoE, and FCoE supports NPIV and NPAR. A physical port can be split up to 4 NPARs.
MZ311 ROCE mezz module with 4 x 10GE ports Support ROCE.
Multi-IO MZ910 MEZZ1/2 FC mezz module with 2 x 10GE and 2 x 8G FC ports FC ports support NPIV.
InfiniBand MZ610 MEZZ1/2 HCA mezz module with 2 x 4X InfiniBand QDR ports
MZ611 MEZZ1/2 HCA mezz module with 2 x 4X InfiniBand FDR ports
Type Available slot
17
E9000 High Backplane Connections
I/O C
on
necto
rs Sp
ecifica
tion
• The three I/O connectors on the backplane for each half-width compute node are A, B, and C.
• LAN on motherboard (LOM) uses connector A.
• The upper mezz module in slot MEZZ1 uses connector B.
• The lower mezz module in slot MEZZ2 uses connector C • The reserved LOM is fixedly connected to slots 2X and 3X. The backplane reserves two SerDes lanes for LOM signals to each slot. • MEZZ1 is fixedly connected to slots 2X and 3X The backplane reserves eight SerDes lanes for MEZZ1 signals to each slot. • MEZZ2 is fixedly connected to slots 1E and 4E The backplane reserves 8 SerDes lanes for MEZZ2 signals to each slot.
I/O Connections Specification
Backplane
半宽刀片
A
B C
A
B C
A: LOM
B: MEZZ1
C: MEZZ2
2X
3X
1E
4E
8x
A
B C
Half-width Node Mezz2
Mezz1 B
C
8x
8x
8x Half-width Node
Full-width Node
Backplane
I/O Connections from MEZZ card to switch slot
18
Blade Type GE Mezz Module 10GE Mezz Module
Multi-IO Mezz
Module InfiniBand Mezz Module
MZ110 MZ510 MZ311/MZ512 MZ910 MZ610① MZ611①
CH121 Mezz1 /2 Mezz1 /2 Mezz1 /2 Mezz1 /2 Mezz 2 Mezz 2
CH220 Only Mezz1② Only Mezz1② Only Mezz1② Only Mezz1② Not Support② Not Support②
CH221 Only Mezz1③ Only Mezz1③ Only Mezz1③ Only Mezz1③
Mezz 2④
【Only customized in
HPC projects】
Mezz 2④
【Only customized
in HPC projects】
CH222 Mezz1 /2 Mezz1 /2 Mezz1 /2 Mezz1 /2 Mezz 2 Mezz 2
CH240 Mezz1 /2 Mezz1 /2 Mezz1 /2 Mezz1 /2 Mezz 2 Mezz 2
CH242 Mezz1 /2/3/4 Mezz1 /2/3/4 Only Mezz1⑤ Mezz1 /2/3/4 Mezz 2/4 Mezz 2/4
Mezz Card and Blade Compatibility Matrix
Matrix
R
em
ark
Compatibility Matrix
① You are advised to install the InfiniBand mezz modules in Mezz2/Mezz4 (Releated to slots 1E and 4E), for cabling convenience because of the high
port density and thick InfiniBand cables.
②By default configuration, the Mezz2 slot of CH220 is already occupied (By the signal connector for standard PCIe card expansion slot) , so only
Mezz1 of CH220 can be used to deploy network mezz module.
③By default configuration, the Mezz2 slot of CH221 is already occupied (By the signal connector for standard PCIe card expansion slot) , so only
Mezz1 of CH221 can be used to deploy network mezz module by default.
④ But in HPC projects, when used CH221 to support GPGPU/co-processors, customized -configuration by PO of CH221 can be provided, the
customized-CH221 can use Mezz2 to deploy IB card. (Note: Customized CH221 need to be tracked by R&D now)
⑤ The new CH242 delivered from 2014.1 can support 1*MZ512 or*MZ311 mezz card(Must be deployed on Mezz1.Old version CH242 don't support
MZ512/MZ311).The special feature provided by MZ311 is ROCE, and since that the OS drivers of MZ311 are limit to only few new OS
versions,MZ311 is not recommend to deploy when no requirement with ROCE.
19
com
patib
ility
MEZZ and Switch Module Compatibility -1 Application
Scenarios
Customer Requirements on
Network Planes
Switch Module Recommended
Slots for Switch
Modules
Mezz
Module
Remarks
1. Conventional
Ethernet Networking
(Web service
deployment, big data
clusters, etc)
GE network 2 x CX110 2X/3X 1 x MZ110
10GE network 2 x CX310 2X/3X 1 x MZ510
2. Ethernet and FC
storage network
(Enterprise DC
consolidation,
virtualization,
database cluster, etc)
Ethernet and FC switching
network
2 x CX911
Or CX912
2X/3X 1 x MZ910 Configure GE or 10GE transceiver modules based
on customer requirements. If GE electrical ports are
required, Huawei provides GE RJ45 electric
transceiver modules for option.
Ethernet and FC network with
ultra-high reliability, requiring
physical redundancy on Ethernet
cards and HBA cards)
4 x CX911
Or CX912
2X/3X
1E/4E
2 x MZ910 Configure GE or 10GE transceiver modules based
on customer requirements. If GE electrical ports are
required, Huawei provides GE RJ45 electric
transceiver modules for option.
Network with three physically
isolated switching planes: the GE
switching plane for management,
the 10GE switching plane for
services, and the FC switching
plane for storage
2 x CX911
Or CX912
2X/3X 1 x MZ910 The 10GE and FC switching planes are provided.
2 x CX110 1E/4E 1 x MZ110 The GE switching planes are provided.
20
com
patib
ility
MEZZ and Switch Module Compatibility -2
3. Converged Ethernet
(VDI, enterprise DC
consolidation,
virtualization, etc)
Converged Ethernet networking
with IP SAN
2 x CX310 2X/3X 1 x MZ510 Multiple-plane communications can be implemented
by VLAN.
Converged Ethernet networking
with FC SAN
2 x CX311 2X/3X 1 x MZ510 Multiple-plane communications can be implemented
by VLAN.
4. InfiniBand network
(HPC)
HPC network: GE + InfiniBand
network, non-redundancy plane
1 x CX110 2X/3X 1 x MZ110 If Ethernet redundancy is required, configure one
more CX110.
1 x CX610 1E/4E 1 x
MZ610/MZ611
Choose the MZ610 (QDR) or MZ611 (FDR) based
on customer requirements.
Application
Scenarios
Customer Requirements on
Network Planes
Switch Module Recommended
Slots for Switch
Modules
Mezz
Module
Remarks
21
E9000 MM910 Management Module
Managem
ent M
odule
descrip
tion
Main parts and ports
• The MM910 manages the E9000, complies with IPMI 2.0, and provides management functions such as remote startup,
shutdown, reset, logging, hardware monitoring, SOL, KVM over IP, virtual media, fan monitoring, and PSM monitoring.
• The MM910 supports 1+1 redundancy, and provides a local KVM port for server management.
Description
CPU
FPGA DSP
Management GE port
Management serial port
Local KVM port
22
E9000 Converged Infrastructure Blade Server
• Computing 7 kinds of computing nodes,fully support E5-2600/E5-4600/E7-
4800 processors
• Storage Distributed storage solution provides cost-effective solution for
applications of big data
• Network 8 kinds of switch modules support GE/10GE/FCoE/FC/IB
QDR/FDR
• Management Esight unified management improves management efficiency over
70%
5 No.1
Energy
Efficiency
6 Convenient
O&M
No.1
Reliability
Support running at 40°C
The failure rate is 15% lower than competitors 4
1 No.1
Computing
Density
32*2P notes and 64*Romley EP 130W CPU per chassis Maximum floating point performance 16.5TFlops / chassis
2 No.1
Storage
Density
CH222(Full width)support 15*2.5 inch HDDs
Single-frame support 120*2.5 inch HDDs
3 No.1
Switch Performance
E9000 switch module base on advanced Huawei DataCenter
Switch Technology
15.6T backplane switch capacity,support maximum 128*10GE
ports and evolution to 40GE and 100GE
Support Ethernet,IB,FC ports, flexible networking
Rank first in China Mobile and China Unicom competition
testing
Chinese green energy certification
Plug and Play
Automatic configuration and transmission data, including
BIOS, RAID, network card
23
No.1 Computing Density
HUAWEI CH140
HUAWEI E9000
DELL M1000e
IBM FlexSystem
Quantity of CPUs / E5-2600 64/12U 32/10U 28/10U
Single node maintenance Yes Yes No
Quantity of memory channel 8 6 6
E900 Highest Computing Density
Half width slot support 2*2P nodes, E5-2600
CPU,every node support 8 memory
channels, support single node maintenance
IBM FlexSystem X222
DELL Power420
full width slot 4 nodes support E5-2400 CPU,every node only support 6 memory
channels
One chassis supports 32*2P notes、64*Romley EP 130W
CPU
Maximum floating point performance 16.5TFlops
Every node supports 8 memory channels, leading
memory bandwidth
Full hight 4 nodes support E5-2400 CPU,
every node only support 6 memory
channels. Not support single node
maintenance
24
No.1 Storage Density
HUAWEI CH222
IBM FlexSystem storage node
DELL internal SAN PS-M4110x
HUAWEI E9000
DELL M1000e
IBM FlexSystem
Quantity of HDDs per slot 15 7 14
Quantity of HDDs per chassis 120 56 98
E9000 Highest Storage Density
E9000 CH222:Support 15*2.5’ HDDs,SAS,
SATA, NL-SAS, 120 HDDs in one chassis Dell SAN PS-M4110x occupies double slots,support 14 HDDs, 56 HDDs in one
chassis
IBM Flexsystem storage note, support 14*2.5’
HDDs, 98 HDDs in one chassis
Note: E9000 chassis supports 8 CH222 computing nodes
E9000 CH222(Full width)support 15*2.5 inch HDDs
Single-frame support 120*2.5 inch HDDs,the biggest memory
capacity in one chassis
25
No.1 Switch Performance
E9000 Switch Module
Other Manufacture
HUAWEI
E9000
DELL
M1000e
IBM
FlexSystem
HP
C7000
Backplane bandwidth 15.6T 7.292T 7.168T 6.144T
Quantity of 10GE 128 48 88 64
E9000 switch performance overall leading
Switch slot uplink 32 ports,single-frame maximum 128*10GE ports,support more than 3 plane network
CX116 GE pass-thru: 32ports CX317 10GEpass-thru: 32ports
CX911 multi-plane switch board
IBM: single-frame max 88*10GE ports,only 2 network plane
HP/DELL:switch module uplink 16*10GE ports
E9000 switch module base on advanced Huawei DataCenter Switch
Technology
15.6T backplane switch capacity,support maximum 128*10GE
ports and evolution to 40GE and 100GE
Support Ethernet,IB,FC ports, flexible networking
EN4091 10Gb Board:
14 ports
EN4093 10Gb switch board:
14*10G+2*40G
HP 6120XG
10G switch board:
8 ports
10G switch board :8 ports
IB switch board :8ports
26
No.1 Reliability
Independent air-duct, improving
system heat dissipation
Quality control throughout the whole
process
The most stringent standards of
reliability testing for components
Passive backplanes avoid single
points of failure
• Front and rear independent
air-duct
• Duct design optimization
• High and low temperature test,
HALT
• 3000 times Power cycle test
• Continuous 30 days stress test
• Supplier Certification
• Component selection and
control
• IPD process from module to
system
• 150 reliability patents
• EMC testing, safety testing
HUAWEI Others
Failure Rate(According to the statistical result from customer T)
0.87% 1.12% Support stable operation at 40°C high temperature, ensuring business continuity
The failure rate is 15% lower than competitors
Ensure Reliability by Advanced Design and Strict Testing
• The passive backplanes contain
no active components such as
resistors, capacitors, and ICs,
except PCBs and connectors
27
No.1 Energy Efficiency
80PLUS Platinum Power
efficiency 94.6%
DEMT--Dynamic Energy
Management Technology
Power Capping Technology
Chinese Green Energy Certification
• Non-toxic design, Energy saving
• Green energy, to meet customer
requirements of environmental
protection
• Improve power utilization of the
equipment room and cabinet
• Improve equipment room
density, reduced rental costs;
• Improve energy efficiency over
13% by DEMT
• Range of energy saving cover
idle~100% load
Leading Energy Efficiency, Energy Saving
• 80PLUS Platinum power, 94.6%
conversion efficiency
• onboard DC/DC 94% conversion
efficiency
Rank No.1 in SEPC power testing
Rank No.1 in in China Mobile and China Unicom competition testing
Chinese green energy certification
28
Configuration
Migration
Offline
Configuration
Configuration
Remains
• Deployment, changing
or migration of blades
or switch modules
• Plug and play
• Parameters automatically configured and migrated (including
configurations of BIOS,network card,RAID etc.)
Initial deployment
Equipment migration
Mass deployment
Plug and play
Configuration migration with
equipment location
• Time-saving, changing
equipment would only
cost 2 minutes instead
of 20 minutes
Convenient O&M
Equipment changing
29
Technical Innovation: Accelerating Service Development
Huawei 4T financial data query test
Hardware acceleration solutions greatly accelerate services.
Use the PCIe SSD card to improve the IOPS by 100 times.
Use the compression card to improve the Hadoop performance by 40%.
Use the coprocessor to provide an acceleration ratio of 300%.
Use the iNIC to improve the Vswitch performance by 200%.
CH221
I/O expansion compute node
E9000 chassis
SSD card
iNIC
Intel Phi
coprocessor
Top 17
Financial
Ledger SQL
Query
Exadata Huawei
SQL17 Timeout 320s
SQL13 905s 319s
SQL12 737s 124s
SQL7 85s 15s
30
DIM
Ms a
t 1.5
times th
e u
sual h
eig
ht
Differential Advantage: Huawei Large-Capacity DIMMs at
1.5 Times the Usual Height
1.5 times the usual
height
42 mm to 46 mm
(1.65 in. to 1.81 in.)
VLP
19 mm (0.75 in.)
Standard height
30 mm (1.18 in.)
Universal
DIMMs in
the
industry
Huawei
IBM
• The RH2288H V2 supports DDR3 DIMMs at 1.5 times
the usual height, reducing costs by 20% to 30%
compared with DIMMs at the usual height (in the case of
32 GB memory).
• All E9000 compute nodes, except for the CH140 and
CH242, support DIMMs at 1.5 times the usual height.
DIMMs at 1.5 times the usual height are used in virtualization solutions, reducing memory investment by 20% to 30%.
31
Differential Advantage: DEMT
Energ
y savin
g s
tatis
tics
Descrip
tion
Energy saving statistics of the RH2288 V2 using the dynamic energy management technology (DEMT)
The DEMT is a dynamic energy-saving technology developed by Huawei. The technology automatically monitors server resource usage based on
service loads, dynamically adjusts server running status based on resource utilization, provides minimum power based on service requirements, and
minimizes server power consumption.
• Slashes system power consumption in various load scenarios without affecting service performance.
• Automatically triggers and monitors energy saving in closed-loop mode without manual intervention.
• Lowers power consumption for PSUs, processors, and fans based on service requirements.
DEMT
Remarks:
The data is obtained for the RH2288 V2
server in the integer computing benchmark
test. The effect varies depending on server
configurations.
32
Differential Advantage: Power Capping Technology
Backgro
und a
nd
benefits
T
est d
ata
Background
A rack can house more devices after the power capping technology is used.
Benefits
• The power supply and heat dissipation costs for data
centers dramatically increase and even exceed device
costs.
• The power supply and heat dissipation capabilities of data
centers do not meet requirements for service expansion.
• The power supply and heat dissipation equipment of data
centers is underused.
• Assigns power supply and heat dissipation resources based
on actual device power, improving energy usage.
• Increases reliability without affecting service performance.
• Eliminates the risks of insufficient heat dissipation and power
supply if air conditioners are faulty or service loads increase.
• Supports more devices in a rack.
Value
33
Differential Advantage: Huawei Proprietary Heat
Dissipation Design
E9000 compute node
E9000 chassis
Key
technolo
gie
s
Descrip
tion
System vector
airflow
management
Double-faced
cellular board
Aluminum board
embedded with
copper heat sink:
MIMO
Benefits • Ranks No. 1 in the SPECpower test.
• Supports smooth product evolution and expansion
and supports architecture evolution in 10 years and
processor evolution based on three generations.
• Supports operating temperature 40°C (104°F), which
is higher than the normal operating temperature 35°C
(95°F).
Huawei proprietary heat dissipation design
Key technologies
• Vector airflow management: ensures heat dissipation for high-power processors (95 W/130 W/135 W) with efficient utilization of limited airflow.
• Double-faced cellular board: increases the amount of system airflow input by achieving the open porosity of 43%, an increase of 115% compared with HP servers.
• Multiple-input multiple-output (MIMO) dynamic energy control: reduces energy consumption by 4.22%, raising the ranking from No.6 to No.1.
• Aluminum board embedded with copper heat sink: reduces the heat sink weight by 45%, cutting the cost by 40%.
The excellent heat dissipation design of the E9000 supports long-term stable operating at 40°C
(104°F) and technology evolution in 10 years and processor evolution based on three generations.
34
Differential Advantage: MIMO
Dia
gra
ms
Descrip
tion
MIMO principles and test data
MIMO heat dissipation and energy saving technology
Fan control
Temperature (chips,
Ta) CPU states
Fan speed
Fan speed
Target temperature
Noise limitation
Temperature limitation
CPU states
Input Output
Relationship between the processor
leakage current and temperature
Fan speed S
yste
m p
ow
er CPU high utilization
CPU low utilization
Relationship between the optimal energy saving
point and fan speed
• When the traditional fan speed adjustment technology is used, the fan speed is minimized when the device is operating at the normal temperature, ensuring lowest
noise while implementing heat dissipation. As the x86 manufacturing process develops, the leakage current of processors increases with the temperature. For
example, when the temperature of a processor increases by 1°C (33.8°F), the power consumption of the processor increases by about 0.7 W. The fan power
consumption is proportional to the fan speed by cube.
• The MIMO technology dynamically controls the fan speed in real time, balances the fan power consumption and hardware power consumption, and optimizes the
system energy consumption based on parameter value changes.
• Input parameters for energy saving control include the temperature (chip temperature and ambient temperature), processor running status, fan speed, and thresholds
(noise/temperature). Output parameters include the component target temperature, fan speed, and processor status.
• The MIMO technology saves energy by 5%, which is higher than the traditional fan speed adjustment technology.
35
Differential Advantage: Double-faced Cellular Board
Dia
gra
ms
Descrip
tion
Diagrams
Double-faced cellular board
• Compared with other structure, closed equilateral hexagonal honeycomb structure achieves the maximum force with the minimal materials and
maximizes the porosity area to ensure the maximum cooling area with the proper strength.
• Large-area bionic cellular heat dissipation holes ensure proper panel strength, maximize the cooling area, and ensure high air intake efficiency. The
most air intake volumes in unit time bring most cool air, which ensures excellent cooling performance for servers.
• Huawei servers use double-faced cellular board design, which adopts cellular heat dissipation holes on both sides of disk trays and provides lower
air resistance than competitors' products.
Porosity rate 58.9% Porosity rate 75%
36
Differential Advantage: Shock Absorption Design
Dia
gra
ms
Descrip
tion
Diagrams
Shock absorption design
• Shock risks in expected application environments are assessed during system design. Proper shock absorption is designed to prevent shock failures.
• Packaging buffer design ensures safe device transportation.
• Reasonable fan speed adjustment and fan component shock isolation are designed to avoid HDD-sensitive frequencies and to decrease risks of HDD performance
deterioration caused by rotating components.
37
Differential Advantage: High-Standard EMC Design
Descrip
tion
Pic
ture
s a
nd d
ata
Huawei EMC competitiveness comparison
Advantages of Huawei EMC design
• 20-year experience in electromagnetic immunity designs for Huawei network products in complex application environments
• General-purpose, high-reliability surge protection design
• Strict RE control based on global standards
EMC Competitiveness Comparison
Huawei Competitor Conducted
susceptibility 10 V 3 V
Signal port EFT 1 kV 0.5 kV
Power supply port
EFT 2 kV 1 kV
Radiated
susceptibility 10 V/M 3 V/M
ESD susceptibility Contact discharge 6 kV
Air discharge 8 kV
Contact discharge 4 kV
Air discharge 8 kV
Anti-surge
capability ITU 2.5/2.5 kV IEC 2 kV/2 kV
Radiation
emission (RE) CE/FCC Class A CE/FCC Class A
Huawei servers provide higher anti-interference and surge-protection
capabilities than competitors' products, supporting high adaptability.
38
Differential Advantage: Huawei-developed Technologies
and Optimization Capability
Descrip
tion
Huawei-developed technologies and optimization capability
• Architecture and solution design
• Component selection
• Schematic diagram
• PCB
• Heat dissipation
simulation
• Signal integrity simulation
• BIOS and BMC
• CPLD and FPGA logic
• iMana (management
software) - substitute for
USM
• Most competitors in China do not have comprehensive R&D systems. Most of them provide ODM servers purchased from Taiwan and United States.
• Competitors such as HP, IBM, Dell, and Cisco design architecture and management software and partner with ODM vendors such as Foxconn,
Inventec, Quanta for design, test, and production.
39
Smooth Evolution: Supporting Network Evolution
in 10 Years
Dia
gra
ms
Descrip
tion
Technology development trend
Network development trend and E9000 architecture planning
With the emergence and popularization of 100GE, InfiniBand EDR, and 32G FC technologies in the next
few years, support for signals at a rate higher than 25 Gbit/s is essential for smooth network evolution. The
HUAWEI E9000 high-speed chassis is designed to support 100GE and InfiniBand EDR evolution. To help
customers maximize return on investment (ROI) in the future 10 years, proper architecture planning is
implemented to ensure that the E9000 supports high-speed signals and high-speed backplane signal links.
This meets requirements for network evolution in the future 10 years and provides competitive advantages for
customers in the big data analysis market by delivering high performance, high bandwidth, and low latency.
40
Smooth Evolution: Supporting Processor
Evolution in 10 Years
Pic
ture
s
Descrip
tion
Independent air channel design and Intel processor planning
E9000 heat dissipation specifications and design for processor evolution based on three generations
• Separated air channels of the server blades,
switching subsystem, and power supply
subsystem
• Intelligent fan speed adjustment and high
efficiency heat dissipation
• Air vents in the backplane ensuring the shortest
air channels for nodes
• 1.5U space allowing for large air intake space
Processor (Tock) Processor Processor Type Processor with the
Highest Power
Release Date MAX TDP
Romley Ivy-Bridge IVB-EP 2S E5-26XX V2 2013 Q3 135 W (plan)
IVB-EP 4S E5-46XX V2 2013 Q4 130 W (plan)
IVB-EX E7-48XX V2
E7-88XX V2
2013 Q3 155 W (plan)
Grantly Haswell HSW-EP 2S E5-26XX V3 2014 145 W (plan)
HSW-EP 4S E5-46XX V3 2014 135 W (plan)
HSW-EX 2S E7-48XX V3
E7-88XX V3
2014 165 W (plan)
Next Generation > 165 W?
More cores need to be integrated into a processor due to
virtualization applications of data centers and competition
requirements, especially competition between the RISCtolA and the
midrange computer. As a result, processor power consumption is still
on the rise. From the released Intel road map, the maximum power
consumption of processors for servers increases to 155 W and 165
W. The HUAWEI Tecal E9000 meets the predicted requirements by
providing excellent heat dissipation design for compute nodes, which
facilitates applications of processors of 165 W or higher.
• Wide operating temperature range: Compute nodes' long-
term operating temperature ranges from 0°C to 40°C (32°F to
104°F).
• 700 W heat dissipation for a half-width compute node slot
• 1400 W heat dissipation for a full-width compute node slot
• 280 W heat dissipation for a switch module slot
• Compute nodes supporting the Intel E5/E7 processor family
work efficiently when DIMMs are fully configured.
41
Why the Huawei E9000 Uses a 12U Chassis?
Descrip
tion
Advantages of a 12U chassis
12U is the optimum height designed based on computing density, computing and storage capabilities, and long-term
evolution. 12U helps customers maximize ROI and minimize TCO by providing a wide range of hardware expansion
resources. 12U has the following advantages:
• With 12U height, the E9000 chassis has sufficient heat dissipation capabilities, can operate properly for a long term at 40°C
(104°F) to adapt to more severe environments, and follows the processor development trend and overall component power
consumption development trend of the next six or eight years to help customers maximize ROI.
• 12U provides 2.4-inch height per slot so that each slot can house 2.5-inch hard disks in three drawers and 3.5-inch hard disks
in two drawers. This greatly expands system storage capacity to better support integration with distributed storage and big
data applications.
• 12U space can house 16 half-width slots and 8 full-width slots. Each node supports DIMMs at 1.5 times the usual height.
Conventional blade server vendors reduce the chassis height to increase computing density per unit space. Such design
leads to the use of standard-height DIMMs and VLP DIMMs, which are less cost-effective than DIMMs at 1.5 times the usual
height.
Note:
Note: If a competitor promotes 10U height with four chassis in a rack during bidding, attempt to purchase the customer as
follows:
The three chassis in an E9000 rack provide higher computing density (CH140) than the four chassis in the competitor' rack, and reserve 4U space for placing storage devices, switches, rack servers, and other devices.
42
1 Click to add Title Market Overview and Positioning
Click to add Title 2 Product Specifications and Highlights
4 Product Comparison
Click to add Title 3 Application Scenarios
Agenda
5 Ordering Guide
6 How to Get Resources
43
Application Scenarios
IO Acceleration components
PCIe SSD, GPU
Network GE, 10GE, 8GFC, FCoE, Infiniband switch, TRILL large layer 2 data center switches
Storage IPSAN, FC-SAN, FCoE, distributed storage
Computing 2S, 4S computing nodes, storage expansion, IO expansion computing nodes
The modular converged architecture meets various workload requirements
Enterprise Datacenter
Virtual Desktop
Appliance
HPC
Key Application
Physical machine, VM, and infrastructure with converged computing, storage, and networking resources
VDI in a BOX
Application performance acceleration, High-speed Fabric interconnection, Business intelligence/DW, memory database, big data
Four-socket compute nodes supported in half-width slots,
InfiniBand switching RISC to IA
44
Enterprise Data Center Application Physical and Virtual Servers
Enterprise Datacenter Application
LAN
GE
10GE
8*8G FC
FC SAN
iSCSi
FCOE
8G FC
SAN
10GE
LAN
IPSAN
FCSAN
Typical Configuration
• E9000 chassis
• CH121 2-socket compute node (for web, middleware, and application VM
deployment)
• CH220 resource expansion 2-socket compute node
• CH222 storage expansion 2-socket compute node
• CH240 4-socket compute node (database physical machine deployment)
• Large-capacity SSD cards with application acceleration for email, ERP, CRM,
databases, and BI
• CX110 and CX311 switch modules
• GE, 10GE, FCoE, and FC switching, providing a converged network to
improve management convenience, flexibility, and scalability.
45
VDI in a Box Computing and Storage Convergence Without SAN
VDI in a box
GE/10GE
LAN
Typical Configuration
• E9000 chassis
• CH222 storage expansion 2-socket compute node
• CX110 switch module
• PCIe SSD card
Features
• Supports 128 processor cores, 6 TB memory capacity, and up to 128 TB
raw storage capacity.
• Supports 500 (heavy) to 1000 (light) virtual desktop infrastructure (VDI)
users.
• Supports deployment of an OS and hot applications on PCIe SSD cards,
which reduces the VDI startup peak, increases IOPS by 800%, and reduces
costs by 20%.
• Supports the disk drawer and hot-swappable disks to reduce the time
required to rebuild data during disk replacement.
• Supports the virtual block storage (VBS) distributed harsh table (DHT) ring
to protect shared disk storage in cross-server mode.
46
MPP Architecture OLAP for BI, DW, and In-memory Database
MPP Architecture Typical Configuration
• E9000 chassis
• CH222 storage expansion 2-socket compute node
• CH240 4-socket compute node (1.5 TB memory capacity)
• PCIe SSD card
• CX311 switch module
Features
• Provides 2-socket 24-DIMM computing capability per node. Supports 15
disks per node.
• A 4-socket 48-DIMM analysis node provides 1.5 TB memory capacity to
support the memory database and real-time analysis.
• Each node provides service bandwidth of 20GE. The switch latency is in ns,
which removes the IO bottleneck during the ETL process.
• The large-capacity PCIe SSD card is used for the index and hot data cache,
which greatly improves the IOPS of the parallel database.
56G IB
10GE LAN
47
Unstructured Database Application Hadoop, Hbase Application
Unstructured Database Application Typical Configuration
• E9000 chassis
• CH121 2-socket compute node
• CH222 2-socket storage expansion compute node (for web, middleware,
application VM deployment)
• Hadoop hardware compression card
• CX110 switch module
Features
• A NameNode 2-socket compute node can provide a cost-effective large
memory with up to 768 GB memory capacity.
• A DataNode 2-socket compute node supports 15 x 2.5" disks, and provides
40GE service bandwidth (4GE per node).
• The compression card improves Hadoop performance by 20%, and reduces
network traffic by more than 60%, CPU usage by over 80%, used disk space
by more than 50%, and disk I/O data read and write operations by over 50%.
GE LAN
10GE
48
Key Applications RISC to IA, Unix Migration
Key Applications Typical Configuration
• E9000 chassis
• CH121 2-socket compute node (for web, middleware, and application VM
deployment)
• CH240 4-socket compute node (database physical machine deployment)
• CH280 8-socket compute node (2013)
• PCIe SSD card
• CX110 and CX311 switch modules
Features
• Supports the VM resource pool for web, application, and middleware layers
and virtual NICs to increase network throughput, which ensures VM security.
• The OLTP database is deployed on physical machines, which supports
stateless computing and migration, and use FC SAN for shared storage.
• Supports a large-capacity cache by using PCIe SSD cards to improve I/O
performance for databases.
• Supports highly reliable redundancy for PSMs (N+1/N+N) and fan modules.
12 x GE
uplink ports
16 x 10GE
uplink ports
8 x GE
downlink
ports FC
8 x GE
downlink
ports
32 x 10GE
uplink ports
LAN
8G FC
SAN
49
High Performance Computing HPC Application
HPC Feature
• CH140 Twin Computing Node: High-density computing
• Supports 2*2-socket compute nodes in half-width slots
• Supports 64 Intel Xeon E5-2600 processors in a chassis.
• Supports 192 E5-2600 processors in a rack(3 chassises).
• Supports 12 TB memory capacity
• Supports InfiniBand QDR/FDR
• Supports InfiniBand EDR evolution
• Supports GPU and SSD resource expansion
CH140 4S high density computing node
CH221 IO expansion 2S computing node
50
Customer requirements
As the dispatching and directing management system is closely related to
production security, the China Railway Engineering Corporation (CREC) requires a
system with high reliability and security.
The dispatching and directing management system frequently transmits data,
which imposes a high requirement on the data transmission latency.
The system must be easy to maintain.
Highlights
Reliability: The E9000 uses a passive backplane and fully redundant key
components, which greatly improves system reliability.
Real-time capability: The E9000 backplane provides a switching capability of up
to 15.6 Tbit/s, ensuring high-speed data switching for internal service modules.
Maintainability: The E9000 provides unified eSight management interfaces for
configuring, monitoring, and managing the chassis, PSUs, fan modules, switch
modules, and compute nodes.
Case: Dispatching and directing management
system for CREC
51
Customer requirements
• Storage: The distributed storage solution is used to allow all compute nodes to
share the storage space.
• Computing: The system supports the next-generation Intel CPUs with the data
processing capability of 8 TFLOPS at peak values.
• Network: The multiple-plane networking is used to isolate the computing, storage,
and management networks.
Solution
• The Lustre distributed storage solution is used, and compute nodes and storage
nodes are selected for the Lustre networking.
• The existing platform can be smoothly upgraded to Ivy Bridge, which meets
requirements for the architecture and computing performance.
• The GE, 10GE, and IB networking solutions are provided, and physical planes are
isolated, which ensures stable service operating.
Case: HPC for UK XX University
52
1 Click to add Title Market Overview and Positioning
Click to add Title 2 Product Specifications and Highlights
4 Product Comparison
5 Ordering Guide
Click to add Title 3 Application Scenarios
Agenda
6 How to Get Resources
53
E9000 Chassis Advantages
Ad
va
nta
ge
s
E9000 chassis advantages
Switching Industry-leading backplane switching capability of 15.6 Tbit/s
Storage 8 CH222 storage nodes, configured with 120 x 2.5" internal
hard disks in a chassis for providing the largest internal
storage capacity in a chassis.
Computing 64 Romely EP 130 W CPUs in a chassis, with the highest
density in the industry
Heat
dissipation
Support for stable operating at 40°C
Note:
A.Only IBM servers support the 40°C specifications among
competitors.
B.The CH140 twin compute nodes support the temperature
range from 5°C to 35°C, and therefore the CH140 twin
compute nodes support CPUs of up to 130 W.
PSU 80 Plus Platinum PSUs with power efficiency of 94.6%, which
is 5% higher than the industry level
54
E9000 Compute Node Advantages A
dva
nta
ge
s
Form Factor
Half-width CH121 N/A
DIMMs at 1.5 times the
usual height
One PCIe x8 FH HL SSD on
each compute node
Half-width CH140 twin
compute nodes Independent
node
maintenance
64 x 130 W E5-2600
CPUs in a chassis, with
the highest density in
the industry
N/A N/A N/A
Full-width CH220 I/O
expansion node N/A N/A
DIMMs at 1.5 times the
usual height N/A
4 PCIe x8 FH HL slots for
installing 4 GPU or PCIe SSDs
per compute node
Full-width CH221 I/O
expansion node N/A N/A
DIMMs at 1.5 times the
usual height N/A N/A
Full-width CH222 storage
node N/A N/A
DIMMs at 1.5 times the
usual height
15 x 2.5" hard disk slots in a full-width
slot of 1.5U One PCIe x8 FH HL SSD on
each compute node
Full-width, 4-socket E5-
4600 CH240 compute node N/A N/A
DIMMs at 1.5 times the
usual height
8 x 2.5" hard disk slots (The number of
hard disks supported on a 4-socket
compute node is twice that of a
conventional 4-socket compute node.)
N/A
Full-width, 4-socket E7-
4800 CH242 compute node N/A N/A N/A
8 x 2.5" hard disk slots (The number of
hard disks supported on a 4-socket
compute node is twice that of a
conventional 4-socket compute node.)
One PCIe x8/x16 FH HL slot
CPU Memory Storage PCIe Expansion Compute Node
55
Competitiveness Comparison Between the E9000
and Products from Tier 1 Competitors Key
Competitiveness Key Feature HP C7000 G8 IBM FlexSystem Cisco UCS G3 Dell M1000e HUAWEI E9000
Engineering capability Power supply and heat dissipation for
front and rear slots 1200 W/100 W 1200 W/100 W 1200 W/100 W 1400 W/280 W 1400 W/280 W
Computing capability Computing capability per chassis 32 56 16 64 (E5-2400) 64
Memory capacity Memory capacity per chassis
(mainstream chips) 8.2 TB 10.8 TB 6.14 TB 12.3 TB 12.3 TB
Storage capability
2.5" disk quantity per slot 12 12 12 4 15
Convergence of computing and storage
resources External SAN
External SAN
Internal SAN External SAN External SAN
External SAN
Internal distributed storage
Network switching
backplane capability 6.144 Tbit/s 7.168 Tbit/s 1.28 Tbit/s ? 15.6 Tbit/s
Number of 10GE ports per chassis 120 64 16 ? 128
Maximum plane quantity 4 2 1 3 5
Multi-plane networking Y Y N Y Y
10GE/FCoE converged switch module Y Y Y Y Y
40GE Y N Y Y Y
RoCE N Y N N Y
16G FC N Y N Y N
PCIe expansion Maximum number of standard PCIe slots
per compute node N 2 PCIe x8 + 2 x PCIe x16 slots N N
4 PCIe x8 or
2 PCIe x16 slots
Operating environment Ambient temperature 5°C to 35°C 5°C to 40°C 5°C to 35°C 5°C to 35°C 5°C to 40°C
56
HUAWEI E9000 IBM Flexsystem HP c7000 Cisco UCS 5108 Dell M1000e
Target field HPC, virtualization, and high-end enterprise
applications
Converged architecture Large enterprise data center Enterprise data center Universal compute node
Dimensions 12U, 20.9" (530.2 mm) H
17.4" (442 mm) W
33.1" (840 mm) D
10U, 17.3" (440 mm) H
17.4" (442 mm) W
31.5" (800 mm) D
10U, 17.4" (442 mm) H
17.6" (447.04 mm) W
32.0" (813 mm) D
6U, 10.5" (267 mm) H
17.5" (445 mm) W
32" (812 mm) D
10U, 17.3" (440 mm) H
17.6" (447 mm) W
29.7" (754 mm) D
Maximum number
of supported
compute nodes
10U/16 FH or 8 FH server blades (vertical)
blades (horizontal)
10U/14 FH or 7 FH server blades (vertical)
blades (horizontal)
10U/16 FH or 8 FH server blades (vertical)
blades (vertical)
10U/8 FH or 8 FH server blades
(vertical)
blades (horizontal)
10U/16 FH or 8 FH server blades (vertical)
blades (vertical)
PSU Max 6 x 3000 W AC or
6 x 2500 W DC
Max 6 x 2500 W AC Up to 6 x 960 W/2250 W Output
Up to 6 x 2400 W Output
Single-phase AC or -48 V DC
4 x 2500 W
220 V single-phase AC
6 x 2700 W hot-plug PSUs
110 V to 120 V or 208 V to 240 V AC
Fan module 14 hot-swappable fan modules 10 hot-swappable fan modules 10 fan modules 8 hot-swappable fan modules 9 hot-swappable fan modules
Switch module ≤ 4
GE, 10GE, 8G FC, FCoE, and InfiniBand
QDR/FDR
≤ 4
GE, 10GE (40GE ports available), 8G/16 G
FC, FDR InfiniBand, SR-IOV, and FCoE
≤ 8
GE, 10 GE, 8 GFC, QDR InfiniBand, and SAS
≤ 2
Each switch module providing 4 x
10GE SFP+ ports (FCoE)
≤ 6
GE, 10GE, 8G FC, and InfiniBand QDR/FDR
Other features Most hard disks supported on a compute
node
Support for DIMMs at 1.5 times the usual
height
IBM new-generation blade server, planned
for replacing the BladeCenter products
Widely deployed enterprise-level blade
server
released in 2007
Released in 2009
Important part of the UCS
Similar architecture with the HP c7000
64 server blades supported in four chassis in
40U
2-socket compute
node
CH121/CH140 (twin node)/CH221/CH222 X86: X220/X222 (twin node)/X240
Power: p24L/p260
BL460c Gen8, BL420c Gen7, BL620c G7,
BL465c Gen8…
B200 M2/B250 M2/B230
uiM2/B200M3/B22 M3
M420 (twin node), M520, M620…
4-socket compute
node
CH240/CH242 X86:x440
Power:p460
BL680c G7 (4 blades), BL685c G7 (8
blades), and BL660c Gen8 (8 blades)
B440 M2/B420 M3 M820, M910, M905
Weight Empty chassis: 70 kg (154.32 lb)
Fully configured with 2-socket compute
nodes: 212 kg (467.38 lb)
Fully configured with 4-socket compute
nodes: 223 kg (491.63 lb)
Empty chassis: 99 kg (218 lb)
Fully configured: 224 kg (493 lb)
68.5 kg (DC PSUs, compute nodes only in the
chassis)
87 kg (single-phase AC)
100.7 kg (three-phase AC)
Configured with compute nodes
only in the chassis: 40.8 kg (89.95
lb)
Full configuration: 115.7 kg (255.07
lb)
Max fully loaded with server blades and rear
modules: 178 kg
Chassis Specifications Comparison--E9000 vs. Tier 1 Competitive Products
57
Compute Node Comparison--E9000 vs. IBM Flexsystem
X222 Flexsystem
Half-width 2 x 2-socket twin
compute nodes
X240
Half-width 2-socket compute
node
Full-width 2-socket + I/O
expansion node
CH121 CH220 CH221 CH140
E9000 Compute Node CH222 CH240 CH242
Half-width 2-socket
compute node
Half-width 2 x 2-socket twin
compute nodes
Full-width I/O
expansion node Full-width I/O
expansion node
Full-width storage
expansion node
Full-width 4-socket E5-4600
compute node
Full-width 4-socket E7-4800
compute node
D
A
A A
A DIMMs at 1.5
times the
usual height
B More standard PCIe cards
supported
C Larger local storage
capacity
D CPUs of later series E Independent
maintenance
F Long-term stable operating at
40°C
G More DIMMs
supported
H Flexible configuration
of RAID controller
cards
I Others
X240 + I/O
expansion node
58
Compute Node Comparison--E9000 vs. IBM
Flexsystem
Flexsystem
CH121 CH220 CH221 CH140
E9000 Compute Node CH222 CH240 CH242
Half-width 2-socket
compute node
Half-width 2 x 2-socket
twin compute nodes
Full-width I/O expansion
node
Full-width I/O expansion node Full-width storage
expansion node
Full-width 4-socket E5-
4600 compute node
Full-width 4-socket E7-
4800 compute node
A DIMMs at 1.5
times the
usual height
B More standard PCIe cards
supported
C Larger local storage
capacity
D CPUs of later series E Independent
maintenance
F Long-term stable operating at
40°C
G More DIMMs
supported
H Flexible configuration
of RAID controller
cards
I Others
Full-width 4-socket E5-4600
compute node
X440
A/C/H B/C/D/H
• The CPU with the highest performance in the Intel E5-2600 series is the E5-2690 CPU (20 MB cache, 8 cores, 2.90 GHz, and 135 W).
• The CPU with the highest performance in the Intel E7-4800 series is the E7-4870 CPU (30 MB cache, 10 cores, 2.40 GHz, and 130 W).
A/C
X240 + storage
expansion node
Full-width 2-socket +storage
expansion node
59
How to Defend Against IBM Flexsystem
How to defend against the Flexsystem?
• The Flexsystem supports the internal storage device V7000.
The V7000 occupies 3U space and has limited expansion capability. The Huawei external storage device S2600T or S5500T provides
the same storage capacity as the V7000 in a just 2U space and higher expansion capability than the V7000.
• A Flexsystem I/O expansion node provides more PCIe slots than the E9000 CH221.
The Flexsystem I/O expansion node uses a PCIe switch to provide PCIe slots. However, the communication bandwidth between the
switch and the CPU is the bottleneck. The E9000 CH221 provides two PCIe x16 slots directly from the CPU, supporting a higher
bandwidth.
• The Flexsystem provides 16G FC ports.
The mainstream products provide 8G FC ports because the 16G FC specification has poor cost effectiveness.
• The E9000 provides the 4-socket E7-4800 CH242 compute node, while IBM does not provide any similar product.
Persuade customers to use the high-end E7-4800 compute node to beat IBM.
60
Compute Node Comparison--E9000 vs. HP C7000 CH121 CH220 CH221 CH140
E9000 Compute Node CH222 CH240 CH242
Half-width 2-socket
compute node
Half-width 2 x 2-socket
twin compute nodes
Full-width I/O expansion
node
Full-width I/O expansion node Full-width storage expansion
node
Full-width 4-socket E5-4600
compute node
Full-width 4-socket E7-4800
compute node
BL460c Gen8
C7000 Compute Node
Half-height 2-socket E5-
2600 compute node
BL660c Gen8
Full-height 4-socket E5-
4600 compute node
BL680c Gen7
Full-height 4-socket E7-
4800 compute node
A/B/F/G/I
I: The 460c has to use
four fewer DIMMs
when E5-2690 series
CPUs are configured.
A/C/F/G B/C/D/F
B/C/F/I
I: The 680c occupies four
slots. A chassis supports
only four 4-socket E7
compute nodes.
A DIMMs at 1.5 times
the usual height
B More standard PCIe
cards supported
C Larger local storage
capacity
D CPUs of later series E Independent
maintenance
F Long-term stable
operating at 40°C
G More DIMMs supported H Flexible configuration
of RAID controller
cards
I Others
• The CPU with the highest performance in the Intel E5-2600 series is the E5-2690 CPU (20 MB cache, 8 cores, 2.90 GHz, and 135 W).
• The CPU with the highest performance in the Intel E7-4800 series is the E7-4870 CPU (30 MB cache, 10 cores, 2.40 GHz, and 130 W).
61
How to Defend Against the HP C7000
How to defend against the C7000?
• The BL680 supports 64 DIMMs.
A chassis supports four BL680s, and each BL680 is configured with 64 DIMMs. This configuration provides low density and supports a
complex stacking structure, which induces a high failure rate. The E9000 CH242 supports 32 DIMMs. A chassis supports eight CH242s,
which provides higher density and supports more hard disks and PCIe cards than the BL680.
• GE + FC networking
The E9000 currently does not support GE and FC networking. Persuade customers to use the 10GE and FC networking. If GE or FC
networking is required, recommend the E6000 GE and FC, or E9000 10GE and FC networking to customers. Currently, the E9000 GE
and FC solutions are under development and will be released in April of 2014.
• Brocade FC switch
The E9000 that supports the Brocade FC switch was on sales in October of 2013.
62
Compute Node Comparison--E9000 vs. Cisco UCS
B200M3
UCS
Half-width 2-socket
compute node
B420M3
Full-width 4-socket E5-
4600 compute node
B440M2
Full-width 4-socket E7-
4800 compute node
A/B/F
A/C/F
C/B/F/I I: supports E7-4870 (130
W). The server blades that use the 130 W E7-
4870 CPUs were recalled due to the
overtemperature.
CH121 CH220 CH221 CH140
E9000 Compute Node CH222 CH240 CH242
Half-width 2-socket
compute node
Half-width 2 x 2-socket
twin compute nodes
Full-width I/O expansion
node
Full-width I/O
expansion node Full-width storage
expansion node
Full-width 4-socket E5-4600
compute node
Full-width 4-socket E7-4800
compute node
A DIMMs at 1.5 times
the usual height
B More standard PCIe cards
supported
C Larger local storage
capacity
D CPUs of later series E Independent
maintenance
F Long-term stable
operating at 40°C
G More DIMMs supported H Flexible configuration
of RAID controller
cards
I Others
• The CPU with the highest performance in the Intel E5-2600 series is the E5-2690 CPU (20 MB cache, 8 cores, 2.90 GHz, and 135 W).
• The CPU with the highest performance in the Intel E7-4800 series is the E7-4870 CPU (30 MB cache, 10 cores, 2.40 GHz, and 130 W).
63
How to Defend Against the Cisco UCS
How to defend against the Cisco UCS?
• Storage or PCIe expansion computing nodes
UCS does not provides blades such as storage expansion node(E9000 CH222) or PCIe expansion node(E9000 CH220/221 alike);
• Open protocol and different network type
UCS only supports 10GE FCoE, and the network environment is not open to regular equipment because of its private protocol, so it
can not meet the demand of interconnection availability of blades and third party’s TOR switches, besides, it also can not compliant to
the features of supporting different network type such as FC, GE, or physically isolated multi-plane networking;
64
Compute Node Comparison--E9000 vs. Dell M1000e CH121 CH220 CH221 CH140
E9000 Compute Node CH222 CH240 CH242
Half-width 2-socket
compute node
Half-width 2 x 2-socket
twin compute nodes
Full-width I/O expansion
node
Full-width I/O
expansion node Full-width storage
expansion node
Full-width 4-socket E5-
4600 compute node
Full-width 4-socket E7-
4800 compute node
C/D/G
A/B/F/I
I: The M620 cannot
support the E5-2690
CPUs. The M620
supports four fewer
DIMMs when the E5-
2667 CPUs are
configured.
A/C/F
M420 M1000e
1/4-height, high-density node
M620
Half-height 2-socket
compute node
M820
Full-height 4-socket E5-
4600 compute node
Full-height 4-socket E7-
4800 compute node
M910
B/C/F/I
I: The M910 supports
the E7-4830 CPUs of
up to 105 W.
A DIMMs at 1.5 times the usual height B More standard PCIe cards supported C Larger local storage
capacity
D CPUs of later series E Independent
maintenance
F Long-term stable
operating at 40°C
G More DIMMs supported H Flexible configuration of RAID
controller cards
I Others
65
How to Defend Against the Dell M1000e
How to defend against the Dell M1000e?
• Six I/O switch modules
The E9000 provides four physical I/O switch slots to implement five switching planes. The Dell M1000e supports only three switching
planes.
The E9000 provides more ports on switch modules than the Dell M1000e.
• GE + FC networking
The E9000 currently does not support GE and FC networking. Persuade customers to use the 10GE and FC networking. If GE or FC
networking is required, recommend the E6000 GE and FC, or E9000 10GE and FC networking to customers. Currently, the E9000 GE
and FC solutions are under development and will be released in April of 2014.
• Brocade FC switch
The E9000 that supports the Brocade FC switch was on sales in October of 2013.
66
Compute Node Comparison--E9000 vs. IBM BladeCenter
CH121 CH220 CH221 CH140
E9000 Compute Node CH222 CH240 CH242
Half-width 2-socket
compute node
Half-width 2 x 2-socket
twin compute nodes
Full-width I/O expansion
node
Full-width I/O expansion
node Full-width storage
expansion node
Full-width 4-socket E5-
4600 compute node
Full-width 4-socket E7-
4800 compute node
A/B//F/G/I
I: I: The HS23 does
not support the E5-
2690 CPUs but
supports only the high-
cost VLP DIMMs.
HS23 BladeCenter
Full-height 2-socket
compute node
A DIMMs at 1.5 times
the usual height
B More standard PCIe cards
supported
C Larger local
storage capacity
D CPUs of later series E Independent
maintenance
F Long-term stable
operating at 40°C
G More DIMMs supported H Flexible configuration of
RAID controller cards
I Others
• The BladeCenter is gradually replaced by the Flexsystem.
• The CPU with the highest performance in the Intel E5-2600 series is the E5-2690 CPU (20 MB cache, 8 cores, 2.90 GHz, and 135 W).
• The CPU with the highest performance in the Intel E7-4800 series is the E7-4870 CPU (30 MB cache, 10 cores, 2.40 GHz, and 130 W).
67
6 How to Get Resources
5 Ordering Guide
Agenda 1 Click to add Title Market Overview and Positioning
Click to add Title 2 Product Specifications and Highlights
4 Product Comparison
Click to add Title 3 Application Scenarios
68
集群NAS引擎
服 务
存储单元
Type of the server blade
One server need base parts
Mezz Card
Blade Type
Base Parts
Mezz Parts
Opt Parts
Quotation Elements for the Blade System
Server Blade
Optional parts on demands
Blade Chassis
Chassis Type
Base Parts
Switch Module
Opt Parts
Server blade
Chassis need base parts
Network switch
Optional parts on demands
69
Blade System Product Configuration Procedure Start the
UniSTAR tool.
Select Fibre
Channel modems.
Select optional parts.
Select a model of
Server blade.
Determine if the
riser card need.
Determine the PCIe card quantity.
Select PCIe card
type in the PCIe
slots.
(optional)
Select a blade from the E6000 or E9000
Select base parts.
CPU quantity
Memory quantity
CPU type
Memory type
Hard Disk quantity Hard Disk type
RAID card type
Determine if the
DVD need
Determine if
the OS need Select OS type.
Select OS
version
Determine if the
insert card need
Select network internet card Select mezz card.
Start the
UniSTAR tool.
Select Fibre
Channel modems.
Select optional parts.
Select a model of
blade chassid.
Select the chassis according to blade
Select base parts. Fan module quantity
Power quantity Power type
Determine if the
DVD need
Select network switch according to blade Select switch.
Determine if the
rail need
Management module quantity
70
What Is SCT?
SCT: a swift, smart, and simple online
configuration quotation tool
SCT: simplifying configuration quotation
The SCT comprehensively shows
the latest and hot Huawei
products, updates data in real
time, and enables quick product
selection, helping you learn about
Huawei products conveniently.
Easy quotation order creation,
specific discount settings,
automatic price verification,
and convenient quotation
order management help you
comprehensively create and
manage quotation orders.
Intelligent product
configuration, automatic
configuration verification, and
configuration sharing simplify
product configuration, ensure
configuration accuracy, and
help you complete
configuration easily.
Quick learning about
Huawei products Intelligent product configuration Easy quotation order creation
Product Configuration Quotation
Back to the Agenda
71
How to Obtain SCT Access Permission
SCT login
Use your Huawei account to log in to the following website:
http://app.huawei.com/unistar/sct
NOTE:
You can log in to the SCT as user Guest to view and configure products. Enter the verification code to directly log in to the SCT.
The recommended resolution is 1280 x 1024. Supported browsers include Internet Explorer 8.0, Firefox 11.0+, Safari 5.12+, and
Chrome 19.0+.
If you already have the eCFG permission, use your W3
account for login.
If you do not have the eCFG permission, use the
permission application e-Flow to apply for data package
permission of the corresponding product line.
For a Huawei product manager For a dealer
If you do not have a Huawei account, register
an account at Huawei's official website.
If you already have a Huawei account, send
your account to the channel manager to apply
for the SCT permission.
Account/Permission application
72
SCT functions
Product
Enables you to select a product for
configuration.
Configuration
Enables you to create a configuration item,
view the configuration list, add or delete a
product, and modify product configuration.
Quotation
Enables you to create a quotation item,
view the quotation list, and add, delete, or
modify product configuration.
1
2
3
73
1 Click to add Title Market Overview and Positioning
Click to add Title 2 Product Specifications and Highlights
4 Product Comparison
6 How to Get Resources
Click to add Title 3 Application Scenarios
Agenda
5 Ordering Guide
74
How to Get Huawei Document Resource
Policy
– Learn about the channel partner policy.
Query and Application
– Query or apply for partners.
Documents and Tools
– Query pre-sales documents and tools of partners.
Solutions
– Obtain solution cooperation information.
Method 1: enterprise website
http://enterprise.huawei.com/en/
Method 2: email
Method 3: Document User Guide
How can I obtain
pre-sales
documents?
75
How to Get Pre-sale Help
http://enterprise.huawei.com
/en/about/contact
Support Center
Huawei Experts Team
Partners
Partners
7*24 hours presales email and
telephone support
Products and solutions consulting
Copyright©2012 Huawei Technologies Co., Ltd. All Rights Reserved.
The information in this document may contain predictive statements including, without limitation, statements regarding the future financial and operating results, future product
portfolio, new technology, etc. There are a number of factors that could cause actual results and developments to differ materially from those expressed or implied in the predictive
statements. Therefore, such information is provided for reference purpose only and constitutes neither an offer nor an acceptance. Huawei may change the information at any time
without notice.
HUAWEI ENTERPRISE ICT SOLUTIONS A BETTER WAY