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Digital RF Stabilization System Based on MicroTCA Technology - Libera LLRF. Robert Černe May 2010, RT10, Lisboa [email protected]. www.i-tech.si. Outline. Introduction Hardware overview Digital signal processing Software architecture LLRF application. www.i-tech.si. - PowerPoint PPT PresentationTRANSCRIPT
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Digital RF Stabilization System Based on MicroTCA Technology - Libera LLRF
Robert Černe
May 2010, RT10, Lisboa
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Outline
● Introduction● Hardware overview● Digital signal processing● Software architecture ● LLRF application
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Introduction 1/2: Instrumentation Technologies and the Libera brand
● Provider of state-of-the-art Libera family instrumentation systems.
● Instrumentation systems are used for diagnostics and beam stabilization at particle accelerators.
● All-in-one instruments cover analog and real-time digital signal processing and high level software.
● LLRF application:● Low Level RF (LLRF) systems are responsible for precise control of RF
fields in the accelerating structures and use feed-back or/and feed-forward techniques to achieve this.
● Key requirements:● 36 RF input channels.● Low amplitude and phase noise of the LLRF receiver and LLRF transmitter.● Distributed digital signal processing.● Low latency data transfer between FPGAs (< 100 ns).● High data throughput between FPGA and CPU.● Small form factor.● Generic design to support reuse of developed hardware for development of
new instruments.
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Introduction 2/2: LLRF application and key requirements
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Hardware Overview 1/7: Technologies
● Based on MicroTCA / AMC standards.● Based on IPMI board management.● Intel dual core COM Express computing
module. ● PCIe over backplane and cable.● Gigabit ethernet.● Low latency LVDS links.● Distributed processing on Xilinx Virtex 5
FPGAs.● Distributed acquisition circular buffers
(DDR2RAMs).
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Hardware Overview 2/7: Architecture
● Chassis is designed to fit into 19 inch rack and has 2U height.
● Integrated power supply module that produces 12 V payload power.
● Chassis and backplane can accept up to eight AMC modules (4x double width and 4x single width; all mid-size).
● ICB board in non AMC slot at the top on the left.
● Cooling is performed by two replaceable fan modules, which produce horizontal air flow.
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Hardware Overview 3/7: Interconnection Board (ICB)
● Implements MCH functions and acts as a COM Express carrier board.
● Power distribution.● High throughput PCIe switch fabric.● Distribution of switch fabric clock.● IPMI management of AMC modules.● Integrated COM Express module with
powerful CPU. ● FPGA for configuration and control of ICB
hardware.● Interfaces: JTAG, RS232, host USB,
management Ethernet, 2x PCIe, 2x LXI, DVI, USB and 2x GbE.
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Hardware Overview 4/7: LLRF receiver AMC module
● Consists of digital and RF PCBs.● 9 RF input channels, LO (Local Oscilator)
input and calibration input.● Down conversion technique used.● 9 x 16 bit ADCs (up to 130 MS/s), raw
acquisitions (DDR RAM up to 8 Gbits)● Virtex 5 FPGA .● ARM processor with IPMI support.● DMA implemented in FPGA.● PCIe endpoint implemented in FPGA.● 8x PCIe link to the card edge connector.● SerDes transmitters implemented in
FPGA.● Dedicated low latency LVDS links to the
card edge connector.
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Hardware Overview 5/7: LLRF transmitter AMC module
● Consists of digital and RF PCBs.● 2 RF output channels, 2 RF input channels
abd LO input.● Up/Down conversion technique used.● 2 x 14 bit double DACs (up to 260 MS/s),
2x 16 bit ADCs raw acquisitions (DDR RAM up to 8 Gbits)
● Virtex 5 FPGA .● ARM processor with IPMI support.● DMA implemented in FPGA.● PCIe endpoint implemented in FPGA.● 4x PCIe link to the card edge connector.● SerDes receivers implemented in FPGA.● Dedicated low latency LVDS links to the
card edge connector.
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Hardware Overview 6/7: Timing AMC module
● Consists of digital and RF PCBs.● MO (Master Oscillator) input.● LO (Local Oscillator) generation and
output.● Sampling clock generation and distribution
to AMC modules.● Interlock input and output.● 2x trigger input and distribution to AMC
modules.● ARM processor with IPMI support.● Lattice FPGA .● PCIe endpoint implemented in FPGA.● 1x PCIe link to the card edge connector.
● 3.3 V and 12 V payload power connections from ICB to all AMC modules.● Digital lines for JTAG communication between ICB and each AMC module.● Digital lines for I2C communication between ICB and each AMC module.● Differential lines between ICB and each AMC module for USB communication.● Differential lines between ICB and each AMC module used for PCIe lanes and
PCIe clock.● Differential lines between Timing AMC module and each AMC module used for
sampling clock distribution.● Two digital lines between Timing AMC module and each AMC module for
interlock information transfer.● Differential lines between LLRF transmitter and each LLRF receiver.
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Hardware Overview 7/7: Backplane
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Signal Processing Overview 1/2: Control loops
● Low latency cavity field control loop● Scaling and phase rotation of probe signals● Partial / global vector sum calculation● Set-point signal generation● Feed forward signal generation
● Pulse shaping (during fill time, flat top )● Feed-back / feed-forward control algorithms● Drive signal generation● Interlock triggering based on signal power
threshold
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Signal Processing Overview 2/2: Signal acquisition
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Software Overview: Software architecture
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LLRF Application Overview 1/3: Functions
● Libera LLRF system operation (state transitions, parameter setting, interlock control).● Signal monitoring.● Different RF diagnostics, calibration and compensation algorithms.
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LLRF Application Overview 2/3: Freq. response
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LLRF Application Overview 3/3: Signal monitoring