#icae2018 - tecnalia for sponsor.pdf · communication and promotion plan page 11 benefits for...

20 - 22 June 2018 Donostia - San SebastiánPROPOSAL FOR SPONSORS

INTERNATIONAL CONGRESSON ARCHITECTURAL ENVELOPESVIII

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CONTENTS

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1 INVITATION Page 3

RESULTS OF THEVII EDITION - ICAE 2015 Page 4

APPROACH FOR THE VIIIEDITION OF THE CONGRESS - ICAE 2018 Page 6

TECNALIA AND THEICAE 2018 CONGRESS Page 7

ORGANISING COMMITTEE Page 8

DETAILS OF THE CONGRESSINFORMATION FOR SPONSORS Page 9

COMMUNICATION ANDPROMOTION PLAN Page 11

BENEFITS FORSPONSORS Page 12

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1. INVITATION

This latest edition will be the eighth and the approach aims to follow the format of the past two editions: a national and international forum enabling the most relevant aspects of the world of envelopes to be discussed whilst staying abreast of the latest developments in the sector through two different but complementary points of view:

• The latest advances, studies and developments from the point of view of R&D of universities, research centres and manufacturing firms

• Use of these advances in innovative buildings and envelopes and their direct impact on the market and in everyday life.

During the congress, we want to be able to provide this dual vision, the future and the developments that we envisage for the forthcoming years and the everyday life that we face in 2018.

This event is one of the most important at a national level related to envelopes as it brings together the two aforementioned fields in the same forum: R&D and the market.

To do so, experts from different specialities come together in order to provide a global vision of all of the elements that are influential when it comes to designing, manufacturing, installing and using an envelope today. The congress offers a unique opportunity to discover and stay abreast of the all of the developments in the sector and the new products that are envisaged in the forthcoming years.

For this reason, we would like to rely on your participation in this latest edition of the congress.

Julen Astudillo President of the Organising Committee

TECNALIA invites you to participate in the VIII International Congress on Architectural Envelopes, ICAE 2018, which will be held from 20 to 22 June 2018 in Donostia - San Sebastian.

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2. RESULTS OF THE VII EDITION - ICAE 2015

The seventh edition of the International Congress on Architectural Envelopes, organised by TECNALIA Research & Innovation, was held from 27 to 29 May 2015 in Donostia - San Sebastian. This edition focused on smart envelopes. The congress brought together over 300 researchers, industrialists and architects from Latin America and the United States, as well as different European countries.

Over three days, ICAE 2015 became the meeting point to discover the latest trends in the sector, products, solutions and success stories in the market; whereby the event is backed by data such as:

• Over 300 professionals representing more than 150 entities.

• 45% of participants belong to industries related to envelopes, 10% prescribers, 41% researchers and 4% related to sectorial associations. This shows that the different agents that make up the façade sector were attracted and brought together to dialogue.

• In the international field, people from France, Italy, Germany, United Kingdom, Netherlands, Belgium, USA, Turkey, Sweden, Finland and Denmark participated.

• Over 70 speeches were given.

• 12 industrial firms presented their products on their stands.

The ICAE 2015 congress, organised by TECNALIA, showcased an extensive and innovative array of technological developments in Architectural Envelopes.

It was attended by over 300 participants and 70 first rate speakers.

Industrial Firms

Architecture Studios and Engineering Firms

Public and Private Research Bodies

Associations

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International speakers, such as Lorenzo Valles (Head of R&D at the European Commission), Uli Blum (Zaha Hadid Architects), Ulrich Knaack (TU Delft), Edouard Gillon (WATG), Rob Henderson (UN Studio), Alex de Jong (OMA), Jesús Román (Estudio Rafael de la Hoz), Jesús Cerezo (ENAR Envolventes), Xavier Ferrés (Ferrés Arquitectos), Pablo Garrido (Catalunya Polytechnic University), Lisa Rammig (Eckersley O´Callaghan), Guruprakash Sastry (Infosys), Stefan Marinitsch (Seele GmbH), Francesc Arbós (Bellapart), Patrick England (FAEFC, European Association of Façade Manufacturers), Jos Lenferik (VEKA), Max Radt (Wicona)… and researchers from TECNALIA among many others, participated in the congress.

One of the most important challenges faced by the congress was to convey the importance of new developments and technologies related to making envelopes smarter in recent years. The afternoon of the second day of the congress was devoted to a debate table on the new possibilities offered by information technologies in their relationship with envelopes.

The congress relied on the collaboration and support of industry, as a result of its contribution through speeches and the sponsorship of: ALUCOIL, ALUMAN, ARCELORMITTAL, DEKTON, DOW CORNING, ROCKWOOL, SAINT GOBAIN, PAREX, SIKA, STROW, VEKA and WICONA and the collaboration of the Spanish Association of Manufacturers of Light Façades and Windows (ASEFAVE), VETECO, the AMANAC Cluster (Advanced Material & Nanotechnology Cluster for Energy Efficiency in Buildings), the European Construction Technology Platform (ECTP), the European Steel Technology Platform (ESTEP), the European Façade Network, the Federation of European Window and Curtain Wall Manufacturers´ Association (FAECF), the Basque Government, the Spanish Steel Technological Platform (PLATEA) and the Spanish Construction Technological Platform (PTEC).

www.tecnalia.com

VII CONGRESO INTERNACIONAL DE ENVOLVENTES ARQUITECTÓNICAS VII INTERNATIONAL CONGRESS ON ARCHITECTURAL ENVELOPES

www.icae2015.com

27-29 de mayo, 2015May 27-29, 2015Palacio de Congresos

y Auditorio KursaalDonostia - San Sebastián

España / SpainColaboradores I Partners

Patrocinadores I Sponsors

www.tecnalia.com

VII CONGRESO INTERNACIONAL DE ENVOLVENTES ARQUITECTÓNICAS VII INTERNATIONAL CONGRESS ON ARCHITECTURAL ENVELOPES

www.icae2015.com

27-29 de mayo, 2015May 27-29, 2015Palacio de Congresos

y Auditorio KursaalDonostia - San Sebastián

España / SpainColaboradores I Partners

Patrocinadores I SponsorsSPONSORS (ICAE 2015)

COLLABORATORS (ICAE 2015)

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3. APPROACH FOR THE VIII EDITION OF ICAE 2018 AND MAIN THEMES OF THE CONGRESS

The architectural envelope, due to it being the main reason for holding the conference and the driving force that has guided the previous seven editions, and Industry 4.0 due to its growing importance in recent years. This importance has been increasing due to the need to improve the manufacturing, assembly, distribution and installation processes of many of the products in order to be competitive in today’s market.

This trend is not a far cry from the world of envelopes, in which greater complexity is acquired due to the difficulty of the final step (installation on an unstructured medium, such as a building in the construction process) and the common uses in the world of construction.

The first steps related to Industry 4.0 are starting to be taken in architectural envelopes, among which the following can be highlighted:

• New manufacturing methods (additive manufacturing).

• Use of robots in the process of manufacture and assembly.

• Introduction of the ICTs (Information and Communication Technologies) in all fields of the process.

• Use of BIM systems in manufacturing, installation and in building management.

• Introduction of the IoT (Internet of Things) in the entire value chain.

All of this is without forgetting the regular themes at the congress are related to the characteristics that an architectural envelope should provide to function properly throughout its useful life:

• Energy efficiency

• Heat Storage

• New materials

• Sustainability, Wind, Photovoltaic systems - Solar gain

• Life-cycle Analysis, Acoustic insulation

• Glass

• Industrialised systems

• Safety, etc.

The general theme of the congress will be Envelopes 4.0. Under this title, the aim is to unify the two aspects to be fostered in this latest edition:

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Therefore, the latest developments as a result of this collaboration in diverse fields will be presented during the congress: materials, new products, use of information technologies throughout the construction process, Smart buildings and Smart cities, validation, certification, etc.

The congress is the optimum environment to compare first hand with our customers the projects and developments that have been carried out over the past three years, through joint ventures related to R&D performed by companies in conjunction with TECNALIA as well as collaborations or direct requirements to solve problems that arise during the use of products or systems in their useful life (studies, analysis, calculations, testing, etc.).

Much of this collaboration is reflected in this TECNALIA Catalogue in the field of architectural envelopes that represents collaboration with companies in recent years as well as TECNALIA’s technological offer.

For TECNALIA, the congress is the ideal opportunity to create synergies with many of the participating companies with which it has constantly collaborated for more than 30 years.

TECNALIA’s technological offer in the field ofArchitectural Envelopes

4. INVITATION

https://www.tecnalia.com/images/stories/Catalogos/CAT_envolventes_EN.pdf

https://www.tecnalia.com/images/stories/Catalogos/CAT_envolventes_EN.pdf

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5. ORGANISING COMMITTEE

For the successful outcome of the congress, an organising committee has been set up, consisting of the following TECNALIA staff:

• Julen Astudillo Programmes and Technology Manager Sustainable Construction Division

• Dr. Jose Antonio Chica Industrialised Construction Director Sustainable Construction Division

• Miguel Mateos Innovation and Conformity Assessment Point Manager Technological Services Division

• Virginia Aseguinolaza Director of the Construction Area Technological Services Division

• Xabier Olano Head of Safety Laboratory Technological Services Division

• Peru Elguezabal Envelopes Project Manager Sustainable Construction Division

• Roberto Garay Envelopes Project Manager Sustainable Construction Division

• Beñat Arregui Energy Efficiency Sustainable Construction Division

• Anais Silban Communication and Marketing Manager Technological Services Division

• Myriam Torres Communication and Marketing Manager Sustainable Construction Division

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6. DETAILS OF THE CONGRESS

DATEFrom 20 to 22 June 2018

VENUEKursaal Congress Centre and Auditorium

Avda. de Zurriola, 120002 DonostiaGipuzkoa - Spain

FIRST DAY20 JUNE

SECOND DAY21 JUNE

THIRD DAY22 JUNE

HALL 1 HALL 2 HALL 1 HALL 2 HALL 1

9am - 11am Plenary Conferences 9am - 11amInternational Conferences

ClusterMeeting

National Conferences

11am - 11.30am Coffee Break 11am - 11.30am Coffee Break Coffee Break

11:30am - 1:30pmTechnical

ConferencesTechnical

Conferences11:30am - 1:30pm

International Conferences

ClusterMeeting

National Conferences

1:30pm - 2:45pm Lunch 1:30pm - 2:45pm Lunch Lunch

2:45pm - 4:25pmTechnical


Conferences2:45pm - 4:25pm

Workshop 1

Workshop2

Workshop 3

Workshop4

4:25pm - 4:50pm Coffee Break 4:25pm - 4:50pm

4:50pm - 6:30pmTechnical


Conferences4:50pm - 6:30pm

8:00pm Congress Dinner

INFORMATIONFOR SPONSORSJulen Astudillo: 647 402 258 - [email protected] Silban: 606 584 776 - [email protected] Torres: 664 109 217 - [email protected]

[email protected]

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20/6 - FIRST DAY:

21/6 - SECOND DAY:

22/6 - THIRD DAY:

PLENARY CONFERENCES Introduction to the congress by the leading agents in the sector

TECHNICAL CONFERENCES Scientific speeches related to the main and secondary themes of the congress.

• A selection of these papers (around 20) may be presented in a special number with a collaborating journal and therefore they will be indexed

INTERNATIONAL CONFERENCES Selection of international conferences with architects / engineering firms / companies based on the most relevant international actions..

• Possibility of sponsorship of these conferences by interested companies

CLUSTER MEETINGS Projects/associations with themes related to envelopes.

THEMED WORKSHOPS To go into detail on aspects of interest related to envelopes.

• Sponsorship of the workshop by companies is being considered

The structure would be as follows:• Presentation of the session by the sponsoring

company• Technical conferences on the theme• Debate open to participants

WORKSHOP THEMES• New challenges in energy efficiency: Buildings Zero

Energy - Plus Energy Houses• Additive Manufacturing/Industry 4.0/Robotics in

construction.• New materials: possibilities and features• Information and Communication Technologies in

envelopes - Internet of Things

NATIONAL CONFERENCES Conferences that reflect the most outstanding actions on a national level by architects/engineering firms/ companies in the field of architectural envelopes.

In this eighth edition, we are going to have a new tool, which is a networking section, a forum for B2B meetings.

Those registered in ICAE 2018 networking will have access to an online meeting tool in which their supply and/or demand capacities will be published, or in other words, what is offered and demanded by the rest of the participants.

Once their supply and/or demand capacities, have been published, those registered may request meetings and receive meeting requests from the rest of the participants.

Use of the online meeting tool allows up to 10 meetings lasting 15 minutes to be scheduled with potential clients.

These meetings will take place in a space that has been fitted out for this purpose during coffee breaks and at lunchtime.

NETWORKING

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COMMUNICATION PLAN• Press Releases:

- At least five press releases prior to holding the congress- Two press releases after the event

• Management of Interview in journals, newspapers and radio

COMMUNICATION CHANNELS• Web Event: www.icae2018.eu • Collaborating Media• Collaborating Organisations• Sponsors• Specialised media of the sector

ADVERTISING CHANNELS Banners, e-mailings, etc.

• TECNALIA own resources• Collaborating Organisations• Sponsors

TECNALIA CORPORATE SOCIAL NETWORKS• Twitter: @tecnalia• #ICAE2018

SPECIAL POST EVENT DEVELOPMENTDevelopment of a special section on the congress website in which the most important events will be published (video of interviews and specific material).

Prior to the congress, the following promotion actions will be carried out:

7. COMMUNICATION AND PROMOTION PLAN

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The International Congress on Architectural Envelopes, in its eighth edition, has achieved important national presence and relevance. There are already important commercial trademarks, institutions and business organisations that support and sponsor this congress.

Sponsoring this VIII edition on Architectural Envelopes is an excellent way of associating your corporation with an international event of high standing, increasing your visibility and accessing new clients.

Sponsorship offers the following general benefits as well as others depending on the different types of sponsorship:

• Linking your brand with innovation in a congress of European relevance.

• Increasing your image as a key player in the sector.

• Presence of your brand in the event’s advertising and communication: leaflets, newsletters, posters, programme, website, etc.

• Possibility of obtaining qualified contacts with professionals of the sector.

• Diffusion of your products to prescribers.

• Meetings with the most influential players in the sector.

• Increasing relations with current and potential clients.

• Discovering current trends and challenges in the sector.

• Being recognised as a sponsor of the congress through an extensive promotion campaign.

SUPPORTING THIS CONGRESS IS ESTABLISHING NEW CONTACTS AND THE OPPORTUNITY TO BE PRESENT IN A STRATEGIC FORUM.

All of the sponsors will benefit, increasing their brand as detailed below:

8. BENEFITS FOR SPONSORS

Hosting all social, non-profit making events, external contributions and collaboration are one of the fundamental pillars of the organisation.

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ORGANISATION OF THE STRUCTURE OF PRESENTATIONS of the workshop along with TECNALIA.

POSSIBILITY OF MAKING A SPEECH to present the workshop (10 minutes).

THANKS IN THE OPENING SPEECH..

ONE-PAGE ADVERTISEMENT in the brochure of the congress.

LOGO IN PROMOTIONAL VIDEOS of the congress.

SPONSORSHIP INVOLVES THE SUPPLY OF 5 FULL ENTRANCE TICKETS (three days) by TECNALIA to the sponsor to be distributed among its clients.

LOGOS of the SPONSORS PRINTED ON THE FOLLOWING SUPPORTS: Stage, programme, book of speeches, posters, congress website, promotional videos.

CONGRESS WEBSITE. Inclusion of the sponsors’ logos and the link to their websites on the congress website.

PRE-EVENT COMMUNICATION VIA E-MAIL (lower part of e-mails):In the weeks prior to the event, an email-newsletter will be

sent to over 3,000 contacts of TECNALIA, all of which belong to the sector and/or are interested in it. This e-mail will report on the evolution of the congress and will also include a space for the event’s sponsors

CONFERENCE BOOKLET: Logo of the sponsors in the booklet that will present the conferences that are part of the congress.

CONFERENCE SCREEN: During the event, the stage will be presided by a large screen which will reflect the logos of the sponsors.

MEETING POINT IN THE HALL: Possibility of leaving promotional material in the hall of the event during the congress in a space especially prepared for the sponsors. Exhibition space of 2 m².

INSPIRING SESSION BY TECNALIA. TECNALIA experts will visit the Sponsor’s company and its Technical Team to analyse and make proposals regarding innovation opportunities in relation to business concerning Industry 4.0.

€6.000 + VAT

GENERAL SPONSOR OF ICAE 2018 AND OF ONE OF THE CONGRESS WORKSHOPS

BENEF ITS

GOLD SPONSOR

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€ 3.000 + VAT + expenses for 1 speaker

GENERAL SPONSOR OF ICAE 2018 AND OF ONE OF THE SPEAKERS AT THE PLENARY SESSIONS OF THE CONGRESS

Possibility of introducing the speaker mentioning the sponsorship and APPEARING IN ALL OF PUBLICATIONS RELATED TO THE CONGRESS as a sponsor of the speech.

The choice of the speaker will be decided between the sponsor and TECNALIA.

The sponsor will incur the costs of the selected speaker attending the event (travel and hotel). This speaker will be one of those RESPONSIBLE FOR GIVING ONE OF THE PLENARY CONFERENCES.

LOGO IN PROMOTIONAL VIDEOS of the congress..

Sponsorship involves the supply of 5 FULL ENTRANCE TICKET (three days) by TECNALIA to the sponsor to be distributed among its clients.

LOGOS OF THE SPONSORS PRINTED ON THE FOLLOWING SUPPORTS: Stage, programme, book of speeches, posters, congress website, promotional videos.


PRE-EVENT COMMUNICATION VIA E-MAIL (lower part of e-mails): In the weeks prior to the event, an email-newsletter will be sent to over 3,000 contacts of TECNALIA, all of which belong to the sector and/or are interested in it. This e-mail will report on the evolution of the congress and will also include a space for the event’s sponsors.



MEETING POINT IN THE HALL: Possibility of leaving promotional material in the hall of the event during the congress in a space especially prepared for the sponsors. Exhibition space of 2 m²..

INSPIRING SESSION BY TECNALIA. TECNALIA experts will visit the Sponsor’s company and its Technical Teamto analyse and make proposals regarding innovation opportunities in relation to business concerning Industry 4.0.

SILVER SPONSOR

BENEF ITS

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Sponsorship involves the supply of 5 FULL ENTRANCE TICKETS (Three days) by TECNALIA to the sponsor to be distributed among its clients.

LOGO IN PROMOTIONAL VIDEOS of the congress.

LOGOS OF THE SPONSORS PRINTED ON THE FOLLOWING SUPPORTS: Stage, programme, book of speeches, posters, congress website, promotional videos.


PRE-EVENT COMMUNICATION VIA E-MAIL (lower part of e-mails): In the weeks prior to the event, an email-newsletter will be sent to over 3,000 contacts of TECNALIA, all of which belong to the sector and/or are interested in it. This e-mail will report on the evolution of the congress and will also include a space for the event’s sponsors.



MEETING POINT IN THE HALL: Possibility of leaving promotional material in the hall of the event during the congress in a space especially prepared for the sponsors. Exhibition space of 2 m².

INSPIRING SESSION BY TECNALIA. TECNALIA experts will visit the Sponsor’s company and its Technical Team to analyse and make proposals regarding innovation opportunities in relation to business concerning Industry 4.0.

€3.000 + VAT

GENERAL SPONSOR OF ICAE 2018

BRONZE SPONSOR

BENEF ITS

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#icae2018 - tecnalia for sponsor.pdf · communication and promotion plan page 11 benefits for...

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