ICTURKEY 2019ECSEL JU

Istanbul, 5/7/2019

Dr.ir. Yves GIGASEHead of ProgrammesECSEL JU

Outline

1. What is ECSEL?2. What kind of projects?3. How do I participate?4. What will come next?

TOPICS: Information & Communication Technologies (ICT) and Cross-cutting themes of H2020:• 5G• Next Generation Internet• Big Data and Applications• Digitising European Industry• Smart Health and Care

64 projects2161 beneficiaries

3 385 million Euro cost1 174 million Euros in funding

ECSEL : A UNIQUE MODEL TO PROMOTE EUROPEAN INNOVATION

3 (Industry) Associations:AENEAS EPOSS ARTEMISIA

28 ECSEL Participating States

European Commission

Re-inforce/Align National strategies and European priorities

Promote synergies between commercial strategies and societal needs

INCLUDING TURKEY

TRIPARTITE=3 – PartneringJU = Joint Undertaking

JU: COMMON GOVERNANCE + COMMON FUNDING

Participating States

Public companiesCompanies (large and small)

Universities, RTOs,…

Regions

Smart Specialization ESIF/ERDF

> 1.17B€ 1.17B€

> 1.6B€

Governing BoardECSEL Members

(Public Authorities, Private Members)

Executive DirectorProgramme Office

Public Authorities BoardEuropean Commission,

ECSEL Participating States

Private Members BoardAENEAS, ARTEMIS-IA, EPoSSSRA

WPSRA

Call

Contributions EU:EPS:Benefiaries in 1:1:2 proportionTurkey is an ECSEL participating state!

JU: common strategy: Strategic Research Agenda (SRA)

LONG TERM TOPICS

• 3 Industry Associations• AENEAS• ARTEMIS-IA• EPoSS

• Other activities of the 3IA• EFECS• Brokerage events• Matchmaking

• SRA is adopted by the Governing Board

ECSEL ARE PEOPLE, ORGANIZATIONS AND PROJECTS

BUT ALSOPUBLIC AUTHORITIES

ASSOCIATIONSEVENTS

Outline

1. What is ECSEL?2. What kind of projects?3. How do I participate?4. What will come next?

Focus Areas

High Performance Computing

ArtificialIntelligence

5G

Cybersecurity

IoT / IIoT Smart Power Grid

LONG TERM TOPICSNeuromorphic computing Quantum computing

Edge Computing

ECSEL: NETWORKS OF PARTNERS AND PROJECTS

CPS platform developments

More Moore Technology

Silicon on Insulator Technology

Other Components

MtM IC-Technology

MtM pilot lines for ISS

Digitalisation of Industry CPS with mixed

HW/SW developments

Integrated Smart Systems

Platforms for Cyber Physical Systems

Evolution also visible in the interactions between clusters

Evolution and continuity in projects

Value chain approach

Cluster: More Moore

from ASML10

Cluster: New components for ICs

11

Fully Depleted Silicon on Insulator: EU changing therules of the game for edge computing, IoT, always-on applications, radars, … made in Europe !

PLACES2BE Call 2017 ECSEL Ocean12 lowest power processorCall 2015 ECSEL Reference 4G/4G+ & 5G

Call 2014 ECSEL Ways2gofast 22 nm ultra low powerCall 2013 ECSEL Things2Do FDSOI process/design

Call 2012 ENIAC Places2Be 28nm FDSOI industrialisation

RF-SOI

Cluster: Power electronics

“Enhanced Power Pilot Line”: 2nd generation powersemiconductor devices on 300mm wafer

“Enabling Power technologies on 300mm Wafers” project wasbased on the concept of a 1:1 transfer approach from 200 mm to300 mm diameter silicon wafers.

excellence in speed and reliability for Morethan Moore technologies : high volumeproduction and quick introduction.

Power Semiconductor and Electronics Manufacturing 4.0 smart, security, variation, simulation

Infineon Austria invests 1,6 B € over 6 years on a new 300 mm fab for power semiconductors: 400 employees and 1,8 B€ additional sales. (May 2018)

Important Projects Common European Interest

ST-Italy is building a 300mm Si-fab and a 200mm SiC fab for power components and circuits.

Example

Call 2018 selected projects

All selected projects reach out to programmes outside of ECSEL: value chain stakeholders, other associations or programmes, etc by:• Developing standards• Using roadmaps and priorities of other

organisations• Integrating communities outside ECSEL in the

ECSEL value chains • Developing key enabling technologies enabling

technologies of other programmes/ sectors

Cost 800Mio€ ; Funding 390Mio€ ; 13 projects; 500 beneficiaries

Power2Power and PIN3S

The next-generation silicon-based power solutions in mobility, industry and grid for sustainable decarbonisation in the next decadeThe consortium is composed of a good mix among research institutions, automotive electronics innovation expertise, small and large industry representatives, non-profit organizations, and smart system application companies.Power2Power will enable innovations and create opportunities from possible disruptions by providing cost effective high power electronics components. The work within the project is structured in work packages along the value chain.

Pilot Integration 3nm Semiconductor technology (follow up to Tape3S)Development of new advanced alignment models: alignment and focus sensors scan every wafer creating an advanced model that intelligently combines the data from these sensor and generate a hybrid, high density wafer map which is used as input to the many actuators in the lithography system thereby further improve the performances

Focus on key enabling technologies, involvment of others through roadmapping

Comp4Drones and NewControlFramework of key enabling technologies for safe and autonomous drones’ applications: drone platform with a wide range of integrated sensors (navigation sensors, image & spectral sensors) for transport applications, smart systems focus on essential communication features for a drone: (1) position indication, (2) instructions reception, (3) coordination with other flying objects, and (4) allowing traffic management. (5) Neural network accelerators in FPGA.

Integrated, Fail-Operational, Cognitive Perception, Planning and Control Systems for Highly Automated Vehicles• reference to EPoSS European Roadmap Smart Systems for Automated Driving: 5.4.1

Technology Inside Car, 5.4.2 Infrastructure , 2.2.3 Liability and Safety, 5.4.4 System Integration and Validation,

• At the sensor level, these goals will be achieved through heterogeneous, More-than-Moore integration, improving the reliability and dependability of sensor compounds by eliminating mechanical parts.

• At the system level, this goal will be facilitated by advanced control systems that realize adaptive control circuitry close to the sensor modules

Development of smart systemsAnswering a need identified in the SESAR JUStandardsDevelopment of eco system based on open platform

Development of smart systemsDevelopment of sensors and systemsLinks to several other priority areas

HELIAUS and VIZTA

tHErmaL vIsion Augmented awarenesS • development of a novel chip architecture together with on-chip integrated functions to make the IR sensor as easy to use as visible

sensor, • design and manufacturing of innovative IR optic systems utilizing cutting edge component manufacturing technologies, • as well as cost efficient and ultraprecise packaging and assembly technologies in order to provide a thermal infrared module, • development of specific embedded systems for computer vision developments. • Innovative neural network based algorithms

Vision, Identification, with Z-sensing Technologies and key ApplicationsDevelopment of a high resolution Time-of-Flight ranging sensor module with integrated VCSEL, drivers, filters and optics and of a veryhigh resolution depth camera sensor with integrated filters and optics. Demonstrators/use cases (bringing in various expertise eg in AI and neural networks, citizen services, robotics, etc.):

• automotive in-cabin • smart building• Security• automotive medium-range LiDAR, • automotive long-range LiDAR• industry 4.0• mobile robotics for smart cities

Integrating one value chain in one project: chip manufacturing, embedded software, smart system integration technology

Smart systems use casesAI, Robotics, PhotonicsMobility, Industry, ...

UltimateGaN and APPLAUSE

Research for GaN technologies, devices and applications to address the challenges of the future GaN roadmap• project proposal with strong involvement of the vertical supply chain• spans expertise and partners from raw material research, process innovation and assembly innovation. • envisioned Use Cases will be validated and exploited in compact power application domains representing

enhanced smart systems. Bringing GaN on Silicon radio frequency (RF) performance close to GaN on Silicon Carbide thus enabling an affordable 5G rollout

Advanced packaging for photonics, optics and electronics for low cost manufacturing in Europe• use cases: cardiac implants, cardiac monitoring patches, ambient light sensor for mobile wearable applications,

thermal IR sensor for automotive, datacom transceiver, optical humidity measurement module.

Integrating existing vertical supply chains with stakeholders from different horizons: health, mobility, communication, sensors,...

Arrowhead Tools Arrowhead Tools for Engineering of Digitalisation SolutionsProvision of a mature service integration platform providing extensive interoperability between IoT services and legacy technology together with management capabilities for dynamic configuration and orchestration of System of Systems solutions.

Development of platforms for Systems of Systems

MADEIN4

Metrology Advances for Digitized ECS industry 4.0Development of predictive behavioural capability with use case in Advanced Packaging that will enable the strong European players to compete with their low cost Asian competitors more efficiently through the algorithm and use case activities.

Big dataIndustry 4.0Advanced metrologyProcess control in semiconductor and automotive manufacturing

TEMPOTechnology & hardware for nEuromorphic coMPuting• developed solutions on Deep Learning inference and Spiking Neural

Networks can be applied to embedded implementation of AI algorithms in sensors/actuator loops for industrial, health and automotive applications

• by enabling efficient intelligence (i.e. inference) at leaf nodes, it aligns with the expected achievement of technology-driven and connected intelligence

Development of advanced technologies for AI

IA projects

Project Partners Cost EU FUNDING NATIONAL FUNDING

APPLAUSE 34 34.7 8.6 8.1Arrowhead Tools 90 90.7 22.8 23.9CPS4EU 38 53.0 13.0 13.2MADEin4 47 126.2 29.4 31.5PIN3S 25 119.6 26.8 23.6Power2Power 43 74.3 17.0 15.9VIZTA 25 87.8 21.3 24.7Total 302 586.2 138.8 141.1

RIA projects

Project Partners Cost EU FUNDINGNATIONAL FUNDING

AI4DI 41 30.1 8.8 8.7COMP4DRONES 53 26.9 8.0 8.3HELIAUS 11 27.7 8.2 8.5NewControl 49 43.3 12.6 9.0TEMPO 26 35.1 10.4 9.6UltimateGaN 26 48.4 14.1 12.9Total 206 211.6 62.2 56.9

But is that enough? Why work together?

(DISSEMINATION)ü EXPLOITATION OF THE

INNOVATIONMORE IMPACT? ü CREATE SYNERGIES

BETWEEN COMMUNITIES

PROJECT LEVEL

META PROJECT LEVELLIGHTHOUSE INITIATIVES

As a programme can we achieve more impact?

LIGHTHOUSE INITIATIVES

MOBILITY.EINDUSTRY4.EHEALTH.E

A container of coordinated activities coming from different programmes using their synergy to achieve overarching common goals.

Lighthouse initiatives ≠ Lighthouse projects!!!

ECSEL projects active in Mobility.E• Total cost: 700M€• Total funding: 330M€ • Number of participants: 356• Distributed over 26 countries

MOBILITY.E LIGHTHOUSE INITIATIVE

Clean Connected Autonomous MobilityLIASE Support

Industry

Associations

Mobility.E LIASE

LIASE=Lighthouse Initiative Advisory Service

Industry4.ELIASE• Andrew Lynch (IMR)• EFFRA (Chris Decubbere)• Eduardo Beltran (Mondragon

Corporation)• Knut Hufeld (Infineon DE) • Olli Ventä (VTT)

Support• ECSEL Office• DG Connect• CSA_Industry4.E

Outline

1. What is ECSEL?2. What kind of projects?3. How do I participate?4. What will come next?

CALL SCHEDULE: example for 2019

CALL LAUNCH DECISION (PAB) 23/01/2019FINALIZATION OF WORKPLAN (GB) 24/01/2019CALLS 2019 LAUNCH 06/02/2019CALLS 2019 PO DEADLINE 07/05/2019FEEDBACK ON PO MID JUNECALLS 2019 FPP DEADLINE 18/09/2019SELECTION AND FUNDING DECISION (PAB) 19/11/2019COMMUNICATION TO CONSORTIA END NOVEMBER

BROKERAGE EVENT 2019 BRUSSELS

Calls 2020 will be similar

Call 2019 and Call 2020• Call 2019:

• Under evaluation• 27 RIAs (2 special topics) + 10 IAs

• RIA-Special Topic 1 – Architectures, components and systems for validation/simulation of connected automated vehicles (5M€)

• RIA-Special Topic 2 – Edge computing (10M€)• Information to coordinators end June• Then FPP in september• Budget: ca. 170MioEuro

• Call 2020:• Preparation of Workplan 2020 • 2 calls with special topics, eventually special call• Budget: ca. 160MioEuro

Stay tuned• ECSEL website• Websites of the 3 Associations:

• AENEAS• ARTEMIS-IA• EPoSS

• Brokerage events• EFECS in November (Helsinki)• Events of the Commission in September• TUBITAK

Matchmaking tool: see website of associations

Outline

1. What is ECSEL?2. What kind of projects?3. How do I participate?4. What will come next?

The importance of the value chain

Horizon Europe: evolution not revolutionSpecific objectives of the Programme

Foster all forms of innovation and strengthen market deployment

Strengthen the impact of R&I in supporting EU policies

Support the creation and diffusion of high-quality knowledge

Optimise the Programme’s delivery for impact in a strengthened ERA

Strengthening the European Research Area

Reforming and Enhancing the European R&I systemSharing excellence

Pillar 1Open Science

European Research Council

Marie Skłodowska-Curie Actions

Infrastructures

Pillar 3Open Innovation

European Innovation Council

European innovation ecosystems

European Institute of Innovation and Technology

Pillar 2Global Challenges and Industrial Competitiveness

• Health• Inclusive and Secure Society• Digital and Industry• Climate, Energy and Mobility• Food and natural resources

Joint Research CentreC

lust

ers

Digital Europe programme – What?Digital Europe Programme

Reinforcing digital capacitiesEnsuring their best use

END