http://www.imptelecom.com

March, 2015

Business Model Presentation

Company Profile

IMP-Telecommunications, Ltd. Embedded Systems Design House

About Us

• Prominent Serbian embedded systems design house

• Spin-off company of Michael Pupin Institute (IMP), established in 1997

• 42 employees (27 in core development team)

• Proven know-how to develop prototypes based on customer’s idea

• Experienced embedded systems design team

• Focus on quality and manufacturability

• ISO 9001 and CMMI Level 2 company

Business Offering

• Contract R&D

• Consulting

• Conceptual designs and evaluation boards/proofs of concept

• Original Design Manufacturer (ODM) business model

• Licensing of proprietary IP

• Southeastern European R&D offshore destination

• Outstanding quality/cost ratio (value for money)

“Perfection in Embedded Design” Concept

• One stop shop (turnkey design)

• Electronic products development know-how

• Providing COMPLETE, ready for manufacturing solutions to customer

• Industrial design and design for EMC

• Automated test systems development

• Full competence in each phase of device design

• Fast prototyping

• Network of partner development companies (ICT-Net cluster)

• Cooperation with University

“Perfection in Embedded Design” Concept

Commitment to Quality

• Certified ISO 9001 quality management system

• IT Mark quality assurance certificate

• CMMI for development level 2

• Agile development methodology (scrum-like)

• Proprietary, well-developed design verification check lists

• Strict data management and backup procedures

• Own state-of-the-art laboratory equipment

• Pre-compliance EMC lab

Project Management & QA

• Detailed WBS

• Transparent procedures

• Weekly reporting

• Costs tracking

• Milestone status meetings

• Risk management

• Requirements management

• Configuration management

Customer

Project Manager QA Manager

System

Design Team

HW Design

Team

Embedded

Software

Team

FPGA Design

Team

Mechanical

Design

Team

Test &

Verification

Team

Design for

Manufacturing

Team

Manufacturing

Technologies

• Real-time systems design

• High-speed hardware design

• DSP algorithms development

• Multirate DSP, software-defined radio

• Embedded operating systems (Linux)

• High-speed/high-density PCB Design

• Microwave circuits design

• Power supplies & power management

• Industrial control systems

• Video and multimedia systems

Open-Source Software Linux kernel

• Bootloader for custom boards (U-boot)

• Porting Linux kernel for custom boards

• Linux drivers developing, maintaining and modifying for exotic peripherals

• Full support for our own Linux BSPs

Android

• Java middleware libraries for accessing board peripherals directly from Android

• Full Java API, no need for low level NDK programming and cross-compilation

• Full support and documentation

Design for EMC

• Seven years of experience in the company

• Cooperation with Microwave Group at the University of Belgrade

• Recognized international experts with more than 30 years of experience

• World-class 3D EM field simulation experts (developed Wipl-D, Artech House)

• Extensive list of international references (DEC, Bosch, Motorola, Philips, DuPont)

• Consulting in design phase

• Debugging EMC problems

• EMC hardening

• Product certification and CE marking

Audio and Acoustics

• Cooperation with Acoustics Laboratory at the University of Belgrade

• Development of high-end audio electronics (preamps, amplifiers, power amplifiers, filters)

• Design of loudspeakers

• Audio software development (signal processing, filtering, measurement, modeling, calculations)

• Room acoustic design (studios, opera halls, theatres, chruches)

• Research projects (partial discharge in transformers)

• Audio/acoustics lab (small anechoic chamber, reverberation chamber, instruments, software)

Industrial design service

• Functional, ergonomic and aesthetic aspects of the product

• Conceptual ideas, selection of materials, visualization, 3D & physical modeling, mechanical design, prototyping

• Cooperation with award-winning Nikola Knezevic Industrial Design studio

• Listed as one of the best 40 European designers under 40 for the year 2010

• Awards: IF Design, Braun Design Competition, LG Electronic Design Competition

• Client list: HP, Toshiba, Polaroid, B&W

Automated Test Systems • Five years of experience

• Reference - own manufacturing line with capacity of 2500 devices/month

• Strategic partnership with National Instruments

• Know-how of test methodologies (in-circuit, boundary scan, self-test)

• Design for Manufacturing consultancy

• Development of test jigs

Tools & environments

• Altium Designer

• Cadence

• Mentor Graphics, HyperLynx

• Xilinx ISE, Sysgen

• Matlab

• Labview

• TI’s Code Composer Studio

• IAR Workbench, MPLAB IDE, Eclipse

• SolidWorks 3D mechanical design

Networks & Associations

• Texas Instruments DSP Third Party Developers` Network member since November 2008

• TI EMEA Design House Network Member since March 2011

• Serbian ICT Network Cluster (Board Chairman position)

Currently 14 embedded design companies in the network

Notable Projects

• STOS 3XGA Ethernet thin-client enabling three independent video outputs

• PEC State-of-the-art real-time multichannel DSP controller

• uSFP Sub-miniature 10 Gbps Fibre Channel/Ethernet transceiver

• TZ-600 Mission critical communication device improving safety and security of teleprotection applications in electric power transmission systems

• OpCard Add-on card for expanding capabilities of Motorola GP/GM300 radio

• CTU-300 Crypto telephone set and data transmission device

STOS 3XGA Basic Facts

• Ethernet thin-client for digital signage applications

• Triple-channel VESA video output (up to WXGA resolution)

• Public screen systems, video walls, transportation, control centers, expos, advertising, entertainment

• Low power consumption

• Compact form factor

• Cost-efficient solution

• Image decoding and processing

• Receiving up to three compressed video streams in overlay via UDP and background images via TCP with active resize and rotate algorithms

Complete system designed in-house for Finsoft Ltd., UK.

STOS 3XGA Challenges

• High-speed video hardware design

• Optimization of image processing algorithms on DM64x platform

• Design of application software to assure maximum utilization of resources

• Assuring robust EMC performance

• 24/7 work cycle

• Cost optimization

• Design for manufacturing

• Establishing of production line and automated test procedures

• Specialized test jig design

• Mechanical design

PEC System Basic Facts • Power Electronic Controller

• Multi-board configuration

• CPU board, Digital IO board, Analog IO board and Power Board

• High processing power (4800 MIPS floating-point DSP)

• 16 optical IO channels (10 Mbps each) on Digital IO board

• 16 analog channels (100 kSps) on Analog IO board

• 256 digital channels, 128 analog channels total

• 1500 pages of documentation

• Full design verification and manufacturing procedures

System concept, design and prototyping done fully in-house under custom

development contract.

PEC System Basic Facts 2

• Packet-based data transfer in the system

• 10 us processing cycle

• 6.4 Gbps LVDS communication backbone

• FPGA-based communication switches and interfaces

• High reliability hardware with automatic hardware malfunction detection and protection mechanisms

• Completely separated real-time DSP and system control/management

• Fully redundant industrial 150 W power supply

• Management and monitoring subsystem

• Industrial temperature and EMC environment

uSFP 10 Gbps Transceiver

• Goal: To develop industry’s smallest 10 Gbps LC optical transceiver

• Challenge 1: Fit electronic and electro-optical components in such small space

• Challenge 2: Design hardware for 10 Gbps performance

• Challenge 3: Find suitable high-speed interconnection solution

• Challenge 4: Devise robust mechanical design

• Challenge 5: Cost optimization

An ODM project done in cooperation with TagOn, UK.

uSFP Transceiver - Solution

• Compact design: 13 x 10.5 x 27 mm

• Fully SFP compatible on the electrical interface

• Six-layer rigid-flex board

• Microwave design – signal integrity simulation

• The smallest components available (0201 passive, 3x2 mm controller, uBGA)

• Thin PCB interposer used as connector solution

• 10 Gbps test and evaluation boards developed

uSFP - Casing Prototype

• Made according to 3D STEP model

• Electro-mechanical co-design applied during entire development cycle

• Die-cast metal body

• Lid and cage made from 0.25 mm tin plate

• Precise manufacturing – 20 um tolerance

• Electrical connection via 0.5 mm pitch interposer

TZ-600 Basic Facts

• Communication solution for teleprotection applications in power transmission systems

• Hard real-time system

• Designed for 24/7 operation

• Fast, reliable, and secure

• Modular and programmable interfaces including long-range optical

• DSP technology

• Extremely short command transmission time

• Versatile power supply

Own design, manufacturing and sales.

TZ-600 CPU control unit

• Processing board based on TMS320C5471 dual-core processor

• Embedded Linux ported on ARM7 core

• DSP/BIOS on C54x core

• Separate graphical user interface board based on MSP430

• File system and RDBMS

• Web server for monitoring and maintenance

• Event log function

CTU-300 Basic Facts

• Provides ciphered full-duplex voice and data transmission over analogue telephone lines

• Telephone functions: caller ID, call list, phonebook, country settings, ringer settings etc.

• Simple and intuitive graphical user interface

• Speakerphone option

• Power supplies: mains, 9V DC and built-in Ni-MH battery

• USB computer interface for programming and data communication

• Fast erasure of crypto algorithm

• Full protection against tampering

• Based on TMS320C5410A DSP

Developed and manufactured for Serbian government.

CTU-300 Challenges

• Providing real-time ciphered voice service over dial-up connection (custom data protocol, synchronization)

• Short time required for initialization of crypto connection

• Voice coding technology

• Acoustic and line echo canceling

• Advanced encryption algorithms

• Implementing GUI on MSP430

• Advanced power management

• Mechanical design

OpCard Basic Facts

• Add-on card for expanding capabilities of Motorola GP/GM300 two-way radios (voice scrambler and VHF/UHF radio modem)

• Card controls properties of radio channel, transmitter and receiver, audio signal, and user interface (keyboard and display)

• Excellent EMC immunity and sound quality

• Downloadable firmware (over the air)

• Design based on TMS320F206 DSP

Own development, manufacturing and distribution.

OpCard Challenges

• Offensive RF environment

• Mechanical design

• Robustness

• Voice scrambling algorithms

• Real-time operating software

• PCB requirements:

– Six-layered printed circuit board with buried vias

– High level of integration

Current Development - Qseven board Why Qseven standard?

• To enable the features of latest 45nm mobile chipsets and processors.

• To provide the ability to use the successful Computer- On- Module concept for mobile embedded applications.

• To support the latest graphic standards such as DisplayPort and HDMI.

• Small form factor for easy integration (70 mm x 70 mm).

What is special about Qseven?

• Legacy free – only new serial buses are defined

• Flexibile graphics – current graphic standards are supported

• Embbeded API – Software interface for easy Interchangeability

Features:

• High-performance TI ARM/DSP solutions

• High level of peripherals integration

• High-speed DDR3 SDRAM memory

• Cutting-edge Sitara/Integra/DaVinci processor

Texas Instruments’ Netra processors deliver:

• Dramatic BOM cost reduction trough integration

• Increase overall system performance

• DSP can more efficiently handle complex tasks

• ARM is free to process applications

Our First Qseven board

Qseven module – based on Netra TI SoC

• ARM Cortex-A8 core (up to 1.5 GHz)

• C674x DSP (fixed/floating point @ 1.5 GHz)

• Rich set of peripherals

• 1 GB dual-port DDR3 SDRAM memory

• Gbit Ethernet

• PCIe

• 2 x SATA 3.0

• 5 x USB 2.0

• 3D graphics engine (SGX530, 27 Mpoly/sec)

• 1080p HD video output

• Up to 8 GB NAND Flash

• 9 W maximum power consumption on board

Interfaces:

• 5 x USB 2.0 host ports

• 1 x USB 2.0 client port

• 1 x PCIe 1.1

• 1 x Gbit Ethernet port

• HDMI video output

• LVDS display connection (Open LDI)

• Camera port (feature connector)

• High definition audio

• Dual SATA 2.0 interface

• SD/MMC card interface

• SPI interface

• ACPI power management signals

Qseven - Features and Interfaces

• Android 2.3 – IMP-Telecommunications – FREE

• Full BSP available from March 2012

• SysLink (Link between DSP and ARM) availability

• Linux, Open Source – IMP-Telecommunications – FREE

• BSP available from March 2012

• GA available from June 2011

• Windows Embedded 7.0 – TI – FREE

• Beta BSM available from March 2011 (ARM only)

• SysLink (Link between DSP and ARM) availability

• C6EZAccel and C6EZRun – TI – FREE

• Includes pre-optimized DSP libraries for digital filtering, complex math and image enhancement and analysis

Qseven - Software

• High-end Test and Measurement (Signal/Waveform Generation and Analyses)

• Machine/Industrial Vision (Automated

Inspection, Identification) • Biological Vision (e.g. Cell-sorting and

Analysis) • Tracking and Control (Avionics/Guidance, Radar/Sonar, Solar Tracking) • Multi-channel full HD Video Encode/Decode,

Transcode/Transrate (DaVinci)

Qseven – End Applications

The goal of the project:

• Implement and sell specific hardware/software development platform for Android community

• Optimized for use in home automation, machine control and similar applications

• Enabling Android applications to use standard/legacy interfaces like RS232, RS485, CAN, digital I/Os and other.

Features:

• ARM Cortex A8 @ 1.5 GHz

• 1 GB RAM memory

• 7” Touchscreen display

• Ethernet, Wi-Fi, Bluetooth, GSM

• 4xUSB, SD card

• Camera, audio

• RS232, RS485

• CAN

• Digital I/Os

• Analog inputs

• PWM outputs

Android with wires

• Open source

• Rich and innovate user interface

• Easy applications development

• Internet access, communications

• More than 80.000 available applications

• Market share: 40 %

• Expansion of Android OS on new vertical markets

• Multimedia, smart houses, automotive industry, white goods, …

Why Android?

The End

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