AbouttheSpeakerProf. Rao Tummala is a Distinguished andEndowed Chair Professor inMSE and ECE, andFoundingDirectorofPRC,anNSFERCatGeorgiaTech. He is well known as an industrialtechnologist, technologypioneer,andeducator.Prior to joining Georgia Tech, he was an IBMFellow, pioneering such major technologies asthe industry’s first plasma display and the firstand next three generations of 100 chip multi-chip packaging. He is the father of LTCC andSystem-on-Package technologies. As aneducator, Professor Tummalawas instrumentalin setting up the largest Academic Center inElectronics systems at Georgia Tech involvingmorethan200PhDandMSstudents,25facultyfromECE,ME,MSEandCHE,and50companiesfrom the US, Europe and Asia, all workingtogether with an integrated approach toresearch, education and industry collaborationsin ultraminiaturized and mega-functionalSystem-on-Packagetechnologies.

He received his BE in Metallurgy from IndianInstituteofScience,BangaloreandhisPhDfromUniversityofIllinois,USA.

Prof. Tummala has published more than 500journal and conference technical papers, holds90 US patents and inventions; authored andedited the first modern packaging referencebook—Microelectronics Packaging Handbook(Van Nostrand, 1988), the first undergradtextbook—Fundamentals of MicrosystemsPackaging (McGraw Hill, 2001) and the firstgraduate textbook introducing System-On-Package technology, comparingandcontrastingit with SOC, SIP and 3D ICs. He is a Fellow ofIEEE,IMAPS,andtheAmericanCeramicSociety,and member of the National Academy ofEngineering in US and in India. Prof. Tummalawas the President of both IEEE-CPMT and theIMAPSSocieties.

He has received more than 30 industry,academic and professional society awardsincludingthehighestfacultyawardfromGeorgiaTech, andDistinguishedAlumni fromUniversityof Illinois and Indian Institute of Science;Bangalore, Indiaand IEEEsDavidSarnoff,MajorEducationandFieldAwards.

K e y n o t e s p e a c h L a r g e - s c a l e I n d u s t r y C o n s o r t i u m i n P a r t n e r s h i p w i t h G l o b a l C o m p a n i e s i n N e w E r a o f A u t o m o t i v e E l e c t r o n i c s b y G e o r g i a T e c h , U S A OverviewThe new trends inautomotive electronicssuch as autonomousdriving, in-car smart-phone-like infotainment,privacy and security, andall-electric cars, presentunparalelled research,development, manu-facturing, education andmarketing opportunities.They require newparadigms in materials, tools, processes, substrates, packages, components anddevicesinR&Dandinmanufacturing.GeorgiaTechseesunprecedentedchallengesandopportunitiestoaddressthesechallengesandproposesasystematicapproachto system scaling, system integration, innovative 3D device and packagearchitecturesandheterogeneousintegrationofmanyfunctionswithparticularfocusin electrical, mechanical and thermal designs and new digital, RF, radar, LiDAR,camera,millimeterwave,high-powerandhigh-temptechnologies.

TheGeorgia Tech teamproposes to explore transformative technologies, educatelarge number of highly-interdisciplinary students and involve global companies inR&D and manufacturing of materials, tools, processes, substrates, devices,components, assembly, and test to form a total global supply chain formanufacturing.

GeorgiaTechisdevelopingalarge-scaleindustryconsortiuminvolvingIDMs,OEMs,OSATs,PackageFoundriesaswellasPackageMaterialsandToolcompanies.

This presentation describes the vision, strategy, team, facilities, technical andeducationprogramsandstatusofGeorgiaTech’sindustryconsortium.

GeorgiaTechislookingforJapanesepartnerstocollaborateinalltheaboveareas.

WhoShouldAttendSeniormanagersandexecutivesofsemiconductor,packagematerials,toolandconsumersystemscompanies.

Prof. Rao R. Tummala Pettit Chair Professor in ECE and MSE Director, 3D Systems Scaling Research Center Georgia Institute of Technology Atlanta, GA, USA

IMSI Special Seminar on Emerging Frontiers in Automotive Electronics and Advanced Manufacturing Science, March 3rd. 2017, The University of Tokyo

NAE–TheNextBigElectronicsMarket.