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External Use TM i.MX6 For Industrial PC Application Subtitle of Presentation Jul.07.2014 Starle Li/ 李星宇 | AP Microcontroller Marketing Manager

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External Use

TM

i.MX6 For Industrial PC

Application

Subtitle of Presentation

J u l . 0 7 . 2 0 1 4

Starle Li/李星宇 | AP Microcontroller Marketing Manager

TM

External Use 1

Industrial PC market overview • What is IPC?

− High robustness, high security, working environment is diverse and harsh.

− Running in non-consumer field.

− The core board in a IPC is called SBC(single board computer) or COM(computer on module)

• IPC application in Asia

Src: IMS, 2012

TM

External Use 2

IPC market growth analysis

• There is a clear trend of shift from X86 to ARM in IPC market.

• ARM IPC has the largest growth(18% CAGR) with a total incoming revenue, nearly

equal to X86 in 4 years.

• In Asia, ARM IPC has a higher increase ratio since local customers are more sensitive

to the cost.

0

50

100

150

200

250

300

2013 2014 2015 2016 2017

EMEA IPC* Revenue Growth($M)

ARM

X86

PowerPC

Others

EMEA 41%

Asia Pacific 33%

Americas 22%

Japan 4%

IPC Global Market Share

Src: IHS , 2012. Src: IMS , 2012

TM

External Use 3

Types of IPC

• Panel IPC Box IPC Rackmount

• Embedded IPC DIN Rail IPC Thin client

TM

External Use 4

IPC Market - Standards

Widely used Standards − Registered by an non profit organization (PICMG, PC104)

− Fully compatible (interface, mechanics)

− COM Express, PC/104, MicroTCA, AMC

− Mostly implemented in X86 achitecture.

Industrial Standards

− Organized by an interest group, like SGeT

− Fully Compatible

− Qseven, ULP-COM(also called Smarc)

− Mostly implemented in ARM architecture.

• Vendor Standards

− Defined by a single vendor, e.g. Apalis from Toradex, RTX from Advantech.

− Lots of vendor standards (= no standard)

− Mostly implemented in ARM architecture.

TM

External Use 5

ARM IPC Standard Analysis

• There are still some other self-defined standards. But there is no any standard in ARM IPC dominates the market. Standardization can be one of most challenging issue in ARM IPC.

• In China, majority of IPC doesn’t follow any standards. They are customized for dedicated applications, or tailored for processors.

QSEVEN ULP-COM/SMARC

Standard Owner SGeT SGeT

Members 20+ N/A

Interface PCI-E, SATA, USB2.0, Giga Ethernet,

SDIO, etc.

Parallel RGB/LVDS/HDMI, SATA, USB2.0,

camera interface, multiple SPI, multiple

SDIO, serial ports.etc.

Form factor 70 mm x 70 mm,230 Pin, MXM, 0.5

mm pitch

82 mm x 50 mm and 82 mm x 80 mm,314

Pin, MXM3.0, 0.5 mm pitch

ARM processors TI Sitara 38xx/33xx

FSL i.MX6S/D/Q

Nvidia Tegra 3

TI Sitara 33xx

FSL i.MX6S/D/Q

i.MX6 Vendors Advantech,Congatec, iWave, Seco,

kancotec

Advantech,Kontron, Adlink, GreenBase

TM

External Use 6

SGeT—ARM Standardization association

• SGET e.V. is a technical and scientific association with its registered office in

Munich. The purpose of the Association is the promotion of science and

research. The purpose is realized in particular when SGET, in a team effort in

various workgroups on embedded computer technologies, prepares and

compiles technical specifications or other work results such as implementation

guidelines, software interfaces or system requirements, which serve the

purpose of energy efficiency, environmental protection and effective

technology, science and the public, publishes such information and promotes

its application for the benefit of the general public.

TM

External Use 7

A typical architecture of SBC

TM

External Use 8

Today’s development model is changing

• Innovation is increasingly coming from small business/Geek

− Small business, personalized design, short design cycle, extreme

enthusiasm.

• Social development

− All are connected into social network based on interest

• Open Hardware movement

− Reform the methodology of HW development, share, and support.

− Arduino, Rex, Wandboard, etc.

• Venture investment

− Social investment, angel investment.

TM

External Use 9

Hardware (Boards/Silicon)

Operating Systems

Standard

Middleware

Application

Specific

Middleware

Apps

Applications (OEM and Off-the-Shelf)

Application Specific

Middleware

Standard

Middleware

OS

(Off-the-Shelf)

H/W

Today’s Design Model

Historical

Design

Model

The Changing Face of Engineering in OEM’s

Challenges: • Improves the time to market

• Lowering development cost with

increased system complexity

− Less hardware engineering resources

and value the software and system

engineering activities

− Multicore, High-Speed I/O, DDR

memories, …

− Lowering Power Consumption

• Increasing internal IP ownership

• Support long life cyles

Embedded board

solutions vendors help

OEMs to meet these

challenges

* Source: IMS Research preliminary report on

global embedded computer board space, 2012

TM

External Use 10

The Changing Face of Engineering in OEM’s

“Make vs. Buy” Decision Matrix

Customer Challenges Full Custom Module (SMARC, SOM, Custom)

• Longest period driving

slowness to react

• Shortest period to react to

Market request

• Keeping up with full &

complex technology

evolution driving higher

cost of resources

• Complex modules designed

by Module vendors makes

less risky, complex and

costly on customer system

• Most of the IP are not

necessarily valued by

customers

• Limit the customer investment

to better concentrate on their

own IP

• OEM responsibility for all

elements of design

• Customer can rely on EBS

vendors to full fill the

system parts

• Lowest • Potential low cost due to

multiple customers per

module

Unit Cost

Support long life

cyles

Increasing

internal IP

ownership

Lowering

development

cost with

increased

system

complexity

Time-to-market

TM

Freescale, the Freescale logo, AltiVec, C-5, CodeTEST, CodeWarrior, ColdFire, C-Ware, t

he Energy Efficient Solutions logo, mobileGT, PowerQUICC, QorIQ, StarCore and Symphony

are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. BeeKit, BeeStack,

ColdFire+, CoreNet, Flexis, Kinetis, MXC, Platform in a Package, Processor Expert, QorIQ

Qonverge, Qorivva, QUICC Engine, SMARTMOS, TurboLink, VortiQa and Xtrinsic are trademarks

of Freescale Semiconductor, Inc. All other product or service names are the property

of their respective owners. © 2011 Freescale Semiconductor, Inc.

Confidential and Proprietary

TM

External Use 12

UDOO: Android Linux Arduino in a tiny

single-board computer by SECO

• Unique Linux and Arduino SBC

• i.MX 6Solo/Dual/Quad

• Microcontroller M3 (Arduino) R3 1.0 input

• DDR3 1GB

• 76 fully available GPIO

• HDMI and LVDS + Touch (I2C signals)

• Ethernet RJ45 (10/100/1000 MBit)

• WiFi Module

• Mini USB and Mini USB OTG

• USB type A (x2) and USB connector (requires a specific wire)

• Analog Audio and Mic

• SATA (Only Quad-Core version)

• Camera connection

• Micro SD (boot device)

• Power Supply 12V and External Battery connector

www.UDOO.org

In Production since Q4’13

TM

External Use 13

Wandboard: i.MX 6 open source community board

by TechNexion

• Unique Linux and Arduino SBC

• i.MX 6Solo/DualLite/Quad

• 512 MB to 2GB DDR3

• Audio

• Optical S/PDIF

• HDMI

• Camera interface

• Micro-SD slot

• Serial port

• Expansion Header

• USB

• USB OTG

• SATA

• Gigabit LAN

• WiFi (802.11n)

• Bluetooth

In Production since Q2’13

TM

External Use 14

RIoT: i.MX 6Solo open source development

platform by Element14/Embest

• i.MX 6Solo + Kinetis K20 MCU

• OS: Linux and Arduino

• 1 GB DDR3 RAM

• CCD or CMOS and MIPI CSI data lanes @

1 Gbps

• HDMI, LVDS, parallel RGB, 3.5 mm audio,

• 1 x USB2.0 OTG, mini USB, 4 x USB2.0

HOST,

• uSD Card, SD Card, 10M/100M/GB

ethernet,

• 2 channel I2C, 2 channel SPI, 3 channel

PWM,

RIoTboard.org

In Production since Q1’14

TM

External Use 15

i.MX6 Rex

• http://www.imx6rex.com/

TM

External Use 16

i.MX6 Rex

• Open source

project.

• All documents are

free for download,

including

Schematic and

PCB files

TM

External Use 17

e络盟(element14) i.MX6Q MCIMX6Q-SL Development Kit

►RMB: 1,210.50 (no tax) ► Supplier:英蓓特科技

Where to visit and buy:

http://www.timll.com/chinese/product/SABRE%20Lite.asp?u

tm_source=BaiduSEM&utm_medium=Freescale&utm_camp

aign=Freescale

http://www.element14.com/community/community/knode/sin

gle-board_computers/sabrelite

TM

External Use 18

Wandboard

A lowcost Cortex-A9 board created by a group of engineers in their free time

that work with ARM architecture based solutions on a daily basis.

Create a System-on-Module device to easy users to create their own design

For more details, please visit:

http://www.wandboard.org/

TM

External Use 19

China local IDH: 华北工控 EMB-2500

CPU

Freescale Cortex™-A9 i.MX 6 (单核、双核、四核可选)

内存 板载1GB DDR3 内存

Flash 板载iNAND 4GB

图形控制 CPU集成

显示接口 1x mini HDMI ,2x 24bit 双通道LVDS ,1x VGA

以太网 AR8033_10/100/1000Mbps 1x LAN, 1x 板载WiFi(可选)

Touch I2C转4线电阻触摸 MAX11801 Keypad 3x 3 matrix(和GPIO

复用)

音频 Line in(插针)\Line out(插针)\Mic(插针)

I/O 接口 1x SATAII, 1x Micro SD 2x CAN(由CPU型号决定,可选),4x USB2.0, 1x Mini USB(OTG) 2x RS-232, 1x I2C

看门狗 支持 GPIO 8x GPIO

电源类型 单电源+5V DC

操作系统 Andriod/LINUX

EMB-2500兼具了稳定可靠的工业级产品性能和智能化数字多媒体播放器的优势,可广泛为数字标牌、汽车、数字控制、交互式客户端、媒体播放、广告、LCD大屏、交通控制、信息系统、金融设备等众多领域提供解决方案。

CPU Card Details Usage Details

TM

External Use 20

The Winning Factor of the future: SW and Algorithm

• SW is the way to differentiate us from rivals

• SW is the key winning factor for connected AI:

Machine Vision

Facial recognition

Argument reality

TM

External Use 21

MX6x OTT Demo Board

Port: HDMI

CVBS / Audio Line Out

SPDIF

USB HOST x2

SATA

RJ45 x2 100Mbps

Wi-Fi / BT

Infrared Remote

TM

External Use 22

OTT Turns Any TV into an Android Smart TV

- Web browsing, Gaming, VOD, Office work…

OTT BOX

Air Mouse

Wi-Fi Router

TV Movie

Game

Web

:

:

: Storage

Cloud…

TM

External Use 23

i.MX 6 Series: Supreme Scalability and Flexibility Leverage One Design Into Diverse Product Portfolio

Scalable series of SIX ARM Cortex-A9-based SoC Families

i.MX 6Solo i.MX 6Dual i.MX 6Quad

i.MX

6Solo Family

i.MX

6Dual Family

i.MX

6Quad Family

i.MX 6DualLite

i.MX

6DualLite

Family

i.MX

6SoloLite

i.MX

6SoloLite

Family

i.MX 6SLX

Pin-to-pin Compatible

Software Compatible

i.MX

6SoloX Family

TM

External Use 24

i.MX 6Solo

i.MX 6Dual i.MX 6Quad

• Dual ARM Cortex-A9

up to 1/1.2GHz

• 1 MB L2 cache, Neon,

VFPvd16, Trustzone

• 3D graphics

with 4 shaders

• Two 2D GFX engines

• 64-bit DDR3 and 2-

channel 32-bit

LPDDR2 at 533MHz

• 1080p60 video

• PCIe (x1 lane)

• Gigabit Ethernet

• SATA-II

• Single ARM

Cortex-A9 up to

1GHz

• 512KB L2 cache,

Neon, VFPvd16,

Trustzone

• 3D graphics

with 1 shader

• 2D graphics

• 32-bit DDR3 and

LPDDR2 at 400MHz

• 1080p30 video

• Gigabit Ethernet

• PCIe (x1 lane)

• EPD controller

• Quad ARM Cortex-A9

up to 1/1.2GHz

• 1 MB L2 cache,

Neon, VFPvd16,

Trustzone

• 3D graphics

with 4 shaders

• Two 2D GFX engines

• 64-bit DDR3 and 2-

channel 32-bit

LPDDR2 at 533MHz

• 1080p60 video

• PCIe (x1 lane)

• Gigabit Ethernet

• SATA-II

• Dual ARM

Cortex-A9 up to

1GHz

• 512KB L2 cache,

Neon, VFPvd16,

Trustzone

• 3D graphics

with 1 shader

• 2D graphics

• 64-bit DDR3 and 2-

channel 32-bit

LPDDR2 at 400MHz

• 1080p30 video

• Gigabit Ethernet

• PCIe (x1 lane)

• EPD controller

• Single ARM®

Cortex™- A9 at 1GHz

• 256KB L2 cache,

Neon, VFPvd16,

Trustzone

• 2D graphics

• 32-bit DDR3 and

LPDDR2 at 400MHz

• 10/100 Ethernet

• EPD controller

i.MX 6DualLite

i.MX 6SoloLite

i.MX 6 Series At a Glance

Scalable series of six ARM Cortex A9-based SoC families

Red indicates change from column to the left

• Single ARM Cortex-

A9 up to 1GHz

• Single Cortex-M4

at 166Mhz

• 256KB L2 cache,

Neon, VFP,

Trustzone

• 3D and 2D Graphics

• 32-bit DDR3 and

LPDDR2 at 400MHz

• Dual Gigabit

Ethernet

• PCIe (x1 lane)

i.MX 6SoloX

Pin-to-pin and Power Compatible

Software Compatible • ARM Cortex-A9 based solutions ranging up to 1.2GHz

• HD 1080p encode and decode (except 6SoloLite/6SoloX)

• 3D video playback in high definition (except 6SoloLite/6SoloX)

• Integrated IO’s may include HDMI v1.4, MIPI and LVDS, display ports, MIPI camera, Gigabit Ethernet, multiple USB 2.0 and PCI-Express

• SW support: Google Android™, Linux®, QNX, Windows® Embedded CE

TM

External Use 25

i.MX 6Quad/6Dual Applications Processor

Multimedia

i.MX 6Quad/6Dual

CPU Platform

System Control

Dual / Quad Cortex-A9

Security

Secure JTAG

PLL, Osc

Clock & Reset

NEON per core

Watch Dog x2

Timer x3

PWM x4

Internal Memory

ROM

RAM

Graphics: OpenGL/ES 2.x,

OpenCL/EP, OpenVG 1.x

Smart DMA

1MB L2-cache + VFPv3

RNG

TrustZone

Security Ctrl

Secure RTC

32KB I-cache per core

32KB D-cache per core

Video Codecs: 1080p30

Connectivity

LP-DDR2,

DDR3 / LV-DDR3

x32/64, 533 MHz

MMC 4.4 / SD 3.0 x3

MMC 4.4 / SDXC

UART x5, 5Mbps

I2C x3, SPI x5

ESAI, I2S/SSI x3

3.3V GPIO

USB2 OTG & PHY USB2 Host & PHY

MIPI HSI

S/PDIF Tx/Rx

PCIe 2.0 (1-lane)

1Gb Ethernet

+ IEEE1588

NAND Ctrl (BCH40)

USB2 HSIC Host x2

S-ATA & PHY 3Gbps Power Mgmt

Power Supplies

FlexCAN x2 MLB150 + DTCP

eFuses

Ciphers

20-bit CSI

HDMI & PHY

MIPI DSI

LCD & Camera Interface

24-bit RGB, LVDS (x3-8)

MIPI CSI2

IOMUX

Temp Monitor

Audio: ASRC

PTM per core

Keypad

Resizing & Blending

Inversion / Rotation

Image Enhancement

2x Imaging Processing Unit

• Specifications:

CPU: i.MX6Quad: 4x Cortex-A9 @ 850MHz/1GHz/1.2GHz

i.MX6Dual: 2x Cortex-A9 @ 850MHz/1GHz/1.2GHz

Process: 40nm

Package: 21x21 0.8mm Flip-chip BGA

Temp Range (Tj): Up to -40 to 125C, AEC-Q100 Grade 3

Qual Tiers: Commercial, Automotive, Industrial

Pin compatible with i.MX 6DualLite and i.MX 6Solo

Up to 10000 / 5000 DMIPS

• Key Features and Advantages

Multi-core architecture for high performance, 1MB L2 cache

64-bit LP-DDR2, DDR3 and raw / managed NAND

S-ATA 3Gbps interface (SSD / HDD)

Delivers rich graphics and UI in HW

OpenGL/ES 2.x 3D accelerator with OpenCL EP support and OpenVG 1.1 acceleration

Drives high resolution video in HW

Multi-format HD1080 video decode and encode

High quality video processing (resizing, de-interlacing, etc.)

Flexible display support

Four simultaneous: 2x Parallel, 2x LVDS, MIPI-DSI, or HDMI

Dual display up to WUXGA (1920x1200) and HD1080

MIPI-CSI2 and HSI

Increased analog integration for simplified power supplies

Temperature monitor for smart performance control

Expansion port support via PCIe 2.0

Car network: 2xCAN, MLB25/50/150 with DTCP, 1Gb Ethernet with IEEE1588 time stamping hardware

• Availability

Samples: Now

Production: Q4 2012

TM

External Use 26

Intelligent Integration of Multi-Media

2x/4x ARM

Cortex- A9s

Image

capture

VPU

2D/3D

Graphics

IPU

i.MX 6Dual/6Quad IPU - Four Display support (2x MIPI-DSI, Parallel, HDMI v1.4a)

- Stereoscopic camera input

- Color adjustments and gamut mapping

- Gamma correction and contrast stretching

- Compensation for low-light conditions & backlight reduction

i.MX 6Dual/6Quad VPU -H.264 MVC1080p60 decode

-H.264 MVC 720p60 encode

- 350mW power consumption for single video!

i.MX 6Dual/6Quad– 2x/4x cores - Create, transform, enhance, & publish multimedia fast!

- Intuitive User Interfaces for content viewing

- Scalability for ‘the next big use case’

i.MX 6Dual/6Quad Triple-Play Graphics - 3 engines: 3D, OpenVG and BLT

- 200 MT/s, 4 shaders, 3 separate engines

- High quality 3D games optimized for mobile

- Augmented reality views (real world + 3D objects)

- Advanced 3D video formats (source/depth format)

Movie Content

Recording Video

Game Content

3D LCD

3D Television

Publish

TM

External Use 27

i.MX 6 Series: Triple-Play Graphics Solution

− GPUv4 @ 533MHz

− 200M triangles / sec

− 4 Shader Cores: 30 GFLOPS

− Halti support

GC2000 GC355 GC320

i.MX 6

Vector Graphics 3D + GPGPU Composition • GPU-2Dv1 @500Mhz

• Up to 1G pixels / sec raw performance

• GPU-VG @ 500MHz

• 350M pixels / sec raw performance

• Native OpenVG™ 1.1 Khronos conformance with hardware tessellation

DirectX®

TM

External Use 28

Ultra Low Power

GC320 Composition GPU XDirectFB DirectDraw Renderscript GTK+

HAL

Application

Qt

Kernel GC320 GPU

Middleware and

Applications

Built in support for UI elements High quality video scaling to 1080p resolution Multiple pixel formats Multi-surface blend+rotate

Windows/Android/Linux/QNX

UI Layer Acceleration

Programmable 9 x 9 Tap Filter

up/down

scaling

image effects and

editing

256 Levels of

Transparency

Rotation

Sprite Engine

Multiple RGB and YUV Formats

32K x 32K Coordinate System

Supports Image Sizes Up to 16MB

High Quality Text Rendering

Window Management

Multi-surface Blending

TM

External Use 29

OpenVG 1.1 Vector Graphics Processor

Memory Controller

Host Interface

AHB AXI

Graphics

Pipeline

Front End

VG Pixel

Engine Vector Graphics Engine Imaging Engine

GC3505 GPU Core

► Full fixed function hardware

vector graphics GPU

► Hardware Tessellation • Minimum CPU involvement

► 16X FSAA • Photorealistic quality • No performance degradation

► Multi-format rendering • sRGB color transformation • Video image conversion

► High-quality vector font

rendering support

► Dedicated GPU for QoS

requirements

Vivante GC355 GPU

TM

External Use 30

OpenGL ES 3D Engine GC880

•High Performance

•Programmable 3D Core

•CoolThreads™ multilevel clock

gating

• Massive data parallelism

•Supporting: • OpenGL ES 1.1/2.0/Halti

• OpenVG 1.1

• OpenGL 2.1 & 3.0

• DX11 9_3

• OpenCL 1.1 EP (6Q/6D only)

GC2000

• 27M triangles / sec

• 266 M pixels / sec raw

performance

• 1x SIMD Vec4 Shader Core

• 200M triangles / sec

• 1000 M pixels / sec raw

performance

• 4x SIMD Vec4 shader cores

TM

External Use 31

i.MX 6 Series: Why We Are Winning

• Security − RNG, Crypto accelerator, Trustzone, SNVS, etc.

• Scalable Product Platform − Ability to start at any of 4 entry points and scale as needed

− Wide ball pitch BGA packages

− Industrial, Automotive and Consumer availability

• Long Term Availability and High Quality − Extended Temp range available with full Industrial qualified parts

− Automotive and industrial devices on Freescale’s Product Longevity Program

• Industrial Environment and Peripheral Support − 3.3V IO

− 0.8mm pitch package to reduce PCB & manufacturing cost

− Flexible interface support including legacy interfaces – DDR2, DDR3, LVDS

− Broad peripheral support – Gbit ethernet, CAN, SATA, PCI-E, LVDS

• Rich and Active Ecosystem − Easy to build/engage on i.MX

− Multiple 3rd parties: EBS, Solution Providers assist in OEM design-in

• Multi-OS Support: WinCE, Linux, Andriod, VxWorks, QNX, Citrix

TM

External Use 32

i.MX ARM9 Portfolio Feature i.MX25x i.MX233 i.MX28x

RAM 128KB 32KB 128KB

Flash Interface MLC/SLC NAND Flash w/ 8-bit

RS, NOR Flash

SLC/MLC/Managed NAND Flash

20-bit BCH, 8-bit RS

SLC/MLC/Managed NAND Flash w/

20-bit BCH

DRAM Interface 150 MHz 16-bit DDR2, mDDR,

SDRAM

150 MHz 16-bit DDR1, mDDR 200 MHz 16-bit DDR2, LV-DDR2,

mDDR

LCD 1 overlay, alpha blending,

panning

8 overlays, alpha blending, scaling,

rotation, color space conversion

8 overlays, alpha blending, scaling,

rotation, color space conversion

Integrated TV-Out - Yes Yes

CMOS Sensor Interface Yes - -

CAN x2 - x2

10/100 Ethernet Single 10/100 - Dual 10/100 (1588 H/W Time

stamping) and L2 Switch

Analog Audio External Stereo ADC/DAC with amps, Mono

speaker amp output

External

S/PDIF Interface - 1 output 1 output

Power Management External Integrated Integrated

USB 2.0 HS port (Host/Device) HS PHY

x1, HS Host with FS PHY x1

HS port (Host/Device) with PHY x1 HS Host/Device with PHY x1, HS

Host with PHY x1

SIM x2 - -

P-ATA Yes - -

Security Secure Boot, Tamper Detect,

RNG, Crypto (3DES)

Secure Boot, Crypto (AES-128) Secure Boot (HAB4), Crypto (AES-

128)

TM

External Use 33

i.MX25 Target Markets

Point Of Sale

• Secure ePOS Terminals

• Data Acquisition (Scanners)

• Fixed and Handheld Printers

Industrial

• HMI (Factory Automation & Building Control)

• Smart Meters

• General Embedded / Consumer

Feature Benefit

Integration and Connectivity –

Ethernet, CAN, SDIO,

Touchscreen Controller,

DDR2, USB PHY, Camera I/F

Reduced system cost and

complexity, greater product

feature scalability

LCD Controller Can drive high color VGA

displays for information

display and user interaction

Security Robust, tamper-resistant

devices for secure

applications

Industrial qualification and

product longevity

Supports the full life of the

product in the field

Windows CE and Linux BSP’s Reuse software across

i.MX platforms

Optimized performance and

power consumption

Fanless automation,

increased battery life for

portable equipment

TM

External Use 34

i.MX28 Target Applications

Industrial

• Smart Energy - Gateways/Meters

• HMI - Factory Automation

• HMI – Building Control

• Industrial Control

• Fixed and Handheld Printers

Home & Office

• HMI (Appliances, Security Panels, Automation)

• Portable Medical

• Media Gateways/Accessories

Automotive

• Audio Connectivity

• CAN Gateways

TM

External Use 35

Insert Title Here: Content Slide

• Sed ut perspiciatis unde omnis iste natus error sit voluptatem

− Totam rem aperiam, eaque ipsa quae ab illo inventore

Veritatis et quasi architecto beatae vitae dicta sunt explicabo

• Nemo enim ipsam voluptatem quia voluptas sit aspernatur