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I N D I A N A U N I V E R S I T Y TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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Page 1: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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TransPAC

John HicksTransPAC HPCC Engineer

Indiana University

APAN Conference – Shanghai 27-August-2002

Page 2: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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Webpage - http://www.transpac.org

The TransPAC Project is funded by the US National Science Foundationand the Japan Science and Technology Corporation

Introduction to TransPAC

The TransPAC Project is jointly funded by the US National Science Foundation and the Japan Science and Technology Corporation.

The TransPAC Project provides high-performance network connectivity between the Asia-Pacific region and the United States for the purpose of encouraging educational and scientific collaboration among scientists and researchers in these respective areas.

Page 3: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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On 15 October 2001, TransPAC was upgraded to 1.244Gbps. The new TransPAC network has dual 622Mbps connections from Tokyo to Seattle (Pacific Wave Connection Point) [POS] and to Chicago (StarLight Connection Point) [ATM].

• The Tokyo-Seattle link is supplied by Teleglobe.

• The Tokyo-Chicago is supplied by KDDI.

TransPAC May 1, 2002

Page 4: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002
Page 5: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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TransPAC Evolution

May 8 – Received a phone call from a friend at Teleglobe warning of troubles.

May 15 – Troubles with Teleglobe are officially confirmed

May 23 – RFP for new TransPAC service released

May 27 – TransPAC northern circuit fails. TransPAC now relying on only southern circuit.

Page 6: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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TransPAC June 2002

June 3 – RFP responses due

June 6 – Initial award to KDDI-A pending minor negotiations.

June 10 – Official award to KDDI-A

June 21 – Tokyo-Seattle circuit complete, testing begins

June 24 – Testing shows errors, circuit examined, testing continues

June 25 – Circuit is clean, routes begin to be passed

June 26 – Traffic is passed across the northern circuit again!

Page 7: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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TransPAC Network

Page 8: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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TransPAC Northern Route

Page 9: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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TransPAC Southern Route

Page 10: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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TransPAC PVCs

Page 11: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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IPv6 on TransPAC

• Northern and Southern TransPAC routes provide IPv6.• Northern route provides line-rate native IPv6 support.• Southern route provides 4 PVCs (Korea, WIDE, APAN,

IMnet) to the 6 TAP CISCO 7206.• TransPAC will participate in a IPv6 Land Speed

Record demo from Tokyo to New York.• Waiting on Abilene to install equipment in New York.• We are also exploring a demo from Tokyo to

Amsterdam (iGrid 2002).

Page 12: INDIANAUNIVERSITYINDIANAUNIVERSITY TransPAC John Hicks TransPAC HPCC Engineer Indiana University APAN Conference – Shanghai 27-August-2002

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Questions and discussion

John Hicks

Indiana University

[email protected]