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World Class Standards
Industrialization process for the M2M SIM
Minor and major changes ahead
Cristina DeLeraInfineon Technologies
© ETSI 2007. All rights reservedMachine to Machine (M2M) Workshop
Industrialisation process for the M2M SIM 2
World Class Standards
This is how we all know it in the chip card industry…
test on chip cardmodule level
wafer fabfrontend and preassembly
assemblypersonalization
on card level
Industrialisation process for the M2M SIM 3
World Class Standards
Automotive /
Industrial applicationstape & reeltest on
VQFN level
Chipcard applications, e.g. M2M
newequipment
newdelivery form
…and this is how it may end upwafer fab
frontend and preassembly
assembly
Industrialisation process for the M2M SIM 4
World Class Standards
New investments in test equipment
test on VQFN level
newequipment
Gravity handler, input in tubes
Pick and place, input in trays
Industrialisation process for the M2M SIM 5
World Class Standards
Delivery formClearly dominant delivery form for volumes in industrial and automotive industry, why?
tape & reel
newdelivery form
Storage room optimization(3.000 pcs in one reel, ~500 pcs in a tray)
Less raw material
Higher throughput
Easier equipment set up, lessmaintenance work
Industrialisation process for the M2M SIM 6
World Class Standards
XYZWirelessmoduleproviders
System integrator
XYZSIM chipproviders
SIM chip+packageproviders
SIM cardproviders (incl. network operatorconfig)
Customer
Networkoperator
contract
What is new or who is new?
New silicon
New form factor
New businessmodel
Industrialisation process for the M2M SIM 7
World Class Standards
A new silicon?
Newest technology…but stable
Long life, 10 years or more
Resistance to vibration and humidity
Frequent wite/erase of data
…
Industrialisation process for the M2M SIM 8
World Class Standards
Alternative form factor?
Industrialisation process for the M2M SIM 9
World Class Standards
New business players in the value chain?
•Project based business
•Case by case is decided, who are the business partners
•New form factors may be introduced
•Further integration might occur at component level
Industrialisation process for the M2M SIM 10
World Class Standards
Automotive /
Industrial applications
tape & reel
test on VQFN level
Chipcardapplications, e.g.
M2M
newequipmentc
newdelivery form
Coming back to the value chain picture…wafer fab
frontend and preassembly
assembly
Industrialisation process for the M2M SIM 11
World Class Standards
Chip
card
s
Auto /
Industrial
tape & reel
tape & reel
PCBA assembly
and soldering
Tested PCB personalized
VQFN
Personalization & testing
PCBA assembly
and solderingnewequipment
newprocess/partner
newprocess/partner
Industrialisation process for the M2M SIM 12
World Class Standards
Equipment
Personalization & testing
PCBA assembly
and soldering new
process/partner
newequipment
New investments requested
for volume production:
perso equipment, soldering…
Soldering takes place at max.
260°C (according to JEDEC)
Industrialisation process for the M2M SIM 13
World Class Standards
Final product: tested PCB
After personalization and soldering, components are tested
Due to sensitivity of content of stored data, possibility for testing islimited
Tested PCB personalized
VQFN
newprocess/partner
Industrialisation process for the M2M SIM 14
World Class Standards
Summary
All in all, the whole value chain must work together and be readyfor some minor and major changes.
Standardization will help accelerate the market take off!
Thank You