Industry trends are boosting Jet Printing

Nico Coenen – Global Sales Director Jet Printing

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• What is Jet Printing

• Market Overview

• Industry Trends

• Typical Applications

Agenda

What is Jet Printing

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What is Jet Printing?

• Jet Printing at high frequency while moving over the board at high speed

• Solder paste and SMA (Surface Mount Adhesive)

• Dot volumes 5-20 nl

• Unique in the industry

Jet Print Head

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Jet Printing solder paste

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Software control

MY600 Jet printer

Print head

Jet printing3 basic elements

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Cassette has ID chip and barcode on the cartridge• The right paste for the right job• Paste/glue within due date• Low paste level warning

Temperature control• Maintains local paste temperature at 30oC

Closed system• Low solder paste waste• Environmentally friendly

Cassette Holder Ejector CartridgeFilter box

The print head in detailsThe MY600 Cassette

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The print head

paste

Market overview

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The electronics industry segments

Source and copyright: Prismark April 2014

Computer490 BUSD 2.7%

Communications482 BUSD 3.1%

Consumer147 BUSD 3.5%

Automotive178 BUSD 6.5%

Industrial/Medical253 BUSD 5.8%

Military/Aerospace128 BUSD 2.8%

CAGR 2013-2018 Geographic distribution

66%

16%Americas

Asia/ROW

4%JapanEurope

14%

71%

5%7%

Asia/ROW17%

Japan

AmericasEurope

16%AmericasAsia/ROW

19%

57%

EuropeJapan 9%

Americas28%

50%Europe

5%Japan

Asia/ROW 17%

Japan

Americas19%

3%

11%Asia/ROW

Europe67%

Asia/ROW

29%Europe20%

34%18%Americas

Japan

Total: 1,678 BUSD

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PCB assembly market

China 45%

Asia/ROW

19%Japan

7%

Europe12%

Americas

17%

China 45%

Asia/ROW

20%

Japan7%

Europe12%

Americas

16%

2012 2017

Total: 86 BUSD

-of which equipment: 5 BUSDTotal: 112 BUSD

Region CAGR 2012-2017 Segments

Americas 4.2% Industrial/Medical, Military/Aerospace, Infrastructure

Europe 5.4% Industrial/Medical, Automotive, Infrastructure

Japan 5.4% Automotive, Consumer

Asia/ROW 6.5% Mobile, Consumer, Automotive

China 5.4% Computer, Mobile, Consumer, Automotive

Source and copyright: Prismark April 2014

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Market dynamics and trendsElectronics products and effect on PCB assembly

Decreasing cost for electronics

• Cost per placement • Higher speed lines • Higher utilization, quality & yield (DPMO, reject rates, etc.)

Build to order• Higher mix and shorter batches• NPI turn around time• Logistics and material handling

Functionality increases and miniaturization

• More complex boards ‘broad band’ PCBs• Semicon assembly – new packaging needs• Higher accuracy

Increasing safety and reliability requirements

• Higher quality & yield (DPMO, reject rates, etc.)• Higher accuracy

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Electronics ComponentsTo be mounted in PCB assembly

252325

54

6534

43

2018

433

2013

340

270202756

2018

10,401

1,007

9,124

2013

7,314

6,355

Value, BUSD Billion Units

2013-2018 CAGR Value Units

Passives +5.0% +7.5%

Discretes +3.8% +5.9%

ICs +5.2% +5.9%

ICsDiscretesPassives

Source and copyright: Prismark April 2014

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Array package pitch trendsExcludes Small Die DCA, Display Driver and RF Modules

Kc314.088bp-pitch trends

(Excludes Small Die DCA, Display Drivers, and RF Modules)

1.27mm02008 2009 2010 2011 2012 2013 2014 2015 2016 2017 2018

10

20

30

40

50

60

70Bn Units

1.0mm

0.5mm

0.65-0.8mm

0.4-0.45mm

0.3-0.35mm

DCA in Module

Note: Sub 0.5mm was 2% of overall volume in 2008. By 2018 this will increase to 28% or 19Bn unitsSource and copyright: Prismark April 2014

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Passive component size reduction

1.2 TrnUnits

2.2 TrnUnits

4.5 TrnUnits

8 TrnUnits

60%Market Share

50%

40%

30%

20%

10%

0%20001996 2005 2010 2015

0805 and larger

0603

0402

0201

01005

Kc0311.080bp-passive

Source and copyright: Prismark April 2014

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PCBA & SCA slowly merging

Accuracy / Quality

Traditional SMT

High-end SMT

Die packaging<1 µm

5µm

15µm

35µm

SCA PCBA

Speed5000 cph

System packaging

Technology Trends

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Strong technology trendsdrive need for new capabilities on equipment

Stencil printers

Dispensers

• difficult to doeverything on the board

• very slow, notcost effective

• accuracy ischallenging

Technology drivers• miniaturization

• mixing large and small components

• higher density boards

• 3D electronics and boards

• new semiconductor packaging

• new LED technology

• hybrid packaging/devices• flexible boards

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Opportunity for jet printingreplacing both stencil printers and dispensers

Stencil printer

1. high-end electronics low to mid volume

2. high volume SMT smart phone board

3. semiconductor LED technology

Stencil printer Stencil printer Dispensing Dispensing

DispensingDispensingDispensingDispensing

Examples

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Which stencil to use?Do I need to compromise?

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perfect volume controlperfect volume control

mix small and large partsmix small and large parts

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3D print examples

Each solder joint can be optimized for: solder paste volume, position, height, shape, pad coverage

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Flexible & thin boards - Panels

Board stretch and alignment• Boards are aligned and any stretch is

compensated for by using board fiducials

Board warpage• Laser height sensor maps board surface• Control software ensures the the print head travels with constant jet

height over the board

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Jet printing challenging boards

With jet printing, you can easily handle multi-level PCB’s

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Pin-in-paste

• Enough solder to cover the pins

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Jet print on mounted boards

Excellent position accuracy even at larger jet printing heights.Result depends on dot size and distance to board.

Typical applications shielding and repair.

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MY500 in high volume production (add-on)

Use the jet printer after the screen printer to add volume or add solder paste to challenging board designs. No need for stepped stencils, special coating, preforms etc.

Step 1. Screen print full board Step 2. Add volume with MY500

Step 1. Screen print all padsexcept cavities. Step 2. Jet print in the board cavities

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Alpha confirms solder joint quality withadd-on

JP-500 jettedbefore and afterRe-flow.

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Industry trends

4the Industrial Revolution

Lights out

factory

Industry 4.0

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Definition Industry 4.0

Industry 1.0

Industry 3.0

Industry 2.0

Industry 4.0

End of 18the century Beg. Of 20the century Beginning of 1970 Today

Deg

ree

of c

ompl

exity

1st Industrial revolution trough introduction of mechanical production facilities with the help of water and steam power

2nd Industrial revolution trough introduction of mass production with the help of electrical energy

3rd Industrial revolution trough application of electronics and IT to further automate production

4th Industrial revolution On the basis of cyber-physical production systems (CPPS), merging of real and virtual worlds

First programmable logic control system 1969

First assembly line 1870

First mechanical weaving loom 1784

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Smart Factory – Cyber Physical Production Systems (CPPS)

Internet of :

People

Service

Things Data

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How does Jet printing serve Industry 4.0Electronics products and effect on PCB assembly

Automation • Automatic changeover possible without human intervention for lot size 1

Software driven • Easy to communicate with other devices, programs received from engineers desk

Closed Loop • Integrated 2D inspection and repair

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• Exciting times with 4the

industrial revolution

• Industry trends pushes PCBA

further

• Jet Printing will be part of this

Conclusions

Thank Younico.coenen@mycronic.com