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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 1
Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode The first PrimePACK™ 2 product from Infineon implementing IGBT5 and .XT joining
technology with copper wire bonding and sintered silver die attach.
22 bd Benoni Goullin44200 NANTES - FRANCE +33 2 40 18 09 16 [email protected] www.systemplus.fr
SP19492 – POWER Semiconductor report by Amine ALLOUCHELaboratory Analysis by Véronique LE TROADEC
October 2019 – SAMPLE
REVERSE COSTING® – STRUCTURAL, PROCESS & COST REPORT
http://www.systemplus.fr/http://www.systemplus.fr/
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 2
SUMMARY
Overview / Introduction 4
o Executive Summary
o Market
o Reverse Costing Methodology
o Glossary
Company Profile 9
o Infineon profile
o Infineon Technology and Product Portfolio
o Supply Chain
Physical Analysis 14
o Synthesis of the Physical Analysis
o Package Analysis
Package Opening
Package Cross-section
o Si IGBT Die
IGBT Die View & Dimensions
IGBT Die Process
IGBT Die Cross-section
o Si Diode Die
Diode Die View & Dimensions
Diode Die Process
Diode Die Cross-section
Manufacturing Process 107
o Si IGBT Fabrication Unit
o Si IGBT Process Flow
o Si Diode Fabrication Unit
o Si Diode Process Flow
o Final Test & Packaging Fabrication unit
o Packaging Process Flow
Cost Analysis 128
o Synthesis of the Cost Analysis
o Yields Explanation & Hypotheses
o Si IGBT
IGBT Front-End Cost
IGBT Wafer Cost per Process Step
IGBT Die Probe Test & Dicing
IGBT Die Cost
o Si Diode
Diode Front-End Cost
Diode Wafer Cost per Process Step
Diode Die Probe Test & Dicing
Diode Die Cost
o DBC Cost
DBC BOM Cost
DBC Assembly Cost
o Module Cost
Module BOM Cost
Packaging Assembly Cost
Final Module Cost
Selling Price Analysis 151
o Definition of prices
o Estimation of selling price
Comparison 154
o Comparison of Infineon IGBT3 vs IGBT4 vs IGBT5.
Feedbacks 157
Company Services 159
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 3
Overview / Introductiono Executive Summaryo Marketo Reverse Costing
Methodologyo Glossary
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Executive Summary
The market outlook for power electronics industry is promising. In 2018, the power semiconductor devices market segment represented US$17.5 billion, with a CAGR 2018-2024 of 3.2%.
The biggest growth in this market is driven by IGBT modules that represents 23% of the total market in 2018 and is expected to increase in the coming years. That’s why various players are currently investing in new manufacturing lines: Infineon have invested US$1.9 billion in Villach to build a second fab for power devices on 300 mm wafers.
Industrial is one of the main applications for IGBT modules. For this purpose, Infineon released the FF1200R12IE5 ; its first PrimePACK™ 2 product with IGBT5 and .XT joining technology. This novel joining technology implements copper wire bondings and sintered silver as die attach layer.
The module employs Infineon’s IGBT5 TRENCHSTOP™ and Emitter Controlled 5 diode in 1200V Half-Bridge configuration with a nominal current rating of 1200 A.
This report presents a deep analysis of the FF1200R12IE5 module. Supported by a full teardown of the module’s components and housing, this report reveals Infineon’s design of the IGBT5 and EC5 diode as well as its innovative assets in the PrimePACK™ 2 packaging.
This report includes an estimated manufacturing cost of all the module’s components and its selling price analysis. It proposes a comparison between, IGBT3, IGBT4 and IGBT5 technologies from Infineon.
These comparisons highlight differences in the die design, packaging and electrical performances.
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 4
Overview / Introduction
Company Profile & Supply Chain o Infineon Profileo Infineon Modules Portfolioo Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Infineon PrimePACK™ with TRENCHSTOP™ IGBT5 .XT Portfolio
• Infineon proposes PrimePACK™ modules (with IGBT5 and .XT joining technology) in the PrimePACK™ 2 and PrimePACK™ 3+packages.
• FF1200R12IE5 is the first PrimePACK™ 2 product from Infineon with IGBT5 and .XT joining technology. It implements Infineon’s IGBT5 TRENCHSTOP™ and Emitter Controlled 5 diode in 1200V Half-Bridge configuration with a nominal current rating of 1200 A.
Analyzed module
Source: Infineon, Product Brief: “PrimePACK™ with TRENCHSTOP™ IGBT5 .XTThe dawning of a new era”
Analyzed module
Source: Infineon Technologies 2015, PrimePACK™withIGBT5 & .XT, Z. Zhenbo
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 5
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Cu Terminal leads (x)
FF1200R12IE5 – Optical View©2019 by System Plus Consulting
Nuts M8 (x4)
Terminal Lugs (x7)
x-plated CuBaseplate
IGBT5 (x)
(16x) Diode EC5:
o Dimensions:
xx mm² (xxmm x xxmm)
o Electrical Connection: xx sintering on DBC
+ xx ⌀xxµm wire bonding (.XT Technology)
Ni-plated Cu Baseplate:
o Dimensions:
xxmm x xxmm x xxmm
PrimePACK™2 Packaging:
o Dimensions: 171 mm x 89 mm x 37 mm
Synthesis of the Physical Analysis
Silicone gel NTC
Package Housing
(16x) IGBT5:
o Dimensions:
xx mm² (xxmm x xxmm)
o Electrical Connection: xx on DBC
+ xx ⌀xxµm wire bonding (.XT Technology)
Al2O3 DBC (x)
Al2O3 DBC (x4):
o Total thickness: xx µm
o Electrical Connection:
xx Solder on Baseplate
x Terminal substrate (x)
Nuts M4 (x7)
Diode EC5 (x)
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 6
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Opening – Disassembling (4/6)
xxx
Housing removal Steps – Optical Views©2019 by System Plus Consulting
Copper terminal leads (x3)
Terminal Lugs (x7)
o The protective gel is following the shape all around the housing borders.This implies that the silicone gel deposition is performed xxx
Protective gel
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 7
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Opening – Baseplate Dimensions
Baseplate Characteristics
o Dimensions: xxmm x xxmm x xmm
xx mm
xx mm
x m
m
Housing removal Steps – Optical Views©2019 by System Plus Consulting
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 8
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
DBC – Terminal substrate Wire Bonding:
o x wires
o x bond wire
o .XT Technology
o Diameter: x µm
o Average length: x mm
o Total Number: x
DBC -to next- DBC Wire Bonding:
o x between the x DBCs of dies.
o x bond wire
o .XT Technology
o Diameter: x µm
o Average length: x mm
o Total Number: x
Wire Bonding (2/3)
Wire bonding – Optical View©2019 by System Plus Consulting
DBC – Terminal substrate
wire bond (x)
DBC -to next- DBCwire bond (x)
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 9
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Cross-Section
Package Cross-section (Tilted) – Optical View©2019 by System Plus Consulting
Cu Baseplate
xx xx
xxx
Al2O3
xxx
CuAlumina DBC
Cu
xxx
xxx
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 10
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Package Cross-Section – DBC Thickness
xx
xx
xx
xx
xx
xx
xxx
DBC Thickness:
o (Cu/Al2O3/Cu) DBC
o Top Cu layer: xx µm
o Al2O3 layer: xx µm
o Bottom Cu layer: xx µm
o Total DBC substrate: xx µm
DBC solder:
o Material: xx (xx)
o Thickness: xx µm
xx
xx µm
xx µm
xx µm
xx µm
xx
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 11
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Si IGBT - Die Dimensions
IGBT Die – Optical View©2019 by System Plus Consulting
o Die dimensions: xx mm² (xx x xx)
xx m
m
xx mm
xx pad
xx pad
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 12
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Process – Delayering
Die Delayering – Optical View©2019 by System Plus Consulting
Before delayering xx removal xx removal
xx xx
Xx removal
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 13
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Process – Delayering
Die Delayering (Cu removal) – Optical View©2019 by System Plus Consulting
Die Delayering (Cu, Ti, W removal) – SEM View©2019 by System Plus Consulting
xx µm
o Transistor pitch: xx µm
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 14
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Cross-Section – Ring
Die Cross-Section – Optical View©2019 by System Plus Consulting
xx
xxx
xx
xx
xx
xx µm
xx µm
o Guard Ring: xx µm
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 15
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis o Synthesiso Packageo Si IGBT5 Designo Si Diode EC5 Design
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Die Cross-Section – Optical View©2019 by System Plus Consulting
Die Cross-Section
xx
xx
xxx
Die Cross-section – SEM View©2019 by System Plus Consulting
xx
xx
xx
xx
xx
xx µm
xx µm
xx µm
xx µmxx
xx
xxx
xx
xx
xx
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 16
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo Si IGBT Fab Unito Si IGBT Process Flowo Si Diode Fab Unito Si Diode Process Flowo Packaging Fab Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
IGBT Process Flow (2/4)
Frontside
• LOCOS (Oxide #1 formation)
Frontside
• xx
• Poly
Frontside
• xx
• Oxide xx
Drawing not to Scale
xxxx
xx
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 17
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo Si IGBT Fab Unito Si IGBT Process Flowo Si Diode Fab Unito Si Diode Process Flowo Packaging Fab Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Si Diode Process Flow (1/2)
Frontside
• xx
• xx
Frontside
• Oxide
Frontside
• xx
Drawing not to Scale
xx
xx
xx
xx
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 18
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo Si IGBT Fab Unito Si IGBT Process Flowo Si Diode Fab Unito Si Diode Process Flowo Packaging Fab Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Module Process Flow
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 19
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flowo Si IGBT Fab Unito Si IGBT Process Flowo Si Diode Fab Unito Si Diode Process Flowo Packaging Fab Unito Packaging Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Module Process Flow (3/4)
Xx welding of terminals on
DBC
• xx Welding of terminals: xx
Placement
• Housing is xxx
Placement
• xxx
Drawing not to Scale
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 20
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Related Reports
About System Plus
IGBT Front-End Cost
The Front-End cost ranges from $xx to $xx according toyield variations.
The main part of the wafer cost is due to the xx (xx%)followed by the xx cost (xx%) .
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 21
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Related Reports
About System Plus
IGBT Wafer Cost Per Process Steps
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 22
Overview / Introduction
Company Profile & SupplyChain
Physical Analysis
Manufacturing Process Flow
Cost Analysiso Synthesiso Si IGBT Costo Si Diode Cost o DBC Costo Packaging Costo Module Cost
Selling Price Analysis
Comparison
Related Reports
About System Plus
Packaging Assembly Cost
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 23
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Estimated Manufacturer Price
The module manufacturing cost ranges from$xx to $xx according to yield variations.
By taking into account a gross margin of xx%for Infineon (2018 results), the module sellingprice is estimated to range from $xx to $xxaccording to yield variations.
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 24
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparisono Comparison between
IGBT3, IGBT4 and IGBT5 from Infineon
Related Reports
About System Plus
IGBT3 vs IGBT4 vs IGBT5 from Infineon
IGBT4 – SEM View©2019 by System Plus Consulting
Infineon IGBT IGBT3 (600V) IGBT4 (1200V module) IGBT5 (1200V module)
Wafer thickness (µm) xx xx xx
Metal contact layer (µm) xx xx xx
Pitch (µm) xx xx xx
Trench depth (µm) xx xx xx
Trench oxide thickness (µm) xx xx xx
IGBT3 – SEM View©2019 by System Plus Consulting
IGBT5 – SEM View©2019 by System Plus Consulting
xx xx xx
xx xx
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 25
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparisono Comparison between
IGBT3, IGBT4 and IGBT5 from Infineon
Related Reports
About System Plus
IGBTx – SEM View©2019 by System Plus Consulting
IGBTx – SEM View©2019 by System Plus Consulting
IGBTx – SEM View©2019 by System Plus Consulting
IGBT3 vs IGBT4 vs IGBT5 from Infineon
o As the IGBT3 and IGBT4, the IGBT5 technology from Infineon is based on xx xx. The xx region are xx
o The main evolution from IGBT3/4 to IGBT5 technology is xx
o The xx contact layer in the IGBT5 module is xx since the xx
o For a same voltage of xx, xx
Infineon IGBT IGBT3 (xxV) IGBT4 (xxV module) IGBT5 (xxV module)
Current of Inverter’s IGBT (A) xx xx xx
Die area (mm²) xx xx xx
Current density (A/mm²) xx xx xx
Die cost ($) xx xx xx
Die Ampere cost ($/A) xx xx xx
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 26
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Plus
Related Reports
REVERSE COSTING ANALYSES - SYSTEM PLUS CONSULTING
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MARKET AND TECHNOLOGY REPORTS - YOLE DÉVELOPPEMENT
POWER ELECTRONICS & COMPOUND SEMI• Status of the Power Electronics Industry 2019• Status of the Power Module Packaging Industry 2019
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 27
COMPANYSERVICES
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 28
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Pluso Company Serviceso Contact
Business Models Fields of Expertise
Custom Analyses(>130 analyses per year)
Reports(>60 reports per year)
Costing Tools
Trainings
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©2019 by System Plus Consulting | Infineon PrimePACK™2 1200V Power Module with IGBT5 and EC5 Diode 29
Overview / Introduction
Company Profile & Supply Chain
Physical Analysis
Manufacturing Process Flow
Cost Analysis
Selling Price Analysis
Comparison
Related Reports
About System Pluso Company Serviceso Contact
Contact
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6.DELIVERIESThe delivery schedule on the purchase order is given for information only and cannot be strictly guaranteed.Consequently any reasonable delay in the delivery of services will not allow the buyer to claim for damages or tocancel the order.
7.ENTRUSTED GOODS SHIPMENTThe transport costs and risks are fully born by the Buyer. Should the customer wish to ensure the goods against lost ordamage on the base of their real value, he must imperatively point it out to System Plus Consulting when theshipment takes place. Without any specific requirement, insurance terms for the return of goods will be the carriercurrent ones (reimbursement based on good weight instead of the real value).
8.FORCE MAJEURESystem Plus Consulting responsibility will not be involved in non execution or late delivery of one of its dutiesdescribed in the current terms and conditions if these are the result of a force majeure case. Therefore, the forcemajeure includes all external event unpredictable and irresistible as defined by the article 1148 of the French CodeCivil?
9.CONFIDENTIALITYAs a rule, all information handed by customers to system Plus Consulting are considered as strictly confidential.A non-disclosure agreement can be signed on demand.
10.RESPONSABILITY LIMITATIONThe Buyer is responsible for the use and interpretations he makes of the reports delivered by System Plus Consulting.Consequently, System Plus Consulting responsibility can in no case be called into question for any direct or indirectdamage, financial or otherwise, that may result from the use of the results of our analysis or results obtained usingone of our costing tools.
11.APPLICABLE LAWAny dispute that may arise about the interpretation or execution of the current terms and conditions shall be resolvedapplying the French law.It the dispute cannot be settled out-of-court, the competent Court will be the Tribunal de Commerce de Nantes.
TERMS AND CONDITIONS OF SALES