integrated circuits
DESCRIPTION
INTEGRATED CIRCUITS. Dr. Esam Yosry. Lec . #8. Introduction Resistor Design Capacitor Design Inductor Design MOSFETs (CMOS) BJTs BiCMOS. VLSI Components in CMOS Technology. Introduction ( Chip Fabrication Cycle). Resistor Design. - PowerPoint PPT PresentationTRANSCRIPT
INTEGRATED CIRCUITSDr. Esam Yosry
Lec. #8
VLSI
Com
pone
nts i
n CM
OS Te
chno
logy
Introduction
Resistor Design
Capacitor Design
Inductor Design
MOSFETs (CMOS)
BJTs
BiCMOS
Intro
duct
ion
(Chi
p Fa
brica
tion
Cycle
)
Resistor Design
• Assume we have a sheet of material of thickness t and width W, then A = W t
• Next assume that L = W; which means that we have a square, then the resistance becomes the sheet resistance per square (Ω/).
𝑅=𝜌 𝐿𝐴
𝑅=𝜌𝑡
Material technological parameters
Resistor Design
• The fabrication house supplies the designer with the values of the sheet resistance R.
• R resistance of one square of the fabricated silicon layer.
• The engineer designs for the number of squares to be put in series or in parallel to get the needed resistance.
Resistor Design
Sheet ResistanceCounting SquaresEnd ContactsBends (Corners)
R
3R
R/3
End contact =0.3 to 0.4 (0.35 is typical)
Corner =0.65
CC=dxd
2dx2d
Resistor Design• Example• If R = 100 Ω/, and the resistance needed is
200 Ω, then two squares are added in series.• If the resistance needed is 50 Ω, then two
squares must be put in parallel.
• n squares in series R= n R
• n squares in parallel R= R/n
• The sheet resistance of the diffused layer from 10 to 200 Ω (100kΩ?!)
Equivalent Resistance of End Contacts
R= body resistance (nR) + end contacts resistance (2x0.35R) + corners resistance (ncx0.65R) + metal/Si contact resistance RC (usually very low)
End contact =0.35
CC=dxd
2dx2d
Resistor’s Accuracy
Absolute Accuracy
Matching Accuracy *Resistors are usually made from polysilicon
* Inaccuracy comes frompoly line edge-shift duringprocessing (PR dimensionalchange, lateral etching, UVdiffraction,…etc)
*As inaccuracy is almost the same in the two resistors matchingaccuracy is very high
Absolute Accuracy
Rnominal = n R =(nL/L) R
= (length/width) R
Include line-edge shift of LR = (length L / L L) R
(length / L L) R
= (length/L)(1+ L/L) R
= (length/width) R )(1+ L/L) = Rnominal (1+ L/L) L/L = 1 to 5 %
R= nR
n squares
L
Length>>width
Matching Accuracy
R1 = R1nominal (1+ L/L)
R2 = R2nominal (1+ L/L)
R1 / R2 = R1nominal / R2nominal
Accurate VLSI designs should depend on resistance ratio
rather than on absolute resistance
n2 squares
R1= n1R
n1 squares
R2=n2 R
Matching resistorsis feasible in ICs butaccurate resistors arehard to obtain
How to Increase Absolute Accuracy ?
Use rounded corners(since errors on corner squares are high)
Use straight lines with metallic interconnects(to eliminate any corner effect)
Use dummy features(to reduce over etching - see explaination)
Rounded Corners
Current density is more uniformly distributed in rounded corners than in square corners
Perfectly roundedshapes are sometimesnot supported by Sifoundries
45o are acceptedby most layouttools and Sifoundries
Straight Poly Lines with Metallic Interconnects
End contacts should have the lowest contact
resistance
Color Code for Masks:Red: PolysiliconBlue: Metalic interconnectBlack: Contact cut
Dummy Poly Features
• The dummy shapesaround the main body of the resistor makes the lateral etching equal allover the poly edges.
• Knowing the etching rate, the etching time is optimized to etch just the necessary volume of poly.
Without dummyfeatures
Withdummyfeatures
How to Increase Matching Accuracy?
Use pairs with common centroid
(to reduce the effect of technological parameter spread also
called gradient)
R1
R1
R2
R2
dummy dummy
Comparison of the Chip Area required for Serpentine Resistor Geometries
Versus Multiple Straight Resistors
Capacitors
Between two polys
Cnominal = A / Tox
Poly I
Poly II
Oxidedielectricconst.,r = 4
Upper poly IIarea
Oxidethicknessbetweenpoly I andPoly II
Capacitor’s Accuracy
Absolute AccuracyMatching Accuracy
* Inaccuracy comes frompoly line edge-shift duringprocessing (PR dimensionalchange, lateral etching, UVdiffraction,…etc)
*As inaccuracy is almost the same in the two caps matchingaccuracy is very high if of the sameperimeter-to-area ratio
Absolute Accuracy
Anominal = axb (dashed line)
A = Anominal - xP is the edge-shiftP is the nominal perimeter =2(a + b)
Absolute Cap Error = C/C= A/A=- xP/A (A is nominal)
Error is proportional to the perimeter-to-area ratioNever use large perimeter features (like zigzags)
a
b
Matching Accuracy
Cap ratio Error = C1/ C2 = [C1xxP1/A1]/ [C2xxP2/A2]
For matched caps C1=C2 (nominal and real values)
P1/A1 = P2/A2 makes C1= C2 for matched real values
On Chip Inductors
Square (hollow) Octagonal (hollow) Series resistance Rs
Parasitic cap Cs
Substrate Conductivity Losses Rp
Q=3 to 10 at 1 GHz
Equivalent Circuit
Equivalent Circuit Elements
Cs= cap to substrate
Substrate eddycurrent loss
Substrate displacementcurrent loss
Rp
Rs= seriesresistance
Substrate Resistivity Effect
• No substrate current loss• Low cap (series caps) • High self resonance frequency
• No substrate current loss• Large cap • Low inductance
Multi-Layer Inductors
Series resistance increases linearly with number of turnswhile L increases quadratically, hence Q is improved
L up to 60 nH
Bond Wire Inductors1 nH / mm
• L = 3 to 4 nH, Q = 40 to 50 but poor reproducibility• High pad and pin caps reduces the self-resonance frequency• Not suitable for mass production
3-D Inductors
• High L (up to 15 nH).• High Q (30 - 50)• Good reproducibility• Large pad caps
Thanks
Many thanks to Prof. Hany Fikry and Prof Wael Fikry for their useful materials that help me to prepare this presentation.