integrated photonics advances in optical transmission: an industry view

Integrated Photonics Advances in Optical Transmission: An Industry View

Júlio César R.F. de Oliveira, Ph.D18 de Maio de 2016

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Confidential and Proprietary Information2

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Confidential and Proprietary Information

BrPhotonics Location and Facilities

CPqD Campus, Campinas, Brazil Production Facility

• for Thin Film Polymer on Silicon (TFPS) Modulators and Packaging

Cleanrooms• Class 100• Class 10000

Labs

• Optical Transmission• Packaging• Qualification

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Long Haul/Metro Transceiver Market Dynamics

SFF, Integration, Low Power Consumption, Low Cost

100Gbps

1Tbps 400Gbps

200Gbps

10

0G

b/s

20

0G

b/s

40

0G

b/s

1Tb

/s

Lin

e R

ate

Evo

luti

on

Form Factor Reduction

MSA CFP CFP2 CFP4 QSFP

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Microfabrication – Thin Film Polymer on SiliconTFPS process for high-speed optical modulators

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Manufacturing of TFPS Modulators Chips

Top clad

Electro-optic polymer

End of waveguideWaveguide trench

Bottom clad

Ground plane

Silicon substrate

Top electrode

Ground pads

• BrPhotonics has a 200m2, class 10 cleanroom in

Seattle (In transfer to Campinas)

• Team of chemists, process, RF, and optical

engineers

• Specialized in the manufacture of EO polymer

modulators

• Capacity of 200 wafers/year

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Photonic Packaging

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Photonic Packaging – TOSA Process

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TOSA Evaluation KitEvaluation Board (EVB)

TOSA Carrier PCB

TOSA on carrier

TOSA EVK assembled

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Real-time 100/200 G CFP2-ACO TOSA validation

ClariPhy CL20010

Coherent ASIC

BrPhotonics 100G

CFP2-ACO TOSA

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100G/200G real-time OSNR validation

Required OSNR @ SD-FEC (2.4e-2)

– BrPhotonics ACO-TOSA: 11.6 dB

Penalty with respect to theory: 1.6 dB.

– LiNbO3 reference transmitter: 11.6 dB

BrP ACO-TOSA compliant with LiNbO3 reference.

10 15 20 25 30-8

-7

-6

-5

-4

-3

-2

OSNR [dB/0.1 nm]

log10(B

ER

)

3.8e-3 BER

2.0e-2 BER

2.4e-2 BER

100G Theory

LiNbO3

TOSA #19 (1)

TOSA #19 (2)

TOSA #20 (3)

16 18 20 22 24 26 28 30 32-4

-3.5

-3

-2.5

-2

-1.5

OSNR [dB/0.1 nm]

log10(B

ER

)

2.0e-2 BER

2.4e-2 BER

200G Theory

LiNbO3 (Literature)

TOSA #20 (Real-Time)

TOSA #19 (Real-Time)

Required OSNR @ SD-FEC (2.0e-2):

– BrPhotonics ACO-TOSA: 19.0 dB

Penalty with respect to theory 2.2 dB.

– LiNbO3 reference transmitter: 19.0 dB (literature)

BrP ACO-TOSA compliant with LiNbO3 reference.

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ASIC 100G (10x10) OTN 40 nm OTN ASIC

– Single chip solution Mapper/Framer/Criptography/FEC for 100G

40nm TSMC Test Chip

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ASIC DSP 400G 16nm DSP ASIC

– Single chip 400G 64 to 16 QAM/QPSK up to 45GBd

16nm FF+ TSMC Test Chip

LineModem

(DSP)

OTU4Framer

ClientMapper

Line 2

Host

LineAFE

Register File

EmbeddedµP

Real-TimeCapture RAM

SPI

HI

HQ

VI

VQ

MDIO

20 x 25G10 x 50G H

ost

Se

rde

s

Cro

ssb

ar

Sw

itch

an

d G

ea

rbo

x

OTUx

LineModem

(DSP)

OTUx

HI

HQ

VI

VQ

Line 1

LineAFE

25G Serial

FEC

FEC

OTU4Framer

ClientMapper

OTU4Framer

ClientMapper

OTU4Framer

ClientMapper

OTU4Framer

ClientMapper

ADC_I

ADC_Q

DAC_I

DAC_Q

AFE INTERFACE DSP

DAC_I 128X8

DAC_Q 128X8

ADC_I 128X8

ADC_Q 128x8

DSP_I_IN 128X8

DSP_Q_IN 128X8

DSP_OUT 64X4

AHB MASTER

SPI I

F

ADC_I CNTRL/STATUS

ADC_Q CNTRL/STATUS

ADC_I_CLK

ADC_Q_CLK

DAC_I CNTRL/STATUS

DAC_Q CNTRL/STATUS

DAC_I_CLK

DAC_Q_CLK

AFE

_A

HB

L_IF

/32

/32

DSP_RX_CLK

DSP_TX_CLK

TST_BUSI_OUT_128X8

AFE

_R

ST_

N

DSP

_R

ST_

N

PMONPMON IF

AFE

ADC_HI_P

ADC_HI_N

ADC_QI_P

ADC_QI_N

DAC_HI_P

DAC_HI_N

DAC_HQ_P

DAC_HQ_N TST_BUSQ_OUT_128X8

Osc(Need to

Spec)

CSR_INTERFACE

SCLK

OSC_P

OSC_N

700MHz

RXPLL

TX

PLL

16GHz

16GHz

70

0M

Hz

DIV32_BYPASS

DIV32_BYPASS

PLL_BYPASS

PLL_BYPASS

Full ASIC Arch.

DSP Test Chip IPs- TR- PE- Demapper- MUX

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External Cavity Tunable Laser

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100G/200G Polymer DP-IQ Modulator

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Silicon Photonics – Tapeout timeline

March 2013

October 2013

March 2014

October 2014

DP-QPSK

Modulator v1

OpSIS/IME

5x5 mm²

DP-QPSK

Receiver v1

OpSIS/IME

2.5x5 mm²

DP-QPSK

Modulator v2

OpSIS/IME

5x5 mm²

Si/TFPS Modulator

External Cavity Laser

IME

3x16 mm²

DP-QPSK

Receiver test

blocks

IME

3x16 mm²

Feb2016

DP-QPSK

Receiver v2

IMEC

5x1.15 mm²

DP-QPSK

Modulator v2

IMEC

3.6x2. mm²

Characterizationn

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Silicon Photonics – Coherent Receiver

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Silicon Photonics – DP-IQ Modulator

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Highlights

BrPhotonics is currently shipping high bandwidthmodulators, mainly exporting (US Army, DuisburgUniv/Corning, Tyndall, Mackenzie Univ., OeSolutions,Menara Networks)

BrPhotonics is currently exporting deep submicron(16nm) ASIC IPs and services (partnership with CPqD)

BrPhotonics is involved with LNLS in development ofstate of art Sirius large area detectors (PiMega)

BrPhotonics just finish second round of investment (lastweek), and now, CPqD, GigPeak and FINEP areshareholders

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BrPhotonics Investment Cicle

Joint Venture CPqD/GigOptix - Fev’14

Business plan Submission Third Investor – Aug’14

Valuation Fev’15

Negotiation Mar’15

MoU Signature May’15

Due Diligence (PwC/CEPEDA) July’15

Intangible Valuation Aug’15

Shareholders and Investment Agreements Nov’15 (Legal Issues)

Investiment Initial plan 15/Set....Closed May’16

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Entrepreneurship

Biz Enviroment

VC’s

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Entrepreneurship

Nós somos aquilo que fazemos repetidamente.

Excelência, então, não é um ato, mas um hábito.(Aristóteles)

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Conclusions

BrPhotonics is promoting the convergence betweenphotonics and microelectrônics in agreement with itsoriginal plans.

We have demonstrated our current efforts on thedevelopment of key technologies to accomplishsuch challenging roadmap.

BrPhotonics is focused on the domain of suchtechnologies to successfully reach the global marketbased on the following view:

– Reduce the cost per bit and power consumption

– Increase the transceiver ports density withminiaturization

Thank you!

www.brphotonics.com

integrated photonics advances in optical transmission: an industry view

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