intel 32nm technologydownload.intel.com/pressroom/kits/32nm/westmere/mark...45 nm 32 nm 22 nm...
TRANSCRIPT
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Intel 32nm Technology
Mark Bohr
Intel Senior Fellow
Logic Technology Development
Feb. 10, 2009
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Key Messages
• Intel has developed a 32nm logic technology with
industry-leading features
• Intel is first to demonstrate working 32nm processors
• Intel’s 32nm process is on track for production
readiness in Q4 ’09
• Both CPU and SoC versions of this 32nm process will
be available
• Intel’s strength as an integrated device manufacturer
allows us to continue to deliver new generations of
advanced process technology on a 2 year cadence
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Intel Logic Technology Development
Process Name P1264 P1266 P1268 P1270 P1272
Lithography 65nm 45nm 32nm 22nm 16nm
1st Production 2005 2007 2009 2011 2013
Manufacturing
Development
4
45nm High-k + Metal Gate Transistors
Revolutionary transistor technology for
improved performance and lower leakage
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45nm Microprocessor Products
45nm production ramp has been the fastest yet
Twice as fast as the 65nm ramp in its first year
Single Core
6 Core
Dual Core
8 Core
Quad Core
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Intel Logic Technology Evolution
Process Name P1264 P1266 P1268 P1270 P1272
Lithography 65nm 45nm 32nm 22nm 16nm
1st Production 2005 2007 2009 2011 2013
Manufacturing
Development
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32nm Technology
• 2nd generation high-k + metal gate transistors
• Immersion lithography on critical layers
• 9 copper + low-k interconnect layers
• ~70% dimension scaling from 45nm generation
• Pb-free and halogen-free packages
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32nm Transistors
• 2nd generation high-k + metal gate
0.9nm equivalent oxide thickness high-k
(scaled from 1.0 nm on 45nm)
Replacement Metal Gate process flow
30nm gate length
4th generation strained silicon
• >22% performance increase
• Tightest reported gate pitch
• Highest reported drive currents
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Transistor Pitch Scaling
Transistor gate pitch continues to scale 0.7x every 2 years
Tightest gate pitch of all reported 32nm technologies
100
1000
1995 2000 2005 2010
Gate Pitch
(nm)
0.7x every
2 years
32nm Generation
112.5 nm Pitch
PitchPitchPitch
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32nm Transistor Performance
32nm provides improved performance or reduced leakage
Highest drive current of all reported 32nm technologies
1
10
100
1000
0.6 0.8 1.0 1.2 1.4 1.6 1.8
ION (mA/um)
I OF
F (n
A/u
m)
1.0 VIntel
45nm
Intel
32nm
1
10
100
1000
0.8 1.0 1.2 1.4 1.6 1.8 2.0
ION (mA/um)
I OF
F (n
A/u
m)
1.0 VIntel
45nm
Intel
32nm
Better Better
+14% +22%
>5x
>10x
NMOS PMOS
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SRAM Cell Size Scaling
Transistor density doubles every 2 years
Moore’s Law continues!
0.1
1
10
1995 2000 2005 2010
Cell Area
(um2)
0.5x every
2 years32nm Generation
0.171 um2 Cell
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32nm SRAM Test Chip
• 0.171 um2 cell
• 291 Mbit
• >1.9 billion transistors
• 4 GHz operation
• First demonstrated Sep ’07
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Rapid Yield Improvement
Defect
Density
(log scale)
2002 2003 2004 2005 2006 2007 2008 2009 20102002 2003 2004 2005 2006 2007 2008 2009 20102002 2003 2004 2005 2006 2007 2008 2009 2010
90 nm 65 nm 45 nm 32 nm
32nm yield improvement on track for Q4 ’09 production
2 year
Higher
Chip
Yield
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32nm Manufacturing Fabs
D1D Oregon - Now D1C Oregon - 4Q 2009
Fab 11X New Mexico - 2010Fab 32 Arizona - 2010
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System Integration
High
Performance
Logic
Memory
Analog Graphics
Low
Power
Logic
Power
Regulator
I/O I/O
I/O
Analog
High Perf.
Logic
GraphicsLow Power
Logic
Power
Reg.
Memory
Discrete SoC
System integration will continue, using key elements
such as the AtomTM core, to realize improved
performance and power in a smaller form factor
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32nm SoC Process
45 nm 32 nm 22 nm
Process: P1266 P1266.8 P1268 P1269 P1270 P1271
Products: CPU SoC CPU SoC CPU SoC
Intel is developing both CPU and SoC versions of each
process generation, to provide transistors, interconnects
and other device features optimized for each product line
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Integrated Device Manufacturer Advantage
PackagingMasks
Process
Design Tools
Product
Manufacturing
Design for Manufacturing
Co-Optimized Process+Product
Rapid Yield Learning
Early Product Ramp
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Summary
• Intel has developed a 32nm logic technology with
industry-leading features
• Intel is first to demonstrate working 32nm processors
• Intel’s 32nm process is on track for production
readiness in Q4 ’09
• Both CPU and SoC versions of this 32nm process will
be available
• Intel’s strength as an integrated device manufacturer
allows us to continue to deliver new generations of
advanced process technology on a 2 year cadence
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