Intel Corporation’sIntel Corporation sHigh Density Data Center

An Operational ReviewPaul Vaccaro / Intel – Data Center Architect

David Seger / IDC Architects – Principal Mechanical Technologist

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JFS1 High Density Data Center

HPC for Silicon DesignGl b l D i C i E iGlobal Design Computing Environment

User System

CCC Systems

User System

CCC Systems

Batch cycles from Hub

Interactive

Interactive & Batch Compute Cycles

from Hub

Latency/Bandwidth

Medium Site Datacenter

Interactive Compute Servers

Large Memory Compute Servers

Storage & BackupI f t t

Interactive Compute Servers Large Memory

Compute Servers (Interactive)

Interactive

User SystemCCC Systems

Batch Compute Servers

Infrastructure Servers

Storage & Backup

& BackupInfrastructure Servers

Batch cycles from Hub

Interactive

Latency/Bandwidth Small Site

ClosetLarge Site Datacenter (Hub) Infrastructure

Servers

Storage (Backup)

Closet

HPC for Silicon DesignIntel Design Computing Capacity

Silicon Design Compute and Storage Demand vs. Utilization

Growth of Design 2006 2012

EDA-MIPS 75,392 533,554

i C S 62 13 38 92Compute Servers (K)

EDA MPS (10K)

Storage (PB)

Linux Compute Servers 62,137 38,927

Number of Cores 132,282 451,990

Compute BatchUtilization ~58% ~86%Utilization

This is growth specific to Intel silicon design engineering environment and does not include

overall corporate IT demand.

Data Center Compute Dashboard

Site and Facility Configuration

Generators

Office

Module CG

ener

ators

Module D

Module E

Module A

Module B

Office

Circulation Spine

Chilled Water Storage TanksAB

Low Temp Chiller Plant

High-Temp Chiller Plant

Chilled Water Plant

Waterside Economizer

CoolingTower

HeatExchanger

Chiller Condenser

CondenserWater Pump Chiller

Chiller Evaporator

ChilledWater Pump

FromData Center

ToData Center

Water Pump

Chilled Water Plant Economization

1 600 000

1,800,000 

2,000,000 

1,000,000 

1,200,000 

1,400,000 

1,600,000 

‐Hou

rs

400,000 

600,000 

800,000 

, ,

Ton‐

‐

200,000 

7977757371696765636159575553514947454341393735333129272523

Outside Air Wetbulb (Deg F)

Mechanical Cooling Economizer Cooling(6,415,500 Ton-Hours) (14,608,500 Ton-Hours)

Data Center Modules

Recirculation Air Handlers

Cooling Coils & Filtration

Electrical Distribution

Air Pathway to IT space

Hot Aisle Isolation

Hot AisleCold Aisle

Non-Isolated Low Power IT

Airflow Model – White Space>100 Temperature (deg F)

91.25

82.5

Network Racks

73.75

<65

Airflow Model – Utility Level>600 Speed (ft/min)

450

300

150

<0

Temperature & Pressure Control Zones

Cascading Energy Efficiency

Hot aisle containment

Increased supply air temperature

Hi h hill d High temperature chilled water system

Variable speed infrastructure fans

Infrastructure fan output tracks IT airflow demand

Water side economizer

Variable speed chilled water pumps

Variable speed cooling tower fans

Adiabatic humidification

Energy Efficiency - PUE*Operational PUE Range*

1.35 without economizer

1 21 With 100% Free Cooling 5,114 kW

6,217 kW

IT Load

Total Load

Current PUE*

1.21 With 100% Free Cooling* Calculated

5,114 kW

1,103 kW

1 22

IT Load

Facility Load

Current PUEJFS1 1.22

0.812

Current PUE

Current DCIE

1.25

1.50

1.75

2 002.001.00

* April 12, 2013Source: US Energy Information Administration, http://www.eia.gov/consumption/commercial/census-maps.cfm

JFS1 Power Demand Forecast14

10

12

14

8

10

Customer Load Projections

75% of Customer Projections

and (

MW

)

4

6 50% of Customer Projections

PGE Demand Requirements

Actual Load Peak values TOTAL

Dem

a

0

2

-05

-07

-09

-11

Dec

-

Dec

-

Dec

-

Dec

-

Paul VaccaroData Center ArchitectIntel

David Seger, PE, LEED APPrincipal Mechanical TechnologistIDC Architects / CH2M HillIDC Architects / CH2M Hill

503.872.4492

Thank YouThank You