intel server products and technology overvieaug 16, 2005 · make it a leader. intel® server...
TRANSCRIPT
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Enterprise Products and Services Division Know Who’s In Your Server.Make It A Leader. Intel® Server Products.
Intel Server Products and Technology Overview
Travis Brown – Sr. Technical Marketing EngineerMatt Alford – Product Marketing Engineer
SCO Forum 2005Aug 9, 2005
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Know Who’s In Your Server.Make It A Leader. Intel® Server Products.
Agenda2005 Intel Server Product Overview
• UP/DP Pedestal Product Roadmap• UP/DP Rack Product Roadmap• Chassis Product Roadmap
2006 Server Technology Trends• DDR2 -> FBDIMM Transition• SCSI -> SAS Transition
Wrap Up / Q&A
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Know Who’s In Your Server.Make It A Leader. Intel® Server Products.
2005 Server TechnologiesProcessors: 64-bit Intel® Xeon™ processor coresNetworking: TCP Offload (TOE)Storage: SATA, 10K – 15K SCSI, 3.5” drivesEnvironmental: Power management (DBS)Management Technology: Tiered management, OOB toolsMemory: DDR2I/O: PCIe
DDR2 top to bottom, PCIe and flexible management =High performance, Reliable Server Systems
DDR2 top to bottom, PCIe and flexible management =High performance, Reliable Server Systems
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Know Who’s In Your Server.Make It A Leader. Intel® Server Products.
EPSD UP/DP Pedestal Optimized Roadmap
With U320 SCSI AdapterWith U320 SCSI Adapter
With U320 SCSI AdapterWith U320 SCSI Adapter
SE7221BK1-E –DDR2
2-w
ay1-
way
SE7210TP1-E - DDR
SE7520BD2 - DDR
SE7520AF2 – DDR2
SE7520BD2D2 – DDR2
Shipping Q3’05 Q4’05
SE7221BA1-E –DDR2
SE7320EP2 – DDR2
SE7525RP2 – DDR2
SE7230NH1 or SE7230NH1LX - DDR2
Aug’05Aug’05
Committed Schedule
Committed Schedule
IntelPentium ™ 4processor
IntelPentium ™ 4
processor
Intel XeonProcessor
IntelPentium ™ 4
processor
Fully RoHScompliance
RoHSComplianceBy Exemption
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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EPSD UP/DP Rack Optimized Roadmap
Committed Schedule
Committed Schedule
IntelPentium ™ 4processor
IntelPentium ™ 4
processor
Intel XeonProcessor
IntelPentium ™ 4
processor
2U1U
SE7210TP1-E
SE7221BK1-E –DDR2
SE7520JR2 - DDR/DDR2
SE7320VP2 –DDR/DDR2
SE7320VP2 – DDR/DDR2
SE7520JR2 - DDR/DDR2
Shipping Q3’05 Q4’05
SE7230NH1 or SE7230NH1LX DDR2
Aug’05Aug’05
Fully RoHScompliance
RoHSComplianceBy Exemption
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Know Who’s In Your Server.Make It A Leader. Intel® Server Products.
EPSD Chassis Roadmap
SR2400
SR1400 AC
SC5275
2U1U
Shipping
5U
SC5300 (LX, BRP, Base)
SR1350-E (Kahana)
Q3’05 Q4’05
SR1450
SR1325TP1
SR1435VP2
SR1425BK1-ESR1475NH1
SC5295
SR1435VP2D2
SR1475
Aug’05Aug’05
Aug’05Aug’05
Q3’05Q3’05
Committed Schedule
HDRM
Pedestal with rack option
Pedestal only
Fully RoHScompliance
RoHSComplianceBy Exemption
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Know Who’s In Your Server.Make It A Leader. Intel® Server Products.
2006 Server Technology Inflections and Trends
Processors: Dual 64-bit Intel® Xeon™ processor coresNetworking: IO Acceleration / TCP OffloadStorage: SAS transition, Enterprise 2.5” drive transitionEnvironmental: Lead free/ROHS, Power supply efficiency,Power management (DBS), Low power processorsManagement Technology: BMC integration, ASMI, VirtualizationMemory: New FB DIMMs, higher capacity boards, more granularityI/O: More PCIe
Look for major platform performance increases coming in 2006!Look for major platform performance increases coming in 2006!
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Why move to FBDIMM?
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Know Who’s In Your Server.Make It A Leader. Intel® Server Products.
The ProblemMemory hungry apps driving memory bus data rates and DRAM bit densities up
“Stub-bus” architecture causing signal and data integrity concerns at higher data rates driving down number of devices per channel MemCtrl
DR
AM
DR
AM
DR
AM
DR
AM
Stub-bus Topology
ImpedanceDiscontinuities
048
121620242832
99 00 01 02 03 04 05 06 07
Stub-bus Capacity/Ch: GB
Computed trend - Source: Pete Vogt
Gap is growing
Demand
Supply
0
500
1000
1500
2000
2500
99 00 01 02 03 04 05 06 07
DRAM Bit Density; Mb/dev
Result: Server memory capacity has hit a ceiling
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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The Solution: FB DIMM
MemCtrl
DR
AM
Buffer
DR
AM
Buffer
DR
AM
Buffer
DR
AM
Buffer
Point-to-Point Links
FB-DIMM buffers the DRAM data pins from the channel and uses point-to-point links to eliminate the stub bus
FB-DIMM capacity scales throughout DDR2 & DDR3 generations
0
5
10
15
20
25
30
35
99 00 01 02 03 04 05 06 07
FB-DIMM Capacity/Ch: GBFB-DIMM
FB-DIMM Capability - Source: Pete Vogt
FB-DIMM eliminates the “Stubs” & Meets the Capacity DemandFB-DIMM eliminates the “Stubs” & Meets the Capacity Demand
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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FB-DIMM Solution Details
Up to 8DIMMs**
• • •Memory
Controller
AMB
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
AMB
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
AMB
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
Serial signaling similar to
PCI-Express
DDR2 connector with unique key
SMBus
AMB
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
DRAM
CommodityDRAMs
** FBD spec supports up to 8 DIMMs per channel, however initial Intel chipsets will only address 4 DIMMs.
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Routing Comparison
Direct DDR2 Registered DIMMs: 1 Channel, 2 Routing Layers with 3rd layer required for power
FB-DIMM: Fewer Layers, Less Routing AreaSource: Intel Enterprise Architecture Group
Serpentine routing is
complicated and uses up
a lot of board area
FB-DIMMs:2 Channels, 2 Routing Layers (includes power delivery)
Fewer signals and
no trace length
matching minimizes board area
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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DDR2 vs. FBD Config Comparison
4x capacity8GB vs. 32GB
~2.5x throughput~6.5GB/s vs. ~16.5GB/s
Lower pin count~480 vs. ~280
FB-DIMM Provides 4x the Capacity in standard configuration
DDR2Memory
Controller
DIM
MD
IMM
FB-DIMMMemory
Controller
DIM
MD
IMM
DIM
MD
IMM
DIM
MD
IMM
8GB with 1Gb x4 DRAMs~6.5GB/s of throughput w/DDR2-800
(only 2 ranks per channel)
32GB with 1Gb x4 DRAMs~16.5GB/s of throughput w/DDR2-800
(2 ranks per DIMM)
DIM
MD
IMM
DIM
MD
IMM
DIM
MD
IMM
DIM
MD
IMM
4 DIMMs per channel doesn’t work
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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0 2 4 6 8 10 12 14 16 18
Sustained Memory Subsystem Throughput (GB/s)
Ave
rage
Mem
ory
Rea
d La
tenc
y
2 DDR2 800 channels, 2 ranks per channel
4 FB-DIMM 800 channels, 2 dual rank DIMMs per channel
Source: Intel
DDR2 vs. FBD Config Comparison
Slightly larger delay for the additional buffer
FB-DIMM provides very high sustained throughput due to simultaneous reads/writes
FB-DIMM has consistent latency across a wide throughput range
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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What to expect in the SCSI to SAS transition
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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The ProblemParallel architecture can no longer reliably keep up with data rate increases.Cost of deploying multiple HBAs to support SCSI 16 device limitRising need for flexible solution to support either Online or Nearline storage
Current Parallel SCSI architecture has hit a ceilingCurrent Parallel SCSI architecture has hit a ceiling
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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The Solution: Serial Attached SCSI
SAS is the next generation of SCSISame SCSI protocol for data transferSerial instead of Parallel interconnect• Same cabling/connectors/physical interface as SATA
Point to point architecture• Unlike shared bus of SCSI (15 drives maximum per channel)• Ports can be linked together – ‘Wide’ ports for larger throughput to Expanders• 300MB/s per port initially, moving to 600MB/s and more in future
SATA Tunneling Protocol provides compatibility with SATA devices• Allows lower cost drives/devices to be used in the SAS environment
Expanders provide greater performance and flexibility
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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SAS vs. SCSI
Benefits of SASTransparent application migration from SCSI->SASReliability is equivalent using SAS or SCSI drivesSATA drives can be used in SAS environmentSAS drives are dual ported, providing full redundancy to drives, if desired
Transition to SAS from SCSISAS industry launching Q1’05, and will be widely available by ’06EPSD is a technology leader, and SAS is the next technologySCSI will continue to exist as commodity for several years - ~2010
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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SAS vs. SATA
Benefits of SASSAS architecture supports enterprise environments by design
• Protocol supports larger drive configurations• SAS drives are designed for higher performance and reliability (MTBF)• SAS drives are dual ported, providing full redundancy to drives
Benefits of SATASATA integrated into current and future generation chipsetsSATA technology has 1.5year head start on SAS
• SATA is now stable, and infrastructure is established• Low risk of unexpected technology or interoperability issues
SW and HW RAID greatly reduces reliability gap
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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SAS Architecture
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Expander Overview
Expanders allow access to multiple targetsNon-blocking switch architecture – basically a simple FC switchAllows any number of incoming SAS controller ports to connect to a large number of SAS or SATA targetsAggregate throughput from multiple targets
• Provides the functionality to fully utilize the available bandwidth/IOPS of the connection
Two types of Expanders: Edge and Fan-OutEdge: Direct and Subtractive Routing only
• Supports direct devices and ONE other Expander connected (subtractive)• Primary inside the box need
Fan-Out: Direct, Subtractive, and Table Routing• Supports direct devices and up to 128 other Expanders (routing to the necessary
connected Expander via the internal routing table)• Tables can be smaller than max of 128 – this is the common implementation today• Primarily large port count/external box usage
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Maximizing Connectivity
Fanout Expander
Edge Expander
Fanout Expander
Edge ExpanderEdge Expander
Edge
Exp
ande
r Ed ge Ex pande rEdge Expander
Maximum Configuration
1 Fanout Expander
128 Edge Expanders
16,384 SAS Devices
Single Hosts Shown
Source: Seagate Technologies
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Using a “Wide” Connection
Wide connection = 2 or more single connections
Provides high bandwidth path for Host
Cannot stripe data on a wide link
Edge Expander
R
1200MB/sec connection. (Not a striped connection.)
300MB/sec connection
Source: Seagate Technologies
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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SAS vs. SATA connectors
Diagram courtesy of HPwww.scsita.org/aboutscsi/ sas/tutorials/SAS_Physical_layer.pdf
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Expanders Extend SAS & SATA Topology
SATA DrivesSAS Drives
SSP
SSP
STP
SATA
Conversion
Serial SCSI ProtocolSerial Tunneling Protocol
SATA and SAS Drives can be
freely mixed in any configuration
Source: Seagate Technologies
R
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Usage Model - Direct Connect
8-port SAScontroller
SFF 848432-pin
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
0 1 2 3
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
SFF 848432-pin
4 5
SFF 848432-pin
SFF 848432-pin
- Throughput and IOPS are Drive limited
- Simple, low cost implementation
6 7
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Usage Model – w/Expanders
4-port SASController
SAS7-pin
SAS7-pin
SAS7-pin
SAS7-pin
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
SAS29-pin
Additional 4-drive bay accessory
Expander
- Much more efficient than Direct Attach model
- Slightly higher cost, but major performance improvement
Expander
- Provides capability to connect to many more drives, including external attach (if desired)
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Wrap-UpIntel’s 2005 server product line up provides a solution for all your customer needs.FBDIMM technology solves the server memory capacity problem created by the stub-bus architecture of today and allows for a high speed server memory architecture for next generation products.SAS is the next generation SCSI solution for servers requiring high capacity and performance disk subsystems in 2006 and beyond.
Watch for these technologies in 2006 Intel server products!Watch for these technologies in 2006 Intel server products!
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Thank You!
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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For More information on the products mentioned in this presentation visit:
http://developer.intel.com/products/server/motherbd
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Backup
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*Third-party marks and brands are the property of their respective owners; Xeon™, Itanium®and Pentium® are trademarks of Intel Corporation. All products, dates, and figures are preliminary and subject to change without any notice. Copyright © Intel Corporation 2005.
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Enclosure ManagementEnclosure management in configurations where one SAS port is mapped to one hard drive.
SGPIO– Fault, rebuild & locate indication– Does not provide drive event notification to BMC– Limited ability to add new features
SAF-TE & SES2– Fault, rebuild & locate indication– Provides drive event notification to BMC– Able to implement new features
Enclosure management in configurations with expandersSES2
– Fault, rebuild & locate indication– Provides drive event notification to BMC– Able to implement new features