introduction to okins electronics

We are connecting to the future !

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Introduction toIntroduction toIntroduction toIntroduction to

OKins ElectronicsOKins ElectronicsOKins ElectronicsOKins Electronics

Introduction toIntroduction toIntroduction toIntroduction toIntroduction toIntroduction toIntroduction toIntroduction to

OKins ElectronicsOKins ElectronicsOKins ElectronicsOKins ElectronicsOKins ElectronicsOKins ElectronicsOKins ElectronicsOKins Electronics

Excellence in Interconnection SysteminsOKins Electronics Co., LTD.

Contents

� Corporate Profile

� OKins Business Introduction

� BiTS Technologies & Engineering

� BiTS Products Details


Company Profile

Company Name OKins Electronics CO., LTD.

CEO/President Jin-Kook Jun

Founded on Apr.13 1998

Employee 85 (as of Apr.2007)

Address HQ 6F Byucksan Sunyoung Technopia, 196-5,

Ojeon-dong, Uiwang-si, Gyunggi-do, Korea

R&D Samjon-ri 19, Songsan-myeon, Hwasung-si,

Gyunggi-do, Korea

Web site www.okins.co.kr

Contact (T)82.31.460.3500 (F)82.31.460.3555


Mold & StampMold & Stamp

BUBU

SemiconductorSemiconductor

BUBU

Connector BUConnector BU

BiTSBiTS BUBU(Burn(Burn--In & Test Socket)In & Test Socket)

* BU : Business Unit

Business Portfolio

Display BUDisplay BU


Organization

EngineeringEngineering

CEOCEO

Burn-in socketBurn-in socket

General AffairGeneral Affair

Test SocketTest Socket

PurchasingPurchasing

FinanceFinance

Spring probesSpring probes

Prod Eng’ringProd Eng’ring

Team IITeam II

Team ITeam I

ProductionProduction

SalesSales

Test SocketTest Socket

Burn-in SocketBurn-in Socket

BiTS BUBiTS BU Semicon BUSemicon BU


SalesSales

SalesSales

DevelopmentDevelopment

AdministrationAdministration

QCQC

QAQA

Connector BUConnector BU

COKCOK


Overseas BUOverseas BU


Display BUDisplay BU



MarketingMarketing

Stamping R&DStamping R&D


� Customer is always right; Customer provides the definition of quality. Quality

should be judged by customer not by ourselves, and we accept the judge by

customer.

� Our quality defines not only products, but also our services; Customer assess

the quality of our services as well as the quality of our products, when it comes

to total customer satisfaction. Our services will delight our customers beyond

expectation.

� The quality management system focus on prevention; It is too late when we

detect a defect, eliminating the cause of a defect is our principle in quality

management. Every possible means shall be implemented in order to prevent

any potential defect.

“OKins Quality principle is to deliver our customers never-content satisfaction

through continuous improvement with innovative quality products”

Our commitment to quality control system enforces not only to simply win market

share, but to offer the best quality. We believe the dedication to the OKins quality

management gives us the recognition worldwide.

Quality Principles


Hsinchu, Taiwan

Yokohama, Japan

Phoenix, USA

Singapore

Suzhou, China

UK, Europe

OKins, Korea

Manila, Philippines

OKins Network


· New Intelligence Co., LTD.

· Tsu Yu Building

5F-2 NO.67 Tsu Yu Road

Hsin Chu, Taiwan, R.O.C.

· Contact : Amy Wu

· TEL : 886-3-534-6339

· FAX : 886-3-534-6337

· [email protected]

· Antares-ATT K.K.

· 6F Paleana Building

2-2-15 Shin Yokohama,

Japan, 222-0033

· Contact : Masao Inagaki

· TEL : 81-45-473-9881

· FAX : 81-45-473-9884


· Antares Advanced Test Technologies

· 2102 W.Quail Avenue, Suite 2

Phoenix, AZ 85027

· Contact : Mark Murdza

· TEL : 1-623-581-5330

· TF : 1-800-348-2505 EXT.49

· FAX : 1-623-780-3987


Taiwan

Japan

U.S.A


· The Siemens Center, 60 Macpherson Rd,

Blk 1, # 07-09A, Singapore 348615

· Contact : CK Wee

· TEL : 65-6391-5310

· FAX : 65-6292-2661



· Burlington House369, Wellingborough RoadNorthampton NN24EU, England

· Contact : Trevor Beard

· TEL : 44-1604-638642

· FAX : 44-1604-621240


Singapore

China

Europe

· OKins China Suzhou Office

· 610,Blkb1A, Singa Plaza, No.8, Jinji Hu Road,

Suzhou Industrial Park, PRC. 215021

· Contact : Su Jin Jeong

· TEL : 86.512.6763.4380

· FAX : 86.512.6763.4381


OKins Network


Burn-in Socket

Test Socketfor Memory

Test Socketfor Non-Memory

Spring Probes

COK

Heat Sink

TSOP, BGA, CSP, PLCC, etc

Heat sinks for memory module

Change Over Kit for final package test

Customized design; single & dual ended

Logic, ASIC, RF, Wireless, CCM, etcATE handler, Manual operation

Spring probes (pogo), stamped contactTSOP, QFP, BGA, CSP, etc

BiTS (Burn-in & Test Socket) BU


Products � I/O connectors (cell phone)

� 2pin battery connectors (cell phone)

� Joggle switch (MP3)

� 18pin plug (cell phone charger)

� I/O connectors (cell phone)

� 2pin battery connectors (cell phone)

� Joggle switch (MP3)

� 18pin plug (cell phone charger)

Connector BU


Mold & Stamp BU

Business SubjectBusiness SubjectBusiness Subject

� Research & Development for

- Stamping technology: BeCu, etc

- Molding technology: fine pitch, low cost, etc

- Material research

� Production Support for

- Socket contact: burn-in socket, test socket

- Connector contact

- Memory module heat sink

- Socket molds: burn-in socket, test socket


Service Area EDS (Electric Die Sorting)Package Test

Devices ASIC, Digital, Analog,Sensors, Mixed Signal, etc

Testers Advantest T3324Teradyne A360Eagle ETS-200FSTLA III (TAOS)Teradyne Flex (in plan)

Prober EG4080/4090P-8XL, 80W

Semiconductor BU (Test House)

Handler TAOS(YYE)


Strengths

� Comprehensive understanding of the test interface mechanism

: Various product line – test socket, burn-in socket, device carrier,

component parts, etc

� Flexible design proposal: compatible with market existing designs,

ATE, handlers, boards, etc

� Price and lead time competitiveness over high volume demand

� User friendly designed products that enables to minimize

maintenance time and cost

� Intimate relation with customers in many aspects known as the

best in the market

� Comprehensive understanding of the test interface mechanism

: Various product line – test socket, burn-in socket, device carrier,

component parts, etc

� Flexible design proposal: compatible with market existing designs,

ATE, handlers, boards, etc

� Price and lead time competitiveness over high volume demand

� User friendly designed products that enables to minimize

maintenance time and cost

� Intimate relation with customers in many aspects known as the

best in the market


Customers

Customer ProductsCustomer Products

Samsung BI socket, Test socket, Carrier & kit

Hynix BI socket, Test socket, Carrier

Infineon BI socket (OEM)

Spansion BI socket (OEM), Carrier

Intel BI socket (OEM)

Amkor Test socket, Spring probes

Board houses BI socket, Test socket

Samsung BI socket, Test socket, Carrier & kit

Hynix BI socket, Test socket, Carrier

Infineon BI socket (OEM)

Spansion BI socket (OEM), Carrier

Intel BI socket (OEM)

Amkor Test socket, Spring probes

Board houses BI socket, Test socket


� Mechanical Engineering capable of mechanical design

- burn-in sockettest socket for memory & logic products- specific commercial connectors- other mechanical parts

� Electrical Engineering capable of electrical modeling and simulation- mechanical performance prediction

� Spring probes engineering for next generation devices- high speed- low inductance- high current- low cost

� Molding & Stamping capabilities for micro pitch products

� Micro machining technology- research team for MEMS and LIGA development

� Alternative contact development for test socket- low cost- high speed (RF, wireless, etc)- high performance in yield

� World wide research resources for new materials

� Mechanical Engineering capable of mechanical design

- burn-in sockettest socket for memory & logic products- specific commercial connectors- other mechanical parts

� Electrical Engineering capable of electrical modeling and simulation- mechanical performance prediction

� Spring probes engineering for next generation devices- high speed- low inductance- high current- low cost

� Molding & Stamping capabilities for micro pitch products

� Micro machining technology- research team for MEMS and LIGA development

� Alternative contact development for test socket- low cost- high speed (RF, wireless, etc)- high performance in yield

� World wide research resources for new materials

Engineering


� Mechanical Engineering

13 engineers capable of mechanical design

burn-in socket

memory test socket & kit

logic test socket

spring probe

connector

� Electrical Engineering

1 engineer capable of electrical modeling

electrical engineering Lab at a college

: modeling, simulation

� Mechanical Engineering

13 engineers capable of mechanical design

burn-in socket

memory test socket & kit

logic test socket

spring probe

connector

� Electrical Engineering

1 engineer capable of electrical modeling

electrical engineering Lab at a college

: modeling, simulation

Socket Engineering


Burn-in Socket

� Various CSP socket outlines for users’ flexible BI board design

� Competitive price offer with fast lead time on high volume

production requirements

� Three different contact force contacts available upon package

balls composition: Eutectic and Pb-free

� Anti-sticking mechanism: Slider moves during cover press down

which prevents from ball sticking

� Abundant field experience & FA capability with working world

largest burn-in houses

� Burn-in Board supply could be possible upon request.

� Various CSP socket outlines for users’ flexible BI board design

� Competitive price offer with fast lead time on high volume

production requirements

� Three different contact force contacts available upon package

balls composition: Eutectic and Pb-free

� Anti-sticking mechanism: Slider moves during cover press down

which prevents from ball sticking

� Abundant field experience & FA capability with working world

largest burn-in houses

� Burn-in Board supply could be possible upon request.


Current Capabilities Development Plans

TSOP 0.80/0.65/0.50mm Requirements driven

Sn/Pb, Pb-free Pb-free enforced

BGA/CSP 1.27/1.0x0.8/0.80/0.65/0.5mm below 0.5mm

Pinch Alternative contacts


LGA - 0.5/0.65/0.8mm

QFN 1.0/0.5mm 0.4/0.65mm pitch

Low cost

CLCC 1.0mm Requirements driven

Current Capabilities Development Plans

TSOP 0.80/0.65/0.50mm Requirements driven


BGA/CSP 1.27/1.0x0.8/0.80/0.65/0.5mm below 0.5mm

Pinch Alternative contacts


LGA - 0.5/0.65/0.8mm

QFN 1.0/0.5mm 0.4/0.65mm pitch

Low cost

CLCC 1.0mm Requirements driven

Burn-in Socket Plans


Test Socket

� Excellent Contact Solutions with high performance spring probes

technology designed by OKins

� Price Advantages coming along with wide selection of open tools for

socket housing

� Existing ATE handlers compatible design: Advantest, Ando, Mirae,

Techwing, STH, etc

� Device carrier can be proposed at the time of test socket design:

OKins unique design proposal

� Fastest Lead Time on high volume production requirement

� Flexible Design for low & high volume

� Electrically and mechanically proven performance of single-ended

spring probe (barrel plunger)

� Excellent Contact Solutions with high performance spring probes

technology designed by OKins

� Price Advantages coming along with wide selection of open tools for

socket housing

� Existing ATE handlers compatible design: Advantest, Ando, Mirae,

Techwing, STH, etc

� Device carrier can be proposed at the time of test socket design:

OKins unique design proposal

� Fastest Lead Time on high volume production requirement

� Flexible Design for low & high volume

� Electrically and mechanically proven performance of single-ended

spring probe (barrel plunger)


Category Speed Pitch Addition

Spring probes ~ 1.5GHz 0.5mm low cost for memory test

Spring probes 3.0GHz ~ 0.5mm RF test

Stamping ~ 800MHz 0.4mm low cost for memory test

Stamping - 0.2mm fine pitch

Elastomer 1.5GHz ~ 0.5mm low cost

Alternative - 50u ~ MEMS

Category Speed Pitch Addition

Spring probes ~ 1.5GHz 0.5mm low cost for memory test

Spring probes 3.0GHz ~ 0.5mm RF test

Stamping ~ 800MHz 0.4mm low cost for memory test

Stamping - 0.2mm fine pitch

Elastomer 1.5GHz ~ 0.5mm low cost

Alternative - 50u ~ MEMS

Test Socket Plans


� Design and Field Experiences obtained during high volume production

supply to largest memory IC makers.

� Various design options available for high performances: yield, life time,

electrical performance, etc.

� Thorough understanding of single-ended (barrel plunger) design

enables the users to get better performances.

� Research and development for best material selection & plate option

have been running in order to increase pin performance.

� Design and Field Experiences obtained during high volume production

supply to largest memory IC makers.

� Various design options available for high performances: yield, life time,

electrical performance, etc.

� Thorough understanding of single-ended (barrel plunger) design

enables the users to get better performances.

� Research and development for best material selection & plate option

have been running in order to increase pin performance.

Spring Probes


� Design Pro-E

IBM CADCAM

� Reliability Test socket multi tester

Milli-ohm meter

Mega ohm meter

Smart measuring scope

Load cell meter

Linear gauge

Hot temp. chamber

Durability tester

Withstanding voltage tester

X-ray inspector

High/low power microscope

3D level microscope (NEXIV)

SEM (scanning electron microscope)

Laser fusing equipment

�� DesignDesign ProPro--EE

IBM CADCAMIBM CADCAM

�� ReliabilityReliability Test socket multi testerTest socket multi tester

MilliMilli--ohm meter ohm meter

Mega ohm meterMega ohm meter

Smart measuring scopeSmart measuring scope

Load cell meterLoad cell meter

Linear gaugeLinear gauge

Hot temp. chamberHot temp. chamber

Durability testerDurability tester

Withstanding voltage testerWithstanding voltage tester

XX--ray inspectorray inspector

High/low power microscopeHigh/low power microscope

3D level microscope (NEXIV)3D level microscope (NEXIV)

SEM (scanning electron microscope)SEM (scanning electron microscope)

Laser fusing equipmentLaser fusing equipment

Capabilities


- Automatic pin insertion machine ; burn-in

- Manual assembly machine ; burn-in

- Laser marking machine ; test

- NC machine ; machining

- Spring probe assembly machine ; pogo pin

- Automatic pin insertion machine ; burn-in

- Manual assembly machine ; burn-in

- Laser marking machine ; test

- NC machine ; machining

- Spring probe assembly machine ; pogo pin

- Mold tool 3 suppliers Test, Burn-in, Carrier

- Molder 3 suppliers Test, Burn-in, Carrier

- Stamper 3 suppliers Test, Burn-in

- Machining 2 suppliers Test, COK

- Assembly in-house & Test, Burn-in, Carrier

3 suppliers

- Probe pin 3 suppliers Test

- Mold tool 3 suppliers Test, Burn-in, Carrier

- Molder 3 suppliers Test, Burn-in, Carrier

- Stamper 3 suppliers Test, Burn-in

- Machining 2 suppliers Test, COK

- Assembly in-house & Test, Burn-in, Carrier

3 suppliers

- Probe pin 3 suppliers Test

Manufacturing EquipmentsManufacturing EquipmentsManufacturing Equipments

Capabilities

Manufacturing Outsource CapabilitiesManufacturing Outsource CapabilitiesManufacturing Outsource Capabilities


Burn-in Test Socket

# Burn# Burn--in Test Socketin Test Socket TSOP 0.5mm pitch 48, 54LD 300mils

0.65mm pitch 86LD 400mils

0.8mm pitch 54, 66LD 400mils

BGA 1.27mm pitch 33.2x28.4mm

0.8x1.0mm pitch 18x26mm

0.8mm pitch 20x20, 22x26, 22x28mm

0.65mm pitch 26x26mm

0.50mm pitch 19.5x26mm

Design Feature ;

♦ Compact design for high density on PC Board

♦ Various contact forces upon package balls

♦ Alternative socket lead length

♦ Long operation cycles over 30K times

♦ Zero insertion force for loading

♦ Competitive development cost

♦ Stable contactability for Lead-free balls

Products


# Test Socket# Test Socket TSOP-I 28/32/48 pin

TSOP-II 32/44/50/54/66/86 pin 400mils IC packages

QFP 100TQFP & 100PQFP

Design Feature ;


♦ Various contact designs available

♦ Operation cycles over 30K times


♦ Designed for auto test handler use

Test Socket with stamped contactsProducts


# Test Socket# Test Socket TSOP-II 0.65, 0.8, 0.5mm pitch

TQFP 0.65mm pitch

BGA 0.5, 0.65, 0.8mm pitch (ball matrix upon customers’ inquiry)

Design Feature ;

♦ Compatible design for currently available handlers

♦ Use various spring probe pins for contact


♦ Operation cycles over 100K times

♦ Both machining & molding available for housing

♦ Designed for tin flake and contact contamination

♦ Self-Cleaning by device contact


♦ Designed for high frequency device

♦ Excellent design for Current flow & Cold test

Test Socket with pogo for memory ATEProducts


# Logic Test Socket# Logic Test Socket BGA All ball counts and matrix (over 1,000 pin)

CSP All ball counts and matrix (Min 0.4mm pitch)

QFP/TQFP/TSOP All ball counts and matrix

QFN/MLF All package types available

Design Feature ;

♦ High reliability, high speed and low profile design

♦ Standard design for ATE handler

♦ Long operation cycles over 100K times

♦ Designed for tin flake and contact contamination

♦ Specific & customized design for low cost

♦ Industry standard footprint

♦ Easy operation by manual use

Test Socket for Logic DevicesProducts


# Spring Probe Pin# Spring Probe Pin Pitch 0.4~1.27mm pitch

Length Min 1.9mm and longer

Frequency Max 15GHz

Specification Design available for customers’ device specifications

Design Feature ;

♦ Diverse design features available

♦ Double-ended Plunger & Barrel Plunger

♦ Long operation cycles over 300K Times

♦ Excellent design for Current flow & Cold test

♦ Designed for Tin flake prevention

♦ Self-cleaning by solder ball Contact

♦ Stable contactability at Lead-free balls

Spring ProbesProducts


# Change Over Kit Compatible for various handlers design

Advantest, Ando, Mirae, TWE, STH, Hitachi, etc.

Design Feature ;

♦ Compatible with current ATE handlers

♦ Offer the optimized test condition

♦ Specifically designed for specific handlers

♦ Fast lead time for new development


# Change Over Kit Preciser, Test tray with insert, Match plate, Buffer rail, Pitch converter, Vacuum head, Updown stopper, etc.

COK (Change Over Kit)Products


# Device Carriers Compatible for various testers design

- TSOP-I

- TSOP-II

- T/MQFP

- BGA/uBGA/FBGA & etc.

Device Carriers (Insert)

Design Feature ;

♦ Compact design for high density on tray

♦ Improved design from original concept

♦ Package self-alignment by free loading


Products


We hope to achieve great success and create

a new accomplishment together with the

valuable partners.

introduction to okins electronics

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