irfz44n

IRFZ44NHEXFET® Power MOSFET

01/03/01

Parameter Typ. Max. UnitsRθJC Junction-to-Case ––– 1.5RθCS Case-to-Sink, Flat, Greased Surface 0.50 ––– °C/WRθJA Junction-to-Ambient ––– 62

Thermal Resistance

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VDSS = 55V

RDS(on) = 17.5mΩ

ID = 49AS

D

G

TO-220AB

Advanced HEXFET® Power MOSFETs from InternationalRectifier utilize advanced processing techniques to achieveextremely low on-resistance per silicon area. This benefit,combined with the fast switching speed and ruggedizeddevice design that HEXFET power MOSFETs are wellknown for, provides the designer with an extremely efficientand reliable device for use in a wide variety of applications.

The TO-220 package is universally preferred for allcommercial-industrial applications at power dissipationlevels to approximately 50 watts. The low thermalresistance and low package cost of the TO-220 contributeto its wide acceptance throughout the industry.

l Advanced Process Technologyl Ultra Low On-Resistancel Dynamic dv/dt Ratingl 175°C Operating Temperaturel Fast Switchingl Fully Avalanche Rated

Description

PD - 94053

Absolute Maximum RatingsParameter Max. Units

ID @ TC = 25°C Continuous Drain Current, VGS @ 10V 49ID @ TC = 100°C Continuous Drain Current, VGS @ 10V 35 AIDM Pulsed Drain Current 160PD @TC = 25°C Power Dissipation 94 W

Linear Derating Factor 0.63 W/°CVGS Gate-to-Source Voltage ± 20 VIAR Avalanche Current 25 AEAR Repetitive Avalanche Energy 9.4 mJdv/dt Peak Diode Recovery dv/dt 5.0 V/nsTJ Operating Junction and -55 to + 175TSTG Storage Temperature Range

Soldering Temperature, for 10 seconds 300 (1.6mm from case )°C

Mounting torque, 6-32 or M3 srew 10 lbf•in (1.1N•m)

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S

D

G

Parameter Min. Typ. Max. Units ConditionsIS Continuous Source Current MOSFET symbol

(Body Diode)––– –––

showing theISM Pulsed Source Current integral reverse

(Body Diode)––– –––

p-n junction diode.VSD Diode Forward Voltage ––– ––– 1.3 V TJ = 25°C, IS = 25A, VGS = 0V trr Reverse Recovery Time ––– 63 95 ns TJ = 25°C, IF = 25AQrr Reverse Recovery Charge ––– 170 260 nC di/dt = 100A/µs ton Forward Turn-On Time Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)

Source-Drain Ratings and Characteristics

49

160

A

Starting TJ = 25°C, L = 0.48mH RG = 25Ω, IAS = 25A. (See Figure 12)

Repetitive rating; pulse width limited by max. junction temperature. (See fig. 11)

Notes:

ISD ≤ 25A, di/dt ≤ 230A/µs, VDD ≤ V(BR)DSS, TJ ≤ 175°C

Pulse width ≤ 400µs; duty cycle ≤ 2%. This is a typical value at device destruction and represents operation outside rated limits. This is a calculated value limited to TJ = 175°C .

Parameter Min. Typ. Max. Units ConditionsV(BR)DSS Drain-to-Source Breakdown Voltage 55 ––– ––– V VGS = 0V, ID = 250µA∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient ––– 0.058 ––– V/°C Reference to 25°C, ID = 1mARDS(on) Static Drain-to-Source On-Resistance ––– ––– 17.5 mΩ VGS = 10V, ID = 25A VGS(th) Gate Threshold Voltage 2.0 ––– 4.0 V VDS = VGS, ID = 250µAgfs Forward Transconductance 19 ––– ––– S VDS = 25V, ID = 25A

––– ––– 25µA

VDS = 55V, VGS = 0V––– ––– 250 VDS = 44V, VGS = 0V, TJ = 150°C

Gate-to-Source Forward Leakage ––– ––– 100 VGS = 20VGate-to-Source Reverse Leakage ––– ––– -100

nAVGS = -20V

Qg Total Gate Charge ––– ––– 63 ID = 25AQgs Gate-to-Source Charge ––– ––– 14 nC VDS = 44VQgd Gate-to-Drain ("Miller") Charge ––– ––– 23 VGS = 10V, See Fig. 6 and 13td(on) Turn-On Delay Time ––– 12 ––– VDD = 28Vtr Rise Time ––– 60 ––– ID = 25Atd(off) Turn-Off Delay Time ––– 44 ––– RG = 12Ωtf Fall Time ––– 45 ––– VGS = 10V, See Fig. 10

Between lead,––– –––

6mm (0.25in.)from packageand center of die contact

Ciss Input Capacitance ––– 1470 ––– VGS = 0VCoss Output Capacitance ––– 360 ––– VDS = 25VCrss Reverse Transfer Capacitance ––– 88 ––– pF ƒ = 1.0MHz, See Fig. 5EAS Single Pulse Avalanche Energy ––– 530 150 mJ IAS = 25A, L = 0.47mH

nH

Electrical Characteristics @ T J = 25°C (unless otherwise specified)

LD Internal Drain Inductance

LS Internal Source Inductance ––– –––S

D

G

IGSS

ns

4.5

7.5

IDSS Drain-to-Source Leakage Current

IRFZ44N

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Fig 4. Normalized On-ResistanceVs. Temperature

Fig 2. Typical Output CharacteristicsFig 1. Typical Output Characteristics

Fig 3. Typical Transfer Characteristics

1

10

100

1000

0.1 1 10 100

20µs PULSE WIDTHT = 25 CJ °

TOP

BOTTOM

VGS15V10V8.0V7.0V6.0V5.5V5.0V4.5V

V , Drain-to-Source Voltage (V)

I ,

Dra

in-t

o-S

ourc

e C

urre

nt (

A)

DS

D

4.5V

1

10

100

1000

0.1 1 10 100

20µs PULSE WIDTHT = 175 CJ °

TOP

BOTTOM

VGS15V10V8.0V7.0V6.0V5.5V5.0V4.5V


I ,

Dra

in-t

o-S

ourc

e C

urre

nt (

A)

DS

D

4.5V

1

10

100

1000

4 5 6 7 8 9 10 11

V = 25V20µs PULSE WIDTH

DS

V , Gate-to-Source Voltage (V)

I ,

Dra

in-t

o-S

ourc

e C

urre

nt (

A)

GS

D

T = 25 CJ °

T = 175 CJ °

-60 -40 -20 0 20 40 60 80 100 120 140 160 1800.0

0.5

1.0

1.5

2.0

2.5

T , Junction Temperature ( C)

R

, D

rain

-to-

Sou

rce

On

Res

ista

nce

(Nor

mal

ized

)

J

DS

(on)

°

V =

I =

GS

D

10V

49A

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Fig 8. Maximum Safe Operating Area

Fig 6. Typical Gate Charge Vs.Gate-to-Source Voltage

Fig 5. Typical Capacitance Vs.Drain-to-Source Voltage

Fig 7. Typical Source-Drain DiodeForward Voltage

1 10 1000

500

1000

1500

2000

2500


C, C

apac

itanc

e (p

F)

DS

VCCC

====

0V,CCC

f = 1MHz+ C

+ C

C SHORTEDGSiss gs gd , dsrss gdoss ds gd

Ciss

Coss

Crss

0 10 20 30 40 50 60 700

4

8

12

16

20

Q , Total Gate Charge (nC)

V

, G

ate-

to-S

ourc

e V

olta

ge (

V)

G

GS

I =D 25A

V = 11VDS

V = 27VDS

V = 44VDS

0.1

1

10

100

1000

0.0 0.6 1.2 1.8 2.4

V ,Source-to-Drain Voltage (V)

I

, Rev

erse

Dra

in C

urre

nt (

A)

SD

SD

V = 0 V GS

T = 25 CJ °

T = 175 CJ °

1 10 100

VDS , Drain-toSource Voltage (V)

0.1

1

10

100

1000

I D,

Dra

in-t

o-S

ourc

e C

urre

nt (

A)

Tc = 25°CTj = 175°CSingle Pulse

1msec

10msec

OPERATION IN THIS AREA LIMITED BY R DS(on)

100µsec

IRFZ44N

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Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case

Fig 9. Maximum Drain Current Vs.Case Temperature

25 50 75 100 125 150 1750

10

20

30

40

50

T , Case Temperature ( C)

I ,

Dra

in C

urre

nt (

A)

°C

D

VDS

90%

10%VGS

td(on) tr td(off) tf

VDS

Pulse Width ≤ 1 µsDuty Factor ≤ 0.1 %

RD

VGS

RG

D.U.T.

VGS

+-VDD

Fig 10a. Switching Time Test Circuit

Fig 10b. Switching Time Waveforms

0.01

0.1

1

10

0.00001 0.0001 0.001 0.01 0.1

Notes:1. Duty factor D = t / t2. Peak T =P x Z + T

1 2

J DM thJC C

P

t

t

DM

1

2

t , Rectangular Pulse Duration (sec)

The

rmal

Res

pons

e(Z

)

1

thJC

0.010.02

0.05

0.10

0.20

D = 0.50

SINGLE PULSE(THERMAL RESPONSE)

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QG

QGS QGD

VG

Charge

D.U.T.VDS

IDIG

3mA

VGS

.3µF

50KΩ

.2µF12V

Current RegulatorSame Type as D.U.T.

Current Sampling Resistors

+

-VGS

Fig 13b. Gate Charge Test CircuitFig 13a. Basic Gate Charge Waveform

Fig 12b. Unclamped Inductive Waveforms

Fig 12a. Unclamped Inductive Test Circuit

tp

V (BR )D SS

IAS

Fig 12c. Maximum Avalanche EnergyVs. Drain Current

R G

IA S

0 .01Ωtp

D .U .T

LVD S

+- VD D

D R IV E R

A

1 5V

20V

25 50 75 100 125 150 1750

60

120

180

240

300

Starting T , Junction Temperature ( C)

E

, S

ingl

e P

ulse

Ava

lanc

he E

nerg

y (m

J)

J

AS

°

IDTOP

BOTTOM

10A 18A 25A

IRFZ44N

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Peak Diode Recovery dv/dt Test Circuit

P.W.Period

di/dt

Diode Recoverydv/dt

Ripple ≤ 5%

Body Diode Forward DropRe-AppliedVoltage

ReverseRecoveryCurrent

Body Diode ForwardCurrent

VGS=10V

VDD

ISD

Driver Gate Drive

D.U.T. ISD Waveform

D.U.T. VDS Waveform

Inductor Curent

D = P.W.Period

+

-

+

+

+-

-

-

RG

VDD

• dv/dt controlled by RG• ISD controlled by Duty Factor "D"• D.U.T. - Device Under Test

D.U.T*Circuit Layout Considerations • Low Stray Inductance • Ground Plane • Low Leakage Inductance Current Transformer

* Reverse Polarity of D.U.T for P-Channel

VGS

[ ]

[ ]

*** VGS = 5.0V for Logic Level and 3V Drive Devices

[ ] ***

Fig 14. For N-channel HEXFET® power MOSFETs

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L E A D A S S IG NM E NT S 1 - G A T E 2 - D R A IN 3 - S O U RC E 4 - D R A IN

- B -

1 .32 (.05 2)1 .22 (.04 8)

3 X 0.55 (.02 2)0.46 (.01 8)

2 .92 (.11 5)2 .64 (.10 4)

4.69 ( .18 5 )4.20 ( .16 5 )

3X0.93 (.03 7)0.69 (.02 7)

4.06 (.16 0)3.55 (.14 0)

1.15 (.04 5) M IN

6.47 (.25 5)6.10 (.24 0)

3 .7 8 (.149 )3 .5 4 (.139 )

- A -

10 .54 (.4 15)10 .29 (.4 05)2.87 (.11 3)

2.62 (.10 3)

1 5.24 (.60 0)1 4.84 (.58 4)

1 4.09 (.55 5)1 3.47 (.53 0)

3 X1 .4 0 (.0 55 )1 .1 5 (.0 45 )

2.54 (.10 0)

2 X

0 .3 6 (.01 4) M B A M

4

1 2 3

N O TE S :

1 D IM E N S IO N IN G & TO L E R A N C ING P E R A N S I Y 1 4.5M , 1 9 82. 3 O U T LIN E C O N F O R M S TO JE D E C O U T LIN E TO -2 20 A B .

2 C O N TR O L LIN G D IM E N S IO N : IN C H 4 H E A TS IN K & LE A D M E A S U R E M E N T S D O N O T IN C LU DE B U R R S .

Part Marking InformationTO-220AB

Package OutlineTO-220ABDimensions are shown in millimeters (inches)

PA R T N U M B ERIN TE R N A TIO N A L

R E C TIF IER

L O G O

E XA MP L E : TH IS IS AN IR F1 0 1 0 W IT H AS SE M B L Y L O T C O D E 9 B1 M

A S SE M BL Y

L O T C O D E

D ATE C O D E

(YYW W )

YY = YE AR

W W = W E EK

9 2 4 6IR F 10 1 0

9B 1 M

A

Data and specifications subject to change without notice. This product has been designed and qualified for the Automotive [Q101] market.

Qualification Standards can be found on IR’s Web site.

IR WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, USA Tel: (310) 252-7105TAC Fax: (310) 252-7903

Visit us at www.irf.com for sales contact information.01/01

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/

irfz44n

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