ise 316: manufacturing engineering i: processes

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ISE 316: Manufacturing Engineering I: Processes Micro/Nano-Scale Manufacturing

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ISE 316: Manufacturing Engineering I: Processes. Micro/Nano-Scale Manufacturing. Outline. Historical Perspective and Introduction Why make things very small Sensors and Actuators Micro/nano-scale manufacturing processes. If at first, the idea is not absurd, then there is no hope for it. - PowerPoint PPT Presentation

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Page 1: ISE 316: Manufacturing Engineering I: Processes

ISE 316: Manufacturing Engineering I: Processes

Micro/Nano-Scale Manufacturing

Page 2: ISE 316: Manufacturing Engineering I: Processes

Outline

• Historical Perspective and Introduction

• Why make things very small

• Sensors and Actuators

• Micro/nano-scale manufacturing processes

Page 3: ISE 316: Manufacturing Engineering I: Processes

If at first, the idea is not absurd, then there is no hope for it.

- Albert Einstein

Page 4: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

1822: Nicéphore Niépce invents lithography to pattern a portrait. Five years later, Lemaître etched out the engraving with a strong acid

1939: First p-n junction on a semiconductor (W. Schottky)

1958: First integrated circuit developed at Texas Instruments. Jack Kilby wins the Nobel at 2000

1959: Richard Feynman dreams big (Oops, small!)

Cardinal d’Amboise

First IC

1948: First transistor (J. Bardeen, W.H. Brattain, W. Shockley) http://www.pbs.org/transistor/science/events/pointctrans.html

Why can’t we write the entire 24 volumes of Encyclopedia Brittanica on the head of a pin?

Page 5: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

1965: Gordon Moore foretells the future of silicon industry

1965: First MEMS device? Resonant gate transistor built by Nathanson, Newell and Wickstrom

Every 2 years: # transistors double; cost remains same or decreases. On the same scale in the auto industry, cars would cost 5 cents and average 300000 mpg today

Page 6: ISE 316: Manufacturing Engineering I: Processes

•Human hair: 50,000 nm across

•Viruses range in size from 20 to 300 nanometers (nm)

•10 hydrogen atoms in a line, 10 Angstroms (or 1 nm)

A View from Macro to Micro to Nano

Nanoparticles exist all around us – in sea, air, cigarette smoke, and diesel exhaust.

So, what is different today?

Why is the issue of nanotechnology generating so much discussion?

Page 7: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

1989: Breakthrough in MEMS. Polysilicon micromotors built by Tai and Muller. Lateral comb drive actuator built by Tang, Nguyen and Howe

hair

RotorStator

combs

1994: Digital micro-mirror device (DMD) from Texas Instruments

1995: Commercial accelerometer from Analogue Devices

Page 8: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

IC vs MEMS Technology

AMD K6 Microprocessor(top 6 layers only)

0.75

TI - DMD

Page 9: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

Is there a limit?

What are the issues?Fabrication (180 nm)MaterialsPhysical mechanisms

Page 10: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

1985: R. Smalley, R. Curl and H. Kroto discovers Buckminsterfullerene or Bucky ball. Nobel in 1996.

Nano-abacus of C60 molecules

http://jcrystal.com/steffenweber/POLYHEDRA/p_00.html

A C60 molecule

Page 11: ISE 316: Manufacturing Engineering I: Processes

Nano materials

• Carbon nanotubes (CNTs; also known as buckytubes) are allotropes of carbon with a cylindrical nanostructure. Nanotubes have been constructed with length-to-diameter ratio of up to 132,000,000:1,[1] significantly larger than any other material. These cylindrical carbon molecules have novel properties, making them potentially useful in many applications in nanotechnology, electronics, optics, and other fields of materials science, as well as potential uses in architectural fields.

Page 12: ISE 316: Manufacturing Engineering I: Processes

Armchair and zigzagcarbon nanotube

Page 13: ISE 316: Manufacturing Engineering I: Processes

Multiwall nanotubes

Page 14: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

1986: (1) Atomic Force Microscope is invented.

(2) Eric Drexler publishes “Engines of Creation” www.foresight.org/EOC/Engines.pdf

NaCl on Mica

During the early decades of the 21st century, the advent of practical molecularmanufacturing technology will make it possible to fabricate inexpensively almost any conceivable structure allowed by the laws of physics.

Consequences will include immensely powerful computers, abundant and very high quality consumer goods, and microscopic devices able to cure most diseases by repairing the body from the molecular level up.

Page 15: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

1991: Sumio Ijima discovers carbon nanotubes

http://www.photon.t.u-tokyo.ac.jp/~maruyama/wrapping.files/frame.html

1997: DNA based micromechanical device built

Page 16: ISE 316: Manufacturing Engineering I: Processes

MEMS & Nanotechnology: A Glimpse

Nano gears

2001: Carbon nanotube based logic demonstrated

Nano bearings

Page 17: ISE 316: Manufacturing Engineering I: Processes

Should we borrow from Nature?

NATURE vs. ENGINEERINGNATURE vs. ENGINEERING

Billions of years to evolveBillions of years to evolve Revolutionary, Ingenuity drivenRevolutionary, Ingenuity driven

Does not use metalsDoes not use metals Metals and Artificial materials Metals and Artificial materials drivendriven (e.g. Stone Age (e.g. Stone Age Iron Age) Iron Age)

Movement by sliding/contractionMovement by sliding/contraction The Wheel The Wheel

Energy storageEnergy storageGravitational/ ElasticGravitational/ Elastic Electrical and KineticElectrical and Kinetic

A wet technologyA wet technology Mostly dryMostly dry

Smooth shapesSmooth shapes Sharp corners, rectangularSharp corners, rectangular

Page 18: ISE 316: Manufacturing Engineering I: Processes

Nanometer: A Different Perspective

• Human hair: 50,000 nm across

• Bacterial cell: a few hundred nanometers

• Seeable with unaided human eye: 10,000 nanometers

• 10 hydrogen atoms in a line

Page 19: ISE 316: Manufacturing Engineering I: Processes

Reasons to Miniaturize

Miniaturization Attributes

Reasons

Low energy and little material consumed

Limited resources

Arrays of sensors Redundancy, wider dynamic range, increased selectivity through pattern recognition

Small Small is lower in cost, minimally invasive

Favorable scaling laws

Forces that scale with a low power become more prominent in the micro domain; if these are positive attributes then miniaturization favorable (e.g. surface tension becomes more important than gravity in a narrower capillary)

Page 20: ISE 316: Manufacturing Engineering I: Processes

Reasons to Miniaturize

Miniaturization Attributes

Reasons

Batch and beyond batch techniques

Lowers cost

Disposable Helps to avoid contamination

Breakdown of macro laws in physics and chemistry

New physics and chemistry might be developed

Smaller building blocks

The smaller the building blocks, the more sophisticated the system that can be built

Page 21: ISE 316: Manufacturing Engineering I: Processes

Need for Scaling

• As linear size decreases behavior changes.– Not well understood on

the nano-scale.– Scaling represents an

approximation to assist in understanding.

• Scaling helps to explain nature and can also be used to design devices.

Page 22: ISE 316: Manufacturing Engineering I: Processes

Scaling

• If a system is reduced isomorphically in size (i.e. scaled down with all dimensions of the system decreased uniformly), the changes in length, area and volume ratios alter the relative influence of various physical effects.

• Sometimes these effect the operation in unexpected ways.

Page 23: ISE 316: Manufacturing Engineering I: Processes

Is scaling different in the micro world?

Page 24: ISE 316: Manufacturing Engineering I: Processes

Scaling of Length, Surface Area and Volume

• What happens as an object shrinks?– Area L2

– Volume L3

L

LL

Page 25: ISE 316: Manufacturing Engineering I: Processes

Why Whales Swim Faster

L3

L2

22

2

1LAuCF DD

where CD: drag coefficient ρ: density of fluid A: largest projected area of the body u: velocity

Page 26: ISE 316: Manufacturing Engineering I: Processes

Scaling of Mechanical SystemsW

Page 27: ISE 316: Manufacturing Engineering I: Processes

Scaling of Mechanical Systems

13

2 L

L

L

mass

forceonaccelerati

In nano-mechanical systems accelerations are large.

01 ))(())(( LLLtimeonacceleratispeed

Lfrequencyscaletimesticcharacteri 1__

Speed is length scale invariant.

Page 28: ISE 316: Manufacturing Engineering I: Processes

Actuators

• Electrical

• Electrostatic

• Magnetic

• Thermal

Page 29: ISE 316: Manufacturing Engineering I: Processes

Electrostatic Motors

+-

+-

-

Polysilicon micromotor:

• Rotor sits atop a 0.5mm layer of polysilicon that acts as an electrostatic shield.

• Rotor, hub, stators formed from 1.5mm polysilicon.

• A 2.0mm polysilicon disk is attached to rotor.

Page 30: ISE 316: Manufacturing Engineering I: Processes

Projection TV Technology

Page 31: ISE 316: Manufacturing Engineering I: Processes

Mirror mechanism for DLP TV (Texas Instruments)

Use of electrostatic torque for mirror positioning.

Page 32: ISE 316: Manufacturing Engineering I: Processes

Thermal Actuation

The current flow produces Joule heating that in turn imparts a large thermal stress on the device, concentrated in the long thin beam. The thermal expansion of the thin beam causes the device to bend at the short thin beam. The blade rotates in the plane of the substrate.

Page 33: ISE 316: Manufacturing Engineering I: Processes

Piezoelectric ActuatorsRecall the piezoelectric effect:

Page 34: ISE 316: Manufacturing Engineering I: Processes

Ideal Sensor

• Zero Mass: no additional mass, no thermal compensation (no latent heat energy stored), thermally equilibrate infinitely rapid, infinitely wide dynamic response.

• Zero physical size: Could be installed virtually anywhere, extreme spatial resolution by arrays.

• Zero energy.

Historically, most successful applications of MEMS techniques fall in the “Sensors” category.

MEMS Sensors are close. They offer high sensitivity, can be batch fabricated (low cost, high volume), some times wireless and are robust

Page 35: ISE 316: Manufacturing Engineering I: Processes
Page 36: ISE 316: Manufacturing Engineering I: Processes

Mechanical Sensing

• Micro-mechanical structures at heart of design process• Beams that act as springs• Experience force and/or displacement• Deform under force, pressure, flow, etc.• Measure deflection

• Deflection equations developed for macro-scale and assume:• Material properties do not change• No residual stresses

Silicon is generally used for micro-mechanical structures.

Page 37: ISE 316: Manufacturing Engineering I: Processes

Concept

kxF

Page 38: ISE 316: Manufacturing Engineering I: Processes

Sensor and Transducer

• Sensor: Converts force to displacement

• Sensitivity: 1/k• Transducer : Apply force to get displacement• k can be constant or varying with force

kFx /

Page 39: ISE 316: Manufacturing Engineering I: Processes

Cantilever Beam

3/3 LEIk The left cantilever bends as the protein PSA binds to the antibody. The other cantilevers are exposed to different

proteins found in human blood serum.

Page 40: ISE 316: Manufacturing Engineering I: Processes

Another View of Sensing

Displacement as a means of sensing!

Page 41: ISE 316: Manufacturing Engineering I: Processes

Mechanical Sensing

• Micro-mechanical structures at heart of design process• Beams that act as springs• Experience force and/or displacement• Deform under force, pressure, flow, etc.• Measure deflection

• Deflection equations developed for macro-scale and assume:• Material properties do not change• No residual stresses

Silicon is generally used for micro-mechanical structures.

Page 42: ISE 316: Manufacturing Engineering I: Processes

Concept

kxF

Page 43: ISE 316: Manufacturing Engineering I: Processes

Sensor and Transducer

• Sensor: Converts force to displacement

• Sensitivity: 1/k• Transducer : Apply force to get displacement• k can be constant or varying with force

kFx /

Page 44: ISE 316: Manufacturing Engineering I: Processes

Cantilever Beam

3/3 LEIk The left cantilever bends as the protein PSA binds to the antibody. The other cantilevers are exposed to different

proteins found in human blood serum.

Page 45: ISE 316: Manufacturing Engineering I: Processes

Sensors: Mechanical Measurement

Atomic Force Microscope

Page 46: ISE 316: Manufacturing Engineering I: Processes

Accelerometers

Applications: Inertial guidance system, airbags, vibration measurement

When the reference frame is accelerated, the acceleration is transferred to the proof mass through the spring. The stretching of the spring, which is measured by a position sensor (represented as a length scale in the figure), gives the acceleration when the proof mass is known.

Natural frequency

Damping coefficient

Page 47: ISE 316: Manufacturing Engineering I: Processes

Accelerometers

Page 48: ISE 316: Manufacturing Engineering I: Processes

Piezoelectric Sensing

Page 49: ISE 316: Manufacturing Engineering I: Processes

Chemical Sensor

Page 50: ISE 316: Manufacturing Engineering I: Processes

Biological Sensing

Diagram of interactions between target and probe molecules on cantilever beam. Specific biomolecular interactions between target and probe molecules alter the intermolecular nanomechanical interactionswithin a self-assembled monolayer on one side of a cantilever beam. This can produce a sufficiently large force to bend the cantilever beam and generate motion.