itanium 2 processor package development
TRANSCRIPT
1R
Itanium® 2 Processor Package Development
Kevin Haley, Package Pathfinding Manager
Enterprise Platforms Group, Intel Corporation
2R
Agenda• Overview
• First level interconnect– BGA
• Power delivery– Power Pod
• Second level interconnect– Interposer
• Third level interconnect– Socket
• Summary
• Speaker’s patents
3R
Itanium® 2 Processor Package Development Overview
• Itanium® 2 started in 1998 as an evolution from Itanium®
• Package goal was increased bus and power supply performance– Bus performance driven by trace length
– Tighter power supply tolerance = higher frequency
• New technologies for high value add items– Socket
– Interposer
• Existing technologies for high risk items– Power connector
– First level package– Thermal
Agenda First level interconnect – BGA
Power delivery - Power Pod
Second level interconnect - Interposer
Third level interconnect - Socket
4R
First level interconnect
• ~8000 flip chip connections from Silicon to the first level package – ~750 x 850 mil die
– Need for On-Package decoupling– 130 W dictated use of the integrated heat spreader
– 50 mil ball pitch standard of the day
= 42.5mm BGA
Big die and big BGA, but within Intel technology envelope
Agenda First level interconnect – BGAPower delivery - Power Pod
Second level interconnect - Interposer
Third level interconnect - Socket
5R
Package without heat spreader
Vdd (core)Vtt (FSB)PLL filter
Powerdeliveryconnector
6R
Power delivery
• Power Pod Concept from Itanium®
– Isolates processor power supply from mother board• 100A through a MB was daunting in 1998
– Modularity allows for servicing and future upgrades
• Power pod connector re-used from Itanium®
– Contact pattern changed from Merced – Updated power conversion technology
Width of interposer is set by the connector
Agenda First level interconnect – BGA
Power delivery - Power PodSecond level interconnect - Interposer
Third level interconnect - Socket
7R
Itanium® 2 Power Pod
130 mm100 mm71 mm
19 mm
Input Connector(8 position- 12v; 4position-48v)
51 mmOutput Board to
pod Thermal Plate Width of space forelectronics boards
inside RM
Output Connector mechanically the same
as Itanium(tm) power pod
8R
Itanium® 2 Processor Package Details
Powerdeliveryconnector
ServerManagementComponents
Flip-Chip BGA package withIntegrated Heat Spreader
InterposerSubstrate
9R
Second level interconnect
• Interposer enables tight power regulation– 8-layers of 2oz Cu + outer 2 layers plated to 2.5oz
– Enables a lateral power path
• Interposer enables system management components– Flash
• Fuse options• Mfg data• More decoupling• PLL filter components• and real estate for miscellaneous circuits
Agenda First level interconnect – BGA
Power delivery - Power Pod
Second level interconnect - InterposerThird level interconnect - Socket
10R
Itanium® 2 Processor Package Details
Powerdeliveryconnector
ServerManagementComponents
Flip-Chip BGA package withIntegrated Heat Spreader
InterposerSubstrate
11R
Third level interconnect
• Interposer has 611 pins to socket – Signals are straight through for minimum stub length
• Pins de-populated “randomly” due to manufacturing limitations• Socket has all pins – PGA 700
– Closest processor to processor spacing drives rectangular shape
• Socket designed for signal performance• 4mm to shorten signals with elevated cam box• Hex wrench actuation to allow through-the-heatsink socket access
• Technology extension of an existing processor socket mitigates risk
Agenda First level interconnect – BGA
Power delivery - Power Pod
Second level interconnect - Interposer
Third level interconnect - Socket
12R
Socket
• SMT ZIF socket– Low profile - performance driven (~4 mm)
• Stand-off from processor board dependent on solder volume, land diameter, and board technology used
– 700 positions, ZIF - multiple insertion/extraction (target = 50 actuations)• Tools =3mm hex, manual • Clearance area for vacuum pick and place
– 50 mil pitch, 25 x 28 grid array• BGA interface to MB• Mass and symmetry supports dual sided SMT without tools
– Alignment: Processor notches to posts on socket
Package to Socketalignment features Cam Actuation
13R
Why the apparent random pin depopulation?
•De-populated pins are Vdd (core power) vias
•White circle is the BGA land, green is the pin and via, red is via only
•Vdd comes from the Power Pod, not through the socket
•If the Vdd pin was populated Power pod voltage would be delivered to the motherboard
Sig
Vdd VddGnd Gnd
Sig SigSig
Vdd VddGnd Gnd
pin
pin viavia
pin pin
pin
pin
pin
pin pin
pin viavia
pin pin pin
pin
pin pin
14R
Itanium® 2 package Summary
• Value adds– Reduced package width allowing tighter processor pitch– Interposer/power pod to deliver tight power regulation for Core MHz– Short bus trace, pin and socket minimize stub length for MT/s
• Risk mitigation– Extension of Intel BGA technology– Re-use of Itanium 1 power connector– Socket technology extension of existing Intel socket
15R
• Patents issued to Kevin Haley• U.S. 6,667,548 Diamond Heat Spreading and cooling technique for integrated circuits• U.S. 6,313,987 Thermal connector for joining mobile electronic devices to a docking
station• U.S. 6,181,555 Cooling system for integrated circuit chips in a portable computer• U.S. 6,168,976 Socketable BGA package• U.S. 6,043,560 Thermal interface thickness control for a microprocessor• U.S. 5,982,617 Cooling system for integrated circuit chips in a portable computer lid
assembly• U.S. 5,966,286 Cooling system for thin profile electronic and computer devices• U.S. 5,956,229 Injection molded thermal interface system• U.S. 5,718,282 Heat pipe exchanger system for cooling a hinged computing device• U.S. 5,646,822 Heat pipe exchanger system for cooling a hinged computing device• U.S. 5,621,613 Apparatus for dissipating heat in a hinged computing device• U.S. 5,531,021 Method of making solder shape array package• U.S. 5,506,765 Tape BGA package• U.S. 5,290,735 Thin, high lead count integrated circuit package• U.S. 5,359,225 Thin, high lead count integrated circuit package• U.S. 5,359,768 Method for mounting very small integrated circuit package on PCB• U.S. 5,006,962 Apparatus for surface mounting an Integrated circuit package