O X I D e - a N D P U L S e - F R e e F O R O P t I m U m Q U a L I t y

c O m P e t e N c e a c R O S S t h e S t a N D a R D

Mini wave solderingSeLectIVe SOLDeRINg SyStem

IwmODUL

n Selective shielding gas soldering process

n Reproducible solder quality

n Spatter free soldering

n constant, laminar solder flow

n Specific solder nozzles

n Solder flow circular/one-sided

n One/two controllable solder waves

n Solder wave height controlling

n Pulse-free induction solder pump

n automatic solder refeeding

n wear-restistant coating

n Low maintenance

I N N O V a t I O N a N D m O D U L a R c O m b I N a t I O N S a F e g U a R D P R O c e S S e S a N D Q U a L I t y

I N N O V a t I O N a N D m O D U L a R c O m b I N a t I O N S a F e g U a R D P R O c e S S e S a N D Q U a L I t y

n benefitsthe selective soldering wave with its shielding gas atmosphere guarantees a soldering process free of oxides and residues. thanks to the continuously pumped solder wave, the heat transfer from the molten solder becomes homogeneous, transmit-ted continously to the solder point geometry. the flowing wave of solder cleans surplus resdues of flux, oxides and dirt from the soldering site.

n modularitythe modular solder tank sizes, along with the electromagnetic and pulse- free solder pumping system as well as the quick-change solder nozzles forms the basic process module. Redundant temperature control, the constant sol-der bath leven, optional solder wave height adjustment and continuous refeeding of solder wire guarantee maximum system autonomy.

n Performancethe capillary fill level solder saturation physically distinguishes the solder point in a self-adjusting manner. the ideal solder geometry is reflected reliably in pad/pin form, pin/hole posi-tion and thermal mass distributions in the Pcb layout. Solder through-routes, meniscuses and intermetallic phase characteristics round off the overall performance in a reproducible manner.

mini wave solderingSeLectIVe SOLDeRINg SyStemS

IwmODUL

FUNctIONaL PRINcIPLe

n One-sided solder exit

n circular solder exitn Nozzle principles

Spot nozzle

Solder area

Ring nozzle Linear nozzle matrix nozzle

eUtect® gmbh · Filsenbergstraße 10 · 72144 Dusslingen · germany

telefon +49 (0) 70 72-9 28 90-0 · Fax +49 (0) 70 72-9 28 90-92 · www.eutect.de · info@eutect.de

t e c h N I c a L D a t a

tyPe Iw1 tyPe Iw1-2

All electronic solders permitted

Solder wire pull-in 1 to 6 mmwire reel 1 to 20 kgShielding gas consumption 800 – 3000 l/hShielding gas pressure 1 – 3 bar

Nitrogen

Forming gas

Nitrogen with formic acid

Control platform

embedded-Pc

twincat Soft-SPS

ethercat, fieldbus for measuring data

acquisition and cycle control

Interfaces

Fieldbus ethercat (optional caNopen and Profibus Db)

Digital I/Os

ethernet

USb

Process data acquisition

Solder bath temperature rdundant

Solder bath height

Solder wave height

Solder refeed

Shielding gas

Solder coil colour

Display

touch 11“ bis 19“/remote

Operating systemmS win XP embedded

System dimension

model Iw1 (simple solder pump)Length 510 mmwidth 260 mmheight (excluding nozzle) 170 mm

model Iw1-2 (double solder pump) Length 510 mmwidth 365 mm

height (excluding nozzle) 170 mm

Elektromagnetic induction solder pump

Pump power P= 400 w or P= 800 wmodel Iw1 One controllable solder pump model Iw1-2 two controllable solder pumps

Solder nozzle fitting location

model Iw1 (depth x width) 90 x 160 mmmodel Iw1-2 (depth x width) 90 x 260 mm

System weight

model Iw1 approx. 45 kgmodel Iw1-2 approx. 65 kgmodel Iw1 solder tank approx. 2,5 l/20 kg model Iw1-2 solder tank approx. 5,0 l/40 kg

Heat output

heat-up time 30 to 45 min.Solder temperature adjustment up to 400 °cSolder temperature adjustment max. up to 550 °c (Option)Solder bath height measurement mIN/maX levelSolder wave height optional solderadjustment automationSpezific solder nozzles Quick-change systemalloy wear ceramic coating

IwmODUL