kdf-806 - maintenance manual - 006-05511-0008_8

7/27/2019 KDF-806 - MAINTENANCE MANUAL - 006-05511-0008_8

1/229

MAINTENANCE MANUAL

KDF 806

ADF RECEIVER

MANUAL NUMBER 006 05511 0008


2/229

WARNINGThe enclosed technical data is eligible for export under License Designation NLR and is to beused solely by the individual/organization to whom it is addressed. Diversion contrary to U.S. lawis prohibited.

COPYRIGHT NOTICE

1985-2005 Honeywell International Inc.


3/229

B KDF 806REVISION HISTORY

KDF 806

KDF 806 Maintenance Manual

Part Number: 006-05511-XXXX

For each revision, add, delete, or replace as indicated.

Rev. 8, June/2005

Specific changes in this revision are denoted by revision bar. The Illustrated Parts List is fully re-vised and reformatted. No revision bars are used in this section. It has been updated to reflectcurrent parts lists, assembly drawings, and schematics. Previous revision information has beenretained for historical reference.

ITEM ACTION

Full Reprint Replaces all previous revisions.


4/229

B KDF 806

THIS PAGE IS RESERVED


5/229

B KDF 806TABLE OF CONTENTS

ITEM PAGE

SECTION IVTHEORY OF OPERATION

4.1 INTRODUCTION............................................................................................................ 4-1

4.1.1 BASIC ADF PRINCIPLES.............................................................................................. 4-1

4.1.2 PHASE-MODULATED POINTING SYSTEM................................................................. 4-2

4.2 BLOCK DIAGRAM ........................................................................................................4-64.2.1 RECEIVER RF SECTION..............................................................................................4-6

4.2.2 PHASE DETECTOR AND POINTING CIRCUITRY.......................................................4-6

4.2.3 POWER SUPPLY .......................................................................................................... 4-7

4.2.4 MICROPROCESSOR, SWITCHING & BEARING COMPUTATION CIRCUITRY......... 4-7

4.3 DETAILED CIRCUIT THEORY...................................................................................... 4-7

4.3.1 RECEIVER RF SECTION.............................................................................................. 4-74.3.2 AUDIO AND AGC SECTION .........................................................................................4-8

4.3.3 LSI FREQUENCY SYNTHESIZER................................................................................ 4-8

4.3.4 PHASE DETECTOR ...................................................................................................... 4-9

4.3.5 BEARING POINTER CIRCUITRY ............................................................................... 4-10

4.3.6 XYZ POWER................................................................................................................ 4-11

4.3.7 RESET CIRCUIT.......................................................................................................... 4-11

4.3.8 POWER SUPPLY ........................................................................................................ 4-11

SECTION VMAINTENANCE

5.1 INTRODUCTION............................................................................................................5-1

5.2 TEST AND ALIGNMENT...............................................................................................5-2

5.2.1 TEST EQUIPMENT REQUIRED....................................................................................5-2

5.2.2 DEFINITION OF STANDARD TEST TERMS AND CONDITIONS................................5-2

5.2.3 FINAL TEST DATA SHEET........................................................................................... 5-5

5.2.4 ALIGNMENT .................................................................................................................. 5-8

5 3 OVERHAUL 5 18


6/229

B KDF 806ITEM PAGE

SECTION VI

ILLUSTRATED PARTS LIST

6.1 GENERAL...................................................................................................................... 6-1

6.2 REVISION SERVICE ..................................................................................................... 6-1

6.3 LIST OF ABBREVIATIONS........................................................................................... 6-1

6.4 SAMPLE PARTS LIST.................................................................................................. 6-3

6.5 KDF 806 FINAL ASSEMBLY ........................................................................................6-56.6 KDF 806 MAIN BOARD ..............................................................................................6-17

6.7 KDF 806 MUTE BOARD ........................................................................................... 6-121

6.8 KDF 806 RECEIVER BOARD ................................................................................... 6-139

6.9 KDF 806 RF AMP BOARD........................................................................................ 6-193

6.10 KDF 806 AGC AMP ADAPTER BOARD .................................................................. 6-209

6.11 KDF 806 POWER SUPPLY ASSEMBLY.................................................................. 6-217

6.12 KDF 806 POWER SUPPLY BOARD......................................................................... 6-227

6.12 KDF 806 AUDIO BOARD.......................................................................................... 6-243

CONFIGURATION APPENDIX


7/229

B KDF 806ITEM PAGE

FIGURE 4-1 PLANE E-M WAVE ...................................................................................... 4-1

FIGURE 4-2 INDUCED VOLTAGES VS RELATIVE BEARING ANGLE ..........................4-2FIGURE 4-3 32 HZ MODULATION SIGNALS.................................................................. 4-3FIGURE 4-4 PHASE MODULATOR PHASOR DIAGRAM ............................................... 4-3FIGURE 4-5 PHASE MODULATION OF SENSE CARRIER............................................4-4FIGURE 4-6 POINTING SYSTEM BLOCK DIAGRAM ..................................................... 4-5FIGURE 4-7 KDF 806 BLOCK DIAGRAM ...................................................................... 4-13FIGURE 5-1 KDF 806 SYSTEM TEST SETUP ................................................................ 5-4FIGURE 5-2 SWEEP ALIGNMENT EQUIPMENT SET-UP............................................ 5-10

FIGURE 5-3 190-205 KHZ BANDPASS FILTER RESPONSE....................................... 5-11FIGURE 5-4 285-400 KHZ BANDPASS FILTER RESPONSE....................................... 5-12FIGURE 5-5 400-600 KHZ BANDPASS FILTER RESPONSE....................................... 5-12FIGURE 5-6 600-900 KHZ BANDPASS FILTER RESPONSE....................................... 5-13FIGURE 5-7 ALTERNATE ALIGNMENT TEST SETUP.................................................5-14FIGURE 5-8 UNIT TROUBLESHOOTING FLOWCHART.............................................. 5-31FIGURE 5-9 POWER SUPPLY TROUBLESHOOTING FLOWCHART.......................... 5-32FIGURE 5-10 IF CIRCUIT TROUBLESHOOTING FLOWCHART.................................... 5-33FIGURE 5-11 COHERENT DETECTOR TROUBLESHOOTING FLOWCHART.............. 5-35FIGURE 5-12 AUDIO CIRCUIT TROUBLESHOOTING FLOWCHART............................ 5-37FIGURE 5-13 BEARING DETECTOR TROUBLESHOOTING FLOWCHART..................5-38FIGURE 5-14 TROUBLESHOOTING WAVEFORMS.......................................................5-39FIGURE 6-1 SAMPLE PARTS LIST ................................................................................. 6-3FIGURE 6-2 KDF 806 END ITEM ASSEMBLY DRAWING ............................................ 6-11FIGURE 6-3 KDF 806 MAIN ASSEMBLY DRAWING (-0000)........................................ 6-43FIGURE 6-4 KDF 806 MAIN ASSEMBLY DRAWING (-0010)........................................ 6-51FIGURE 6-5 KDF 806 MAIN SCHEMATIC (-0000) ........................................................6-57

FIGURE 6-6 KDF 806 MAIN SCHEMATIC (-0010) ........................................................6-89FIGURE 6-7 KDF 806 MAIN SCHEMATIC (-0020) ...................................................... 6-105FIGURE 6-8 KDF 806 MUTE BOARD ASSEMBLY DRAWING (-0000) ....................... 6-125FIGURE 6-9 KDF 806 MUTE BOARD ASSEMBLY DRAWING (-0010) ....................... 6-129FIGURE 6-10 KDF 806 MUTE BOARD SCHEMATIC (-0000)........................................ 6-133FIGURE 6-11 KDF 806 MUTE BOARD SCHEMATIC (-0010)........................................ 6-135FIGURE 6-12 KDF 806 RECEIVER ASSEMBLY DRAWING (-0000)............................. 6-153FIGURE 6-13 KDF 806 RECEIVER ASSEMBLY DRAWING (-0010)............................. 6-159

FIGURE 6-14 KDF 806 RECEIVER SCHEMATIC (-0000) ............................................. 6-163FIGURE 6-15 KDF 806 RECEIVER SCHEMATIC (-0010) ............................................. 6-181FIGURE 6-16 KDF 806 RF AMP ASSEMBLY DRAWING (-0010) .................................6-197FIGURE 6-17 KDF 806 RF AMP ASSEMBLY DRAWING (-0030) .................................6-201FIGURE 6-18 KDF 806 RF AMP SCHEMATIC (-0010) ..................................................6-205FIGURE 6-19 KDF 806 RF AMP SCHEMATIC (-0030) ..................................................6-207

G GC SS G


8/229

B KDF 806



9/229

B KDF 806ITEM PAGE

TABLE 5-1 RECOMMENDED CLEANING AGENTS ................................................... 5-20

TABLE 5-2 UNSAFE CLEANING AGENTS.................................................................. 5-21


10/229

B KDF 806



11/229

B KDF 806SECTION IV

THEORY OF OPERATION

4.1 INTRODUCTION

4.1.1 BASIC ADF PRINCIPLES

In order to fully understand the operation of an automatic direction finder (ADF) system, it is ad-vantageous to first examine the radio wave which induces the signals in an ADF antenna system.A radio wave consists of two electromagnetic field components; an electric field (E) and a mag-netic field (H). These fields are perpendicular in space and their amplitudes vary sinusoidally withtime. A simplified illustration of a plane electromagnetic wave is shown in FIGURE 4-1 PLANE

E-M WAVE. Stations which broadcast in the ADF band (190 kHz - 1799 kHz) transmit verticallypolarized radio waves, meaning that the E field is vertical in space, while the H field is horizontal.

FIGURE 4-1 PLANE E-M WAVE

It is the magnetic field of the radio wave which induces voltages in the loop windings of the ADFantenna. The loop antenna consists of two mutually perpendicular windings on a square ferrite


12/229

B KDF 806Note that as one of the signals passes through a null (e.g.; the cosine of 90 is 0, so no voltageis induced in the cosine loop at a relative bearing of 90 ), it goes through a 180 phase shift. Forexample, the cosine of 135 is -.707, so at a relative bearing of 135 the induced cosine voltage

will be 70.7% of the voltage induced at a relative bearing of 0 , and 180 out of phase. Thus theloop antenna receives directional information from the transmitting station. Note, however, that

the sine and cosine loop signals will be in phase with each other at both 45 and 225 relativebearings, for instance. Without some kind of a reference signal, the ADF system would be unableto determine which of the two relative bearings was correct. This is the purpose of the sense an-tenna, which responds to the electric field of the radio wave. The sense signal maintains a refer-ence phase to which loop signals are compared in order to resolve the bearing ambiguity. The

sense signal is in phase with the E field of the radio wave, hence it is 90 out of phase with the

loop signals.

FIGURE 4-2 INDUCED VOLTAGES VS RELATIVE BEARING ANGLE

The KDF 806 has two basic operating modes, the antenna mode (ANT) and the ADF mode. Inthe ANT mode, the loop signals are disabled and the receiver functions as a simple AM receiver.

The indicator needle remains parked at the 90 bearing position. This mode allows improved au-dio reception and is most useful for station identification. In the ADF mode, the loop signals pro-vide bearing information and the indicator points to the relative bearing of the station.

4.1.2 PHASE-MODULATED POINTING SYSTEMThe KDF 806 uses a phase-modulated (PM) system to derive the bearing pointer signals. Referto FIGURE 4-6 POINTING SYSTEM BLOCK DIAGRAM for the following discussion.

The sine loop signal, cosine loop signal, and sense signal are each separately amplified in the an-tenna amplifier/modulator circuit. The loop signals are then applied to the inputs of a pair of bal-anced modulators which are modulated by 32Hz square waves in quadrature As shown in FIG-


13/229

B KDF 806This quadrature summing operation produces a phase modulation of the sense signal, with theamount of modulation a function of the relative sine and cosine loop signals, and hence the angleto the station.

FIGURE 4-3 32 HZ MODULATION SIGNALS(TOP MOUNTED ANTENNA)

As an example, consider the case where the relative bearing to the station is 45 . During the firstquarter of the 32 Hz period, both modulation signals are high (see FIGURE 4-4 PHASE MODU-LATOR PHASOR DIAGRAM) and the loop signals are passed through the modulators with zero

phase shift. They are in phase with each other and at a relative amplitude of .707 (sin 45 = cos45 = .707). At the summing junction, they are added together with the sense signal, which is in

quadrature with the loop signals and at a relative amplitude of approximately 5.0.


14/229

B KDF 806The vector diagram in the first quarter of FIGURE 4-4 PHASE MODULATOR PHASOR DIAGRAMillustrates how the signals add. The resulting output signal has a relative amplitude of 5.2 and a

phase of -16 relative to the sense signal. In effect, the smaller loop signals are being used to

phase modulate the sense carrier. During the second quarter of the 32 Hz period, the sine mod-ulator inverts the sine loop signal. The sine and cosine signals, being equal in amplitude and op-posite in phase, cancel, leaving the sense signal itself as the resultant. Similarly, the resultant sig-

nal during the third quarter has a relative amplitude of 5.2 with a phase of +16 relative to thesense, while the fourth quarter resultant is the sense signal itself. FIGURE 4-5 PHASE MODU-LATION OF SENSE CARRIER illustrates the phase modulation of the sense carrier at a relative

bearing of 150 . Notice that this phase modulation is dependent upon the amplitude of the com-bined loop signals, and that the resultant signal either leads or lags the sense carrier, depending

upon the polarity of the summed loop signals. Notice also that a small amount of amplitude mod-ulation will be present. This has no effect upon the system performance, as the signal is later am-plified and limited, the pointing information being derived solely from the zero-crossing points bythe phase detector.

FIGURE 4-5 PHASE MODULATION OF SENSE CARRIER

AT A RELATIVE BEARING OF 150

The output of the antenna amplifier/modulator circuit is filtered, mixed, and amplified to an inter-mediate frequency (IF) of 140 kHz with the phase modulation information intact. This phase mod-

ulated 140 kHz signal is limited and squared to remove any amplitude modulation and reducenoise. It is then applied to the input of a phase-locked loop coherent detector circuit which com-pares its phase to that of a 140 kHz constant phase reference signal. The output of the phasecomparator thus contains a signal component at 32 Hz, the rate at which the phase of the inputsignal is being switched. This output is passed through a commutative filter, which acts like a verynarrow bandpass filter centered at 32 Hz, which removes noise from the 32 Hz bearing signal.


15/229

B KDF 806


16/229

B KDF 806The preceding discussion has assumed that the antenna is mounted on top of the aircraft. Werethe antenna to be mounted on the bottom of the aircraft, the phases of the sense signal and cosineloop signal would be reversed, while the sine loop phase would remain unchanged. As far as the

pointing system is concerned, however, the sine loop signal appears to be reversed in phase sincethe sense and cosine loop signals retain the same phase relationship. In order to maintain correct

pointing, the 32 Hz angle +90 modulation square wave that normally modulates the sine loop sig-nal is inverted, effectively inverting the sine loop signal and reestablishing the proper phase rela-tionships between the three signals.

4.2 BLOCK DIAGRAM

(Refer to the FIGURE 4-7 KDF 806 BLOCK DIAGRAM for the following discussion.)4.2.1 RECEIVER RF SECTION

The RF input signal from the antenna passes through one of a set of selectable half-octave pre-selector filters into the first mixer. Here, the signal is converted up to an IF frequency of 12.428MHz, after which it is filtered by a crystal to provide selectivity and image rejection. The signal isthen amplified approximately 25 dB in an AGC-controlled stage and mixed a second time with a12.288 MHz local oscillator frequency to produce the second IF frequency of 140 kHz. The 140kHz signal is then bandpass filtered to improve the selectivity, amplified approximately 50 dB, fil-

tered again and then amplified approximately 20 dB before going through a synchronous AM en-velope detector and low pass filter to remove the audio modulation. The detected audio is thenpassed through mute and volume control circuits and then applied to the audio output terminals.It is also integrated, amplified and delayed to provide the AGC voltages to the AGCd stages in theIF section. A 1 kHz BFO frequency may be injected into the AGC line. this allows audio identifi-cation of interrupted carrier non-directional beacon (NDB) stations that are used in various partsof the world. Tuning is controlled by a microprocessor and a large scale integrated (LSI) frequencysynthesizer chip. An 8.192 MHz crystal oscillator drives the synthesizer chip and this frequency

is internally divided by 4 by the synthesizer and is output at 2.048 MHz to clock the microproces-sor. Tuning data from the KFS 586 frequency control head is sent to the KDF 806 through a shiftregister to the frequency synthesizer chip. The frequency synthesizer is part of a phase-lockedloop (PLL) wherein control signals from it are filtered and applied as the controlling voltage to avoltage-controlled oscillator (VCO). The output of the VCO is fed back to the frequency synthe-sizer to complete the loop, as well as being injected as the L.O. frequency to the first mixer. Thesecond L.O. frequency of 12.288 MHz is generated by dividing the 8.192 MHz reference frequen-cy by 2 and multiplying it by 3 with a passive frequency tripler.

4.2.2 PHASE DETECTOR AND POINTING CIRCUITRYThe phase-modulated pointing information is recovered from the 140 kHz IF signal by a phase-locked loop detector circuit. The 140 kHz signal is limited and squared before being inputted tothe phase detector to remove any AM and reduce noise. The phase detector output goes througha low pass filter and acts as a controlling voltage to a voltage-controlled oscillator (VCO). TheVCO output is divided by two and applied to one side of a lock detector. Lock is accomplished


17/229

B KDF 806When the receiver is in the lock condition, the phase detected information is passed through theenabled commutative filter to the A to D (analog-to-digital) which in turn drives the microprocessor.The microprocessor processes the data and then drives the D to A (Digital-to-Analog) converter.

The D to A buffers apply their respective signals to the X and Y linear four quadrant multipliers,which are enabled by the microprocessor. These signals are then buffered and applied to the out-put lines for the direction indicator. The sine and cosine enable switches are enabled or disabled,depending on whether a SINE/COS or an XYZ indicator is used.

4.2.3 POWER SUPPLY

The KDF 806 uses a ringing choke power supply to produce DC voltages of +6.2 Vdc, +9 Vdc,+12 Vdc,-12 Vdc, -26 Vdc and 200 Vdc. This type of supply allows the unit to be operated at anyDC input voltage from 11 Volts to 33 Volts. The +6.2 Volt line is used to produce a well-regulated

+5 Volts for powering the microprocessor while the +12 Volt line is used to produce a well-regu-lated +9 Volts for powering the CMOS digital circuitry and analog RF circuitry. The -26 Volt lineis needed for the EAROM in the KFS 586 and several operational amplifiers, while the 200 voltline drives the high voltage gas-discharge display in the KFS 586. The power supply has over-voltage protection at the input and also employs current-limiting circuitry.

When 26 Vac, 400 Hz is applied to the main board, +35 Vdc and -35 Vdc are produced. Thesevoltages supply the X and Y operational amplifiers in the pointing circuitry.

4.2.4 MICROPROCESSOR, SWITCHING & BEARING COMPUTATION CIRCUITRYThe microprocessor in the KDF 806 contains its own specially programmed ROM (read-only mem-ory) which is programmed to perform several functions which are listed as follows:

A. Computes bearing data.

B. Generates the 32 Hz reference signals that modulate the sense signal.

C. Computes Q.E. data.

4.3 DETAILED CIRCUIT THEORY

4.3.1 RECEIVER RF SECTION

RF energy from the sense antenna is coupled from the primary to secondary windings of trans-former T113. The RF frequency range in which the sense signal falls is preselected by the controlhead. This turns on the diode pair for the correct bandpass filter (T101, T102, T103, etc.) to passthe RF input to a low pass filter comprised of C107, C108 and L102. this filter rejects frequenciesoutside the range of the one-half octave filters, provides additional selectivity and also rejects any

feedback from the first local oscillator. Impedance matching transformer T114 splits the RF signaland in conjunction with Q107 and the primary winding of T115, forms a singly balanced mixer, orthe first mixer. Control transistor Q106 and R111, CR111, R112 and C113, form a constant cur-rent source for biasing the two sections of Q107. Balance potentiometer R109 balances outminute differences in the two sections of Q107. Impedance matching transformer T115 is adjust-ed to pass the difference frequency to 12.428 MHz crystal filter FL101 to impedance matchingtransformer T116 and amplifier Q108 This d al gate FET amplifier pro ides appro imatel 25 dB


18/229


19/229

B KDF 806VCO I 302 is a voltage controlled oscillator chip whose output is fed back to the synthesizer andcompared with the reference frequency. Pump up and pump down pulses are output at pins 3and 2 of the synthesizer to control the frequency of the VCO.

As an example, assume the VCO frequency is too low. Phase and frequency comparison withinthe synthesizer causes the pump up output at pin 3 to go high. The pump down output at pin 2 isin the low state. The high signal at pin 3 turns on Q303, which then turns on Q302. Meanwhile,the low output at pin 2 causes Q304 to be turned off. Therefore, collector current flowing throughQ302 and R306 builds a charge on capacitors C309 and C310, increasing the voltage at thatnode. This voltage is applied through resistor R310 to varactor diode CR301, with the resistor pro-viding isolation between the charge pump and the VCO. The varactor diode acts as a voltage-variable capacitor which forms a tank circuit with L331 to tune the VCO frequency of I302. The

increasing bias voltage on CR301 lowers its capacitance, increasing the resonant frequency of thetank. If the VCO frequency is greater than the reference frequency, the pump up output at pin 3is low, keeping Q303 and Q302 turned off. The pump down output at pin 2 is high, turning on Q304and bleeding the charge off capacitors C309 and C310 through R307. This decreases the biasvoltage on CR301 causing its capacitance to increase and lower the resonant frequency of theVCO tank circuit. When the VCO is on frequency, the pump up and pump down outputs are nor-mally both low, causing Q302, Q303 and Q304 to be turned off, although infrequent pump up puls-es can be observed at pin 3 as leakage paths dissipate charge from the node, necessitating peri-odic refreshing.

The output of the VCO is an ECL level square wave which is amplified by Q305 and low pass fil-tered to a sine wave by L303, C321 and C322. It is then coupled to the gates of Q107, the firstmixer stage. The synthesizer chip performs an additional function by dividing the 8.192 MHz clockfrequency down to 2.048 MHz, which is output as the microprocessor clock signal.

4.3.4 PHASE DETECTOR

The 140 kHz IF output of Q110 contains the amplitude modulation of the received signal. the AMis removed by saturating limiter/squarer I105. The square wave output of I105 is applied to the

input of phase detector I106. CMOS phase-locked loop chip I106 contains two phase compara-tors: phase comparator I is an exclusive OR network, while phase comparator II is a tri-state out-put, edge-controlled network that produces pump up or pump down pulses according to the fre-quency difference of the two inputs. An external VCO, I110, provides a reference frequency whichis looped back to I106-3 to achieve frequency lock in phase comparator II in I106. Bilateral switchI107A is held on at the initial lockup of phase comparator II, allowing 140 kHz to pass through fasttime constant resistor R162 to low pass filter amplifier I108D and buffer/inverter I108C. This signaldrives varactor CR114, changing the capacitive component of the LC tank of VCO I110 to a valuewhich moves its output to approximately 280 kHz, or twice the input frequency out of the IF. Thisoutput is level shifted in Q111 and divided by two in JK network I111A, I111B and inverter I112C.

This network divides the frequency to 140 kHz and provides four signals that are 0 , 90 , 180 ,and 270 with respect to each other. Approximately 140 kHz at zero phase angle (See W/F at TP5) from I111B-10 is applied to I106-3 as a VCO control frequency for phase comparators I and IIin I106. This action continues until the VCO reference at I106-3 equals the input frequency at

I106 14 and the phase difference between I106 1 and 3 is 0 At this point C179 discharges


20/229

B KDF 806This action introduces a 32 Hz modulation to the 140 kHz input signal. Because of the sluggishtime constant in low pass filter I108, the VCO does not respond to the 32 Hz phase modulation,the type I phase detector in I106 picks up the 32 Hz phase modulation. The output at I106-2 con-

tains a 280 kHz signal duty cycle modulated with 32 Hz. Filter amplifier I108A thus passes astepped 32 Hz waveform to commutative filter I313.

4.3.5 BEARING POINTER CIRCUITRY

The DC values of the stepped waveform into I313-3 represent the average value of the combined140 kHz and 32 Hz duty cycles. This value is proportional to the SINE/COSINE phase differenceat the loop antenna. Short time constant resistor R198 and long time constant resistor R199 arepart of the commutative filter. When the system is unlocked, R199 lengthens the time constant,of the commutative filter, causing the bearing indicator to ignore extraneous data or noise. When

fast lock is enabled, I107B is turned on, removing R199 and leaving R198.

This causes a faster time constant in I313, creating an output which permits bearing tracking. Thewaveform at I313-13 is divided into four steps, or periods; two for each half cycle of the 32 Hz sig-nal. The relative amplitude of the four steps represents the sine and cosine bearing information.Commutative filter I313 is switched by 32 Hz waveforms at pins 9 and 10 and inhibited by two mil-lisecond blanking pulses during the first two milliseconds of the eight millisecond period. The 32Hz waveforms used to switch the commutative filter also modulate the antenna loops, ensuringthe proper sequence and timing in the following circuit operations.

The input and output connections of the capacitors in the commutative filter are switched sequen-tially to a selected capacitor. A different capacitor is switched in for each step, or period, of the 32Hz waveform to permit noise filtering without disturbing the bearing data contained in the step am-plitudes. The output at I313-13 contains negative or positive-going spikes along with the step lev-els of the 32 Hz waveform. These spikes are caused by the switching after the end of each period.The period is approximately eight milliseconds long and the blanking pulse period contained withinit is approximately 2 milliseconds long. During each blanking pulse, I313 is switched off and I310is switched on, permitting the microprocessor to read the bearing correction calibration voltage on

R374. The four level 32 Hz waveform is applied to comparator I308A, which is part of a succes-sive approximation analog-to-digital converter. This circuit includes I308, I314, I316A, I316B andassociated components. As the first DC level is applied to I314-38, the microprocessor sets itsdigital output to a level which causes D to A converter I315 to output a DC voltage equal to one-half the 9 Vdc reference voltage on I315-15. This level is buffered by I316A and B and applied toI308A-5. If this value is the same as that on I308A-4, the output at I308A-2 tells the microproces-sor that the existing DC input level has been determined. If the levels at I308A-4 and -5 are dif-ferent, the level at I308A-2 tells the microprocessor that this voltage is high or low. The micropro-cessor then selects one-half of the original voltage and adds or subtracts to or from the originalvalue depending on whether the original value was high or low, and outputs its digital equivalentto I315. The DC level at I316A goes back through the loop to I308A-5 and is compared again withthe level at I308A-4. This acquisition loop continues until the correct value is determined by themicroprocessor.

When the step level changes, a new acquisition loop begins and the new level is determined. Themicroprocessor also time shares D/A con erter I315 ith the Sine/cosine o tp ts or the AC X


21/229

B KDF 806From I319-4, the sine voltage is level shifted and buffered by output driver I323 and associatedcomponents out to Pin 13 of the unit connector. The cosine follows a similar path to Pin 12 of theunit connector. If 26 Vac, 400 Hz power is applied to the unit and Pin 14 of the unit connector is

grounded, the unit is in the XYZ mode. With Pin 14 of the unit connector grounded, I314-26 ispulled low through CR308. This enables the microprocessor to output the X and Y levels. The Xlevel follows a path similar to that discussed for the sine voltages except the signal is applied toI322. Multiplier IC I322 combines the DC voltage which represents the X level from I320-7 withthe scaled down 26 Vac 400 Hz signal present on I322-4. The result of this operation is a 400 Hzsine wave output on I322-2 whose amplitude is a function of the DC voltage at I320-7. The outputfrom I322-2 is amplified by I323 and associated circuitry to provide the X output on Pin 13 of theunit connector. The Y output is similarly processed to provide an output on Pin 12 of the unit con-nector.

The superflag interface consists of components Q1, R4, R5, Q2, and R7 on the Mute board. Re-sistor R7 provides a load for Q2, when the NAV SUPERFLAG output is not loaded . FET Q1, re-sistors R4 and R5 form a circuit to bias Q2 on if FILT. A/C PWR and NAV FLAG is valid. FET Q2acts as a switchable current source for the NAV SUPERFLAG OUTPUT that is controlled by theoutput of Q1.

4.3.6 XYZ POWER

The 400 Hz 26 Vac is supplied through L323 to CR 309, CR310 and CR311. CR309 and C363

produce +35 Vdc which is supplied to CR 314. CR310 and C364 produce -35Vdc which is sup-plied to CR316. When 26 Vac is supplied in the XYZ mode, CR314 and CR316 become forwardbiased causing CR315 and CR317 to be reverse biased. This increases the voltage in the XYZ

mode to 35 Vdc instead of 12 Vdc.

CR311 and C365 produce another +35 Vdc supply. This is divided by R451, CR312 and R351 toproduce a +20 Vdc supply for the X and Y linear four quadrant multipliers. CR312 is a 20 VoltZener diode. If CR312 becomes reverse biased due to the 26 Vac input dropping, Q324 base ispulled low turning Q324 off. When Q324 turns off, Q325 turns on, CR304 becomes forward bi-

ased, and the 26 Vac supplied to the x and y linear four quadrant multipliers through R389 isgrounded. this inhibits the multipliers and insures that no inaccurate pointing can occur due to alow 26 Vac input in XYZ mode.

4.3.7 RESET CIRCUIT

A lost program reset is contained in I317A and I317B. The low clock outputs from I314 keep I317Bpin 5 low. Pin 7 will also be low, causing I317A pin 2 to be low. I317 pin 1 will be a very highimpedance, allowing C369 to charge through an internal pull up resistor in I314, removing the re-set. When the program is lost, the level on I317B pin 5 will increase causing pin 7 to go to a veryhigh impedance. C368 will then charge toward the level on C369 through R384. When the levelon pin 2 exceeds the level on pin 3, pin 1 will go low, producing a reset into I314. C368 will nowdischarge through R384 until pin 3 exceeds pin 2. I317 pin 1 will go to a high impedance levelreleasing the reset. If the clock resumes, pin 7 of I317B will hold C368 discharged and normaloperation will occur. If not, C368 will charge until another reset is produced.


22/229

B KDF 806The aircraft DC power is filtered by two LC stages before being applied to I501, a three-terminal5 Volt regulator. Zener diode CR502 provides over-voltage protection at the input. The DC inputalso acts as the current source for the transformer primary.

I502A is an open-collector voltage comparator which functions as oscillator. Its positive input isat +2.5 Volts due to Voltage divider resistors R511 and R513. Initially, its output is turned off andC306 begins to charge up through R517, R516, and R515. When its voltage exceeds the 2.5 Voltthreshold, the comparator output goes low, causing it to discharge through R515 and R516. Itmust now discharge to a threshold voltage of about +1.6 Volts, however, since the series combi-nation of R512 and R514 now appears in parallel with R513 in the threshold voltage divider. Po-tentiometer R515 adjusts the time constant of the circuit and hence the oscillation frequency.

Voltage regulation is achieved by comparators I502C and I502D. Comparator I502C monitors the

+12 V line and switches state when the voltage drops below a preset threshold. Its output effec-tively maintains a DC threshold voltage which varies according to the power supply load. This volt-age determines the switching threshold of comparator I502D, the output of which is a constant fre-quency, variable duty cycle switching signal. This signal switches base current to Q502, whichdrives Q503. Q503 provides the increased base drive current to power transistor Q504, whichswitches on the primary current. When the output of I502D pulls low, Q502 shuts off, turning offQ503 and Q504. The turn-off time of Q504 is reduced by the fact that the -26 V tap on the sec-ondary begins to go negative at this time, drawing base current through R521 and C510.

Current flowing through R523 in the emitter of Q504 produces a voltage at the negative input ofcomparator I502B. When excessive current causes the voltage to exceed the 0.5 Volt thresholdat the positive terminal, I502B pulls low, turning off I502A and thereby turning off the switchingtransistors. This provides current-limiting protection.

Transistor switch Q501 turns the power supply on and off. The remote ON signal from the KFS586 is at ground potential when the power supply is on, allowing current to flow through the base-emitter circuit of Q501, then through R502 to ground. This turns Q501 on, providing power to thecontrol portion of the power supply, thus, allowing the power supply to function.

KDF 806


23/229

B KDF 806

Rev. 8, June/2005 05511M07.JA Page 4-13

FIGURE 4-7 KDF 806 BLOCK DIAGRAM


24/229

B KDF 806SECTION V

MAINTENANCE

5.1 INTRODUCTIONThis section contains test, alignment, cleaning, repair, and troubleshooting procedures for theKDF 806 ADF Receiver. Included are detailed assembly/disassembly instructions and trouble-shooting instructions.

Information concerning semiconductor test equipment, semiconductor and integrated circuit main-tenance, and specific integrated circuits used in the KDF 806 System may be found in AppendixA at the end of this manual. It is suggested that Appendix A be consulted before attempting toservice the KDF 806.

WARNINGOPERATION OF THIS EQUIPMENT IN-VOLVES THE USE OF VOLTAGES THAT AREDANGEROUS TO LIFE. BEWARE OF ALLVOLTAGES USED IN THE OPERATION OFTHIS EQUIPMENT AND OBSERVE ALL SAFE-

TY PRECAUTIONS WHEN PERFORMINGANY PROCEDURES OUTLINED IN THISMANUAL.

CAUTION:THIS EQUIPMENT CONTAINS ELECTRO-STATIC DISCHARGE SENSITIVE (ESDS) DE-VICES. ESDS DEVICES INCLUDE, BUT ARENOT LIMITED TO, C-MOS, J-MOS, PMOS,NMOS, SOCMOS,HMOS, MOS/FET, MICRO-WAVE MIXER DIODES, SOME BIPLOAR DE-VICES, AND SOME METAL FILM RESIS-TORS.

MOST DAMAGE TO ESDS DEVICES RE-SULTS IN DEGRADED PERFORMANCE ORPREMATURE FAILURE, NOT IN CATA-STROPHIC FAILURE AT THE TIME EXPERI-ENCED.


25/229

B KDF 8065.2 TEST AND ALIGNMENT

The following test procedures may be followed to determine if the KDF 806 system is operatingproperly. If it is not, alignment procedures are detailed in order to bring the KDF 806 up to its min-

imum performance standards. Refer to FIGURE 5-1 KDF 806 SYSTEM TEST SETUP for a sug-gested test set up.

5.2.1 TEST EQUIPMENT REQUIRED

A. Power supply+13.75 VDC @ 1.5 Amps+27.5 VDC @ .75 Amps

B. Oscilloscope

15MHz scope with external triggering capabilityTektronics 465 or equivalent

C. RF Signal GeneratorHP606A/B or equivalent

D. Digital VoltmeterFluke 8600A or equivalent

E. Frequency CounterMonsanto 100A or equivalent

F. AC VTVMBallantine 310 or equivalent

G. ADF Field SimulatorHoneywell KTS 156 Antenna Simulator (Early KTS 156 units did not include a KDF806 Cable. The additional cable to support KDF 806s is available by ordering PN200-02991-0000).

H. Audio OscillatorHP201C or equivalent

I. Serial Data SimulatorHoneywell KTS 143 Systems Test Set

J. Bench Test Kit Parts List(Optional). All bench testing capabilities are provided through use of the KTS 156and KTS 143.

PART NUMBER DESCRIPTION QUANTITY

-00 -01 -02

030-00005-0000 CONN BNC CA RF 142 1 1 1

030-02350-0001 CONN SUB-MIN F 50P 1 1 1

030-02358-0010 CONN 29P 1 - -

KDF 806


26/229

B KDF 806E. Signal Source Impedance - The signal source output impedance shall be 50 ohms

10% and a reactance of not more than 10% of the transmission line characteristicimpedance.

F. Output Loads -

DC Sine/Cos 3VDC @ 300 mA.Two ARINC Standard 3 wire output (XYZ) or one KNI 581 only (Both pointers).Audio output 100mW across 500 ohms.

KDF 806


27/229

B KDF 806

KDF 806


28/229

B KDF 8065.2.3 FINAL TEST DATA SHEET

Serial No. ________________

NOTE:

The term OK indicates that particular function is op-

erating properly.

5.2.3.1 Current Drain

Measure the DC current drain to the unit. It should be 0.9 A or less at 13.75 Vdc and 0.5 A or lessat 27.5 Vdc.

Input Current = ______________.9 A @ 13.75 Vdc

______________.5 A @ 27.5 Vdc

5.2.3.2 Sensitivity of ADF/ANT/BFO Modes

Apply an unmodulated 70 V, 200 KHz signal to the RF input of the KTS 156 Test Set. The KTS156 switches should be in the following positions:

LOOP Switch - ENSENSE Switch - ENLOAD - RCVR

SW Source - RCVRMODE - BRGMODE - Function Switch - BRGBRG Selector - 0

a. Tune the receiver to 200 KHz and monitor the loaded audio output voltage across a500 ohm load with an AC VTVM. In the antenna mode, adjust the KDF 806 volumeoutput (on the KFS 586) to a convenient level on the VTVM. Modulate the RF signalat 30% with a 1KHz tone and note the increase in the audio output level. A minimum

of 6 dB should be noted.

ANT Sensitivity at 200 KHz, 70 V/m Signal (-70 dBm) (S+N)/N = __________12dB

b. Increase the RF input to 150 V and monitor the audio output voltage with an ACVTVM across 500 ohm load. With the unit tuned to 200 KHz and in the ADF mode,adjust the volume control to a convenient level on the VTVM; then switch the modeto ADF/BFO. The BFO should produce a 1 KHz modulated carrier and an increaseof at least 12 dB on the audio output.

ADF/BFO Sens (S+N)/N = ___________18dB

c. With the receiver tuned to 200 KHz, apply a 150 V signal to the receiver. Turn theunit to the ADF mode and set the audio output on the VTVM at a convenient level.Modulate the RF input at 30% with a 1 KHz tone and note the increase in audio out-put level. A minimum of 6 dB should be noted.


29/229

KDF 806


30/229

B KDF 806Correction Combination:

#1 = No Connection#0 = Line Grounded

5.2.3.8 ADF Output Format Selection and Supplementary Outputs

a. Two different types of output drive are available at the bearing output (Pins 11, 12,and 13 of the main connector). DC SIN/COSINE outputs are available by leavingPin 17 to Pin 43 of the main connector open. Pin 11 (COMMON) is at chassis

ground; Pin 12 COSINE output and Pin 13 SIN output will vary from -3 Vdc .3 Vdcto + 3 Vdc .3 Vdc depending upon the selected bearing. The 3 wire synchro XYZoutputs are available by connecting Pins 17 and 43 together. Pin 49 must have 26Vac 400 Hz provided externally to it. Pin 11 (Z) is at AC ground, Pin 12 (Y) output

and Pin 13 (X) output will have a -11.8 Vrms 3% to +11.8 Vrms 3% bearing output(ARINC drive levels) depending upon the selected bearing.

(Check OK) Pin 17 and 43 not connected = DC Mode ______OK(Check OK) Pin 17 and 43 connected = XYZ AC Mode ______OK

b. Check proper voltages for DC SIN/COSINE and AC XYZ modes: (as described in

DEGREES OF CORRECTION 1 (36) 2 (37) 4 (38) 8 (39)

1.00 1 1 1

2.0 1 0 1 1

3.0 0 0 1 1

4.0 1 1 0 1

5.0 0 1 0 1

6.0 1 0 0 1

7.0 0 0 0 1

8.0 1 1 1 0

9.0 0 1 1 0

10.5 1 0 1 0

11.5 0 0 1 0

13.0 1 1 0 0

14.5 0 1 0 0

15.5 1 0 0 0

17.0 0 0 0 0

B KDF 806


31/229

806

c. KNI 581 RMI Select/XYZ output levels are obtained by having the unit in the AC 3wire synchro mode, grounding Pin 14 to Pin 42 of the main connector, the X and Y

AC bearing outputs are reduced to approximately +6Vrms to -6Vrms 4 (when an-

tenna or KTS 156 is rotated 360 ); so that a KNI 581 may be driven by the KDF 806.

XY reduced output/KNI 581 select = _____ Vrms to _____ Vrms +6Vrms to -6V rms

4%

d. The LOCK output at Pin 35 of the main connector shall be 5Vdc 1 Vdc (loaded notgreater than 10K) whenever the unit is not locked onto a frequency with the unit inADF mode or whenever the unit is in the ANT (antenna) mode. The output shall be

0 V .5 Vdc when in the ADF mode and the unit is locked onto a frequency.

locked _______V 0 .5 VdcNot locked _______V 5 1 Vdc

e. (066-1077-01 only) With 27.5 V applied to the unit, the superflag output at Pin 21 ofthe main connector shall be NMT 3.5 Vdc whenever the unit is not locked onto a fre-quency with the unit in ADF mode or whenever the unit is in ANT (antenna ) mode.The output shall be >25.5 Vdc @ .25 A max when the unit is in the ADF mode andthe unit is locked on frequency.

5.2.4 ALIGNMENT

The following instructions describe the alignment procedures for the KDF 806 Receiver. If the pre-ceding tests have indicated a need for alignment, follow these procedures while referring to thedisassembly instructions (Paragraph 5.3.4 DISASSEMBLY/ASSEMBLY), schematics and assem-bly drawings for the location of components, adjustments, and test points. The KFS 586 is a re-quired item of test equipment to align the KDF 806 Receiver. Refer to FIGURE 5-1 KDF 806 SYS-TEM TEST SETUP for a typical KDF 806 test setup. It should be noted that if an entire system isto be aligned, the KA 44B antenna should be aligned first, if only the KDF 806 Receiver is to bealigned, either the KA 44B antenna or the KTS 156 test set may be used.

5.2.4.1 Power Supply

a. Turn KFS 586 function switch to ADF or ANT.

b. Remove power supply cover.

c. Adjust R529 for 12 .05 Vdc at P502-7.

d. Adjust R515 for 18.66 kHz 50 Hz at TP501.e. Check the following voltages:

190 10 Vdc at P502-4-12 1 Vdc at P502-6

B KDF 806


32/229

5.2.4.2 RF Preselector

NOTE:

The preselector has been sweep aligned at the fac-

tory and should not need realignment unless one of

the RF preselector transformers is replaced. To en-

sure optimum performance, do not attempt to realign

the preselector unless a problem can be definitely

traced to the filter section or a new transformer is in-

stalled.

Two alignment procedures are described. The first procedure is used if an RF sweep generator

8610A or equivalent) is available. If a sweep generator is not available, use the second procedureto tune the preselector sections to within 1 dB of an optimum response using an RF generator anda digital voltmeter.

5.2.4.3 Sweep Procedure

The following procedures utilize the RF sweep generator and an oscilloscope with a horizontalsweep input to produce an observable bandpass spectrum of each of the four preselector filters.The procedure consists of adjusting the band-edge frequencies to convenient reference graticuleson the oscilloscope, then adjusting the preselector coils to attain the desires bandpass spectrumin relation to the desired band-edges.

a. Connect equipment as shown in FIGURE 5-2 SWEEP ALIGNMENT EQUIPMENTSET-UP.

B KDF 806


33/229

FIGURE 5-2 SWEEP ALIGNMENT EQUIPMENT SET-UP

b. Place sweep generator in CW mode, set center frequency to 239 kHz. Set sweepwidth to 285 kHz. Tune receiver to 237 kHz.

c. Put sweep generator in manual sweep mode and manually sweep down to 190 kHz.

Position the stationary scope trace on a convenient location on vertical graticule onthe left side of the scope screen. (If an 8601A is used, set the X-channel gain at 1V/DIV, DC coupled).

d. Sweep up to 285 kHz manually and note the position at the stationary line on theright side of the scope screen.

e With the two band edges noted put the sweep generator in the fast sweep mode

B KDF 806


34/229

FIGURE 5-3 190-205 KHZ BANDPASS FILTER RESPONSE

The levels at the 190 and 284 kHz band-edges should be equal within .5 dB. The

ripple should be equal across the passband, and maximum passband should be at-tained.

g. Tune the receiver to 343 kHz and set the sweep generator center frequency to 343kHz.

h. Refer to steps c. and d. and set the band-edges the same except the corner frequen-cies should be 285 kHz at the left of the scope waveform and 400 kHz at the right ofthe scope waveform.

i. Adjust T104, T105 and T106 as in Step F, and attain a waveform spectrum similar

to FIGURE 5-4 285-400 KHZ BANDPASS FILTER RESPONSE.

B KDF 806


35/229


j. Tune the receiver to 400 kHz and set the sweep generator center frequency to 500kHz.

k. Refer to Steps c. and d., set the band-edges to 400 kHz at the left of the scope wave-form and 600 kHz at the right of scope screen.

l. Adjust T107, T108, and T109 to attain a spectrum waveform similar to FIGURE 5-5400-600 KHZ BANDPASS FILTER RESPONSE.

B KDF 806


36/229


5.2.4.4 Alternate Sweep Procedure

NOTE:

This procedure is only to be used when the sweep

alignment is impractical or the necessary equipment

is unavailable. Alignment of the reference oscillator,

VCO and RF/IF in the next three paragraphs should

be performed prior to using the following alternate

preselector alignment procedures. All frequency tol-

erances are 50 Hz.

a. Connect equipment as shown in FIGURE 5-7 ALTERNATE ALIGNMENT TESTSETUP.

B KDF 806


37/229

FIGURE 5-7 ALTERNATE ALIGNMENT TEST SETUP

b. Solder a small jumper wire on the back side of the receiver board from Pin 2 to Pin4 of T101. Also, solder a jumper wire from Pin 2 to Pin 4 of T103.

c. Tune the receiver to 233 kHz and apply a 10 mV, 233 kHz signal directly into thereceiver antenna connector with an RF signal generator. Monitor the AGC voltageat TP102 with a voltmeter.

B KDF 806


38/229

e. Remove the jumper and solder a 2.2 k resistor from Pin 1 to Pin 3 of T103. Applya 1 mV, 190 kHz signal to the receiver and tune the receiver to 190 kHz. Tune T101for peak AGC.

f. Remove the 2.2 k resistor from T103 and solder it from Pin 1 to Pin 3 of T101. Ap-ply a 1mV, 284 kHz signal, tune the receiver to 284 kHz and tune T103 for peakAGC.

g. Repeat Steps e and f until no further adjustment is possible.

h. Solder a jumper wire from Pin 2 to Pin 4 of T106. Apply a 10 mV, 338 kHz signaland tune the receiver to 338 kHz. Tune T105 for maximum AGC.

i. Remove the jumper and solder a 2.2 k resistor from Pin 1 to Pin 3 of T106. Applya 1 mV, 285 kHz signal and tune the receiver to 285 kHz. Tune T104 for maximum

AGC.j. Remove the 2.2 k resistor from Pins 1 and 3 of T106 and solder it from Pins 1 and

3 of T104. Apply a 1 mV, 399 kHz signal and tune the receiver to 399 kHz. TuneT106 for maximum AGC.

k. Remove the 2.2 k resistor from T104 and repeat Steps i and j until no further ad-justment is possible.

l. Solder short jumpers from Pin 2 to Pin 3 of T107 and from Pin 2 to Pin 3 of T109.Apply a 10 mV, 490 kHz signal and tune the receiver to 490 kHz. Tune T108 for

maximum AGC.m. Remove the jumpers and solder a 1.5 kresistor from Pin 1 to Pin 3 of T109. Apply

a 1mV, 400 kHz signal and tune the receiver to 400 kHz. Tune T107 for maximumAGC.

n. Remove the 1.5 k resistor from T109 and connect it from Pin 1 to Pin 3 of T107.Apply a 1 mV, 599 kHz signal and tune the receiver to 599 kHz. Tune T109 for max-imum AGC.

o. Remove the jumpers and solder a 1.5 kresistor from Pin 1 to Pin 3 of T112. Applya 1 mV, 600 kHz signal and tune the receiver to 600 kHz. Tune T110 for maximumAGC.

5.2.4.5 Reference Oscillator (Initial)

a. Connect frequency counter or oscilloscope to I301-17.

b. Adjust C302 to measure 2.048 MHz 25 Hz.

5.2.4.6 VCO

a. With the receiver tuned to 190 kHz, adjust C335 such that the potential across

TP301 is 3.5V .1V, if possible; otherwise adjust as close to 3.5 V as possible withinthe range 3.5 V 1V.

b. Tune the receiver to 550 kHz and adjust R313 for 1.8 Vp-p at junction of C322 andL303

B KDF 806


39/229

NOTE:

Receiver should be tuned to 500 kHz

Repeatedly adjust T115, T116 and T117 to obtain the maximum AGC reading until

no noticeable improvement can be obtained.

c. Swamp C135 by placing a 2k resistor in parallel with it. Tune T118 for maximumAGC. Remove swamping resistor.

d. Swamp R125 by placing a 2 k resistor in parallel with it. Tune T119 for maximumAGC. Remove swamping resistor.

e. Swamp R130 by placing a 10 k resistor in parallel with it. Tune T120 for maximumAGC. Remove swamping resistor.

f. Swamp R129 by placing a 2 k resistor in parallel with it. Tune T121 for maximumAGC. Remove swamping resistor.

NOTE:

The RF input level may have to be increased when

swamping in steps C, D, E and F to maintain an AGC

voltage near 6 V.

NOTE:

The RF input level should be reduced during thealignment such that the AGC is maintained at ap-

proximately 6 V.

5.2.4.8 Reference Oscillator Final Adjustment

a. With the receiver tuned to 500 kHz, set the RF input frequency to 498.5 kHz20 Hz,10 V unmodulated. Note the AGC potential as measured on TP102 or on J8061,Pin 32 the main connector AGC test line. Change the RF input frequency to 501.5kHz and again note the AGC potential. Readjust C302 until the AGC potential isequal at these two frequencies.

b. Repeat Steps 5.2.4.7 and 5.2.4.8 until no noticeable improvement can be obtained.

5.2.4.9 AGC Voltage

a. Tune the receiver to 200 kHz and apply an input to the receiver of 200 kHz at 60 V(-20 dB above threshold of receiver) with no modulation.

b. Adjust R149 to obtain 7 1 Vdc at TP101.5.2.4.10 Mixer Balance

a. Set the RF input to 200 kHz at 3.5 V with no modulation and tune the receiver to200 kHz.

b Adjust the audio output (with volume control) so noise output from receiver is ap

B KDF 806


40/229

b. Adjust T122 to obtain:

(1) 6.4 .2 Vdc at TP104 on later units serial number 1650 and above.

(2) 5.0 .2 Vdc at TP104 on earlier units below serial number 1650.

5.2.4.12 DC, SIN, COS Driver

a. Make certain that the 26 Vac 400 Hz is not applied to the unit and that Pin 17 of theunit connector is ungrounded (This puts the unit in the DC SIN, COS mode). Also,do not apply any load to the bearing indicator outputs of the unit (Pin 12, 13 of theunit connector).

b. Ground TP303 and adjust R433 for the best null simultaneously on both Pins 12 and

13 of the unit connector (as measured with DC voltmeter from Pins 12 and 13 toground).

c. Unground TP303 and ground TP304 and adjust R410 for the best null looking differ-entially between Pins 12 and 13 of the unit connector.

d. Repeat steps B and C until no improvement can be made.

5.2.4.13 AC XYZ Driver

a. Connect 26 Vac 400 Hz power to the unit and ground Pin 17 of the unit connector(This puts the unit in the XYZ mode). Also, do not apply any load to the bearing in-dicator outputs of the unit (Pins 12 and 13 and the unit connector).

b. With TP303 grounded, adjust R395 for the best null as measured with an AC volt-meter on Pin 13 of the unit connector.

c. With TP303 grounded, adjust R394 for the best null as measured with an AC volt-meter on Pin 12 of the unit connector.

d. Monitor the input 26 Vac with an AC voltmeter and unground TP303 and ground

TP304. Adjust R412 such that the output as measured with an AC voltmeter on Pin13 of the unit connector is (11.8/26) .454 times the input AC voltage.

e. Repeat step D while adjusting R399 and looking at Pin 12 of the unit connector.

5.2.4.14 Rotational Pointing

a. Channel the radio to 350 kHz and place it in the ADF mode. Provide an input to thereceiver from a KTS 156 antenna simulator.

b. The input to the simulator should be 350 kHz, unmodulated and at a signal strength

equivalent to 700 V/m at a bearing of 0 .1 . The unit should be set up to provideDC sine, cosine output.

c. Monitor the voltage between J1-13 and ground.

d. Adjust R374 to obtain an output reading of 0 V 20 mV (average DC reading).

B KDF 806


41/229

5.3 OVERHAUL

5.3.1 VISUAL INSPECTION

This section contains instructions and information to assist in determining, by visual inspection,the condition of the units major assemblies and subassemblies. These inspection procedures willassist in finding defects resulting from wear, physical damage, deterioration, or other causes. Toaid inspection, detailed procedures are arranged in alphabetical order.

A. Capacitors, Fixed

Inspect capacitors for case damage, body damage, and cracked, broken, orcharred insulation. Check for loose, broken, or corroded terminal studs, lugs, orleads. Inspect for loose, broken, or improperly soldered connections. On chip caps,

be especially alert for hairline cracks in the body and broken terminations.B. Capacitors, Variable

Inspect trimmers for chipped and cracked bodies, damaged dielectrics, and dam-aged contacts.

C. Chassis

Inspect the chassis for loose or missing mounting hardware, deformation, dents,damaged fasteners, or damaged connectors. In addition, check for corrosion ordamage to the finish that should be repaired.

D. Circuit Boards

Inspect for loose, broken, or corroded terminal connections; insufficient solder orimproper bonding; fungus, mold, or other deposits; and damage such as cracks,burns, or charred traces.

E. Connectors

Inspect the connector bodies for broken parts; check the insulation for cracks, andcheck the contacts for damage, misalignment, corrosion, or bad plating. Check for

broken, loose, or poorly soldered connections to terminals of the connectors. In-spect connector hoods and cable clamps for crimped wires.

F. Covers and Shields

Inspect covers and shields for punctures, deep dents, and badly worn surfaces. Al-so, check for damaged fastener devices, corrosion and damage to finish.

G. Flex Circuits

Inspect flex circuits for punctures, and badly worn surfaces. Check for broken trac-es, especially near the solder contact points.

H. Front Panel

Check that name, serial, and any plates or stickers are secure and hardware istight. Check that the handle is functional, securely fastened, and handle casting isnot damaged or bent.

I Fuse

B KDF 806


42/229

L. Potentiometers

Inspect all potentiometers for evidence of damage or loose terminals, cracked in-sulation or other irregularities.

M. Resistors, FixedInspect the fixed resistors for cracked, broken, blistered, or charred bodies andloose, broken, or improperly soldered connections. On chip resistors, be especiallyalert for hairline cracks in the body and broken terminations.

N. RF Coils

Inspect all RF coils for broken leads, loose mountings, and loose, improperly sol-dered, or broken terminal connections. Check for crushed, scratched, cut orcharred windings. Inspect the windings, leads, terminals and connections for cor-

rosion or physical damage. Check for physical damage to forms and tuning slugadjustment screws.

O. Terminal Connections Soldered

(1) Inspect for cold-soldered or resin joints. These joints present a porous ordull, rough appearance. Check for strength of bond using the points of atool.

(2) Examine the terminals for excess solder, protrusions from the joint, piecesadhering to adjacent insulation, and particles lodged between joints, con-

ductors, or other components.

(3) Inspect for insufficient solder and unsoldered strands of wire protrudingfrom the conductor at the terminal. Check for insulation that is stripped backtoo far from the terminal.

(4) Inspect for corrosion at the terminal.

P. Transformers

(1) Inspect for signs of excessive heating, physical damage to the case,

cracked or broken insulation, and other abnormal conditions.(2) Inspect for corroded, poorly soldered, or loose connecting leads or termi-

nals.

Q. Wiring/Coaxial Cable

Inspect wiring in chassis for breaks in insulation, conductor breaks, cut or brokenlacing and improper dress in relation to adjacent wiring or chassis.

5.3.2 CLEANINGA. General

This section contains information to aid in the cleaning of the component parts andsubassemblies of the unit.

WARNING B KDF 806


43/229

WARNING:OPERATIONS INVOLVING THE USE OF ACLEANING SOLVENT SHOULD BE PER-

FORMED UNDER A VENTILATED HOOD.AVOID BREATHING SOLVENT VAPOR ANDFUMES; AVOID CONTINUOUS CONTACTWITH THE SOLVENT. WEAR A SUITABLEMASK, GOGGLES, GLOVES, AND AN APRONWHEN NECESSARY. CHANGE CLOTHINGUPON WHICH SOLVENTS HAVE BEENSPILLED.

WARNING:OBSERVE ALL FIRE PRECAUTIONS FORFLAMMABLE MATERIALS. USE FLAMMABLEMATERIALS IN A HOOD PROVIDED WITHSPARK-PROOF ELECTRICAL EQUIPMENTAND AN EXHAUST FAN WITH SPARKPROOF

BLADES.

B. Recommended Cleaning Agents

TABLE 5-1 RECOMMENDED CLEANING AGENTS lists the recommended clean-ing agents to be used during overhaul of the unit.

NOTE:

EQUIVALENT SUBSTITUTES MAY BE USED FORLISTED CLEANING AGENTS.

TYPE USED TO CLEAN

Denatured Alcohol Various, exterior and interior

DuPont Vertrel SMT Various, interior

PolaClear Cleaner (Polaroid Corp.) or Tex-

wipe TX129 (Texwipe Co.)

CRT display filter, LCD displays, and gen-

eral purpose lens/glass cleaner.

KimWipes lint-free tissue Various

B KDF 806


44/229

C. Recommended Cleaning Procedures

CAUTION:

DO NOT ALLOW SOLVENT TO RUN INTOSLEEVES OR CONDUIT THAT COVERSWIRES CONNECTED TO INSERT TERMI-NALS.

1. Exterior

(a) Wipe dust cover and front panel with a lint-free cloth dampened withdenatured alcohol.

(b) For cleaning connectors, use the following procedure.(1) Wipe dust and dirt from bodies, shells, and cable clamps us-

ing a lint-free cloth moistened with denatured alcohol.

(2) Wipe parts dry with a clean, dry lint-free cloth.

(3) Remove dirt and lubricant from connector inserts, insulation,and terminals using a small soft bristled brush moistenedwith denatured alcohol.

(4) Dry the inserts with an air jet.

(c) Remove cover(s).

(d) If necessary, open any blocked ventilation holes by first saturatingthe debris clogging the apertures with denatured alcohol and thenblowing the loosened material out with an air stream.

2. Interior

The following solvents are no longer recommended for benchtop or reworkcleaning of printed circuit boards, modules, or sub-assemblies.

FREON TF, IMC TRICHLOROETHANE

CARBON TETRACHLORIDE DETERGENT (ALL AND EQUIVALENTS)

CHLOROFORM METHYLENE CHLORIDE

TRICHLOROETHYLENE GENESOLV 2004/2010

PROPYL ALCOHOL METHYL ALCOHOL

B KDF 806CAUTION


45/229

CAUTION:DO NOT USE SOLVENT TO CLEAN PARTSCOMPOSED OF OR CONTAINING NYLON OR

RUBBER GROMMETS. CLEAN THESEITEMS WITH MILD LIQUID DISHWASHINGDETERGENT AND WATER. USE DETER-GENT FOR THIS PURPOSE ONLY.

CAUTION:DUPONT VERTREL SMT DOES HAVE GEN-ERAL MATERIAL COMPATIBILITY PROB-

LEMS WITH POLYCARBONATE, POLYSTY-RENE, AND RUBBER. IT IS RECOMMENDEDTHAT THESE MATERIALS BE CLEANEDWITH DENATURED ALCOHOL.

CAUTION:DO NOT ALLOW EXCESS CLEANING SOL-

VENT TO ACCUMULATE IN ANY OF THE AD-JUSTMENT SCREW CREVICES AND THERE-BY SOFTEN OR DISSOLVE THE ADJUST-MENT SCREW EPOXY SEALANT.

CAUTION:AVOID AIR-BLASTING SMALL TUNING COILSAND OTHER DELICATE PARTS BY HOLDINGTHE AIR NOZZLE TOO CLOSE. USE BRUSH-ES CAREFULLY ON DELICATE PARTS.

CAUTION:IMPROPER CLEANING CAN RESULT IN SUR-FACE LEAKAGE AND CONDUCTIVE PARTIC-ULATES, SUCH AS SOLDER BALLS OR ME-

TALLIC CHIPS, WHICH CAN CAUSE ELEC-TRICAL SHORTS. SEVERE IONIC CONTAM-INATION FROM HANDLING AND FROMENVIRONMENTAL CONDITIONS CAN RE-SULT IN HIGH RESISTANCE OR OPEN CIR-

B KDF 806NOTE


46/229

NOTE:

Solvents may be physically applied in several ways

including agitation, spraying, brushing, and vapor

degreasing. The cleaning solvents and methodsused shall have no deleterious effect on the parts,

connections, and materials being used. If sensitive

components are being used, spray is recommended.

Uniformity of solvent spray flow should be maxi-

mized and wait-time between soldering and cleaning

should be minimized.

NOTE:Clean each module subassembly. Then remove any

foreign matter from the casting.

Remove each module subassembly. Then remove any foreign matter fromthe casting.

(a) Casting covers and shields should be cleaned as follows:

(1) Remove surface grease with a lint-free cloth.

(2) Blow dust from surfaces, holes, and recesses using an airstream.

(3) If necessary, use a solvent, and scrub until clean, workingover all surfaces and into all holes and recesses with a suit-able non-metallic brush.

(4) Position the part to dry so the solvent is not trapped in holesor recesses. Use an air stream to blow out any trapped sol-vent.

(5) When thoroughly clean, touch up any minor damage to thefinish.

(b) Assemblies containing resistors, capacitors, rf coils, inductors,transformers, and other wired parts should be cleaned as follows:

(1) Remove dust and dirt from all surfaces, including all partsand wiring, using soft-bristled brushes in conjunction with airstream.

(2) Any dirt that cannot be removed in this way should be re-moved with a brush (not synthetic) saturated with an ap-proved solvent, such as mentioned above. Use of a clean,dry air stream (25 to 28 psi) is recommended to remove anyexcess solvent.

(3) Remove flux residue, metallic chips, and/or solder balls with

B KDF 806NOTE:


47/229

NOTE:

When necessary to disturb the dress of wires and

cables, note the positions before disturbing and re-

store them to proper dress after cleaning.(1) Blow dust from surfaces, holes, and recesses using an air

jet.

(2) Finish cleaning chassis by wiping finished surfaces with alint-free cloth moistened with solvent.

(3) Dry with a clean, dry, lint-free cloth.

(4) When thoroughly clean, touch-up any minor damage to the

finish.(5) Protect the chassis from dust, moisture, and damage pend-ing inspection.

(d) Ceramic and plastic parts should be cleaned as follows:

(1) Blow dust from surfaces, holes, and recesses using an airjet.

(2) Finish cleaning chassis by wiping finished surfaces with alint-free cloth moistened with solvents.

(3) Dry with a clean, dry, lint-free cloth.

5.3.3 REPAIR

A. General

This section contains information required to perform limited repairs on the unit.The repair or replacement of damaged parts in airborne electronic equipment usu-ally involves standard service techniques. In most cases, examination of drawingsand equipment reveals several approaches to perform a repair. However, certainrepairs demand following an exact repair sequence to ensure proper operation ofthe equipment. After correcting a malfunction in any section of the unit, it is recom-mended that a repetition of the functional test of the unit be performed.

B. Repair Precautions

WARNINGTHIS UNIT CONTAINS VOLTAGES THAT ARE

DANGEROUS TO LIFE. REMOVE ALL POW-ER BEFORE PROCEEDING WITH REPAIR.

CAUTIONTHIS EQUIPMENT CONTAINS ELECTRO-

B KDF 8061 Ensure that all ESDS and MOS handling precautions are followed


48/229

1. Ensure that all ESDS and MOS handling precautions are followed.

2. Perform repairs and replace components with power disconnected fromequipment.

3. Use a conductive table top for repairs and connect table to ground conduc-tors of 60Hz and 400Hz power lines.

4. Replace connectors, coaxial cables, shield conductors, and twisted pairsonly with identical items.

5. Reference component side of a printed circuit board in this manual meansthe side on which components are located; solder side refers to the otherside. The standard references are as follows: nearside is the componentside; farside is the solder side; on surface mount boards with components

on both sides, the nearside is the side that has the J#### and P#### con-nector numbers.

6. When repairing circuits, carefully observe lead dress and component orien-tation. Keep leads as short as possible and observe correct repair tech-niques.

7. There are certain soldering considerations with surface mount compo-nents. The soldering iron tip should not touch the ceramic component body.The iron should be applied only to the termination-solder filet.

8. Observe cable routing throughout instrument assembly, prior to disassem-bly, to enable a proper reinstallation of cabling during reassembly proce-dures.

C. Electrostatic Sensitive Devices (ESDS) Protection

1. Always discharge static before handling devices by touching somethingthat is grounded.

2. Use a wrist strap grounded through a 1M resistor.

3. Do not slide anything on the bench. Pick it up and set it down instead.

4. Keep all parts in protective cartons until ready to insert into the board.

5. Never touch the device leads or the circuit paths during assembly.

6. Use a grounded tip, low wattage soldering station.

7. Keep the humidity in the work environment as high as feasibly possible.

8. Use grounded mats on the work station unless table tops are made of ap-proved antistatic material.

9. Do not use synthetic carpet on the floor of the shop. If a shop is carpeted,ensure that a grounded mat is placed at each workstation.

10. Keep common plastics out of the work area.

B KDF 806D MOS Device Protection


49/229

D. MOS Device Protection

MOS (Metal Oxide Semiconductor) devices are used in this equipment. While theattributes of MOS type devices are many, characteristics make them susceptibleto damage by electrostatic or high voltage charges. Therefore, special precautionsmust be taken during repair procedures to prevent damaging the device. The fol-lowing precautions are recommended for MOS circuits, and are especially impor-tant in low humidity or dry conditions.

1. Store and transport all MOS devices in conductive material so that all ex-posed leads are shorted together. Do not insert MOS devices into conven-tional plastic snow or plastic trays used for storing and transporting stan-dard semiconductor devices.

2. Ground working surfaces on workbench to protect the MOS devices.

3. Wear cotton gloves or a conductive wrist strap in series with a 200K resis-tor connected to ground.

4. Do not wear nylon clothing while handling MOS devices.

5. Do not insert or remove MOS devices with power applied. Check all powersupplies to be used for testing MOS devices. and be sure that there are novoltage transients present.

6. When straightening MOS leads, provide ground straps for the apparatus for

the device.7. Ground the soldering iron when soldering a device.

8. When possible, handle all MOS devices by package or case, and not byleads. Prior to touching the device, touch an electrical ground to displaceany accumulated static charge. The package and substrate may be elec-trically common. If so, an electrical discharge to the case would cause thesame damage as touching the leads.

9. Clamping or holding fixtures used during repair should be grounded, as

should the circuit board, during repair.10. Devices should be inserted into the printed circuit boards such that leads

on the back side do not contact any material other than the printed circuitboard (in particular, do not use any plastic foam as a backing).

11. Devices should be soldered as soon as possible after assembly. All solder-ing irons must be grounded.

12. Boards should not be handled in the area around devices, but rather byboard edges.

13. Assembled boards must not be placed in conventional, home-type, plasticbags. Paper bags or antistatic bags should be used.

14. Before removing devices from conductive portion of the device carrier,make certain conductive portion of carrier is brought in contact with wellgrounded table top

B KDF 8063. Dress and form leads of replacement component; insert leads into correct


50/229

p p ;holes.

4. Insert replacement component observing correct orientation.

F. PC Board, Multi-Lead Component Removal (ICs, etc.)

1. Remove component by clipping each lead along both sides. Clip off leadsas close to component as possible. Discard component.

2. Heat hole from solder side and remove clipped lead from each hole.

3. Melt solder in each hole, and using a desoldering tool, remove solder fromeach hole.

4. Insert replacement component observing correct orientation.

5. Solder component in place from farside of board. Avoid solder runs. No sol-der is required on contacts where no traces exist.

G. Replacement of Power Transistors

1. Unsolder leads and remove attaching hardware. Remove transistor andhard-coat insulator.

2. Apply Thermal Joint Compound Type 120 (Wakefield Engineering, Inc.) to

the mounting surface of the replacement transistor.

3. Reinstall the transistor insulator and the power transistor using hardwareremoved in step (1).

4. After installing the replacement transistor, but before making any electricalconnections, measure the resistance between the case of the transistorand the chassis, to ensure that the insulation is effective. The resistancemeasured should be greater than 10M.

5. Reconnect leads to transistor and solder in place.

H. Replacement of Printed Circuit Board Protective Coating

WARNINGCONFORMAL COATING CONTAINS TOXICVAPORS! USE ONLY WITH ADEQUATE VEN-TILATION.

1. Clean repaired area of printed circuit board per instructions in the 5.3.2CLEANING section of this manual.

2. Apply Conformal Coating, Humiseal #1B-31 HYSOL PC20-35M-01 (Hu-miseal Division, Columbia Chase Corp., 24-60 Brooklyn Queens Express-way West Woodside N Y 11377) P/N 016-01040-0000


51/229

B KDF 8065.3.4 DISASSEMBLY/ASSEMBLY


52/229

The KDF 806 can be disassembled into basic subassemblies. The following procedures will alloweasy access to all parts for adjustments and/or troubleshooting during repair. Refer to assemblydrawings, alignment procedures, troubleshooting charts, and schematics as necessary.

Unlock and remove the dust cover by turning the DZUS fastener located at each end of the coverCCW.

CAUTION:Use a low wattage soldering iron when replacingcomponents.

CAUTION:Observe care when handling any of the semi-conductor devices.

CAUTION:Replace washers and any transistor insulatingwashers or caps to the same original type.

CAUTION:Clean areas of repair after assuring all exces-sive component areas are clipped and removed.

A. Receiver Board Disassembly

1. Remove the Receiver Board dust cover and expose the board parts. (Anyalignment procedures necessary can be performed at this time. All parts

and test points are accessible for troubleshooting.)

2. Remove a phillips screw at each corner and one in the middle of the board.

3. Remove the two phillips screws at the antenna plate.

4. Carefully lift the Receiver Board away from the chassis.

5. Complete part replacement or component check.

6. To replace the Receiver Board follow the above procedure in reverse, tak-ing care that the interconnecting male pins of the main board mate properly

to the Receiver Board female receptacle sockets.B. Power Supply Disassembly

1. To gain access to the power supply parts for voltage checks, alignment, ortroubleshooting remove the 4 phillips screws (1 in each corner) in the topcover plate.

B KDF 8063. To remove the power supply board, disassemble the mounting hardware

Q Q (


53/229

that secures Q503 and Q504 to the heat-sink (Be sure to note the relativepositions of the transistor mounting hardware). Unscrew the 4 standoffstuds, one at each corner of the board, and lift the power supply board off

of the power supply chassis.4. To reassemble, follow this procedure in reverse. Assure that the intercon-

necting male pins of the main board mate properly with the female socketsin the power supply board.

C. Main Board Disassembly

1. Remove the 4 nuts as described in procedure B-2 and remove the powersupply module from the system main frame since the power supply moduleis secured to the main frame with these four nuts removed.

2. Remove the 2 phillips screws found at the ends of the main connector onthe face plate.

3. Lift the plate covering I302 and remove the phillips screw from the cornerof the board.

4. Remove the remaining 5 phillips screws; 3 are at the corners of the mainboard and the other 2 are outside the fence of I302.

D. Re-assembly

To re-assemble, follow the above procedure in reverse. Be sure to align the maleinterconnecting pins carefully into the female sockets of the power supply and re-ceiver board assemblies.

5.4 TROUBLESHOOTING

Included in this section are troubleshooting flowcharts and waveforms. Additional waveforms andsignificant voltage levels are contained on the schematic diagrams.

5.4.1 GENERAL TROUBLESHOOTING FLOWCHART

The unit troubleshooting flowchart begins with a unit flowchart which narrows the trouble to a cir-cuit flowchart. See FIGURE 5-8 UNIT TROUBLESHOOTING FLOWCHART, FIGURE 5-9 POW-ER SUPPLY TROUBLESHOOTING FLOWCHART, FIGURE 5-10 IF CIRCUIT TROUBLE-SHOOTING FLOWCHART, FIGURE 5-11 COHERENT DETECTOR TROUBLESHOOTINGFLOWCHART, FIGURE 5-12 AUDIO CIRCUIT TROUBLESHOOTING FLOWCHART, FIGURE5-13 BEARING DETECTOR TROUBLESHOOTING FLOWCHART, and FIGURE 5-14 TROU-BLESHOOTING WAVEFORMS.


54/229

B KDF 806


55/229

B KDF 806


56/229

B KDF 806


57/229


B KDF 806


58/229

Rev. 8, June/2005 05511M07.JA Page 5-35

FIGURE 5-11 COHERENT DETECTOR TROUBLESHOOTING FLOWCHART

B KDF 806


59/229

B KDF 806


60/229

B KDF 806


61/229

B KDF 806


62/229

B KDF 806


63/229

B KDF 806


64/229


B KDF 806SECTION VI

ILLUSTRATED PARTS LIST


65/229

6.1 GENERALThe Illustrated Parts List (IPL) is a complete list of assemblies and parts required for the unit. TheIPL also provides for the proper identification of replacement parts. Individual parts lists within thisIPL are arranged in numerical sequence starting with the top assembly and continuing with thesub-assemblies. All mechanical parts will be separated from the electrical parts used on the sub-assembly. Each parts list is followed by a component location drawing.

Parts identified in this IPL by Honeywell part number meet design specifications for this equipmentand are the recommended replacement parts. For warranty information concerning Honeywell re-placement parts, consult the www.bendixking.com website.

Some part numbers may not be currently available. Consult the current Honeywell catalog or con-tact a Honeywell representative for equipment availability.

6.2 REVISION SERVICE

The manual will be revised as necessary to reflect current information.

6.3 LIST OF ABBREVIATIONS

Abbreviation Name

B Motor or Synchro

C Capacitor

CJ Circuit Jumper

CR Diode

DS Lamp

E Voltage or Signal Connect Point

F Fuse

FL Filter

FT Feedthru

I Integrated Circuit

J J k Fi d C t B KDF 806RT Thermistor

Abbreviation Name


66/229

RT Thermistor

S Switch

T Transformer

TP Test Point

U Component Network, Integrated Circuit,Circuit Assembly

V Photocell/Vacuum Tube

W Waveguide

Y Crystal

B KDF 8066.4 SAMPLE PARTS LIST


67/229

B KDF 806


68/229


B KDF 8066.5 KDF 806 FINAL ASSEMBLY

PN DESCRIPTION REV


69/229

PN DESCRIPTION REV-----------------------------------------------------------------------

066-1077-00 ADF RECEIVER ASSY AA066-1077-01 ADF RECEIVER ASSY AA

--------------------------------------------------------------------------------------------------------SYMBOL PART NUMBER FIND NO DESCRIPTION UM -0000 -0001--------------------------------------------------------------------------------------------------------REF100 000-00337-0002 PRODUCT STRUCTURE DIAGRAM, KD F806 RF .00 .REF100 000-00812-0002 PRODUCT STRUCTURE DIAGRAM KDF 806 RF . .00

012-01005-0000 TAPE MYLAR 3 W AR 1.00 1.00012-01005-0003 TAPE MYLAR .250 W IN 1.20 1.40012-01193-0000 INSUL MAIN BOARD EA 1.00 1.00012-01194-0000 INSUL RCVR BOARD EA 1.00 1.00047-05428-0001 CVR DGTL BD W/F EA 1.00 1.00047-05430-0001 CVR RCVR BD FNCE EA 1.00 1.00047-05434-0002 COVER W/HDW EA 1.00 1.00047-05435-0002 REAR PLATE W/F EA 1.00 1.00047-05436-0002 FRONT PLATE W/F EA 1.00 1.00047-05437-0001 BOTTOM TRAY W/F EA 1.00 1.00047-05438-0002 CHASSIS EA 1.00 1.00

057-02203-0000 FLAVOR STCKR EA 1.00 .057-02203-0001 FLAVOR STCKR EA . 1.00057-02401-0000 S/N TAG EA 1.00 1.00057-02425-0000 SERIAL NUMBER TAG, KDF 806 EA 1.00 1.00076-00343-0004 SPACER 4-40 EA 2.00 2.00088-01056-0004 NAMEPLATE DCRTD EA 1.00 1.00089-02140-0000 NUT LOCK 4-40 EA 4.00 4.00089-05903-0003 SCR PHP 4-40X3/16 EA 12.00 12.00089-06008-0003 SCR FHP 4-40X3/16 EA 5.00 5.00089-06081-0004 SCR PHP 4-40X1/4 EA 6.00 6.00

089-06297-0003 SCR FHP 2-56X3/16 EA 2.00 2.00089-06415-0004 SCR PHP 4-20X1/4 EA 1.00 1.00089-08024-0030 WSHR FLT STD #3 EA 2.00 2.00187-01353-0003 CUSHION EA 1.00 1.00200-02880-0000 PWR SUP SUB-ASSY EA 1.00 1.00200-06369-0010 RECEIVER BD EA 1.00 1.00200-08144-0000 KDF806 MUTE BD EA 1.00 .200-08144-0010 KDF806 MUTE BD EA . 1.00206-00135-0002 KDF806 HW/SW CONF. EA 1.00 .206-00199-0002 KDF806 HW/SW CONF. EA . 1.00

PN DESCRIPTION REV-----------------------------------------------------------------------206 00135 0002 KDF806 HW/SW CONF 0

B KDF 806PN DESCRIPTION REV-----------------------------------------------------------------------206-00199-0002 KDF806 HW/SW CONF. 0-------------------------------------------------------------------------------------------------


70/229

SYMBOL PART NUMBER FIND NO DESCRIPTION UM -0002

-------------------------------------------------------------------------------------------------REF100 700-00290-0002 KDF806 CONF. INDEX EA 1.00

057-03284-0002 UNIT SOFTWARE V02 EA 1.00205-00668-0002 KDF806 MAIN BD EA 1.00

PN DESCRIPTION REV-----------------------------------------------------------------------205-00605-0002 KDF806 MAIN BD AA-------------------------------------------------------------------------------------------------

SYMBOL PART NUMBER FIND NO DESCRIPTION UM -0002-------------------------------------------------------------------------------------------------REF1 300-06370-0010 MAIN BD ASSY KDF 806 RF .00

057-05006-0005 KDF806 MAIN BD TAG EA 1.00057-05335-0002 DECAL 205 DASH 02 EA 1.00125-00199-0001 KDF806 ADF PDS EA 1.00193-00605-0002 KDF 806 MAIN BD RF .00200-06370-0010 KDF806 MAIN BD EA 1.00

PN DESCRIPTION REV-----------------------------------------------------------------------205-00668-0002 KDF806 MAIN BD AA-------------------------------------------------------------------------------------------------SYMBOL PART NUMBER FIND NO DESCRIPTION UM -0002-------------------------------------------------------------------------------------------------REF100 300-06370-0010 MAIN BD ASSY KDF 806 RF .00

057-05252-0668 IDT 205-00668-0000 EA 1.00057-05335-0002 DECAL 205 DASH 02 EA 1.00

125-00199-0001 KDF806 ADF PDS EA 1.00193-00668-0002 KDF 806 MAIN BD ASSY RF .00200-06370-0020 KDF806 MAIN BD EA 1.00

PN DESCRIPTION REV-----------------------------------------------------------------------125-00199-0001 KDF806 ADF PDS AA-------------------------------------------------------------------------------------------------SYMBOL PART NUMBER FIND NO DESCRIPTION UM -0001

-------------

kdf-806 - maintenance manual - 006-05511-0008_8

Documents