layer 0 status

Ronald Lipton PMG June 7 2005

Layer 0 Status

• 48 modules, 96 SVX4 readout chips 6-fold symmetry• 8 module types different in sensor and analog cable length


L0 Status

• Layer 0 consists of:– 48 sensor/analog cable/readout

modules of 8 types• 7 and 12 cm sensors• x 4 analog cable lengths• SVX4 readout chips, BeO hybrids• Digital jumper cables

– Carbon Fiber Support structure– Readout Components

• Junction cards/twisted pair cables/adapter cards

– Installation components• Supports attached to the Run2a

SMT structure• Tooling to install and align Layer 0

and extract the Run2a beampipe

hybrid

Analogcable

SVX4

sensor

PitchAdapter


Module Quality

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71 MicronModules

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Modules

All modules are built • 8 of each type (6 needed)• Require:

• <1.5 mA current• no pinholes• <4 bad or noisy channels

• Have one good spare for each type (one marginal)


Component Status

• Modules – done

• Digital jumper cables – done (spares still being assembled at KU)

• Carbon Fiber Support structure – done

• Readout Components

– Junction cards – done

– Twisted pair cables – done

– Adapter cards – done

• Installation components being fabricated

– Supports attached to the Run2a SMT structure

– Tooling to install and align Layer 0 and extract the Run2a beampipe


Module Installation

• 48 to install, started June 2• Problems with the stability of the

CMM slowed the start• Two sets of fixtures. Plan to install

two modules/day (north+south). Procedure– Remove vacuum, electrical test of

previously installed modules– Glue on foam spacers– Measure locations of previously

installed sensors– Glue on next sensor/hybrid pairs– Allow to cure overnight

• Scheduled for 6 weeks– Six facets (3 inner, 3 outer)– Stop after inner layer is complete

for ~2 week electrical test– Assumes 1 additional day/facet for

rotation and alignment


Module Installation


System Tests and Grounding• Layer 0 performance depends on the grounding scheme developed for Run2b

– Carbon fiber cocured with kapton ground mesh– Low inductance connections to sensors and hybrids– Isolation of adapter card grounds to break ground loops– Minimum gap between analog cables and conductors (mesh spacers)

• A series of system tests have been performed with pre-production modules beginning last fall. – Used mechanical prototype support structure (electrically good)– Installed 10 modules (in stages).

• Good overall noise performance• Effects of digital signals on hybrid coupling to analog cable (negligible

at 396ns bandwidth)• Pedestal splitting (also negligible at 396ns bandwidth)• Verified need for low impedance grounding

– Checked that there is no effect of adding modules on adjacent facets, opposite ends

– Tested effect of a signal generator on CF support


Full System Tests

Two parallel efforts:

• Full system test at Sidet

– Plan to read out full Layer 0 withfinal electronics.

• 10 electrical modules already read out

– First stage inner layer only end of June

– Found timing problems – addressed by sequencer firmware changes

• Hybrid strings installed at Dzero, test crate 79

– Testing with conditions similar to operations Use real DAQ with Trigger Framework

– Preparation and exercising of online software

– See similar timing problems which still need to be addressed

– Test crate progress slow – have now resolved interference with normal data taking – should make faster progress

ungrounded0.00

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channel

mean sigma*10 incoh noise


Dzero Installation Tooling

Layer 0 is installed by bringing the detector in through the EC beam pipe, a carbon fiber installation pole is passed through the SMT, picks up Layer 0 and guides it through the SMT.

• Carbon fiber insertion tools– Half of “long tool” built, second, tapered half

should take ~2 weeks• Stages and support tables designed, stages have

been received• Alignment and coupling tooling

– Reuse parts used for aperture survey last Fall– Junction card support being fabricated– Layer 0 to SMT couplings partially

fabricated, some redesign to provide more compliance in supports

• Need to fabricate Layer 0 to insertion tool coupling sections

• Expect to begin Lab 3 tests in the beginning of July


Installation SequenceLong tool inserted

Through SMTLayer 0 connected

to tool

L0 partially inserted in SMT

Layer 0 in installedposition


Cabling

Run 2a Support

DJ cables in insertion position

DJ cables ininstalledposition

JunctionCards (12/side)

Twisted pair cables(not shown)


Cabling

• Preparation– Decable and remove H disks– Remove outer H disk low mass cables– Install adapter cards, LV wire gauge transitions, temperature

monitor interface cards on horseshoe• Installation

– Connect DJCs to junction card/twisted pair assembly and secure to junction card ring

• Test readout– Connect 12 temperature

monitor cables– Insert and recable inner H

disks

4 ch. Adapter Card at HorseShoe


Schedule Summary


Schedule (April 05 update)

Milestones we are watching:• Begin module installation (June 2)

– Completion of inner layer (June 21)Two weeks of testing

– Completion of module installation (July 27)Four weeks of testing

Complete and ready to move (Sept 16)• D0 Installation

– Test fixtures at Lab 3 (June 20-July 20)– Modify and complete (July 21-Aug 30)Ready for mechanical installation Aug 30

We assume that Layer 0 needs to be available at the start of the shutdown

layer 0 status

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