LCG H9RM

1 Version 1.4 | 2019-01-08

Produktdatenblatt | Version 1.1 www.osram-os.com

Applications

LCG H9RM

OSRAM OSTAR® Projection CubeOSRAM OSTAR Projection Cube is a high flux LED for slim designs.

— Projection Home LED & Laser — Projection Mobile (LED & Laser)

Features: — Package: SMD epoxy package

— Chip technology: UX:3

— Typ. Radiation: 120° (Lambertian emitter)

— Color: Cx = 0.318, Cy = 0.642 acc. to CIE 1931 (● converted green)

— Corrosion Robustness Class: 3B

— ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

Ordering Information

Type Luminous Flux 1) Ordering CodeIF = 350 mAΦV

LCG H9RM-LXMX-2 112 ... 210 lm Q65112A6831

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2 Version 1.4 | 2019-01-08

Maximum RatingsParameter Symbol Values

Operating Temperature Top min. max.

-40 °C100 °C

Storage Temperature Tstg min. max.

-40 °C100 °C

Junction Temperature Tj max. 150 °C

Forward Current TS = 25 °C

IF min. max.

100 mA500 mA

Forward Current pulsed D = 0.5 ; f = 120 Hz; TS = 25 °C

IF pulse max. 1000 mA

ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)

VESD 8 kV

Reverse current 2) IR max. 200 mA

LCG H9RM

3 Version 1.4 | 2019-01-08

CharacteristicsIF = 350 mA; TS = 25 °C

Parameter Symbol Values

Chromaticity Coordinate 3) acc. to CIE 1931 within λ = 500 ... 600 nm

Cx Cy

typ. typ.

0.3180.642

Viewing angle at 50% IV 2φ typ. 120 °

Radiating surface Acolor typ. 0.72 x 0.72 mm²

Partial Flux acc. CIE 127:2007 4) ΦE/V 120° = x * ΦE/V 180°

ΦE/V, 120° typ. 0.77

Forward Voltage 5) IF = 350 mA

VF min. typ. max.

2.70 V2.97 V3.50 V

Reverse voltage (ESD device) VR ESD min. 45 V

Reverse voltage 2) IR = 20 mA

VR max. 1.2 V

Real thermal resistance junction/solderpoint 6) RthJS real typ. max.

8.3 K / W10.0 K / W

Electrical thermal resistance junction/solderpoint 6) with efficiency ηe = 29 %

RthJS elec. typ. max.

5.9 K / W7.1 K / W

Brightness Groups

Group Luminous Flux 1) Luminous Flux 1) Luminous Intensity 4)

IF = 350 mA IF = 350 mA IF = 350 mAmin. max. typ.ΦV ΦV Iv

LX 112 lm 130 lm 41 cd

LY 130 lm 150 lm 47 cd

LZ 150 lm 180 lm 55 cd

MX 180 lm 210 lm 66 cd

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Chromaticity Coordinate Groupswithin λ = 500 ... 600 nm

Color Chromaticity Groups 3)

Group Cx Cy

2 0.3083 0.6404

0.3150 0.6504

0.3250 0.6437

0.3183 0.6337

Group Name on Label Example: LX-2Brightness Color Chromaticity

LX 2

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Relative Spectral Emission 4)

Φrel = f (λ); IF = 350 mA; TJ = 25 °C

LCG H9RM

350 400 450 500 550 600 650 700 750 800

λ [nm]

0.0

0.2

0.4

0.6

0.8

1.0Φrel

: Vλ

: CoD green

Radiation Characteristics 4)

Irel = f (ϕ); TJ = 25 °CLCG H9RM

-100°

-90°

-80°

-70°

-60°

-50°

-40°

-30°

-20°-10° 0° 10° 20° 30° 40° 50° 60° 70° 80° 90°

ϕ [°]

0.0

0.2

0.4

0.6

0.8

1.0Irel

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Relative Partial Flux 4)

ΦV(2φ)/ΦV(180°) = f(φ); TJ = 25 °C

0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 160 170 1802*ϕ [°]

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0ΦV(2ϕ)ΦV(180°)

Relative cumulated Luminous Flux 4)

ΦVrel - cum = f (λ); IF = 350 mA; TJ = 25 °C

LCG H9RM

400 500 600 700

λ [nm]

0.0

0.2

0.4

0.6

0.8

1.0

Rel

.cum

.flu

xΦ

Vre

lcum

: CoD green

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Forward current 4), 7)

IF = f(VF); TJ = 25 °CLCG H9RM

2.7 2.8 3.0 3.2 3.4

VF [V]

100

200

400

600

800

1000IF [mA]

Relative Luminous Flux 4), 7)

Φv/Φv(350 mA) = f(IF); TJ = 25 °CLCG H9RM

100

200

400

600

800

1000

IF [mA]

0.0

0.5

1.0

1.5

2.0

2.5ΦV

ΦV(350mA)

Chromaticity Coordinate Shift 4)

ΔCx, ΔCy = f(IF); TJ = 25 °C; full spectral range LCG H9RM

100

200

400

600

800

1000

IF [mA]

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03∆Cx∆Cy : ∆ Cx

: ∆ Cy

Chromaticity Coordinate Shift 4)

ΔCx, ΔCy = f(IF); TJ = 25 °C; within λ = 500 ... 600 nm LCG H9R M.

100

200

400

600

800

1000

IF [mA]

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03∆Cx∆Cy

: ∆ Cx: ∆ Cy

LCG H9RM

8 Version 1.4 | 2019-01-08

Forward Voltage 4)

ΔVF = VF - VF(25 °C) = f(Tj); IF = 350 mALCG H9RM

-40 -20 0 20 40 60 80 100 120 140

Tj [°C]

-0.3

-0.2

-0.1

0.0

0.1

0.2

0.3∆VF [V]

Relative Luminous Flux 4)

Φv/Φv(25 °C) = f(Tj); IF = 350 mALCG H9RM

-40 -20 0 20 40 60 80 100 120 140

Tj [°C]

0.0

0.2

0.4

0.6

0.8

1.0

1.2Φv

Φv(25°C)

Chromaticity Coordinate Shift 4)

ΔCx, ΔCy = f(Tj); IF = 350 mA; full spectral range LCG H9RM

-40 -20 0 20 40 60 80 100 120 140

Tj [°C]

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03∆Cx∆Cy : ∆ Cx

: ∆ Cy

Chromaticity Coordinate Shift 4)

ΔCx, ΔCy = f(Tj); IF = 350 mA; within λ = 500 ... 600 nm LCG H9R M.

-40 -20 0 20 40 60 80 100 120 140

Tj [°C ]

-0.03

-0.02

-0.01

0.00

0.01

0.02

0.03∆Cx∆Cy : ∆ Cx

: ∆ Cy

LCG H9RM

9 Version 1.4 | 2019-01-08

Max. Permissible Forward CurrentIF = f(T)

0 20 40 60 80 100 120TS [°C]

0

100

200

300

400

500IF [mA]

LCG H9RM

10 Version 1.4 | 2019-01-08

Dimensional Drawing 8)

Approximate Weight: 22.0 mg

Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC 60068-2-43)

ESD advice: The device is protected by ESD device which is connected in parallel to the Chip.

LCG H9RM

11 Version 1.4 | 2019-01-08

Electrical internal circuit

Recommended Solder Pad 8)

For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. In case the PCB layout of the application is intended to be used with other OSLON derivates or in future developed OSLON derivates, the heat sink must not be electrically connected to anode or cathode solder pad because of possible chip inverted polarity. Package not suitable for ultra sonic cleaning.

LCG H9RM

12 Version 1.4 | 2019-01-08

Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

00

s

OHA04525

50

100

150

200

250

300

50 100 150 200 250 300t

T

˚C

St

t

Pt

Tp240 ˚C

217 ˚C

245 ˚C

25 ˚C

L

Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

Ramp-up rate to preheat*)

25 °C to 150 °C2 3 K/s

Time tSTSmin to TSmax

tS 60 100 120 s

Ramp-up rate to peak*)

TSmax to TP

2 3 K/s

Liquidus temperature TL 217 °C

Time above liquidus temperature tL 80 100 s

Peak temperature TP 245 260 °C

Time within 5 °C of the specified peaktemperature TP - 5 K

tP 10 20 30 s

Ramp-down rate*TP to 100 °C

3 6 K/s

Time25 °C to TP

480 s

All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

LCG H9RM

13 Version 1.4 | 2019-01-08

Taping 8)

LCG H9RM

14 Version 1.4 | 2019-01-08

Tape and Reel 9)

Reel dimensions [mm]A W Nmin W1 W2 max Pieces per PU

180 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2000

LCG H9RM

15 Version 1.4 | 2019-01-08

Barcode-Product-Label (BPL)

Dry Packing Process and Materials 8)

OHA00539

OSRAM

Moisture-sensitive label or print

Barcode label

Desiccant

Humidity indicator

Barcode label

OSRAM

Please check the HIC immidiately afterbag opening.

Discard if circles overrun.Avoid metal contact.

WET

Do not eat.

Comparatorcheck dot

parts still adequately dry.

examine units, if necessary

examine units, if necessary

5%

15%

10%bake units

bake units

If wet,

change desiccant

If wet,

Humidity IndicatorMIL-I-8835

If wet,

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or equiv

alent p

rocessin

g (peak p

ackage

2. Afte

r th

is b

ag is o

pened, devic

es that w

ill b

e subje

cted to

infrare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

eal date

is id

entical w

ith d

ate c

ode).

a) M

ounted w

ithin

b) S

tore

d at

body tem

p.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD

-033 fo

r bake p

rocedure

.

Flo

or tim

e see b

elow

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Flo

or tim

e 1

Year

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICO

NDUCTORS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

LCG H9RM

16 Version 1.4 | 2019-01-08

Schematic Transportation Box 8)

OHA02044

PACKVAR:

R077Additional TEXT

P-1+Q-1

Multi TOPLED

Muste

r

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

10

(9D) D/C:

11(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY: 2000

0144

(G) GROUP:

260 C RT240 C R

3

220 C R

MLBin3:Bin2: Q

-1-20

Bin1: P-1-20

LSY T6762

2a

Temp ST

R18DEMY

PACKVAR:

R077Additional TEXT

P-1+Q-1

Multi TOPLED

Muste

r

OSRAM Opto

Semiconductors

(6P) BATCH NO:

(X) PROD NO:

10

(9D) D/C:

11(1T) LOT NO:

210021998

123GH1234

024 5

(Q)QTY: 2000

0144

(G) GROUP:

260 C RT240 C R

3

220 C R

MLBin3:Bin2: Q

-1-20

Bin1: P-1-20

LSY T6762

2a

Temp ST

R18DEMY

OSRAM

Packing

Sealing label

Barcode label

Mois

ture

Level 3

Flo

or tim

e 168 H

ours

Mois

ture

Level 6

Flo

or tim

e 6

Hours

a) H

umid

ity In

dicato

r C

ard is

> 1

0% w

hen read a

t 23 ˚

C ±

5 ˚C

, or

reflo

w, v

apor-phase r

eflow

, or e

quivale

nt pro

cessing (p

eak package

2. Afte

r th

is b

ag is o

pened,

devices th

at will

be s

ubjecte

d to in

frare

d

1. Shelf

life in

seale

d bag: 2

4 month

s at <

40 ˚

C a

nd < 9

0% rela

tive h

umid

ity (R

H).

Mois

ture

Level 5

a

at facto

ry c

onditions o

f

(if b

lank, s

eal date

is id

entical w

ith d

ate c

ode).

a) M

ounted w

ithin

b) S

tore

d at

body te

mp.

3. Devic

es require

bakin

g, befo

re m

ounting, i

f:

Bag s

eal date

Mois

ture

Level 1

Mois

ture

Level 2

Mois

ture

Level 2

a4. If b

aking is

require

d,

b) 2a o

r 2b is

not m

et.

Date

and ti

me o

pened:

refe

rence IP

C/J

ED

EC

J-S

TD-0

33 for bake p

rocedure

.

Floor

time s

ee belo

w

If bla

nk, see b

ar code la

bel

Flo

or tim

e > 1

Year

Floor

time

1 Y

ear

Flo

or tim

e 4

Weeks10%

RH

.

_<

Mois

ture

Level 4

Mois

ture

Level 5

˚C).

OPTO

SEM

ICONDUCTO

RS

MO

ISTURE S

ENSITIV

E

This b

ag conta

ins

CAUTION

Flo

or tim

e 72 H

ours

Flo

or tim

e 48 H

ours

Flo

or tim

e 24 H

ours

30 ˚C

/60%

RH

.

_<

LE

VE

L

If bla

nk, see

bar code la

bel

Barcode label

Dimensions of transportation box in mmWidth Length Height

195 ± 5 mm 195 ± 5 mm 30 ± 5 mm

LCG H9RM

17 Version 1.4 | 2019-01-08

Chip Technology: N: standard (1mm²) M: low current (750µm)

Encapsulant Type / Lens Properties R: silicone (with or without diffuser)

Color coordinates according CIE 1931 / Emission color: CG: Cx: 0.32; Cy: 0.64 / color on demand green

L: Light Emitting Diode

Package Type H: Top emitting device, Leadframe based, black reflector package

Lead / Package Properties 9: leadless

Type Designation System

L CG H 9 R N

LCG H9RM

18 Version 1.4 | 2019-01-08

NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class low risk (exposure time 100 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoy-ance, visual impairment, and even accidents, depending on the situation.

Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

For further application related informations please visit www.osram-os.com/appnotes

LCG H9RM

19 Version 1.4 | 2019-01-08

Disclaimer

Attention please!The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS webside.

PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office.By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

Product safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.

In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordi-nate the customer-specific request between OSRAM OS and Buyer and/or Customer.

LCG H9RM

20 Version 1.4 | 2019-01-08

Glossary1) Brightness: Brightness values are measured during a current pulse of typically 25 ms, with an internal

reproducibility of ±8 % and an expanded uncertainty of ±11 % (acc. to GUM with a coverage factor of k = 3).

2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-tion is not allowed.

3) Chromaticity coordinate groups: Chromaticity coordinates are measured during a current pulse of typically 25 ms, with an internal reproducibility of ±0.005 and an expanded uncertainty of ±0.01 (acc. to GUM with a coverage factor of k = 3).

4) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

5) Forward Voltage: The forward voltage is measured during a current pulse of typically 8 ms, with an internal reproducibility of ±0.05 V and an expanded uncertainty of ±0.1 V (acc. to GUM with a coverage factor of k = 3).

6) Thermal Resistance: Rth max is based on statistic values (6σ).7) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-

ences between single devices within one packing unit.8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and

dimensions are specified in mm.9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

LCG H9RM

21 Version 1.4 | 2019-01-08

Revision HistoryVersion Date Change

1.3 2018-12-13 Characteristics Chromaticity Coordinate Groups Package Outline

1.4 2019-01-08 Recommended Solder Pad

LCG H9RM

22 Version 1.4 | 2019-01-08

Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.