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LDC0851EVM User's Guide Literature Number: SNLU194 November 2015

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Page 1: LDC0851EVM User's Guide - Farnell element14 · µUSB (J3) LREF Sensor 1.8V 5 V Coin Cell Battery CR2032 - 3.0 V (BT1) LDC0851 (WSON8) LREF LCOM LSENSE J1 J4 EN OUT Breakaway Portion

LDC0851EVM

User's Guide

Literature Number: SNLU194November 2015

Page 2: LDC0851EVM User's Guide - Farnell element14 · µUSB (J3) LREF Sensor 1.8V 5 V Coin Cell Battery CR2032 - 3.0 V (BT1) LDC0851 (WSON8) LREF LCOM LSENSE J1 J4 EN OUT Breakaway Portion

Chapter 1SNLU194–November 2015

Introduction

The Texas Instruments LDC0851 evaluation module (EVM) helps designers evaluate the operation andperformance of the LDC0851 Inductive Switch. The EVM contains one LDC0851 soldered onto the EVMPCB and options to operate with battery or USB power. A 50-kΩ trim pot is also included to change theswitching distance threshold making it easy to evaluate for a wide variety of use cases.

Table 1-1. Device and Package Configurations

DEVICE IC PACKAGEU1 LDC0851 WSON-8

Figure 1-1. LDC0851EVM

2 Introduction SNLU194–November 2015Submit Documentation Feedback

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Page 3: LDC0851EVM User's Guide - Farnell element14 · µUSB (J3) LREF Sensor 1.8V 5 V Coin Cell Battery CR2032 - 3.0 V (BT1) LDC0851 (WSON8) LREF LCOM LSENSE J1 J4 EN OUT Breakaway Portion

µUSB

(J3)

LREF Sensor

1.8V

5 VCoin Cell Battery

CR2032 - 3.0 V

(BT1) LDC0851

(WSON8)

LREF

LCOM

LSENSE

J1

OUTENJ4

Breakaway Portion 1

ADJ

50-kO�Trim Pot

(R5)

Enable Toggle Switch, SPDT

(S2)

VDD

5 V

Breakaway Portion 2

LP5951

3.0-V Out LDO

Output

LED

(D3)Supply Switch, SPDT

(S2) VDD

3.0 V3.0 V

VDD

VDDVDD

BATUSB

LR

LSLC

LR

LSLC

LSENSE Sensor

20 mm O.D.

7 turns/layer

6 mil trace

6 mil space

2 Layer

6.2 µH

Approaching Metal Target

Chapter 2SNLU194–November 2015

EVM Features and Connections

This section describes the connectors on the LDC0851EVM and how to properly connect, set up and usethe LDC0851.

Figure 2-1. EVM Block Diagram

2.1 Connector Description

Table 2-1. EVM ConnectionsCONNECTOR TYPE FUNCTIONALITY

J1 6 pin, 100 mil header (not stuffed) Provides connections for LREF, LSENSE, and LCOM if sensor portion is detached.

J2 2 pin, 100 mil header (not stuffed) Provides connections for GND and VDD if the power section is detached.

J3 Micro-USB connector Provides 3.0-V power to the DUT when connected to 5 V.

Provides 3.0-V power to the DUT when CR2032 battery is inserted into the batteryBT1 – CR2032 CR2032 Battery Holder slot.

J4 4 pin, 100 mil header (not stuffed) Provides optional connections for DUT Supply, Ground, OUT, and EN.

Spring loaded switch (default on) to toggle EN low. This resamples the voltage on theS1 – EN RESET SPDT Switch ADJ pin.

Toggle between 3.0-V USB Power (USB position) and 3.0-V battery power (BATS2 SPDT Switch position).

Indicates when the output of the LDC0851 switches. Note that LED will be off in theD3 – OUT Green LED absence of a metal target.

D5 Green LED (not stuffed) Indicates 3.0 V is present at output of the 3.0-V LDO (LP5951).

Provides adjustable resistance to create a voltage divider between 0 V and VDD/2 onR5 – OFFSET 50k Trim Pot the ADJ pin. If the voltage is changed during operation, the EN pin must be toggledADJUST low then high with switch S1.

Breakaway The EVM can be separated at this point to use a different supply rail or to directlyPerforationPerforation 1 access VDD, GND, OUT, and EN.

Breakaway Perforation The EVM can be separated at this point to use different LSENSE and LREF sensors.Perforation 2

USB Test Point Test point for 3.0-V output of LP5951.

BAT Test Point Test point for 3.0-V output of Battery

3SNLU194–November 2015 EVM Features and ConnectionsSubmit Documentation Feedback

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Page 4: LDC0851EVM User's Guide - Farnell element14 · µUSB (J3) LREF Sensor 1.8V 5 V Coin Cell Battery CR2032 - 3.0 V (BT1) LDC0851 (WSON8) LREF LCOM LSENSE J1 J4 EN OUT Breakaway Portion

EVM Interface www.ti.com

Figure 2-2. Connector and Feature Locations (Top)

Figure 2-3. Connector and Feature Locations (Bottom)

2.2 EVM InterfaceThe LDC0851EVM can be powered with 5 V via the micro-USB connection (J3) on the top side of theEVM. Alternatively, a 3-V battery via the battery connection (BT1) on the backside of the EVM may beused to directly supply the LDC0851 with 3 V. Use Supply Switch (S2) to select the desired power source.

The voltage on the ADJ pin of the LDC0851 at startup will determine the distance at which a metal targetwill be detected. The voltage can be easily controlled through the 50-kΩ trim pot (R5). Note, the ADJ valueis only sampled once on startup or after EN has toggled low to high with switch S1.

Table 2-2. LED Indicator Behavior with GUI

LED COLOR FUNCTIONALITYD3 Green Indicates when the output of the LDC0851 switches.

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www.ti.com Break-Away Sections

2.3 Break-Away Sections

Figure 2-4. EVM Break-Away Sections

The LDC0851 EVM can be broken into 3 discrete sections: a 5-V to 3-V section which includes the USBinterface section, an LDC0851 section, and a sensor section which contains the LREF and LSENSEsensors.

Figure 2-5. Break-Away Sensor (Top)

Figure 2-6. Break-Away Sensor (Bottom)

Break-Away Sensor Section: The Sensor section of the LDC0851EVM can be broken along theindicated line to separate the sensor from the LDC0851 IC. A three pin header is available on theLDC0851 section to connect to different sensors or for remote location. If the cable connection betweenthe sensor and the LDC0851EVM is longer than 2 cm, use twisted pair or coaxial to connect back to theLDC0851 section.

The EVM sensor is a 4 layer stacked coil design, with the top 2 layers used for the sensing coil, and thebottom 2 layers used for the reference coil.

5SNLU194–November 2015 EVM Features and ConnectionsSubmit Documentation Feedback

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Break-Away Sections www.ti.com

Table 2-3. LDC0851EVM Sensor Parameters

PARAMETER LSENSE SENSOR VALUE LREF SENSOR VALUEOuter Diameter 787.4 mils (20.0 mm) 787.4 mils (20.0 mm)Inner Diameter 619.4 mils (15.7 mm) 619.4 mils (15.7 mm)

Number of turns 7 7Trace Width 6 mils (0.152 mm) 6 mils (0.152 mm)

Trace Spacing 6 mils (0.152 mm) 6 mils (0.152 mm)Number of layers 2 2Trace Thickness 1 oz-cu (35 μm) 1 oz-cu (35 μm)

Inductance at 9.5 MHz 8.65 µH 8.65 µHCSENSOR (C4) 68 pF 68 pF

ƒSENSOR (no target) 9.5 MHz 9.5 MHz

6 EVM Features and Connections SNLU194–November 2015Submit Documentation Feedback

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LSENSE

LREF

LCOM

LDC0851

Sense Coil

RefCoil

Sensor Cap

ADJ

0: Reference switch 1 ± 15: Threshold Adjust

Differential Inductive Switch

4-bit ADC

Mode Select

ApproachingMetal Target

Switching distance set by ADJ Value

ADJ =1 ADJ =15

. . .

R550 k

R353.6 k

VDD

R43.56 k

Chapter 3SNLU194–November 2015

Theory of Operation

The LDC0851 is an inductance based switch for contactless and robust applications such as presencedetection, event counting, and coarse position detection. The device is connected to a reference coil(LREF) and a sensing coil (LSENSE). The output of the LDC0851 switches when the inductance ofLSENSE drops below LREF which is caused by an approaching metal target. The LDC0851 EVMemploys a stacked coil arrangement, in which the LSENSE sensor coil is closer to the metal target thanthe LREF reference coil when approached from the top side (LSENSE side). The user can take advantageof the Offset Adjust feature to change the switching distance (dswitch). The offset is added to LREF sothat increasing the ADJ code causes the LDC0851 to switch at a closer distance. The ADJ code isdetermined by the voltage level on the ADJ pin at device power on and by toggling the Enable pin lowthen high.

Figure 3-1. Simplified Block Diagram for Stacked Coils

7SNLU194–November 2015 Theory of OperationSubmit Documentation Feedback

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Adjusted LREF

(ADJ = 1)

Y�

Target

Distance

Coil

Inductance

dswitch

(ADJ = 1)

Adjusted LREF

(ADJ = 15)

LSENSE

C�0.3x(dcoil)dswitch

(ADJ = 15)

www.ti.com

Figure 3-2. Switch Distance with Offset

A potentiometer (R5) has been included to make adjusting the threshold easier for prototyping. Note thatrotating the potentiometer clockwise towards the MIN direction decreases the ADJ value and results in alonger switching threshold. Similarly, rotating R5 counter clockwise towards the MAX position increasesthe ADJ value and decreases the switching distance. The Enable pin should be toggled low then high toset a new switching threshold.

Figure 3-3. Adjust the Offset

The ADJ value can be achieved by setting the combination of R4 + R5 to the values in Table 3-1.

8 Theory of Operation SNLU194–November 2015Submit Documentation Feedback

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Page 9: LDC0851EVM User's Guide - Farnell element14 · µUSB (J3) LREF Sensor 1.8V 5 V Coin Cell Battery CR2032 - 3.0 V (BT1) LDC0851 (WSON8) LREF LCOM LSENSE J1 J4 EN OUT Breakaway Portion

Codeswitch coil

ADJd d 0.3x 1

16§ ·

u �¨ ¸© ¹

www.ti.com

Table 3-1. Resistor Values for ADJ Code

ADJ Level (code) R4+R5 (kΩ)1 3.572 5.543 7.664 9.935 12.376 15.017 17.878 20.979 24.3610 28.0811 32.1612 36.6713 41.6914 47.2915 53.60

The switching distance for each ADJ code can be approximated with Equation 1.

where• dswitch is the approximated switching distance threshold for stacked coils• dcoil is the coil diameter• ADJCode is the desired value from Table 3-1 (1)

For example, consider a coil with a diameter of 20 mm. An ADJ code of 1 yields a switching distance of5.6 mm, and an ADJ code of 15 yields a switching distance of 0.375 mm. This method helps reduce theeffort needed to design the coil ratio precisely for a specific switching distance. It should be noted that themaximum sensing distance is determined almost entirely by the diameter of the coil for spiral coils or bythe minimum outer dimension for non-spiral coils. It is also recommended to use a target of equal or largersize to the coil diameter to get the longest sensing range.

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Page 10: LDC0851EVM User's Guide - Farnell element14 · µUSB (J3) LREF Sensor 1.8V 5 V Coin Cell Battery CR2032 - 3.0 V (BT1) LDC0851 (WSON8) LREF LCOM LSENSE J1 J4 EN OUT Breakaway Portion

Chapter 4SNLU194–November 2015

Quick Start Guide

4.1 Supply Power to the LDC0851EVMPower can be supplied either through the 5-V micro-USB connection (J3) or through the 3.0-V battery slot(BT1) on the backside of the EVM.

4.1.1 5-V Micro-USB to 3-V Device PowerConnect a USB cable between the 5-V source and the micro-USB connector (J3) on EVM. An onboardLDO will convert the 5-V source into 3.0 V which can be measured at the USB test point shown below.

Figure 4-1. Insert 5-V Micro-USB

Verify that SUPPLY Switch (S2) is in the USB position.

Figure 4-2. Set SUPPLY Switch (S2) to USB

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www.ti.com Supply Power to the LDC0851EVM

4.1.2 3-V Battery PowerAlternatively, the LDC0851 may be operated from battery power. The list of battery requirements isprovided below:

Battery RequirementsParameter SpecificationBattery Model CR2032 UL Certified BatteryVoltage 3.0 VMin Capacity 225 mAhMin Discharge Rate 200 µAManufacturer and Model Number Panasonic - BSG CR2032 (or equivalent)

When the EVM is powered by the battery, it is not necessary to have a micro-USB cable connected to J3.Insert CR2032 battery in the slot (BT1) on the back of the board. A voltage of 3.0 V can be measured atthe BAT test point shown below.

Figure 4-3. Insert CR2032 Battery into BT1

Slide SUPPLY switch (S2) to the BAT position.

Figure 4-4. Change SUPPLY Switch (S2) to BAT

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Adjust the Threshold www.ti.com

4.2 Adjust the ThresholdThe EVM has a potentiometer (R5) which can be used to control the voltage level on the ADJ pin. Rotatethe pot clockwise towards “MIN” so that ADJ value is in the minimum offset position, which has the longestsensing range.

Figure 4-5. Adjust the Offset

To set a new threshold, toggle the EN RESET switch (S1) to re-sample the ADJ pin. This must be doneevery time a new threshold is set.

Figure 4-6. Toggle Enable to Set New Threshold

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www.ti.com Detecting presence of Metal Targets

4.3 Detecting presence of Metal TargetsWith no target is present the OUTPUT LED (D3) should be off. If D3 is on or remains on, increase theoffset with R5 and toggle EN with S1 as shown in the previous step.

Figure 4-7. Observe Status of OUT LED

Bring a conductive target close to the LSENSE coil. The OUT LED (D3) should turn on when the target is1 to 8 mm above the EVM sensing coil depending on the ADJ value.

Figure 4-8. Bring Metal Target Close to LSENSE

To change the switching threshold simply adjust the value of R5, toggle EN with S1 and retest. Note thatduring active operation the ADJ pin draws ~10 µA of current will alter the resistance reading if using amulti meter to check the value. In order to properly set or check the ADJ resistance when using a multimeter, turn off the device, remove the battery, and set S2 to BAT. The resistance measured across R4 +R5 should be set according to Table 3-1 for a desired ADJ setting.

This process can be repeated and fine-tuned for a variety of applications including open/close proximityswitches, white goods, home security and tamper detection, e-meters, and printers.

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Chapter 5SNLU194–November 2015

EVM Design – Board Layout

Table 5-1. Layer Usage

LAYER FUNCTIONALITYTop Signals, Components, Sense coil, and ground-fill

Mid-layer 1 Sense coil, and section transition routingMid-layer 2 Reference coil, and section transition routing

Bottom Signals, Components, Reference coil, and ground-fill

Figure 5-1. Top Layer Routing

Figure 5-2. Bottom Layer Routing

14 EVM Design – Board Layout SNLU194–November 2015Submit Documentation Feedback

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www.ti.com

Figure 5-3. Mid-Layer 1 Routing

Figure 5-4. Mid-Layer 2 Routing

15SNLU194–November 2015 EVM Design – Board LayoutSubmit Documentation Feedback

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Page 16: LDC0851EVM User's Guide - Farnell element14 · µUSB (J3) LREF Sensor 1.8V 5 V Coin Cell Battery CR2032 - 3.0 V (BT1) LDC0851 (WSON8) LREF LCOM LSENSE J1 J4 EN OUT Breakaway Portion

Chapter 6SNLU194–November 2015

EVM Design - Schematic

Figure 6-1. Battery, LDC0851, and Sensor

Figure 6-2. Optional 5-V Micro-USB to 3.0 V

16 EVM Design - Schematic SNLU194–November 2015Submit Documentation Feedback

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Page 17: LDC0851EVM User's Guide - Farnell element14 · µUSB (J3) LREF Sensor 1.8V 5 V Coin Cell Battery CR2032 - 3.0 V (BT1) LDC0851 (WSON8) LREF LCOM LSENSE J1 J4 EN OUT Breakaway Portion

Chapter 7SNLU194–November 2015

EVM Bill of Materials

Table 7-1. Bill of Materials

ITEM DESIGNATOR PART NUMBER MANUFACTURER DESCRIPTION#1 !PCB1 SV601198 Any Printed Circuit Board2 BT1 BK-912 Memory Protection Devices Battery Holder for CR2032, SMT

CAP, CERM, 0.1 µF, 50 V, +/- 10%,3 C1 C1005X7R1H104K TDK X7R, 0402CAP, CERM, 1 µF, 16 V, +/- 10%, X5R,4 C2 C0603C105K4PACTU Kemet 0603

CAP, CERM, 68 pF, 50 V, +/- 5%,5 C4 C1608C0G1H680J TDK C0G/NP0, 0603CAP, CERM, 10 µF, 16 V, +/- 20%, X7R,6 C5 EMK212BB7106MG-T Taiyo Yuden 0805CAP, CERM, 0.1 µF, 25 V, +/- 5%, X7R,7 C6, C7 C0603C104J3RAC Kemet 0603

C2012X7S1A226M125A CAP, CERM, 22 µF, 10 V, +/- 20%, X7S,8 C8 TDKC 0805GRM188R71A225KE15 CAP, CERM, 2.2 µF, 10 V, +/- 10%,9 C9 MuRataD X7R, 0603

10 D1 MMSZ4685-V Vishay-Semiconductor Diode, Zener, 3.6 V, 500 mW, SOD-12311 D3 LG L29K-G2J1-24-Z OSRAM LED, Green, SMD12 D4 MMSZ5232B-7-F Diodes Inc. Diode, Zener, 5.6 V, 500 mW, SOD-123

Fiducial mark. There is nothing to buy or13 FID6 N/A N/A mount.Connector, Receptacle, Micro-USB Type14 J3 ZX62R-B-5P Hirose Electric Co. Ltd. B, SMTInductor, Shielded, Ferrite, 10 µH, 0.4 A,15 L1 VLS201610ET-100M TDK 1.38 ohm, SMD

Thermal Transfer Printable Labels,16 LBL1 THT-14-423-10 Brady 0.650" W x 0.200" H - 10,000 per roll17 R2 CRCW0402200RFKED Vishay-Dale RES, 200, 1%, 0.063 W, 040218 R3 RC0603FR-0753K6L Yageo America RES, 53.6 k, 1%, 0.1 W, 060319 R4 CRCW06033K57FKEA Vishay-Dale RES, 3.57 k, 1%, 0.1 W, 060320 R5 3352T-1-503LF Bourns Trimming Potentiometer, 50K, 0.5W, TH21 R7 CRCW060333R0JNEA Vishay-Dale RES, 33, 5%, 0.1 W, 0603

Switch, SPDT, On-Mom, 1 Pos, 0.01A, 522 S1 JSX08001SAQNL C&K Components VDC, SMD23 S2 CL-SB-12A-01T Copal Electronics Switch, Slide, SPDT, 0.2A, J Lead, SMD24 U1 LDC0851DSGR Texas Instruments 1.8-3.3V Inductive Switch, DSG0008A

Micropower, 150mA Low-Dropout CMOS25 U2 LP5951MG-3.0/NOPB Texas Instruments Voltage Regulator, 5-pin SC-70, Pb-Free

17SNLU194–November 2015 EVM Bill of MaterialsSubmit Documentation Feedback

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STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES1. Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or

documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.Acceptance of the EVM is expressly subject to the following terms and conditions.1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility

evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are notfinished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. Forclarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditionsset forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software

1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or productionsystem.

2 Limited Warranty and Related Remedies/Disclaimers:2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software

License Agreement.2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM

to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatmentby an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in anyway by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications orinstructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or asmandated by government requirements. TI does not test all parameters of each EVM.

2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during thewarranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects torepair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shallbe warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) daywarranty period.

3 Regulatory Notices:3.1 United States

3.1.1 Notice applicable to EVMs not FCC-Approved:This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kitto determine whether to incorporate such items in a finished product and software developers to write software applications foruse with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unlessall required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not causeharmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit isdesigned to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority ofan FCC license holder or must secure an experimental authorization under part 5 of this chapter.3.1.2 For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:

CAUTIONThis device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may notcause harmful interference, and (2) this device must accept any interference received, including interference that may causeundesired operation.Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority tooperate the equipment.

FCC Interference Statement for Class A EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment isoperated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if notinstalled and used in accordance with the instruction manual, may cause harmful interference to radio communications.Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required tocorrect the interference at his own expense.

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

SPACER

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FCC Interference Statement for Class B EVM devicesNOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 ofthe FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residentialinstallation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordancewith the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interferencewill not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, whichcan be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or moreof the following measures:

• Reorient or relocate the receiving antenna.• Increase the separation between the equipment and receiver.• Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.• Consult the dealer or an experienced radio/TV technician for help.

3.2 Canada3.2.1 For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210

Concerning EVMs Including Radio Transmitters:This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:(1) this device may not cause interference, and (2) this device must accept any interference, including interference that maycause undesired operation of the device.

Concernant les EVMs avec appareils radio:Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitationest autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doitaccepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.

Concerning EVMs Including Detachable Antennas:Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna typeand its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary forsuccessful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna typeslisted in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibitedfor use with this device.

Concernant les EVMs avec antennes détachablesConformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type etd'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillageradioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotroperayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Leprésent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans lemanuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antennenon inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation del'émetteur

3.3 Japan3.3.1 Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に

輸入される評価用キット、ボードについては、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page

3.3.2 Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certifiedby TI as conforming to Technical Regulations of Radio Law of Japan.

If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law ofJapan to follow the instructions below with respect to EVMs:1. Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal

Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule forEnforcement of Radio Law of Japan,

2. Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect toEVMs, or

3. Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japanwith respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please notethat if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.

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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けていないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの措置を取っていただく必要がありますのでご注意ください。1. 電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用

いただく。2. 実験局の免許を取得後ご使用いただく。3. 技術基準適合証明を取得後ご使用いただく。

なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ

ンスツルメンツ株式会社東京都新宿区西新宿6丁目24番1号西新宿三井ビル

3.3.3 Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧ください。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page

SPACER4 EVM Use Restrictions and Warnings:

4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOTLIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.

4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handlingor using the EVM, including without limitation any warning or restriction notices. The notices contain important safety informationrelated to, for example, temperatures and voltages.

4.3 Safety-Related Warnings and Restrictions:4.3.1 User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user

guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable andcustomary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to inputand output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, orproperty damage. If there are questions concerning performance ratings and specifications, User should contact a TIfield representative prior to connecting interface electronics including input power and intended loads. Any loads appliedoutside of the specified output range may also result in unintended and/or inaccurate operation and/or possiblepermanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting anyload to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuitcomponents may have elevated case temperatures. These components include but are not limited to linear regulators,switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using theinformation in the associated documentation. When working with the EVM, please be aware that the EVM may becomevery warm.

4.3.2 EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with thedangers and application risks associated with handling electrical mechanical components, systems, and subsystems.User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronicand/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safelylimit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility andliability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors ordesignees.

4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes allresponsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility andliability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and localrequirements.

5. Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurateas possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites asaccurate, complete, reliable, current, or error-free.

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SPACER6. Disclaimers:

6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THEDESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHERWARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIEDWARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANYTHIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.

6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS ANDCONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANYOTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRDPARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANYINVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OFTHE EVM.

7. USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITSLICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANYHANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATIONSHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANYOTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.

8. Limitations on Damages and Liability:8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,

INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESETERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HASBEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITEDTO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODSOR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALLBE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.

8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATIONARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVMPROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDERTHESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCEOF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS ANDCONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.

9. Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not ina resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicableorder, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),excluding any postage or packaging costs.

10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating tothese terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive reliefin any United States or foreign court.

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated

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IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and otherchanges to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latestissue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current andcomplete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of salesupplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s termsand conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessaryto support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarilyperformed.TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products andapplications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provideadequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, orother intellectual property right relating to any combination, machine, or process in which TI components or services are used. Informationpublished by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty orendorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of thethird party, or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alterationand is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altereddocumentation. Information of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or servicevoids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirementsconcerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or supportthat may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards whichanticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might causeharm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the useof any TI components in safety-critical applications.In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is tohelp enable customers to design and create their own end-product solutions that meet applicable functional safety standards andrequirements. Nonetheless, such components are subject to these terms.No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the partieshave executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use inmilitary/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI componentswhich have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal andregulatory requirements in connection with such use.TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use ofnon-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products ApplicationsAudio www.ti.com/audio Automotive and Transportation www.ti.com/automotiveAmplifiers amplifier.ti.com Communications and Telecom www.ti.com/communicationsData Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computersDLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-appsDSP dsp.ti.com Energy and Lighting www.ti.com/energyClocks and Timers www.ti.com/clocks Industrial www.ti.com/industrialInterface interface.ti.com Medical www.ti.com/medicalLogic logic.ti.com Security www.ti.com/securityPower Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defenseMicrocontrollers microcontroller.ti.com Video and Imaging www.ti.com/videoRFID www.ti-rfid.comOMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.comWireless Connectivity www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265Copyright © 2015, Texas Instruments Incorporated