Immersion SilverPros ConsGood Wettability Poor Shelf-Life:

*Must be vacuumed packed for shipping*Must be vacuumed packed for storage*Must not handle Surface Areas

Good CoplanarityGood Reflow CyclesGood Process timesLow Cost Fair Process WindowGood Process Control Poor AdhesionGood Electrical Testability Difficult to Re-Work

Organic Solderability Preservative - OSPPros ConsGood Coplanarity Poor Shelf-Life:

*Degrades with High Temperature *Must not handle Surface Areas

Good Surface OxidationRe-WorkableVery Low Cost Reflow CyclesGood Process Window Flux Sensitivity Good Process Control Poor Wettability

Very Poor Electrical TestabilityPoor Adhesion

Electroless Nickel Immersion Gold - ENIGPros ConsGood Wettability High CostGood Coplanarity Complex ProcessGood Reflow Cycles Not Re-WorkableGood Surface Oxidation Ni/Sn brittle Solder Joints

Good Shelf-Life Field Failure Good Adhesion Fair Process WindowWire Bonding Fair Process ControlKeypadsGood Electrical Testability

Hard GoldPros ConsGood Wettability High CostGood Coplanarity Not Re-WorkableGood Reflow CyclesGood Surface OxidationGood Shelf-LifeGood Process WindowGood Process ControlGood AdhesionGood Electrical Testability

White TinPros ConsGood Wettability Long Process TimeGood Coplanarity Fair Process WindowGood Reflow Cycles Possible Tin WhiskersGood Surface Oxidation Problems if Tin Thickness is LowLow CostGood Process ControlGood AdhesionGood Electrical Testability

Lead-Free Hot Air Solder LevelingPros ConsExcellent Wettability Process ControlMuch Improved Coplanarity over Sn/Pb Heat CycleExcellent Reflow CyclesExcellent Surface OxidationVery Low CostRe-WorkableGood Process WindowGood AdhesionExcellent Solder JointsExcellent Shelf-LifeGood Electrical Testability