leading the way of innovation - milara, inc....• 1class clean-room environment compatibility •...

LEADING THE WAY OF INNOVATION

STENCIL PRINTERSWAFER HANDLING ROBOTSINTEGRATED SYSTEMSDESIGN & MANUFACTURE

Page: 3

ABOUT USMilara, Inc. continually builds upon its rich history of mechatronic design capability applied to automation and delivered by a team of skilled technologists and scientists, through a vertically integrated production system well versed in materials of construction, precision machine parts and tightly controlled production processes.

Milara is a recognized leading global provider of automated semiconductor wafer handling tools for top tier global customer base with strong track record. Other Milara products and services are: inline stencil printers, wafer bumping and wafer printing equipment; 3D Nano-printing cluster tool; contract design and manufacturing services to multiple industries; precision machining services in USA and Europe.

Milara operates with a framework of core values that include determination, commitment, respect, integrity, customer satisfaction, continuous improvement and teamwork.

OUR LOCATIONS

Medwey Milford Bulgaria Beijin

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Milara worldwide network

Central offiCes in north aMeriCa and euroPe

gloBal suPPort offered throught a worldwide network of strategiCally loCated offiCes and suPPort Partners

Page: 5

Milara tiMeline

Under the vision and manage-ment of Mr. Krassy Petkov Milara, Inc. is created and comes to market with its’ industry leading stencil printers.

Milara begins design and production of di�erent integrated system solutions, such as EFEMs and Wafer Handlers.

Design and manufacture of R2R Proximity Stepper Photo-litographic Machine.Milara unveils the NanoOPS Generation 2.

Milara starts working on Wafer Sorting solutions and desig and manufacture the �rst Nano O�set Printing Station for semiconductor application.

Having build new production facilities in Milford and Bulga-ria, Milara enters Wafer Handling Robotics, taking on Diamond Robots.

Milara is working on expan-ding its’ production capabili-ties and focus on producing integrated systems both for personal and client design.

2003 2008 2012 2014 2017

Introduction to market

Expanding

New horizons

With its’ increased production and service capabilities Milara acquires the Equipe Product Line to establish a home for the robot with more than 250000 install base.

2013

Acquiring Equipe

Future PlansBranching out

Developing new technology

Future Plans

MPage: 6

Milara Products

Page: 7

ContentsDiamond Wafer Handling ProductsH1 Atmospheric Robot ............................................................ 10H3 Atmospheric Robot ............................................................ 11H4 Atmospheric Robot ............................................................ 12H4+ Atmospheric Robot ......................................................... 13H5 Vacuum Robot ................................................................... 14E5 Vacuum Elevator ............................................................... 15Diamond Pre-Aligner .............................................................. 16Diamond Linear tracks ........................................................... 20Equipe Wafer Handling ProductsAXM 100 Atmospheric Robot ................................................. 24AXM 400 Atmospheric Robot ................................................. 25DBM Atmospheric Robot ........................................................ 26ESC 200 Controller .................................................................. 27PRE200 Pre-Aligner ................................................................ 28PRE300 Pre-Aligner ................................................................ 29EFEM ............................................................................... 30Wafer Loaders ............................................................. 34Wafer Sorters .............................................................. 36Milara Contract Services ....................................... 38

MPage: 8

Diamond Wafer Handling Products

Page: 9Diamond Products

Diamond series atmospheric robots represent a significant engineering advancement in the design and reliability of wafer handling equipment.

Benefiting from technologically superior components, the robots utilize ultra

low inertia, high-response brushless servomotors coupled with zero-backlash Harmonic Drive® gears to achieve greatly enhanced dexterity and precision.

The innovative, all-in-one, class 1 clean room compatible design incorporates the motion controller, servo amplifiers, and power supply within the robot’s industry standard footprint.

High-strength structural members enable top, bottom or side mount configurations without compromising the system rigidity. A 32-bit, real-time kernel delivers accurate motion profiling along smooth continuous trajectories, while the distributed control architecture allows a seamless integration with linear tracks, pre-aligners, and other sub-components.

Networkable RS-485 and Ethernet interfaces complement the standard RS-232 and teach pendant connections. Powerful native wafer handling and scripting languages facilitate rapid software development for embedding the robots into an OEM application environment. Comprehensive emulation of legacy robot “macro” commands offers a drop-in compatibility with a wide variety of existing semiconductor tools.

Page: 10

other peripheral components• Standard RS-232 interface and Ethernet (Telnet) interfaces to the host computer• Advance 32-bit real-time motion control kernel Powerful wafer handling firmware• Comprehensive software tools and utilities• Software emulation for legacy robot macro commands Optional teach pendant terminal• General purpose digital inputs and outputs for custom use • Class 1 clean-room environment compatibility Reliability – MTBF > 60000 hours, (MCBF > 10,000,000 cycles)

sPeCifiCations:axis Motion range MaxiMuM veloCity

MaxiMuM aCCelera-tion

axis rPeataBility

T > 360° (typical +/-230°) 360 °/s 1500 °/s² ±0.01°

RFrom ±10.5”Up to ±14.4”

(depending on arm)

Up to 35 inch/s(depending on arm) 300 inch/s² ±0.001”(0.025mm)

Z 7” 18 inch/s 44 inch/s² ±0.001”(0.025mm)

features:• Excellent structural rigidity• Modular and highly customizable design• Arm length from 10.50” and 14.40”.• Vertical travel up to 7”• Fully integrated motion controller, servo amplifiers and power supply• High response brushless motors and precise zero-backlash Harmonic Drive® gears Absolute encoders eliminating the initial homing procedure• Handling radial and in-line equipment placement • Seamless integration with prealigner, linear track and

h1 atMosPheriC roBot

4x4-40UNC-2Bon BC 1.39"[35mm]

1.07 [27]

2-LINKS ARM 5.25"x5.25" 1.33 [34]

R1.12 [R29]

FLANGE CONFIGURATIONS

5.25 [133]

5.25 [133]

4x6-32UNC-2B

4X4-40UNC-2Bon BC Ø1.39[Ø35.32]

on BC Ø2[Ø50.8]

1.06 [27]

7.20 [183]

2-LINKS ARM 7.20"x7.20"

7.20 [183]

1.33 [34]

2X 0.118[3] holes for pin M3 on BC Ø.984[Ø25]

FOR SCREWS 6 X 1/4-20UNC-2Bon BC Ø9"[Ø229mm]

10.0

0 [2

54]

STANDARD ARM CONFIGURATIONS

10" FLANGE (STANDARD)

R1.28 [R33]

FOR SCREWS 6 X 1/4-20UNC-2Bon BC Ø10.38"[Ø264mm]

11.3

0 [2

87] 11.3" FLANGE

2X 0.118[3] holes forpin M3 on BC Ø.984[Ø125]

.91 [23]

2.48 [63]

.59 [15]

HIGHT

SIGNAL CONNECTORS PANEL

POWER CONNECTOR

7.00 [178]TRAVEL

NOTES:MINIMUM TABLE HOLE DIAMETER Ø8.2" 1.RECOMENDED TABLE HOLE SIZE Ø8.6" 2.MAX.TABLE HOLE DIAMETER-FLANGE DEPENDANT 3.

HEIGHT Z AXIS TRAVEL18"[457mm] 7"[178mm]

FOR Z AXIS 7" TRAVEL TOP HARD STOP 7.9"[201mm]RECOMENDED TOP LIMIT 7.8[198mm]

7.91 [201]

BOTTOM HARD STOP .91[23mm]RECOMENDED LOW LIMIT .984[25mm]

ZERO REFERENCE POINT

2X 0.118[3] holes for pin M3on BC .984[25]

10.00 [254]

5.25 [133]

R1.12 [R28]

5.25 [133]

4x4-40UNC-2Bon BC 1.39"[35mm]

Page: 11Diamond ProductsDiamond Products

features:• Excellent structural rigidity• Modular and highly customizable design• Arm length from 10.50” up to 24.00”• Vertical travel up to 21”• Fully integrated motion controller, servo amplifiers and power supply• High response brushless motors and precise zero-backlash Harmonic Drive® gears• Absolute encoders eliminating the initial homing procedure• Handling radial and in-line equipment placement• Seamless integration with prealigner, linear track and other peripheral components• Standard RS-232 interface and Ethernet (Telnet) interfaces

to the host computer• Advance 32-bit real-time motion control kernel• Powerful wafer handling firmware• Comprehensive software tools and utilities• Software emulation for legacy robot macro commands• Optional teach pendant terminal• General purpose digital inputs and outputs for custom use• Class 1 clean-room environment compatibility• Reliability – MTBF > 60,000 hours, (MCBF > 10,000,000 cycles)



axis rPeataBility

T > 360° (typical +/-230°) 360 °/s 1500 °/s² ±0.01°

RFrom ±10.5”Up to ±17.0”

(depending on arm)

Up to 50 inch/s(depending on arm) 300 inch/s² ±0.001”(0.025mm)

ZFrom 13” up to 21”depending on ro-

bot body model)18 inch/s 44 inch/s² ±0.001”(0.025mm)


Page: 12 h4+ atMosPheriC roBotfeatures:

• Excellent structural rigidity• Modular and highly customizable design• Arm length from 13.7”• Vertical travel up to 13”• Variety of End Effector options• Fully integrated motion controller, servo amplifiers and power supply• High response brushless motors and precise zero-backlash Harmonic Drive® gears• Handling radial and in-line equipment placement.• Seamless integration with prealigner, linear track and other peripheral components

• Standard RS-232 interface and Ethernet (Telnet) interfaces to the host computer• Advance 32-bit real-time motion control kernel• Powerful wafer handling firmware• Comprehensive software tools and utilities• Software emulation for legacy robot macro commands• Optional teach pendant terminal• General purpose digital inputs and outputs for custom use• Class 1 clean-room environment compatibility• Reliability – MTBF > 60,000 hours, (MCBF > 10,000,000 cycles)

sPeCifiCations:axis Motion range MaxiMuM veloCity MaxiMuM aCCelera-

tion

axis rPeataBility

T > 360° 400 °/s 1500 °/s² ±0.01°R ±13.6” Up to 50 inch/s 300 inch/s² ±0.001”(0.025mm)Z 13” 18 inch/s 44 inch/s² ±0.001”(0.025mm) K 40” 50 inch/s 100 inch/s² ±0.001”(0.025mm)

other peripheral components• Standard RS-232 interface and Ethernet (Telnet) interfaces to the host computer• Advance 32-bit real-time motion control kernel• Powerful wafer handling firmware• Comprehensive software tools and utilities• Software emulation for legacy robot macro commands• Optional teach pendant terminal• General purpose digital inputs and outputs for custom use• Class 1 clean-room environment compatibility• Reliability – MTBF > 60,000 hours, (MCBF > 10,000,000 cycles)



axis rPeataBility

T > 390° 360 °/s 1500 °/s² ±0.01°R1R2 ±13.6” 50 inch/s 300 inch/s² ±0.001”(0.025mm)

ZFrom 8” to 22” (depending on robot

body model)18 inch/s 44 inch/s² ±0.001”(0.025mm)

features:• Excellent structural rigidity• Modular and highly customizable design• Arm length from 13.70”• Vertical travel from 8”to 22”• Fully integrated motion controller, servo amplifiers and power supply• High response brushless motors and precise zero-backlash Harmonic Drive® gears• Absolute encoders eliminating the initial homing procedure• Handling radial and in-line equipment placement• Seamless integration with prealigner, linear track and


23.796604.42

5.250133.35

5.250133.35

13.026330.86

Hard stopto

Hard stop

14.951379.75

20.354517

6.004152.50

1.00425.502.205

56

1.18130

D

0.39410

0.1002.54

0.0240.60

DETAIL D

42.3031074.50 Hard stop to Hard stop

20.152511.85

48.4251230

BB

23.000584.20

8.841224.57

11.811300

10.192258.87

4.455113.15

18.11 [460]

Arm at Top Hard Stop 18.11"[460.0mm]

Recommended Upper Limit at 18.01"[457.5mm]

15.44 [392]

16.83 [428]

0.59 [15]

21.28 [540]

0.39 [10](End-effector

dependent)

4.74 [121]

Arm at Bottom Hard Stop 4.74"[121.0mm]

Recommended Low Limit at 4.84"[123.0mm]

BACKBONE

INTERFACE PANELPOWER INLET

5.16 [131](End-effector

dependent)

FAN

6.85 [174] 6.85 [174]

13.00 [330]

for Screws 6x1/4-20UNC-2Bon BC Ø12.35"[Ø313.69mm]

4.53 [115]

Top Flange Mark

End-effectorshown forreference only

Ø2.56 [Ø65]

Tapped Hole8 x M8x1.25

4.25 [108]

4.25 [108]

4.25 [108]

1.81 [46]

Recommended Table Hole Diameter 11.50"[292.1mm]

STANDARD - TOP MOUNTING

for SCREWS 1/4-20UNC-2Bon BC Ø12.35"[Ø313.69mm]

OPTIONAL - BOTTOM MOUNTING

SIDE (BACKBONE) MOUNTING

8.27 [210]

8.27 [210]

for SCREWS M8

POWER INLET

3.92 [99]

0.59 [15]

13.00 [330]

10.71 [272] 11.08 [281]

Ø0.33 [Ø8.5]

Page: 13Diamond ProductsDiamond Products

Page: 14 h5 vaCuuM roBot

• Optional teach pendant terminal• General purpose digital inputs and outputs for custom use• Reliability – MTBF > 60,000 hours

sPeCifiCations:

features:• Modular and highly customizable design• Fully integrated motion controller, servo amplifiers and• power supply• High response brushless motors and precise zero-backlash• Harmonic Drive® gears• Standard RS-232 interface and Ethernet (Telnet) interfaces• to the host computer• Advanced 32-bit real-time motion control kernel• Powerful wafer handling firmware• Comprehensive software tools and utilities• Software emulation for legacy robot macro commands

Page: 15Diamond ProductsDiamond Products e5 vaCuuM elevator

sPeCifiCations:

Motion range MaxiMuM veloCity MaxiMuM aCCeleration axis rPeataBility wafer size Payload

13.267“ (337mm) hard stop to hard stop

13.188“ (335mm) usable span with software limits

8 inch/sec 12 inch/ sec² ±0.001”(0.025mm) 2” (50mm) to 12” (300mm)

25 kg (55.1 lbs)

weight Cleanliness Base vaCuuM leak rate

21 kg (46.5 lbs) Class 1 Up to 1x10-9 Torr < 1x10-9 std.cc/sec HeMaximum

Servo AxesMaximum

VelocityAxis

Acceleration Repeatability

Base Vacuum

Leak Rate

In vacuum (flange, arm, end effector)In atmosphere (robot body)

Length

Diameter

Maximum

RecommendedMounting Hole Diameter

(for Top Mounting)

Min. Working Envelope

Flange dependable

9.50” (242mm)

Arm Size

24” diameter (with 15.65” long end effector, holding 300mm wafer and 12mm safety gap)

2 Links,

Body Dimensions with a built-in controller and power supply.(No external controller required)

2 x 10.0394” (2 x 255mm)

17.894” (454.5mm) without Mounting Flange

9.41” (239mm)

Operating Temperature

Mounting Configuration

Up to 50ºC (122ºF)

10ºC - 40ºC (50ºF - 104ºF)

Customizable flange with top or bottom mounting bolts

Materials exposed to Vacuum

(Shown with 11” Top mounting flange)

Encoders Type

Control Interface

Facility Requirements

Cleanliness

Vacuum Rate

Payload (including end effector)WeightMotor Type Brushless, low inertia high response

29.5 kg (65 lbs) without an end-effector

Wafer Size

R - Arm extension

travelZ - Vertical

Range of Motions

+/- 19.883“ (505mm) hard stop to hard stop of 2-Links arm2 x 10.039” (2 x 255mm)+/- 19.685“ (500mm) usable span with software limits1.456” (37mm) hard stop to hard stop1.377” (35mm) usable span with software limits

T - Arm rotation> 500º

180 º/sec +/- 0.01º(Optional – Infinite rotation)

+/- 0.001”

+/- 0.001”

(0.025mm)

(0.025mm)

2” (50mm) to 12” (300mm)

360 º/sec²

1.2 kg (2.65 lbs)

90 inch/sec²25 inch/sec

4 inch/sec 12 inch/ sec²

Absolute, 32768 counts/rev on motor shaft

Serial communication via RS-232 and Ethernet (Telnet),Teach pendant terminal serial interface;

General purpose digital I/O .

Voltage range: 100-120 VAC, 200-240 VAC

Class 1

RS232 interface for slave devices;

Up to 1x10-9 Torr

< 1x10-9 std.cc/sec He

Aluminum, Stainless Steel , Bellows (AM-350 SST Annealed), Ferro-magnetic sealing fluid, Viton, Lubricant (Fomblin/Krytox Blend)

Page: 16

Diamond Pre-Aligner


3.23 [82]

3.91 [99](LPA1218 only)

3.74 [95]

2.50 [63]

0.19 [5]

0.89 [23](LIGHT HOUSE HEIGHT 23)

0.24 [6]

SIDE CABLE ENTRY OPTION

LPA STANDALONE MODELS: 26-3, 38-3 (shown), 58-3

9.80 [249]

4.33 [110]

2.60 [66]2.35 [60]

(L)10.52 [267]

4 X Ø0.20 [Ø5]3.70 [94]

6.40 [163]


0.24 [6]

3.74 [95]

0.19 [5]

1.26 [32]

2.50 [63]SIDE CABLE ENTRY OPTION

3.74 [95]

2.50 [63]1.75 [44]

2.77 [70]

(W)6.80 [173]

FANØ2.36 [Ø60]BOTTOM CABLE ENTRY OPTION

6.20 [157]

7.49 [190](H)

0.53 [13] (WITH PINS LENGTH 500)

LPA EDGE HANDLING MODELS: 4EH, 5EH, 6EH, 8EH (shown)

3.60 [91]

2.25 [57]

4.33 [110]4 X Ø0.20 [Ø5]

9.80 [249]

2.60 [66]

6.40 [163]

(L)10.52 [267]


0.27 [7]

2.50 [63]

0.19 [5]

SIDE CABLE ENTRY OPTION

3.74 [95]1.26 [32]

7.57 [192](H)

0.83 [21]

6.50 [165]

FANØ2.36 [Ø60]

)W()W]371] 371[08.6[ 08.6

1.75 [44]

2.77 [70]

2.50 [63]

3.74 [95]

BOTTOM CABLE ENTRY OPTION

LPA EMBEDDED MODELS: 25-1, 38-1, 58-1, 312-1 (shown), 812-1

4 X Ø0.20 [Ø5]

9.86 [250]

2.19 [56]

(L)10.47 [266]

1.56 [40]

2.69 [68]

2.35 [60]

6.32 [161]


0.26 [7]

1.60 [41]

1.82 [46](W)

3.74 [95]

2.75 [70] FANØ2.40 [Ø61]

3.12 [79]

BOTTOM CABLE ENTRY OPTION

7.51 [191](H)

2.50 [63]SIDE CABLE ENTRY OPTION

2.76 [70]

2.05 [52]

3.79 [96] (LPA1218 only)

3.74 [95]

2.77 [70]

1.75 [44]2.50 [63]

(W)6.80 [173]

FANØ2.36 [Ø60]BOTTOM CABLE ENTRY OPTION

6.20 [157]

7.49 [190](H)

0.53 [13] (WITH PINS LENGTH 500)

2.63 [67]

(L)12.49 [317]

(L)15.92 [404] ( LPA1218-3 only)

4.33 [110]

2.60 [66]

11.77 [299]

4 x Ø0.20 [Ø5]

6.40 [163]

LPA STANDALONE MODELS: 312-3, 812-3, 1218-3 (shown)

MWafer Sizes:

25 = 2'’ to 5'’26 = 2'’ to 6'’ 38 = 3'’ to 8'’ 58 = 5'’ to 8'’

312 = 3'’ to 12'’ 812 = 8'’ to 12'’

1218 =12'’ to 18'’4EH = 4'’ only

45EH = 4'’ and 5"5EH = 5'’ only

56EH = 5'’ and 6"6EH = 6'’ only8EH = 8'’ only8ET = 8'’ only

12ET =12'’ only

V = VacuumE = Edge HandlingC = Custom

Chuck Encoder: 1 = 10000 CPR

Chuck

2 = 24000 CPR*

PinsLighthouse

Chuck Diameter in mm

Contact Material:P = Peek (standard)V = Viton K = Kalrez A = AluminumT = TeflonE = Conductive PeekC = Custom

EH Edge HandlingET Edge Handling TAIKO

Standard Sizes:23 for 2'’ to 5'’23 for 2'’ to 6'’ 40 for 3'’ to 8'’ 40 for 5'’ to 8'’ 40 for 3'’ to 12'’ 76 for 8'’ to 12'’76 for 12'’ to 18'’

Customization Code

S = Side Cable EntryB = Bottom Cable Entry

Not applicable for Embedded models

1E = Embedded3 = Standalone

S 23 NE ****P 140

* LPA1218 available with 24000 CPR encoder only

SS3312LPA

CCD Sensitivity:S = StandardH = High

Pin Length in inch*10-3

Standard Sizes: 500 for 25 to 1218543 for 4EH to 8EH578 for 45EH & 56EH906 for 8ET & 12ETxxx Custom

V = Vacuum

V

E = Edge HandlingC = Custom

Contact Material:P = Peek (standard)V = Viton K = Kalrez S = Stainless SteelT = TeflonE = Conductive PeekC = Custom

500 * * * *P NEV

::mmm ni m ni ththgieH dr gieH draadndnaatStS3232 ro roff 52 52 o ott 8121 81216262 88 o ot t HHEE44 ro roff HEHE6262 ro roff 5454 HE HE & & 6565 HEHE8383 E88 ro roff ETHT & & 2121 ETEHxxxx momottsuC suC

Page: 18

26-3 38-3 58-3 312-3 812-3 1218-3 25-1E 38-1E 58-1E 312-1E 812-1E

1218-1E

N/A N/A

10mm 9mm

W

L 404mm

H

328mm267mm 317mm

10000 CPR Encoder

24000 CPR Encoder

Angular Accuracy (3 Sigma)

Body Dimensions

12mmOffset Limit

0.04º

173mm

190mm

MTBF

Cleanliness

Type

4EH, 45EH

5EH, 45EH, 56EH

6EH, 56EH

Host Interface

Flat/Notch Compatibility

Wafer Opacity

8EH, 8ET

12ET

Centering Accuracy (3 Sigma)

Weight

Facilities Required

Servo Axes

5.3kg to 6.0kg

One

3.4kg to 3.8kg

Vacuum Chuck

Three

5.0kg to 5.7kg

100-240V AC, 50-60Hz, 48V A or 24V DC/2A, V acuum 12’’ Hg for vacuum retention

Three

Vacuum Chuck and PinsHandling Edge Handling

190mm to 196mm

95mm

267mm or 317mm266mm

191mm

0.02º

25um

0.04 º

0.02 º

173mm

10mm 1.7mm to 2.0mm

0.06º

0.04º

50um 25um

150mm

200mm

300mm

450mm

Wafer

Square Substrates

Diameter

100mm

75mm

50mm

125mm

Specifications Standalone Embedded Edge Handling

Prealigner Model

RS232, Ethernet

SEMI Standards Compliant

Class 1

Transparent, Semi-Transparent, and Opaque

More than 70000 hours


Page: 20

Diamond Linear tracks

Page: 21features:

• Excellent structural rigidity• Modular and highly customizable design• Linear travel 31” or more• Seemless integration with Diamond robots• Standard RS-232 intergace and Ethernet(Telnet) interfaces to the host computer• Compact footprint• Class 1 clean-room environment compatibility• Reliability - MTBF > 60,000 hours, (MCBF > 10, 000, 000 cycles)

sPeCifiCations:axis Motion range axis rePeataBility Max sPeed

K 31” or more ±0.001”(0.025mm) @3σ

70 inch/s

Mounting holes Mounting holes sPaCing

6 x 9φmm 195mm

156,98 6,180

TRAC

K C

ON

TROLLER

2208 ,661

1455,709

2128 ,346

873,425

TRAC

K C

ON

TROLLER

L = TOTAL LENGHT

H =

340

H1 =

120

4,736

112,50 4,429 5 x 195 [7.677] = 975 38,3866 x 9 MOUNTING HOLES

2108 ,268

2108

,268

197,50 7,776 WORK TRAVEL 197,50 7,776

1435

,624

MOUNTING HOLES

ROBOT MOUNTING HOLES

268 10,551

W = 400 [15,75] (wo cable)

MPage: 22

EquipeWafer Handling Products

Page: 23Equipe Products

Equipe Series atmospheric robots represent the world standard of wafer handling atmospheric robots. Designed for superior performence and reliability, the Equip Series are a cost-effective solution to your needs.

Robust, balanced design is central to the outstanding performance of these systems. Large motors and smooth antibacklash transmissions allow rapid motion with no sensitivity loss within the closed-loop DC servo system. No motors, belts or pulleys are exposed above the mounting surface at any time, keeping particulate contamination to a minimum.

The innovative, all-in-one, class 1 clean room compatible design incorporates the motion controller, servo amplifiers, and power supply within the robot’s industry standard footprint.

High-strength structural members enable top, bottom or side mount configurations without compromising the system rigidity. A 32-bit, real-time kernel delivers accurate motion profiling along smooth continuous trajectories, while the distributed control architecture allows a seamless integration with linear tracks, pre-aligners, and other sub-components.

Of course, the Equipe robots have all the quality and features you’ve come to expect from Milara® wafer handling robots. Easy macro programming, Time Optimized Trajectory software, the most reliable cassette mappers (optional) and seamless integration with Linear Tracks, Pre-Aligners and other components all add up to the new standard in automation.

Page: 24 axM 100 atMosPheriC roBot

installation:Mounting holes Mounting holes sPaCing end effeCtor Mounting dead zone

3x1/4-20 on dia. 9.000” 8.500” 4x4-40 on dia. 1.390” 25 °

features:• MTBF 75,000 hours• Vertical travel: 7” ATM 100• Reach up to 14.4” plus end effector• Class 1 clean room compatible• Compact footprint• Highly repeatable positioning• Available with CE Mark• High ESD tolerance• Macro programmable• MIntelligent commands• S2-93A Ready

sPeCifiCations:axis Motion range axis rePieataBility sPeed

T 335° ± 0.02° @3 σ 360°/secR 2 x (5.25” or 7.2’’) ± 0.002” @3 σ 24 inches/secZ 13.2’’ ± 0.002” @3 σ 10 inches/sec

features:• Robot mechanics are free of backlash, providing highly repeatable positioning.• All system parts are located below the wafer plane, minimizing particulate contamination.• Low-inertia design allows rapid motion with no sensitivity loss within the closed-loop DC servo system.• Highly configurable to accommodate a variety of application requirements.• Built-in reliability and high ESD immunity tolerance ensure dependable operation for many years.

Page: 25Equipe Products axM 400 atMosPheriC roBot

sPeCifiCations:axis Motion range axis rPeataBility sPeed

T 335° ± 0.02° @3 σ 360°/secR 2 x (5.25” or 7.2’’) ± 0.02° @3 σ 24 inches/secZ 13,2’’ ± 0.02° @3 σ 10 inches/sec


3 x 0.25” thru on dia. 12.350” 11.500”

4 x 4-40 on dia. 1.390”(405, 407)

4 x 6-32 on dia. 2.000” (407B, 407C)

25 °

Page: 26 dBM atMosPheriC roBot

sPeCifiCations:axis Motion range axis rePieataBility sPeed

T 360° + 0.01° 360°/secR up to 14.50’’ < ± 0.002” 24 inches/secZ up to 17’’ ± 0.001” 12 inches/sec


4 x .375” thru holes 11.75” 4 x 6-32, 1.00” spacing N/A

features:• Optimized for fast wafer swaps• Standard Integral horseshoe end effectors• Two independent Radial Axis• High throughput• Full 360° theta rotation eliminates dead zone• Improved stiffness and orthogonality• Cassette mapper (optional)• CE Mark (standard) and SEMI S2 Compliant

features:• Optimized for fast wafer swaps• Standard Integral horseshoe end effectors• Two independent Radial Axis• High throughput• Full 360° theta rotation eliminates dead zone.• Improved stiffness and orthogonality• Available with CE Mark• Cassette mapper (optional)• CE Mark (standard) and SEMI S2-Compliant

Intelligent control helps increase throughput Multitasking control of sophisticated functions minimizes host system interaction to speed throughput. The system can, for example, pre-align one wafer while the robot transfers another wafer. And, when used in conjunction with the standard 16 external I/Os, the unit can monitor and control external devices from within the robot mac-ros, thus freeing the host computer to perform other tasks. “S-Curve” motion profiles provide smooth, fast wafer transfers and increased robot life, while the proprietary time optimized trajectory option increases wafer through-put up to 33% over conventional motion profiles. The ESC-200 provides built-in support for all options, including Flip-per, Linear Track, SMIF pods and Wafer Scanner.

Compliant with safety and regulatory standards Optional SEMI S2 compliant versions of the ESC-200 pro-vide all the interlocks and safety features needed to help make your system S2 compliant. Standard CE mark and UL recognition make regulatory compliance easier.

Page: 27Equipe Products esC 200 Controller

Page: 28 Pre200 Pre-aligner

features:• MTBF 65,000 hours• Class 1 clean room compatible• Two independent Radial Axis• Compact Footprint• Highly repeatable positioning• Macro programmable• Intelligent Commands• Available for both: Pin-Load (PRE-201) models ; Chuck Load (PRE-200) models• CE Mark available• FastScan high-throughput (option)• Ultra-clean option available

features:• MTBF 65,000 hours• Class 1 clean room compatible• Two independent Radial Axis• Compact Footprint• Highly repeatable positioning• Macro programmable• Intelligent Commands• Available for both: Pin-Load (PRE-301) models Chuck Load (PRE-300) models• CE Mark available• FastScan high-throughput (option)• Ultra-clean option available

Pre300 Pre-aligner

Milara® Inc. offers the highest precision pre-aligner on the market. The PRE-200 Series Wafer Pre-Aligner combines a high-resolution optical system with high-precision mechanics to yield the greatest overall performance available.

Wafers sized from 3” to 8” (76mm to 200mm) are centered and aligned without mechanical changes or readjustments. The Pre-Aligner automatically senses if the wafer has a flat, notch or major/minor flats. There is even optional software that enables the user to align square substrates. Other features include direct encoder feedback on the wafer chuck and a highly linear light source providing optimal illumination to the Charged Coupled Device (CCD) sensor.

Reliability is one of the PRE-200’s strongest suits With very few moving parts and high ESD tolerance, MTBF numbers are greater than 65,000 hours. Combined with the Milara ATM robot, the PRE-200 Pre-Aligner completes your wafer-handling picture.

Milara® offers the highest precision pre-aligner on the market for 300mm wafers. The PRE-300 Wafer Pre-Aligner combines high-resolution optical sensing with high-precision mechanics to yield the greatest overall performance available.

Wafers sized from 150mm to 300mm are accommodated without mechanical changes or readjustments. The PRE-300 has sensing capabilities which automatically detect if the wafer has a notch or a flat. Other features include direct encoder feedback on the wafer chuck and a highly linear light source to provide optimal illumination to the Charge Coupled Device (CCD).

Full servo control of each of the three axes provides smooth, fast motions. Used with the ESC-200 Series Controller with its high speed CPU and high resolution servo, x/y precision is better than +/- .002” and theta precision is better than +/- .04°.

sPeCifiCations:axis Motion range axis rePieataBility

T Rotate Chuck - .04° (3 Sigma)R Used for X/Y Offset X/Y Alignment : - 0.002” ( +/- 50 Micron) (3 σ)Z Raise and Lower Pins N/A

a

sPeCifiCations:axis Motion range axis rePieataBility

T Rotate Chuck - .04° (3 Sigma)R Used for X/Y Offset X/Y Alignment : - 0.002” ( +/- 50 Micron) (3 σ)Z Raise and Lower Pins N/A

a

Page: 29Equipe Products

MPage: 30

Equipment FrontEnd Modules

EFEM

Page: 31Integrated System

The EFEM (Equipment Front End Module) is a class 1 mini-environment system designed to maximize productivity of semiconductor processing equipment tools that require the highest level of automation.

The Lead Port is modular and can seamlessly integrate to the OEM process tools. Milara EFEMs can be customized to meet the automation requirements of any semiconductor manufacturing facility, adding stations such as prealigners and OCR.

Capable of handling various wafer sizes with 1-4 load ports or custom cassette holders. Diamond EFEMs are built to customer specification to meet specific system and layout requirements.

features:• Integrated design for easy setup and installation, speeding tool qualification• Excellent structural rigidity• Highly customizable design• SEMI BOLTS interface• Class 1 clean-room environment compatibility• Fully compliant with SEMI standards• Front mount access for fast and easy serviceability• Support for 200mm and 300mm wafers• 2,3 and 4 Load Port configuration• Milara Diamond H3 & H4 Robots• Process independent modular design• Recipe driven Diamond Commander Software• Optional SECS/GEM interface• Monitor and Keyboard on Ergotron Arm• Full line of Wafer Aligners• Mapping Sensor• Light tower• Reliability - MTBF > 60,000 hours, (MCBF >10,000,000 cycles

Dimensions*2 Wide EFEM "65 H x 50" W x 44.2" D

(1615 mm H x 1270 mm W x 1123 mm D)Utility ConnectionsElectrical power supply

Vacuum

100-120AVC, 200-240VAC Minimum of 3.0kVA capacity50/60 Hz, single phase

Load PortRobotPrealigner

10 L/min at 375 mmHg (21ft3/hr at 14.77" Hg)10 L/min at 635 mmHg (21 ft3/hr at 25" Hg)304.80 mmHg (12" Hg)

Compressed air (input)Load port

purified >5 µmMin. 60 psi, Max. 145 psi (relative) oil-free

Consumption >1 m3/h for 10 cycles/hourConnection

Robot None

One-touch fitting for ¼" tubing

Ambient ConditionsTemperature Operation: 10°C to 40°C (50°F-104°F) Humidity Operation: 35% to 55% relative humidityCleanliness ISO Class 1 External Communications RS232 or TCP/IPSEMI ComplianceE1.9 E5 E15.1E30 E37 E39 E40 E47.1E57 E62 E63 E64 E84 E87 E90 E94 E95 E99 E116E120E132E134

300 mm Cassette

300 mm Tool Load PortSEMI Equipment Communications Standard 2 Message Content (SECS-II)

Generic Equipment Model (GEM)High-Speed SECS Message Services (HSMS)Object Services Standard: Concepts, Behavior, and ServicesStandard for Processing Management300 mm Boxes and PodsKinematic Couplings300 mm FIMSBOLTS Interface300 mm Cart DockingAMHS Parallel I/O InterfaceCarrier Management System (CMS)Substrate Tracking (CTS)Control Job Management (CJM) unified user interface (UI) SECS-I and SECS-II Protocol for Carrier ID Reader/Write (CIDRW) Equipment Performance Tracking (EPT) Common Equipment Model (CEM)Equipment Client Authentication and Authorization (CA&A) Data Collection Management (DCM)

S2/S8/S14 Safety GuidelinesCE EMC, LVD, and MD Directives

Dimensions are approximate depending on your EFEM configuration.

Page: 32

2 Port Milara EFEM

3 Port Milara EFEM

758

758

1123

1123

382382357357

12701270

505505

1598

1598

1650

1650

1458

1458

300

300

899

899

776

776

630630

1898

1898

29.84

329

.843

758

758

44.21

344

.213

1123

1123

69.88269.88217751775

19.88219.882505505

14.07514.075357.50357.50

15.05915.059382.50382.50

19.88219.882505505

12.70

632

2.74

73.99

518

79.46

76.35

719

39.46

57.41

914

58.45

35.39

489

9

86.70

122

02.20


Page: 34

Milara continuously provides customer with custom wafer handler solutions for 200/300mm wafer platform. Our leading-edge technologies and our highly reliable and unique products offer the best solutions for the requirements of

your semiconductor equipment.

Features:• Equipped with Diamond Single arm or Dual arm wafer handling robots• Equipped with Diamond prealigner for precision alignment• Universal System compatible from 2”-12” wafer applications• Compact footprint to accommodate expensive fab space• Interlock access door• Options to include accessories such as Wafer ID reader, Wafer flipping station, Signal tower, EMO Button, Fan filter unit, etc.• High reliability and low particle generation

Wafer Loaders


MPage: 36

Wafer Sorters


The latest generation high-throughput wafer sorting platform from Milara Inc. It brings to market innovative and fully automated cassette stations, which provide a complete system from the loading of new substrates through the unloading of processed

substrates without interrupting the robot cycle. This enables unparalleled processing throughput of more than 220 wafers per hour.

A modular design allows for the processing of up to 20 carriers simultaneously and central to the system is Milara’s Diamond H4 dual-arm robot for rapid wafer swapping.End effectors on the robot include integrated through-beam sensors for quick and reliable wafer mapping, reporting occupied or empty slots, and identifying cross-slotted substrates.

Fully integrated precision wafer handling components include an autonomous prealigner to center wafers with 25 micron accuracy, an optical character reader to reliably track ID’s on both sides of the substrate, and high-precision digital scales capable of measuring a wafer in one half of a second with 1 milligram resolution. All components of the system are Class 1 compatible and a quiet fan filter built into the mini-environment provides laminar flow for maximum cleanliness.

Page: 38

MilaraContract Services

Page: 39Contract Services

Milara provides contract design and manufacturing services to a variety of industries, encompassing mechanical, electrical, and software. Milara has a long history to become the extension of customers’ capabilities through value engineering, material sourcing, Zero defect mentality and design velocity as well as design flexibility.

MaChiningMilara is a vertically integrated company, which defines the precision requirement from our own machine shop. Milara’s high precision machining centers, over 120 High-precision Mazak CNC machines, provide unparalled production speed and quality of parts fabrication. Combined with our ISO 9001:2015 certification, our focus is to provide our clients with around the clock production capability.

ContraCt designingMilara offers design service since the very beginning. Building on industry-leading knowledge and experience, our team of highly trained mechanical, electrical and software engineers has worked in different industries such as automotive, aerospace, bio-medical, optical and semiconductor. We serve as an extension to your engineering capabilities and provide constructive solutions to your design difficulties.

ContraCt engineeringOur newest contract service features “engineering for hire”. When you are in need of qualified engineer or an engineering team to get the job done, call Milara. With over 20 years of experience and a multi-continental team of engineers working around-the-clock, we can help you to lead the way of innovation.

ContraCt ManufaCturingWith our experienced background in Military product contract manufacturing and extensive production capabilites, Milara offers design, manufacturing and assembly services, encompassing mechanical, electrical, and software for customer’s products in a wide variety of industries, including but not limited to semiconductor, bio-medical and photolitography industries.

Milara, Inc.

49 Maple Street, Milford MA 01757, USATel: (508)-533-5322 Fax: (508)-533-8686 Mail: [email protected]

leading the way of innovation - milara, inc....• 1class clean-room environment compatibility •...

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