lecture 0. course introduction
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ECM583 Special Topics in Computer Systems. Lecture 0. Course Introduction. Prof. Taeweon Suh Computer Science Education Korea University. Course Information. Instructor Prof. Taeweon Suh Prerequisite Computer Architecture, Operating Systems, Java and C-programming Textbook - PowerPoint PPT PresentationTRANSCRIPT
Lecture 0. Course Introduction
Prof. Taeweon SuhComputer Science Education
Korea University
ECM583 Special Topics in Computer Systems
Korea Univ
Course Information
• Instructor Prof. Taeweon Suh
• Prerequisite Computer Architecture, Operating Systems, Java and
C-programming
• Textbook Beginning Android ADK with Arduino by Mario
Bohmer, Apress, 2012
• Office hours After class as needed By appointment at Lyceum 307
• Class web http://esca.korea.ac.kr/
• Contact Information [email protected] 02-3290-2397
2
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Objectives
• Understand computer systems with hands-on experience with Android system and accessory board
• Utilize a computer system to play with real-world electronic components
• Discuss and devise lab materials for educating Computer Science to K-12 students
3
IOIO for Android Android Mega ADK
Korea Univ
Lab Environment
• Android tablet (or phone) + ADK (Android Open Accessory Development Kit) Board
4
USB Cable
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Lab Environment (Cont.)
• Hardware Nexus 7 Tablet or
Personal Phone Arduino Mega ADK
board
• Software GUI-based Arduino
development tool Android Developer
Tools with Eclipse for app programming
5
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Computer Systems
• General-purpose computer systems
• Embedded Systems
6
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A Computer System (till 2008)
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CPU
North Bridge
South Bridg
e
Main Memor
y(DDR2)
FSB (Front-Side Bus)
DMI (Direct Media I/F)
Hard disk
USB
PCIe card
Peripheral devices
Graphics card
But, don’t forget the big picture!
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Past, Present and More…
8
Keep in mind that CPU and computer systems are evolving at a fast pace!
CPU
North Bridge
South Bridge
Main Memor
y(DDR2)
FSB (Front-Side Bus)
DMI (Direct Media I/F)
• Core 2 Duo – based Systems
• Core i7 (Ivy Bridge) – based Systems
FDI: Flexible Display Interface SPI: Serial Peripheral Interface SMBus: System Management Bus
Korea Univ
iPhone Generations
9http://en.wikipedia.org/wiki/History_of_the_iPhone
Original iPhone(iPhone 2G)
June 2007
iPhone 3G
June 2008
http://apple.wikia.com/wiki/IPhone_3G
iPhone 3GS
June 2009
iPhone 4
June 2010
Oct. 2011
iPhone 4S
Sep. 2012
iPhone 5
Korea Univ
Smartphone War
10http://www.sleetherz.com/2011/10/smartphone-war-in-fatal-three-way-iphone-4s-vs-droid-razr-vs-galaxy-nexus/
Korea Univ
iPhone 4 Teardown
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http://news.cnet.com/8301-13924_3-20006904-64.html
http://www.ifixit.com/Teardown/iPhone-4-Teardown/3130/1
GSM (Global System for Mobile communications): 2G, 3G, 4G ..UMTS (Universal Mobile Telecommunications Systems): one of 3G technologies being developed into 4G
Korea Univ
iPhone 4 Teardown
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A4 Processor (ARM Cortex A8) designed by Apple manufactured by Samsung
GSM and more
GSM (Global System for Mobile communications): 3G
Samsung flash memory (32GB): K9PFG08
Audio Codec (Cirrus Logic)
512MB Mobile DDR
Korea Univ
iPhone 4 Teardown
• Accelerometer detects when the user has rotated the device from portrait to landscape, then automatically changes the contents of the display accordingly
• Proximity sensor detects when you lift iPhone to your ear and immediately turns off the display to save power and prevent inadvertent touches until iPhone is moved away
• Ambient light sensor automatically adjusts the display’s brightness to the appropriate level for the current ambient light, enhancing the user experience and saving power at the same time
13
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iPhone 5 Teardown
14http://www.ifixit.com/Teardown/iPhone+5+Teardown/10525/2
16GB NAND Flash from Hynix
3-axis gyroscope
Wi-Fi module
A6 application processor, based off the ARMv7 ISA 1GB Elpida LP (Low Power) DDR2 integrated according to Chipworks
Touchscreen controller
Accelerometer
LTE modem
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Galaxy S3 Teardown
15http://www.ifixit.com/Teardown/Samsung-Galaxy-S-III-Teardown/
Exynos 4412: Quad-core A9 with 1GB DDR2
Intel Wireless Processor
Samsung 16GB eMMC (MultiMediCard) + 64MB NAND Flash
http://www.samsung.com/
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Exynos 4412 Block Diagram
16PoP: Package-on-Package
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Flip-chip DRAM on App. Processor• K3PE7E700B-XXC1 low power 1GB DDR2• S5PC210 Exynos 4210 : ARM Cortex A9 (Dual-core) 1.4GHz with Mali-400 MP GPU
Galaxy Note Teardown
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LCD Driver
Yamaha Audio Codec
Audio Processor
Galaxy Note Teardown
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STMicroelectronics’ Gyroscope
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Atmega2560 Overview
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8-bit CPU
Timer/Counter
Internal memories 4KB EEPROM 256KB Flash 8KB SRAM
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Grading Policy
• K-12 Education Proposal & Project: 60%
• Class Presentations: 40%
20
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Backup Slides
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Atmega328 Overview
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8-bit CPUTimer/Counter
Internal memories 32KB Flash 1KB EEPROM 2KB SRAM
Serial Peripheral InterfaceUniversal
Synchronous and Asynchronous serial Receiver and Transmitter (Serial)
GPIO 2-wire Serial Interface
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Present, Near Future and More…
23
CPU
North Bridge
South Bridge
Main Memor
y(DDR2)
FSB (Front-Side Bus)
DMI (Direct Media I/F)
CPU
North Bridge
South Bridge
Main Memor
y(DDR3)
Quickpath (Intel) orHypertransport (AMD)
DMI (Direct Media I/F)
• Core 2 Duo – based Systems
• Core i7– based Systems
Keep in mind that CPU and computer systems are evolving at a fast pace