lecture 3 - mixedsignal | knowledge is power · pdf file · 2013-06-26lecture 3...
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1
Lecture 3Noise
George YuanHong Kong University of Science and Technology
Fall 2010
©
George Yuan, HKUST
2
Outline
•
Introduction•
Device noise models
•
Circuit noise analysis•
Other noise sources–
Power noise
–
Substrate noise•
Noise reduction
•
Chopping
©
George Yuan, HKUST
6
Noise correlation
21 VVVeq
2212 VVVeq
©
George Yuan, HKUST
22
2121
22
21
221
2 2 VVVVVVVVVeq
Noise power
Equivalent noise
uncorrelated
9
Outline
•
Introduction•
Device noise models
•
Circuit noise analysis•
Other noise sources–
Power noise
–
Substrate noise•
Noise reduction
•
Chopping
©
George Yuan, HKUST
23
Outline
•
Introduction•
Device noise models
•
Circuit noise analysis•
Other noise sources–
Power noise
–
Substrate noise•
Noise reduction
•
Chopping©
George Yuan, HKUST
34
Noise of Current Mirror with series R
©
George Yuan, HKUST
2
1221
222
22
22
21
22
2
12
11m
mm
m
RRinout
diRg
diRg
dididiRRdi
45
Outline
•
Introduction•
Device noise models
•
Circuit noise analysis•
Other noise sources–
Power noise
–
Substrate noise•
Noise reduction
•
Chopping©
George Yuan, HKUST
46
Ground
©
George Yuan, HKUST
1inch wire: 20nH/inch, a transient current: SR=10mA/ns
Δv = L = 20 nH
×
= 200 mVΔiΔt
10mAns
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Grounding for Mixed-signal IC
©
George Yuan, HKUST
• DGND for mixed-signal IC should connect to analog ground plane• DGND couples to AGND• VD
separate to VA
by ferrite bead• Digital switching current absorbed by the decoupling cap path
• Separate digital output and data bus by a register
• Limiting current resistor R
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Substrate Noise
©
George Yuan, HKUST
1. Rn->sub
dominates if two n+ are far away (>100um)2. Guard ring useless
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Source, Bulk Connection?
©
George Yuan, HKUST
The disconnection of B and S reduces substrate noise injection
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Pad Frame, Down Bonding
©
George Yuan, HKUST
1.
Tie the substrate to solid ground;
2.
Down bonding low impedance;
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Outline
•
Introduction•
Device noise models
•
Circuit noise analysis•
Other noise sources–
Power noise
–
Substrate noise•
Noise reduction
•
Chopping©
George Yuan, HKUST
58
Circuit Noise Minimization
©
George Yuan, HKUST
•
Increase input gm•
Enlarge other transistors to reduce the flicker noise and thermal noise
•
Input transistor pair dominates the noise
•
Reduce the flicker noise of input transistors
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References
©
George Yuan, HKUST
1.
W. Sansen, Analog Design Essentials, Springer, 20062.
W. Kester, The Data Conversion Handbook, Analog Devices, 20053.
C. Enz, E. Vittoz, and F. Krummenacher, “A CMOS chopper amplifier”, IEEE J. Solid-State Circuits, Vol. SC-22, pp. 335-342, Jun. 1987
4.
R. Yazicioglu, P. Merken, R. Puers, and C. Van Hoof, “A 60uW 60nV/Hz0.5
readout front-end for portable biopotential
acquisition systems”, IEEE J. Solid-State Circuits, Vol. 42, pp. 1100-1110, May 2007
5.
R. Burt, and J. Zhang, “A micropower
chopper-stablized
operational amplifier using a SC notch filter with synchronous integration inside the continuous-time signal path”, IEEE J. Solid-State Circuits, Vol. 41, pp. 2729-2736, Dec. 2006
6.
J. Witte, J. Huijsing, and K. Makinwa, “A current-feedback instrumentation amplifier with 5uV offset for bidirectional high-side current-sensing”, IEEE J. Solid- State Circuits, Vol. 43, pp. 2769-2785, Dec. 2008
7.
B. Owens, S. Adluri, P. Birrer, R. Shreeve, S. Arunachalam, K. Mayaram, and T. Fiez, “Simulation and measurement of supply and substrate noise in mixed-signal ICs”, IEEE J. Solid-State Circuits, Vol. 40, pp. 382-391, Feb. 2005