led_850nm

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Document Number: 81810 For technical questions, contact: [email protected] www.vishay.com Rev. 1.2, 25-Jun-09 1 High Speed Infrared Emitting Diode, 850 nm, GaAlAs Double Hetero TSHG5210 Vishay Semiconductors DESCRIPTION TSHG5210 is an infrared, 850 nm emitting diode in GaAlAs double hetero (DH) technology with high radiant power and high speed, molded in a clear, untinted plastic package. FEATURES Package type: leaded Package form: T-1¾ Dimensions (in mm): 5 Leads with stand-off Peak wavelength: λ p = 850 nm High reliability High radiant power High radiant intensity Angle of half intensity: ϕ = ± 10° Low forward voltage Suitable for high pulse current operation High modulation bandwidth: f c = 18 MHz Good spectral matching with CMOS cameras • Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 definition APPLICATIONS • Infrared radiation source for operation with CMOS cameras High speed IR data transmission Smoke-automatic fire detectors Note Test conditions see table “Basic Characteristics” Note MOQ: minimum order quantity Note T amb = 25 °C, unless otherwise specified 94 8390 PRODUCT SUMMARY COMPONENT I e (mW/sr) ϕ (deg) λ p (nm) t r (ns) TSHG5210 230 ± 10 850 20 ORDERING INFORMATION ORDERING CODE PACKAGING REMARKS PACKAGE FORM TSHG5210 Bulk MOQ: 4000 pcs, 4000 pcs/bulk T-1¾ ABSOLUTE MAXIMUM RATINGS PARAMETER TEST CONDITION SYMBOL VALUE UNIT Reverse voltage V R 5 V Forward current I F 100 mA Peak forward current t p /T = 0.5, t p = 100 μs I FM 200 mA Surge forward current t p = 100 μs I FSM 1 A Power dissipation P V 180 mW Junction temperature T j 100 °C Operating temperature range T amb - 40 to + 85 °C Storage temperature range T stg - 40 to + 100 °C Soldering temperature t 5 s, 2 mm from case T sd 260 °C Thermal resistance junction/ambient J-STD-051, leads 7 mm, soldered on PCB R thJA 230 K/W

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  • Document Number: 81810 For technical questions, contact: [email protected] www.vishay.comRev. 1.2, 25-Jun-09 1

    High Speed Infrared Emitting Diode, 850 nm, GaAlAs Double Hetero

    TSHG5210Vishay Semiconductors

    DESCRIPTIONTSHG5210 is an infrared, 850 nm emitting diode in GaAlAsdouble hetero (DH) technology with high radiant power andhigh speed, molded in a clear, untinted plastic package.

    FEATURES Package type: leaded Package form: T-1 Dimensions (in mm): 5 Leads with stand-off Peak wavelength: p = 850 nm High reliability High radiant power High radiant intensity Angle of half intensity: = 10 Low forward voltage Suitable for high pulse current operation High modulation bandwidth: fc = 18 MHz Good spectral matching with CMOS cameras Compliant to RoHS directive 2002/95/EC and in

    accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 definition

    APPLICATIONS Infrared radiation source for operation with CMOS

    cameras

    High speed IR data transmission Smoke-automatic fire detectors

    NoteTest conditions see table Basic Characteristics

    NoteMOQ: minimum order quantity

    NoteTamb = 25 C, unless otherwise specified

    94 8390

    PRODUCT SUMMARYCOMPONENT Ie (mW/sr) (deg) p (nm) tr (ns)TSHG5210 230 10 850 20

    ORDERING INFORMATIONORDERING CODE PACKAGING REMARKS PACKAGE FORMTSHG5210 Bulk MOQ: 4000 pcs, 4000 pcs/bulk T-1

    ABSOLUTE MAXIMUM RATINGSPARAMETER TEST CONDITION SYMBOL VALUE UNITReverse voltage VR 5 VForward current IF 100 mAPeak forward current tp/T = 0.5, tp = 100 s IFM 200 mASurge forward current tp = 100 s IFSM 1 APower dissipation PV 180 mWJunction temperature Tj 100 COperating temperature range Tamb - 40 to + 85 CStorage temperature range Tstg - 40 to + 100 CSoldering temperature t 5 s, 2 mm from case Tsd 260 CThermal resistance junction/ambient J-STD-051, leads 7 mm,

    soldered on PCB RthJA 230 K/W

  • www.vishay.com For technical questions, contact: [email protected] Document Number: 818102 Rev. 1.2, 25-Jun-09

    TSHG5210Vishay Semiconductors High Speed Infrared Emitting Diode,

    850 nm, GaAlAs Double Hetero

    Fig. 1 - Power Dissipation Limit vs. Ambient Temperature Fig. 2 - Forward Current Limit vs. Ambient Temperature

    NoteTamb = 25 C, unless otherwise specified

    0

    20

    40

    60

    80

    100

    120

    140

    160

    180

    200

    0 10 20 30 40 50 60 70 80 90 100

    21142 Tamb - Ambient Temperature (C)

    P V - Po

    we

    r D

    issi

    patio

    n (m

    W)

    RthJA

    = 230 K/W

    0

    20

    40

    60

    80

    100

    120

    0 10 20 30 40 50 60 70 80 90 100Tamb - Ambient Temperature (C)21143

    I F - Fo

    rwa

    rd C

    urr

    en

    t (mA)

    RthJA

    = 230 K/W

    BASIC CHARACTERISTICSPARAMETER TEST CONDITION SYMBOL MIN. TYP. MAX. UNIT

    Forward voltageIF = 100 mA, tp = 20 ms VF 1.5 1.8 V

    IF = 1 A, tp = 100 s VF 2.3 VTemperature coefficient of VF IF = 1 mA TKVF - 1.8 mV/KReverse current VR = 5 V IR 10 AJunction capacitance VR = 0 V, f = 1 MHz, E = 0 Cj 125 pF

    Radiant intensityIF = 100 mA, tp = 20 ms Ie 140 230 420 mW/sr

    IF = 1 A, tp = 100 s Ie 2300 mW/srRadiant power IF = 100 mA, tp = 20 ms e 55 mWTemperature coefficient of e IF = 100 mA TKe - 0.35 %/KAngle of half intensity 10 degPeak wavelength IF = 100 mA p 820 850 880 nmSpectral bandwidth IF = 100 mA 40 nmTemperature coefficient of p IF = 100 mA TKp 0.25 nm/KRise time IF = 100 mA tr 20 nsFall time IF = 100 mA tf 13 nsCut-off frequency IDC = 70 mA, IAC = 30 mA pp fc 18 MHzVirtual source diameter d 3.7 mm

  • Document Number: 81810 For technical questions, contact: [email protected] www.vishay.comRev. 1.2, 25-Jun-09 3

    TSHG5210High Speed Infrared Emitting Diode,

    850 nm, GaAlAs Double HeteroVishay Semiconductors

    BASIC CHARACTERISTICSTamb = 25 C, unless otherwise specified

    Fig. 3 - Pulse Forward Current vs. Pulse Duration

    Fig. 4 - Forward Current vs. Forward Voltage

    Fig. 5 - Radiant Intensity vs. Forward Current

    Fig. 6 - Radiant Power vs. Forward Current

    Fig. 7 - Relative Radiant Power vs. Wavelength

    Fig. 8 - Relative Radiant Intensity vs. Angular Displacement

    100

    1000

    0.01 0.1 1 10 100

    tP - Pulse Duration (ms)16031

    tP/T = 0.01

    0.05

    0.2

    0.5

    0.1

    0.02

    Tamb < 50 C

    I F - Fo

    rwa

    rd C

    urr

    en

    t (mA)

    18873

    I F - Fo

    rward

    Curr

    ent (m

    A)

    1000

    100

    10

    1

    VF - Forward Voltage (V)0 2 4

    tP = 100 stP/T = 0.001

    1 3

    1

    10

    100

    1000

    10 000

    1 10 100 100021307 IF - Forward Current (mA)

    I e - R

    adia

    nt In

    tens

    ity (m

    W/s

    r)

    tP = 0.1 mstP/T = 0.001

    0.1

    1

    10

    100

    1000

    1 1 0 100 1000 16971 I F - Forward Current (mA)

    - R

    adia

    nt P

    owe

    r (m

    W)

    e

    800 850- Wavelength (nm)

    90016972

    0

    0.25

    0.5

    0.75

    1.0

    1.25

    e, re

    l - R

    elat

    ive

    Rad

    iant

    Pow

    er

    21111 0.6 00.20.4

    0.9

    0.8

    030

    10 20

    40

    50

    60

    7080

    0.7

    1.0

    I e re

    l - R

    elat

    ive

    Rad

    iant

    Inte

    nsity

    - An

    gula

    r Dis

    plac

    emen

    t

  • www.vishay.com For technical questions, contact: [email protected] Document Number: 818104 Rev. 1.2, 25-Jun-09

    TSHG5210Vishay Semiconductors High Speed Infrared Emitting Diode,

    850 nm, GaAlAs Double Hetero

    PACKAGE DIMENSIONS in millimeters

    (4.7)

    12.5

    0

    .3

    A C

    35.5

    0

    .55

    < 0

    .7

    1.1 0.25

    0.5 + 0.15- 0.05

    5 0.15

    2.54 nom.

    0.5 + 0.15- 0.05

    5

    .8

    0.1

    5

    8.7

    0.

    3

    7.7

    0.

    15

    1 m

    in.

    Area not plane

    technical drawingsaccording to DINspecifications

    R 2.49 (sphere)

    6.544-5258.02-4Issue: 6; 19.05.0995 10916

  • Document Number: 91000 www.vishay.comRevision: 18-Jul-08 1

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