leds lighting the way towards smart cities
TRANSCRIPT
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Memoori Webinar – LED’s Lighting the Way towards smart CitiesSemiconductor approach to integrated lighting solutionsMICHAEL LEGOFF (CEO)
DR KEITH STRICKLAND (C TO)
11 TH MAY 2016
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2COMPANY CONFIDENTIAL
Plessey is an innovative technology design and manufacturing company
• Globally recognised British brand
• Innovation and technology centres in Swindon and Plymouth
• Significant manufacturing facilities in Plymouth
• Strong management team and experienced advisory board
World class GaN-on-Silicon light emitting diode (“LED”) manufacturing technology for the growing solid state lighting (“SSL”) market
• In March 2013 Plessey launched world’s first available GaN on 6-inch silicon LED products
• GaN on Silicon USPs in conjunction with silicon / IC industry advanced packaging
• Differentiated SSL solutions – Integrated Inteligent (i2LED) approach
• Provides integration solution for smart LED lighting
• Cost advantage over traditional LED manufacturing technologies
• Demonstrating LED performance at >60% WPE
Executive Summary
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3COMPANY CONFIDENTIAL
Global Presence
HQ R&D centre Sales office
Plymouth
Swindon
Philadelphia
Florianópolis
ShenzhenDelhi
Shanghai
Munich
Milan
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4COMPANY CONFIDENTIAL
2016 AND ONWARDS
Acquisition of CamGaN provides access
to ground-breaking LED technology
Market-leading sensor technology
developed alongside legacy product sales
Plessey doubles efficacy within the year, from 32 to 64lm/W
Plessey produces world’s first commercial LEDs manufactured on 6” (150mm) diameter silicon substrates
Transfer of experimental recipe onto production tool completed
Plessey re-launched from the Swindon
and Plymouth facilities
Mainstream GaN-on-Si production
Expanded product range – Power LEDs
Efficacy at 130lm/W, and higher in lab
2013201220112010 2014
Advanced packaging solutions
i2LED technology
14 reactors installation plans
Plessey: An innovative technology company
2015
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5COMPANY CONFIDENTIAL
Si
HEAT
GaN on Silicon – Inherent Unique Selling Points
• Better Thermal Performance that provides 3 degrees of leverage• Lower LED operating temp Higher reliability
• Simpler heat sink Lower system cost
• Higher drive current cost down through more lumens per die area
• Improved Hot-Cold factor
• Focussed light emitting surface (smaller etendue)• Surface emitter V.S. volume emitter: How “spread out” the light is
• Simpler and lower cost optical system
• Better lm/W maintenance when scaling up die size
• Better uniformity• Better process control for target wavelength
• Higher wavelength binning yield Lower cost for LEDs with tight
binning requests
• Sharper wavelength peak for big die
• Better colour control for a high power LED
Si 149 W/m·K
Sapphire 27 W/m·K
LIGHT
SiLight absorption → Efficiency loss~20% efficiency drop ~2% efficiency drop
Our GaN-on-Si
Typical GaN-on-Sapphire
Wavelength Std Dev
Consistent PL wavelength standard deviation of < 3nm, typical 2.5nm.Wafer bow is within a tight range of 0 um 10um
Si
Si
Si
mirror
Simple mesa Vertical Thin Film
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6COMPANY CONFIDENTIAL
n-up VLED Chip on Si
Chip Scale Packaging
Wafer Level Packaging
GEN 1: Vertical LED GEN 2: Segmentation/ Chip Scale Optics and
Advanced Packaging
GEN 3: Wafer Scale Packaging &TSV
Intelligent LED Monolithic
Si-Integration
GEN 4: Active Sub-mount
• Double bottom contacts• Active bonded wafer
• Addressable arrays• Zener Diode• Low Power regulation• Photodiodes• Mount on Silicon
• n-Up VLED with wire bond• Two bottom contact• Wafer level phosphor
dispense• TSV-Through Silicon Vias• Wafer scale LED to sub-
mountHV Segmentation
• VHA process• Segmented LED on chip
On-Chip Diagnostics & Controls for• Temperature• Intensity• Spectrum• ESD Connectivity & CommunicationsMicro displays
Hi-Voltage (>48V) DC / AC LEDs for system level benefits in• Retrofits (space constraint)• Driver efficiency• AutomotiveHigh Density LED Arrays for• Automotive Headlamps• Intelligent LED Displays• Power Projection Sources
• Cost Reduction by Scaling to 8” Si• Large Area LEDs• Surface Emission• Superior Thermal Performance• Competitive performance
• No Wire Bonds (Hi Reliability)• Flat Top for Direct Optical Attach• Optimized Active Area Usage• No Far Field Wire Bond Shadow• Low Contact Resistance, • Good thermal resistance
Technology Roadmap
Chip Scale Optics and Reflectors
• White light beam shaping• Reduced secondary optics
• Size and format• System cost advantages• Greater design freedom• Spots• Hi Bays• Stadiums
• On Chip white light • Collimation potential down
to 10 degrees
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Thank You