lev finkelstein isca/thermal workshop 6/2004 1 overview 1.motivation (kevin) 2.thermal issues...

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1 Lev Finkelstein ISCA/Thermal Workshop 6/2004 Overview 1. Motivation (Kevin) 2. Thermal issues (Kevin) 3. Power modeling (David) 4. Thermal management (David) 5. Optimal DTM (Lev) 6. Clustering (Antonio) 7. Power distribution (David) 8. What current chips do (Lev) 9. HotSpot (Kevin)

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Page 1: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

1 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Overview

1. Motivation (Kevin)2. Thermal issues (Kevin)3. Power modeling (David)4. Thermal management (David)5. Optimal DTM (Lev)6. Clustering (Antonio)7. Power distribution (David)8. What current chips do (Lev)9. HotSpot (Kevin)

Page 2: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

2

Lev Finkelstein ISCA/Thermal Workshop 6/2004

What current chips do

Power and thermal management

Page 3: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

3 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Controllers

• Inputs (power, temperature, etc.)• Response time• Tuning• Simplicity of implementation• Performance, reliability• Power management / thermal

management

Page 4: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

4 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Controllers (cont’d)

• A non-trivial tradeoff

Performance Reliability

Cost

Page 5: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

5 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Real processors:

• IBM* PowerPC* G3/G4 Cache throttling • AMD* PowerNow!* Technology• Transmeta* Longrun* technology• Intel® SpeedStep® technology• Enhanced Intel® SpeedStep technology

* Other names and brands may beclaimed as the property of others

Page 6: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

6 Lev Finkelstein ISCA/Thermal Workshop 6/2004

PowerPC G3 Microprocessor

• On-chip temperature sensor (junction temperature)– Based on differential voltage change across

2 diodes of different sizes – Implemented in PowerPC G3/G4 processors

• OS required for control• Instruction Cache Throttling used to

dynamically lower junction temperature

From Micro-35 tutorial

Page 7: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

7 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Transmeta LongRun**

• LongRun power management– Code Morphing* software (processor-

internal)– Performance demands are determined by

sampling the idle time

• Crusoe* processor***

– Voltage changes in steps of 25 mV – Frequency changes in steps of 33 MHz

*Other names and brands may be claimed as the property of others

** Source: http://www.transmeta.com*** Data dated 2001

Page 8: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

8 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Transmeta LongRun (cont’d)

• Idle time decrement V&f• Activity increment V&f (if possible)• Performance mode V&f adjustment

Source: http://www.transmeta.com/crusoe/longrun.html

Page 9: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

9 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Previous Intel microprocessors1

• Thermal monitor mechanism• A two-point mechanism using voltage

scaling (for battery life)

1Information on Intel microprocessors is based on Efraim Rotem’s presentation in the TACS workshop 06/2004

Page 10: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

10 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Thermal monitor

• Based on clock throttling• Full operational mode: maximal

frequency• Minimal operation mode: clocks are

stalled for a part of the duty cycle• Activation options:

– By OS (e.g., ACPI)– By a special hardware

Page 11: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

11 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Static voltage scaling (for battery life)

• Performance mode – Maximal frequency & Vcc– AC outlet or set by user

• Power saving mode– Low frequency & Vcc– Upon request or while the user changed the

usage mode

Page 12: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

12 Lev Finkelstein ISCA/Thermal Workshop 6/2004

The Intel Pentium® M Processor

• Targets the mobile market• Improved power efficiency• Advanced ACPI interface• Enhanced SpeedStep architecture

Page 13: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

13 Lev Finkelstein ISCA/Thermal Workshop 6/2004

DVS in the Pentium M Processor

• Changes both voltage and frequency at the runtime

• Efficiently switches between different DVS control points

Page 14: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

14 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Thermal sensors

Control

Thermal throttleXXooCC

Thermal ControlLogic

SoftwareControl

PROCHOT#XXooCC

Thermal throttleXooCC

Thermal throttleCritical ShutdownYooCC

CriticalpointExternal A/D

•Two thermal sensors•Maximal temperature reached throttling •Critical shutdown point reached shutdown

Page 15: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

15 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Operation modes

• Software control mechanism (e.g., ACPI)– Track the junction temperature– Initiate the appropriate policy

• Self throttle– Digital temperature detector initiates one of

the power control cycles– Used as a fail-safe mechanism since it is

much faster than the software

Page 16: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

16 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Enhanced Intel SpeedStep technology

• Implements DVS• Upon a thermal trigger or SW request,

CPU halts execution and locks PLL at a new frequency (a few sec)

• Once finished, the Vcc starts changing to the new value (order of 1mV/sec)

• Transition up is done in the reverse order

Page 17: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

17 Lev Finkelstein ISCA/Thermal Workshop 6/2004

DVS cycle

Clock

Vcc

Power

Switch Back

Switch

Clock

Vcc

Power

Switch Back

Switch Back

Switch Switch

Page 18: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

18 Lev Finkelstein ISCA/Thermal Workshop 6/2004

DVS transitions

• Frequency transition is fast enough to allow non-interrupted application execution

• DVS transitions can be utilized for energy and thermal control during the normal operation flow

• The target frequency and voltage are programmable by BIOS or OS

• Support for multiple voltage/ frequency points

Page 19: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

19 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Adaptive policy (for battery life)

• Uninterrupted power state transition• User selectable policy• Increases frequency on demand, and

decreases power and frequency while idle for a long time

Page 20: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

20 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Info

• More specific information on Pentium M will be available at Efraim Rotem’s presentation in the TACS workshop 06/2004

Page 21: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

21 Lev Finkelstein ISCA/Thermal Workshop 6/2004

ACPI and OSPM1

• ACPI = Advanced Configuration and Power Interface (an open industry specification)

• OSPM = Operating System-directed configuration and Power Management

• Cooling decisions are based on the application load and the thermal heuristics of the system

1Source: The ACPI specification 2.0, see http://www.acpi.info/

Page 22: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

22 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Cooling policies

• Active cooling – a direct action by OSPM (e.g., turning on a fan)

• Passive cooling – reducing the power consumption (e.g., throttling)

• Critical trip points – shutdown

Page 23: Lev Finkelstein ISCA/Thermal Workshop 6/2004 1 Overview 1.Motivation (Kevin) 2.Thermal issues (Kevin) 3.Power modeling (David) 4.Thermal management (David)

23 Lev Finkelstein ISCA/Thermal Workshop 6/2004

Example of SW-based clock throttling

• P[%] = _TC1 * (Tn – Tn-1) + _TC2 * (Tn –Tt)

• Tn – current temperature

• Tt – target temperature

• Pn = Pn-1 + HW[-P]• Pn is in %

• The coefficients are set by the OEM