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Printed in KoreaP/NO : MFL68026206 (1402-REV00)

CHASSIS : LA46B

MODEL : 39LB5800 39LB5800-UG

CAUTIONBEFORE SERVICING THE CHASSIS,READ THE SAFETY PRECAUTIONS IN THIS MANUAL.

LED TVSERVICE MANUAL

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- 2 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All rights reserved.Only for training and service purposes

CONTENTS

CONTENTS .............................................................................................. 2

PRODUCT SAFETY ................................................................................. 3

SPECIFICATION ....................................................................................... 4

ADJUSTMENT INSTRUCTION ................................................................ 9

BLOCK DIAGRAM .................................................................................. 18

EXPLODED VIEW .................................................................................. 19

SCHEMATIC CIRCUIT DIAGRAM ..............................................................

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Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in theSchematic Diagram and Exploded View.It is essential that these special safety parts should be replaced with the same components as recommended in this manual to preventShock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.

General Guidance

An isolation Transformer should always be used during theservicing of a receiver whose chassis is not isolated from the ACpower line. Use a transformer of adequate power rating as thisprotects the technician from accidents resulting in personal injuryfrom electrical shocks.

It will also protect the receiver and it's components from beingdamaged by accidental shorts of the circuitry that may beinadvertently introduced during the service operation.

If any fuse (or Fusible Resistor) in this TV receiver is blown,replace it with the specified.

When replacing a high wattage resistor (Oxide Metal Film Resistor,over 1 W), keep the resistor 10 mm away from PCB.

Keep wires away from high voltage or high temperature parts.

Before returning the receiver to the customer,

always perform an AC leakage current check on the exposedmetallic parts of the cabinet, such as antennas, terminals, etc., tobe sure the set is safe to operate without damage of electrical

shock.

Leakage Current Cold Check(Antenna Cold Check)With the instrument AC plug removed from AC source, connect anelectrical jumper across the two AC plug prongs. Place the ACswitch in the on position, connect one lead of ohm-meter to the ACplug prongs tied together and touch other ohm-meter lead in turn toeach exposed metallic parts such as antenna terminals, phone

jacks, etc.If the exposed metallic part has a return path to the chassis, themeasured resistance should be between 1 M and 5.2 M .When the exposed metal has no return path to the chassis thereading must be infinite.

An other abnormality exists that must be correc ted before thereceiver is returned to the customer.

Leakage Current Hot Check (See below Figure)Plug the AC cord directly into the AC outlet.

Do not use a line Isolation Transformer during this check. Connect 1.5 K / 10 watt resistor in parallel with a 0.15 uF capacitorbetween a known good earth ground (Water Pipe, Conduit, etc.)and the exposed metallic parts.Measure the AC voltage across the resistor using AC voltmeterwith 1000 ohms/volt or more sensitivity.Reverse plug the AC cord into the AC outlet and repeat AC voltagemeasurements for each exposed metallic part. Any voltagemeasured must not exceed 0.75 volt RMS which is corresponds to0.5 mA.In case any measurement is out of the limits specified, there ispossibility of shock hazard and the set must be checked andrepaired before it is returned to the customer.

Leakage Current Hot Check circuit

IMPORTANT SAFETY NOTICE

SAFETY PRECAUTIONS

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SERVICING PRECAUTIONSCAUTION: Before servicing receivers covered by this servicemanual and its supplements and addenda, read and follow theSAFETY PRECAUTIONS on page 3 of this publication.NOTE : If unforeseen circumstances create con ict between thefollowing servicing precautions and any of the safety precautionson page 3 of this publication, always follow the safety precautions.Remember: Safety First.

General Servicing Precautions1. Always unplug the receiver AC power cord from the AC power

source before;a. Removing or reinstalling any component, circuit board mod-

ule or any other receiver assembly.b. Disconnecting or reconnecting any receiver electrical plug or

other electrical connection.c. Connecting a test substitute in parallel with an electrolytic

capacitor in the receiver.CAUTION : A wrong part substitution or incorrect polarityinstallation of electrolytic capacitors may result in an explo-sion hazard.

2. Test high voltage only by measuring it with an appropriate

high voltage meter or other voltage measuring device (DVM,FETVOM, etc) equipped with a suitable high voltage probe.Do not test high voltage by "drawing an arc".

3. Do not spray chemicals on or near this receiver or any of itsassemblies.

4. Unless speci ed otherwise in this service manual, cleanelectrical contacts only by applying the following mixture to thecontacts with a pipe cleaner, cotton-tipped stick or comparablenon-abrasive applicator; 10 % (by volume) Acetone and 90 %(by volume) isopropyl alcohol (90 % - 99 % strength)CAUTION : This is a ammable mixture.Unless speci ed otherwise in this service manual, lubrication ofcontacts in not required.

5. Do not defeat any plug/socket B+ voltage interlocks with whichreceivers covered by this service manual might be equipped.

6. Do not apply AC power to this instrument and/or any of itselectrical assemblies unless all solid-state device heat sinks arecorrectly installed.

7. Always connect the test receiver ground lead to the receiverchassis ground before connecting the test receiver positivelead.

Always remove the test receiver ground lead last.8. Use with this receiver only the test xtures speci ed in this

service manual.CAUTION : Do not connect the test xture ground strap to anyheat sink in this receiver.

Electrostatically Sensitive (ES) DevicesSome semiconductor (solid-state) devices can be damaged eas-ily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ESdevices are integrated circuits and some eld-effect transistorsand semiconductor chip components. The following techniquesshould be used to help reduce the incidence of component dam-age caused by static by static electricity.1. Immediately before handling any semiconductor component or

semiconductor-equipped assembly, drain off any electrostaticcharge on your body by touching a known earth ground. Alter-natively, obtain and wear a commercially available dischargingwrist strap device, which should be removed to prevent poten-tial shock reasons prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESdevices, place the assembly on a conductive surface such asaluminum foil, to prevent electrostatic charge buildup or expo-sure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESdevices.

4. Use only an anti-static type solder removal device. Some solderremoval devices not classi ed as anti-static can generateelectrical charges suf cient to damage ES devices.

5. Do not use freon-propelled chemicals. These can generateelectrical charges suf cient to damage ES devices.

6. Do not remove a replacement ES device from its protectivepackage until immediately before you are ready to install it.(Most replacement ES devices are packaged with leads electri-cally shorted together by conductive foam, aluminum foil orcomparable conductive material).

7. Immediately before removing the protective material from theleads of a replacement ES device, touch the protective materialto the chassis or circuit assembly into which the device will beinstalled.CAUTION : Be sure no power is applied to the chassis or circuit,

and observe all other safety precautions.8. Minimize bodily motions when handling unpackaged replace-ment ES devices. (Otherwise harmless motion such as thebrushing together of your clothes fabric or the lifting of yourfoot from a carpeted oor can generate static electricity suf -cient to damage an ES device.)

General Soldering Guidelines1. Use a grounded-tip, low-wattage soldering iron and appropriate

tip size and shape that will maintain tip temperature within therange or 500 F to 600 F.

2. Use an appropriate gauge of RMA resin-core solder composedof 60 parts tin/40 parts lead.

3. Keep the soldering iron tip clean and well tinned.4. Thoroughly clean the surfaces to be soldered. Use a mall wire-

bristle (0.5 inch, or 1.25 cm) brush with a metal handle.Do not use freon-propelled spray-on cleaners.5. Use the following unsoldering technique

a. Allow the soldering iron tip to reach normal temperature.(500 F to 600 F)

b. Heat the component lead until the solder melts.c. Quickly draw the melted solder with an anti-static, suction-

type solder removal device or with solder braid.CAUTION: Work quickly to avoid overheating the circuitboard printed foil.

6. Use the following soldering technique.a. Allow the soldering iron tip to reach a normal temperature

(500 F to 600 F)b. First, hold the soldering iron tip and solder the strand against

the component lead until the solder melts.

c. Quickly move the soldering iron tip to the junction of thecomponent lead and the printed circuit foil, and hold it thereonly until the solder ows onto and around both the compo -nent lead and the foil.CAUTION : Work quickly to avoid overheating the circuitboard printed foil.

d. Closely inspect the solder area and remove any excess orsplashed solder with a small wire-bristle brush.

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IC Remove/ReplacementSome chassis circuit boards have slotted holes (oblong) throughwhich the IC leads are inserted and then bent at against the cir -cuit foil. When holes are the slotted type, the following techniqueshould be used to remove and replace the IC. When working withboards using the familiar round hole, use the standard techniqueas outlined in paragraphs 5 and 6 above.

Removal 1. Desolder and straighten each IC lead in one operation by

gently prying up on the lead with the soldering iron tip as thesolder melts.

2. Draw away the melted solder with an anti-static suction-typesolder removal device (or with solder braid) before removingthe IC.

Replacement 1. Carefully insert the replacement IC in the circuit board.2. Carefully bend each IC lead against the circuit foil pad and

solder it.3. Clean the soldered areas with a small wire-bristle brush.

(It is not necessary to reapply acrylic coating to the areas).

"Small-Signal" Discrete Transistor Removal/Replacement1. Remove the defective transistor by clipping its leads as close

as possible to the component body.2. Bend into a "U" shape the end of each of three leads remaining

on the circuit board.3. Bend into a "U" shape the replacement transistor leads.4. Connect the replacement transistor leads to the corresponding

leads extending from the circuit board and crimp the "U" withlong nose pliers to insure metal to metal contact then soldereach connection.

Power Output, Transistor DeviceRemoval/Replacement

1. Heat and remove all solder from around the transistor leads.2. Remove the heat sink mounting screw (if so equipped).3. Carefully remove the transistor from the heat sink of the circuit

board.4. Insert new transistor in the circuit board.5. Solder each transistor lead, and clip off excess lead.6. Replace heat sink.

Diode Removal/Replacement1. Remove defective diode by clipping its leads as close as pos-

sible to diode body.2. Bend the two remaining leads perpendicular y to the circuit

board.3. Observing diode polarity, wrap each lead of the new diode

around the corresponding lead on the circuit board.

4. Securely crimp each connection and solder it.5. Inspect (on the circuit board copper side) the solder joints ofthe two "original" leads. If they are not shiny, reheat them and ifnecessary, apply additional solder.

Fuse and Conventional Resistor Removal/Replacement1. Clip each fuse or resistor lead at top of the circuit board hollow

stake.2. Securely crimp the leads of replacement component around

notch at stake top.

3. Solder the connections.CAUTION: Maintain original spacing between the replacedcomponent and adjacent components and the circuit board toprevent excessive component temperatures.

Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuitboard will weaken the adhesive that bonds the foil to the circuitboard causing the foil to separate from or "lift-off" the board. Thefollowing guidelines and procedures should be followed wheneverthis condition is encountered.

At IC ConnectionsTo repair a defective copper pattern at IC connections use thefollowing procedure to install a jumper wire on the copper patternside of the circuit board. (Use this technique only on IC connec-tions).

1. Carefully remove the damaged copper pattern with a sharpknife. (Remove only as much copper as absolutely necessary).

2. carefully scratch away the solder resist and acrylic coating (if

used) from the end of the remaining copper pattern.3. Bend a small "U" in one end of a small gauge jumper wire andcarefully crimp it around the IC pin. Solder the IC connection.

4. Route the jumper wire along the path of the out-away copperpattern and let it overlap the previously scraped end of thegood copper pattern. Solder the overlapped area and clip offany excess jumper wire.

At Other ConnectionsUse the following technique to repair the defective copper patternat connections other than IC Pins. This technique involves theinstallation of a jumper wire on the component side of the circuitboard.

1. Remove the defective copper pattern with a sharp knife.

Remove at least 1/4 inch of copper, to ensure that a hazardouscondition will not exist if the jumper wire opens.2. Trace along the copper pattern from both sides of the pattern

break and locate the nearest component that is directly con-nected to the affected copper pattern.

3. Connect insulated 20-gauge jumper wire from the lead of thenearest component on one side of the pattern break to the leadof the nearest component on the other side.Carefully crimp and solder the connections.CAUTION : Be sure the insulated jumper wire is dressed so theit does not touch components or sharp edges.

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SPECIFICATIONNOTE : Specifications and others are subject to change without notice for improvement .

1. Application range1.1. This spec sheet is applied all of the 32, 39, 42, 47, 50,

55, 60, 65 LED TV with LA46B chassis.1.2. Not included spec and each product spec in this spec

sheet apply correspondingly to the following each countrystandard and requirement of Buyer

2. Test conditionEach part is tested as below without special notice.

1) Temperature : 20 C 5 C2) Relative Humidity: 65 % 10 %3) Power Voltage

Market Input voltage Frequency Remark

USA 110~240V 50/60Hz Standard Voltage of eachproduct is marked bymodels

4) Specification and performance of each parts are followedeach drawing and specification by part number inaccordance with BOM

5) The receiver must be operated for about 20 minutes prior tothe adjustment

3. Test method1) Performance: LGE TV test method followed2) Demanded other specification

- Safety : UL, CSA, IEC specification- EMC: FCC, ICES, IEC specification- Wireless : WirelessHD Specification (Option)

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4. General SpecificationNo Item Speci cation Remark

1 Market 1) North America

2 Television System NTSC-M, ATSC, 64 & 256 QAM

3 Input Voltage AC 100 ~ 240V 50/60Hz4 Available Channel 1) VHF : 02~13

2) UHF : 14~693) DTV : 02-694) CATV : 01~1355) CADTV : 01~135

5 Aspect Ratio 16:9

6 Tuning System FS

7 LCD Module LC550DUE-FGA3 LGD 55LB5800-UA

T500HVF05.0 AUO 50LB5800-UA

LC550DUE-FGA4 LGD 55LB6100-UG

LC500DUE-FGA4 LGD 50LB5800-UG, 50LB6100-UG

LC470DUE-FGA4 LGD 47LB5800-UG, 47LB6100-UGLC420DUE-FGA4 LGD 42LB5800-UG

LC650DUF-FGA1 LGD 65LB6190-UD

HC600DUF-VHHS2 Sharp 60LB6100-UG

T550HVF04.2 AUO 55LB6100-UG/55LB5800-UG

NC500DUN-VXBP2 INX 50LB6100-UG/50LB5800-UG

T420HVF07.0 AUO 42LB5800-UG

NC390DUN-VXBP2 INX 39LB5800-UG

LC320DUE-FGA4 LGD 32LB5800-UG

NC320DXN-VSBP2 Sharp 32LB580B-UG

LC320DXE-FGA4 LGD 32LB580B-UG

8 Operating Environment 1) Temp : 0 ~ 40 deg2) Humidity : ~ 80 %

9 Storage Environment 1) Temp : -20 ~ 60 deg2) Humidity : ~ 85 %

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5. Supported video resolutions5.1. Component 2D input(Y, CB/PB, CR/PR)

No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed

1. 720*480 15.73 60 13.5135 SDTV ,DVD 480I

2. 720*480 15.73 59.94 13.5 SDTV ,DVD 480I3. 720*480 31.50 60 27.027 SDTV 480P

4. 720*480 31.47 59.94 27.0 SDTV 480P

5. 1280*720 45.00 60.00 74.25 HDTV 720P

6. 1280*720 44.96 59.94 74.176 HDTV 720P

7. 1920*1080 33.75 60.00 74.25 HDTV 1080I

8. 1920*1080 33.72 59.94 74.176 HDTV 1080I

9. 1920*1080 26.97 23.976 74.176 HDTV 1080P

10. 1920*1080 27.00 24.00 74.25 HDTV 1080P

11. 1920*1080 33.71 29.97 74.176 HDTV 1080P

12. 1920*1080 33.75 30.00 74.25 HDTV 1080P

13. 1920*1080 67.432 59.94 148.352 HDTV 1080P

14. 1920*1080 67.50 60 148.50 HDTV 1080P

5.2. HDMI Input (PC/DTV)

No. Resolution H-freq(kHz) V-freq.(kHz) Pixel clock(MHz) Proposed

PC DDC

1 640*350 31.468 70.09 25.17 EGA X

2 720*400 31.469 70.08 28.32 DOS O

3 640*480 31.469 59.94 25.17 VESA(VGA) O

4 800*600 37.879 60.31 40.00 VESA(SVGA) O5 1024*768 48.363 60.00 65.00 VESA(XGA) O

6 1152*864 54.348 60.053 80.002 VESA O

7 1360*768 47.712 60.015 85.50 VESA (WXGA) X

8 1280*1024 63.981 60.020 108.00 VESA (SXGA) O

9 1920*1080 67.5 60 148.5 HDTV 1080P O

DTV

1 720*480 31.50 60 27.027 SDTV 480P

2 720*480 31.469 59.94 27.00 SDTV 480P

3 1280*720 45.00 60.00 74.25 HDTV 720P

4 1280*720 44.96 59.94 74.176 HDTV 720P

5 1920*1080 33.75 60.00 74.25 HDTV 1080I6 1920*1080 33.72 59.94 74.176 HDTV 1080I

7 1920*1080 67.500 60 148.50 HDTV 1080P

8 1920*1080 67.43 59.94 148.352 HDTV 1080P

9 1920*1080 27.000 24.000 74.25 HDTV 1080P

10 1920*1080 26.97 23.97 74.176 HDTV 1080P

11 1920*1080 33.75 30.000 74.25 HDTV 1080P

12 1920*1080 33.716 29.976 74.176 HDTV 1080P

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ADJUSTMENT INSTRUCTION1. Application

This spec. sheet applies to LA46B Chassis applied LED TV allmodels manufactured in TV factory

2. Specification(1) Because this is not a hot chassis, it is not necessary to usean isolation transformer. However, the use of isolationtransformer will help protect test instrument.

(2) Adjustment must be done in the correct order.(3) The adjustment must be performed in the circumstance of

25 5 C of temperature and 6510% of relative humidity ifthere is no specific designation

(4) The input voltage of the receiver must keep 100~240V,50/60Hz

(5) At first Worker must turn on the SET by using Power Onlykey.

(6) The receiver must be operated for about 5 minutes prior tothe adjustment when module is in the circumstance of over15 C

In case of keeping module is in the circumstance of 0C, itshould be placed in the circumstance of above 15C for 2hours

In case of keeping module is in the circumstance of below-20C, it should be placed in the circumstance of above15C for 3 hours.

CautionWhen still image is displayed for a period of 20 minutes orlonger (especially where W/B scale is strong.Digital pattern 13ch and/or Cross hatch pattern 09ch), therecan some afterimage in the black level area

3. Adjustment items3.1. Final assembly adjustment

(1) White Balance adjustment(2) RS-232C functionality check(3) Factory Option setting per destination(4) Shipment mode setting (In-Stop)(5) GND and HI-POT test

3.2. Appendix(1) Tool option menu, USB Download (S/W Update, Option

and Service only)(2) Manual adjustment for ADC calibration and White balance.(3) Shipment conditions, Channel pre-set

4. MAIN PCBA Adjustments4.1. ADC Calibration

- An ADC calibrat ion is not necessar y because MAIN SoC(LGExxxx) is already calibrated from IC Maker

4.2. MAC Address, ESN Key and WidevineKey, DTCP Key, HDCP1.4, HDCP2.0download

4.2.1. Equipment & Condition1) Play file: keydownload.exe

4.2.2. Communication Port connection1) Key Write: Com 1,2,3,4 and 115200 (Baudrate)2) Barcode: Com 1,2,3,4 and 9600 (Baudrate)

4.2.3. Download process1) Select the download items.2) Mode check: Online Only3) Check the test process- US, Ca nada model s: DET ECT -> MAC_WRITE ->

WIDEVINE_WRITE4) Play : START5) Check of result: Ready, Test, OK or NG6) Printer out (MAC Address Label)

4.2.4. Communication Port connection1) Connect: PCBA Jig -> RS-232C Port == PC -> RS-232C

Port

4.2.5. Download1) US, Canada models (14Y LED TV + MAC + Widevine +

ESN Key + DTCP Key + HDCP1.4 and HDCP2.0)

4.2.6. Inspection- In INSTART menu, check these keys.

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4.3. LAN port Inspection (Ping Test)4.3.1. Equipment setting

1) Play the LAN Port Test PROGRAM.2) Input IP set up for an inspection to Test Program. - IP number: 12.12.2.2

4.3.2. LAN PORT inspection (PING TEST)1) Play the LAN Port Test Program.2) Connect each other LAN Port Jack.3) Play Test (F9) button and confirm OK Message.4) Remove LAN CABLE

4.4. EDID Download4.4.1 Overview

It is a VESA regulation. A PC or a MNT will display anoptimal resolution through information sharing without anynecessity of user input. It is a realization of Plug and Play.

4.4.2 Equipment Since embedded EDID data is used, EDID download JIG,

HDMI cable and D-sub cable are not need. Adjust remocon

4.4.3. EDID DATA4.4.3.1. . 2D_8bit_PCM(US) _ xvYCC : off (HD)

HDMI EDID 2D_8bit_PCM(US)_xvYCC : off (HD)

Reference- HDMI1 ~ HDMI3- In the data of EDID, bellows may be different by S/W or Input

mode.

Product ID

HEX EDID Table DDC Function

0001 0100 Analog

0001 0100 Digital

Serial No: Controlled on production line. Month, Year: Controlled on production line:ex) Monthly : 01 -> 01

Year : 2014 -> 18 Model Name(Hex): LGTV

Chassis MODEL NAME(HEX)

LA46B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20

Checksum(LG TV): Changeable by total EDID data.

1 2 3

HDMI1 A5 0C X

HDMI2 A5 FC X

HDMI3 A5 EC X

Vendor Specific(HDMI)

INPUT MODEL NAME(HEX)

HDMI1 67 03 0C 00 10 00 80 1E

HDMI2 67 03 0C 00 20 00 80 1E

HDMI3 67 03 0C 00 30 00 80 1E

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4.4.3.2. 2D_8bit_PCM(US) _ xvYCC : off HDMI EDID 2D_8bit_PCM(US)_xvYCC : off


mode.

Product IDHEX EDID Table DDC Function

0001 0100 Analog

0001 0100 Digital




LA46B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20

Checksum(LG TV): Changeable by total EDID data.1 2 3

HDMI1 E7 1C X

HDMI2 E7 0C X

HDMI3 E7 FC X



HDMI1 67 03 0C 00 10 00 80 1E

HDMI2 67 03 0C 00 20 00 80 1E

HDMI3 67 03 0C 00 30 00 80 1E

4.4.3.3. 2D_10bit_PCM(US) _ xvYCC : offHDMI EDID 2D_10bit_PCM(US)_xvYCC : off


mode.

Product IDHEX EDID Table DDC Function

0001 0100 Analog

0001 0100 Digital




LA46B 00 00 00 FC 00 4C 47 20 54 56 0A 20 20 20 20 20 20 20

Checksum(LG TV): Changeable by total EDID data.1 2 3

HDMI1 E7 02 X

HDMI2 E7 F2 X

HDMI3 E7 E2 X



HDMI1 67 03 0C 00 10 00 B8 2D

HDMI2 67 03 0C 00 20 00 B8 2D

HDMI3 67 03 0C 00 30 00 B8 2D

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5.2. Tool Option setting & Inspection percountries

5.2.1. Overview(1) Tool option selection is only done for models in Non-USA

North America due to rating

(2) Applied model: LA46B Chassis applied to CANADA andMEXICO

5.2.2. Country Group selection(1) Press ADJ key on the Adj. R/C, and then select Country

Group Menu(2) Depending on destination, select US, then on the lower

Country option, select US, CA, MX. Selection is done using +, - KEY

5.2.3. Tool Option inspection Press Adj. key on the Adj. R/C, then select Tool option

Model Tool 1 Tool 2 Tool 3 Tool 4 Tool 5 Tool 6 Tool 7

32LB580B-UG(Sharp) 6769 13329 33152 64070 4566 1353 41771

32LB580B-UG(LGD) 625 13329 33152 64070 4310 1354 41771

32LB5800-UG 625 13329 33152 64070 4310 1353 41771

39LB5800-UG 14963 13329 33152 64070 4566 1353 41771

42LB5800-UG(LGD) 628 13329 33152 64070 4310 1433 41771

42LB5800-UG(AUO) 4724 13329 33152 64070 4310 1353 41771

47LB5800-UG 629 13329 33152 64070 4310 1353 41771

50LB5800-UG(AUO) 4726 13329 33152 64070 4310 1353 41771

50LB5800-UG(INX) 14966 13329 33152 64070 4310 1353 41771

55LB5800-UG(LGD) 631 13329 33152 64070 4310 1402 41771

55LB5800-UA(AUO) 4727 13329 33152 64070 4310 1353 41771

47LB6100-UG 677 13329 33152 64070 12502 1353 41771

50LB6100-UG(LGD) 678 13329 33152 64070 12502 1353 41771

50LB6100-UG(AUO) 4774 13329 33152 64070 12502 1353 41771

50LB6100-UG(INX) 15014 13329 33152 64070 12502 1353 41771

55LB6100-UG(LGD) 679 13329 33152 64070 12502 1402 41771

55LB6100-UG(AUO) 4775 13329 33152 64070 12502 1353 41771

60LB6100-UG 39592 13329 33152 64070 12502 1353 41771

65LB6190-UD 34467 13329 33152 64070 12502 1353 41771

Tool option can be reconstructed by Software

5.3. Magic Motion remote controller Check5.3.1. Test equipment

RF-remote c ontroller for check, IR-KEY-CODE remotecontroller.

Check AA battery before test. A recommendation is that atester change battery every lots.

5.3.2. Test(1) Make pairing with TV set by pressing Start key(Wheel

key) on RCU.(2) Check a cursor on screen by pressing Wheel key of RCU(3) Stop paring with TV set by pressing Back+ Home key of

RCU

5.3.3. Applied modelsChassis Model Name Magic RF receiver

LA46B 32LB580B-UG Dongle

32/39/42/47/50/55LB5800-UG

47/50/55/60LB6100-UG

Dongle Model : An USB dongl e-ty pe rec eiv er wil l besupplied in form of accessory. So thispairing test is not necessary for thesemodels

5.4. Wi-Fi MAC Address Check5.4.1. Using RS232 Command

Command Set ACK

Transmission [A][l][][Set ID][][20][Cr] [O][K][x] or [N][G]

5.4.2. Check the menu on in-start

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5.5. HDMI ARC Function Inspection5.5.1. Test equipment

- Optic Receiver Speaker- MSHG-600 (SW: 1220 )- HDMI Cable (for 1.4 version)

5.5.2. Test method(1) Insert the HDMI Cable to the HDMI ARC port from the

master equipment (HDMI1)

(2) Check the sound from the TV Set

(3) Check the Sound from the Speaker or using AV & OpticTEST program (Its connected to MSHG-600)

* Remark: Inspect in Power Only Mode and check SW versionin a master equipment

5.6. HDMI MHL Function Inspection5.6.1. Test method

(1) Insert the HDMI Cable to the HDMI MHL port from themaster equipment, HDMI3

(2) Check the Green LED of Tester, and TV Display

5.7. EYE-Q Green Function InspectionStep 1) Turn on the TV..Step 2) Press 'EYE button' on the adjustment remote-

controller.Step 3) Cover 'Eye Q sensor' on the front of set with your

hands, hold it for 6 seconds.Step 4) Check "the Sensor Data" on the screen, make certain

that Data is below 10. If Data isnt below 10 in 6seconds, Eye Q sensor would be bad. You shouldchange Eye Q sensor.

Step 5) Uncover your hands from Eye Q sensor, hold it for 6seconds.

Step 6) Check "Back Light(xxx)" on the screen, check dataincrease . You should change Eye Q sensor

5.8. Ship-out mode check (In-stop) After final inspection, press In-Stop key of the Adj. R/C andcheck that the unit goes to Stand-by mode

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9. Optional adjustments9.1. Manual White balance Adjustment9.1.1. Adj. condition and cautionary items

(1) Lighting condition in surrounding area surrounding lightingshould be lower 10 lux. Try to isolate adj. area into dark

surrounding.(2) Probe location: Color Analyzer (CA-210) probe should bewithin 10cm and perpendicular of the module surface(80~ 100)

(3) Aging time i) After Aging Start, Keep the Power ON status during 5

Minutes. ii) In case of LCD, Back-light on should be checked using no

signal or Full-white pattern.

9.1.2. Equipment(1) Color Analyzer: CA-210 (NCG: CH 9 / WCG: CH12 / LED:

CH14)(2) Adj. Computer (During auto adj., RS-232C protocol i s

needed)(3) Adjust Remocon(4) Video Signa l Generat or MSPG-9 25F 720p/216 -Gray

(Model: 217, Pattern: 78)

9.1.3. Adjustment(1) Set TV in Adj. mode using POWER ON(2) Zero Calibrate the probe of Color Analyzer, then place it on

the center of LCD module within 10cm of the surface.(3) Press ADJ key -> EZ adjust using adj. R/C -> 6. White-

Balance then press the cursor to the right (KEY). WhenKEY() is pressed 216 Gray internal pattern will bedisplayed.

(4) One of R Gain / G Gain / B Gain should be fixed at 192,and the rest will be lowered to meet the desired value.

(5) Adj. is performed in COOL, MEDIUM, WARM 3 modes ofcolor temperature. If internal pattern is not available, use RF input. In EZ Adj.

menu 6.White Balance, you can select one of 2 Test-pattern:ON, OFF. Default is inner(ON). By selecting OFF, you canadjust using RF signal in 216 Gray pattern.

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BLOCK DIAGRAM

A u

d i o A M P

( N T P 7 5 1 3 )

M T K A 2

C I S l o t

P_ T

S

P_ T

S

T / C D e m o

d

I F ( + / - )

U S B 1

O P T I C

L A N

D D R 3

1 6 0 0 X 1 6

( 5 1 2 M

B X 2 E A )

H D M I 1

H D M I 2

H D M I 3

A n a l o g

D e m o

d

S Y S T E M E E P R O

M

( 2 5 6 K b )

H D M I

M U X

A i r /

C a b

l e

T U N E R

( T / C / A )

L N B

U S B 2

U S B 3

4 1 P

5 1 P

e M M C

( 4 G B )

S u

b M i c o m

( R E N E S A S

R 5 F 1 0 0 0 G )

D D R 3 1 6 0 0 X 1 6

( 2 5 6 M B X 1 E A )

P_ T

S

5 0 P

5 0 P

X_ T

A L

2 7 M H z

T / C / S 2 W i t h o u

t A T V

L V D S D i a g r a m

A

B

H D C P E E P R O M

( 1 6 K b )

X_ T

A L

3 2 . 7

6 8 K H z

I 2 S O u

t

I 2 C 1

E P I

I 2 C 2

L V D S

U S B

P_ T

S

I 2 C 5

I 2 C 1

H / P

A V / C O M P

T u n e r : I

2 C 6

D V B - S : I

2 C 4

O C P

2 . 5 A

O C P

1 A

( H D D )

M H L 1 A

S I L 1 3 9 2

8 0 0 M H z

M H L : I

2 C 4

M H L

R E A R S I D E S I D E

R E A R ( H )

A M P

T I

C V B S / Y P b P r

S P D I F O U T

E T H E R N E T

I 2 C 3

L O C A L D I M M I N G

B L U T O O T H

I R / N F C

P M I C

L E V E L

S H I F T E R

W I F I

K E Y

L O G O L I G H T

S U B

A S S Y

I 2 C 1

U A R T I R

K E Y

U S B

_ W I F I

8 0 0 M H z

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EXPLODED VIEW

Many electrical and mechanical parts in this chassis have special safety-related characteristics. Theseparts are identified by in the Schematic Diagram and EXPLODED VIEW.It is essential that these special safety parts should be replaced with the same components asrecommended in this manual to prevent X-RADIATION, Shock, Fire, or other Hazards.Do not modify the original design without permission of manufacturer.

IMPORTANT SAFETY NOTICE

A 2

A 3

A 1 0

L V 1

* S e t + S t a n d

2 0 0

5 3 0

4 1 0

1 2 0

1 2 1

5 4 0

5 2 1

4 0 0

9 0 0

3 1 0

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Fi

b e

r

O p t

i c

HE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.IRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISSSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

SPDIF_OUTC36020.1uF16V

R36112.7K

OPT J

K 3 6 0 2

J S T

1 2 2 3

- 0 0 1 1

GND

2VCC

3VINPUT

4

F I X

_ P O L E

+3.3V_NORMAL

R361033

SPDIF

SPDIF OUT

r i g h t$ 2 0 1 4 L G E l e c t r o n i c s .I n c . Al lr i g h tr e s e r v eo r t r a i n i n ga n d s e r v i c ep u r p o s e s

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THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATESSPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.FIRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF ISESSENTIAL THAT ONLY MANUFACTURES SPECIFIED PARTS BE USED FORTHE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.

LED_R

R410710K

L4111BLM18PG121SN1D

WIFI

WOL/ETH_POWER_ON

R4114100

C41020.1uF

R411710K

5%

D41045.6V

AMOTECH CO., LTD.

OPT

R41341K

LOGO_LIGHT

+3.5V_ST

C41000.1uF

+3.5V_ST

R4131

22LOGO_LIGHT R4130

22

OPT

+3.5V_ST

+3.5V_ST

C41110.1uF

16V

WIFI

R 4

1 3 2

1 0

K

L O G O

_ L I G H T Q4100

MMBT3904(NXP)

LOGO_LIGHT

E

B

C

D41015.6V

AMOTECH CO., LTD.OPT

C4113

10uF10V

WIFI

R 4

1 3 3

1 0

K

O P T

WIFI_DP

WIFI_DM

P4101

12507WR-08L

NON_EYE_Q_8P

1GND

2KEY1

3KEY2

4+3.5V_ST

5GND

6LOGO/LED_R

7IR

8GND

9

L4100BLM18PG121SN1D

LOGO_LIGHT

R4113100

C41041000pF50V

R411810K5%

C4107100pF

50V

R 41 25 1 0K

LED_R

C4112

10uF10V

WIFI

KEY2

IR

C41200.1uF16V

L O G O

_ L I G H T

KEY1

+3.5V_S

D41005.6V

AMOTECH CO., LTD.OPT

R413622

WIFI

WOL/WIFI_POWER_ON

P4102

12507WR-10L

EYE_Q_10P

1

2

3

4

5

6

7

8

9

10

11

EYE_SCL

EYE_SDA

D4105ADMC 5M 02 200LOPT

D4106ADMC 5M 02 200L

OPT

R4137100

EYE_Q_10P

R4138100

EYE_Q_10P

P4100

12507WR-06L

WIFI

1

2

3

4

5

6

7

ZD4100

ADLC 5S 02 015WIFI_ESD

ZD4101

ADLC 5S 02 015WIFI_ESD

Place Near Micom

MAX 0.4A

For EMI

$ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .

o r t r a i n i n g a n d s e r v i c e p u r p o s e s

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COMP1/AV1/DVI_R_IN

COMP1/AV1/DVI_L_IN

SOC_RX

AV1_CVBS_DET

COMP1_D

C38000.1uF16V

COMP1_Y/A

+3.3V_NORMAL

+3.5V_ST

COMP1_Pb

+3.3V_NORMAL

D38005.6V

AV_COMP_ESDD38015.6V

AV_COMP_ESD

R381010K

P3800

12507WS-04L

UART_4PIN_STRAIGHT

1

2

3

4

5

COMP1_Pr

D38025.6V

AV_COMP_ESD

R380610K

D38035.6V

AV_COMP_ESD

SOC_TX

Z D

3 8 0

4

A D U C

5 S

0 2

0

R 5 L

O P T

JK3800PPJ245-01

NON_Mold_AV

6A [GN]C-SPRING

7A [GN]E-LUG

4A [GN]CONTACT

5B [BL]C-SPRING

8C [RD1]E-LUG-S

6C [RD1]C-SPRING

4C [RD1]CONTACT

5D [WH]C-SPRING

4E

[RD2]CONTACT6E

[RD2]C-SPRING7E

[RD2]E-LUG

R38111K

R38121K

JK3800-*1PPJ245N2-01

Mold_AV

6A [GN/YL]O-SPRING

7A [GN/YL]E-LUG

4A [GN/YL]CONTACT

5B [BL]O-SPRING

8C [RD1]E-LUG-S

6C [RD1]O-SPRING

4C [RD1]CONTACT

5D [WH]O-SPRING

4E [RD2]CONTACT

6E [RD2]O-SPRING

7E [RD2]E-LUG

AV/COMPONENT REAR

D

UART FOR DEBUG

Apply "AV_COMP_ESD" when your models ESD Test is failed

t $ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .


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THERMAL


R541112

0.1uF

C5413

16V

AMP_MUTE

0.1uFC5420

50V

+24V_AMP

AUD_LRCH

R 5 40 3 1 0 0

+24V

R541012

C 5 4

1 6

2 2 0 0 0

p F

5 0

V

L5401BLM18PG121SN1D

0.1uF

C5421

50V

R540712

C54271uF10V

R5400 10K

AMP_MUTE_MICOM

AUD_SCK

+24V_AMP

R 5 40 2 1 0 0

+3.3V_NORMAL

R540912

0.1uFC5418

50V

AUD_MASTER_CLK

I2C_SCL1

R541412

R5405 100

AMP_MUTE_MICOM

R54063.3

OPT

0.1uFC5400

50V

C542522000pF50V

AUD_LRCK

C5430390pF50V

R541312

C54281uF10V

C540833pF50V

C54400.1uF16V

OPT

C541410uF10V

C54151000pF

50V

C540633pF50V

C54240.01uF50V

OPT

AMP_RESET_N

C54331uF10V

C5431390pF50V

C54110.1uF16V

C5432390pF50V

+24V_AMP

+3.3V_NORMAL

C542622000pF50V

R540110K

AMP_MUTE_MICOM

R540812

R541212

C5417

22000pF

50V

0.1uFC5401

50V

I2C_SDA1

0.1uF

C5419

50VQ5400

MMBT3904(NXP)AMP_MUTE_MICOME

B

C

C5429390pF50V

C54041000pF

50V

1uFC5412

10V

L5

LPH604

10

L5

LPH604

10

L54

LPH6045

10uH

L54

LPH6045T

10uH

IC5400

NTP7513

3DGND_PLL2VDD_PLL

4GND

1AGND_PLL

6DVDD5DGND

7SDATA

8WCK

9BCK

10SDA

1 1

S C L

1 2

F A U L T

1 3

M O N I T O R

_ 0

1 4

M O N I T O R

_ 1

1 5

M O N I T O R

_ 2

1 6

B S T

2 B

1 7

P G N D

2 B

1 8

O U T

2 B

1 9

P V D D

2 B

2 0

P V D D

2 A

21 OUT2A22 PGND2A23 BST2A24 VDR225 AGND26 VCC527 VDR128 BST1B29 PGND1B30 OUT1B

3 1

P V D D

1 B

3 2

P V D D

1 A

3 3

O U T

1 A

3 4

P G N D

1 A

3 5

B S T

1 A

3 6

R E S E T

3 7

A D

3 8

C L K

_ I

3 9

G N D

_ I O

4 0

V D D

_ I O

41

[ E P ] G N D

C542210uF35V

C5423

10uF

35V

R 5 4

1 9

1 0 0

A M P

_ M U T E

_ P W R

_ D E T

POWER_DET

L5400UBW2012-121F

0x54

DUAL COMPONENT

Q1801 1ST : 0TRIY80001A 2ND : 0TR387500AA

MP_MUTE_PWR_DET]-->For fixing AC-OFF POP noise 32"POLA/ROW model->32"POLA/ROW LPBs 3.5st drop time is very fast

r i g h t$ 2 0 1 4 L G E l e c t r o n i c s .I n c .Al lr i g h tr e s e r v ef o rt r a i n i n ga n d s e r v i c ep u r p o s e s

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R610010K

HP_OUTC61011uF10VHP_OUT

C61001uF10VHP_OUT

+3.3V_NORMAL

C61051uF10V

HP_OUT

R610110K

HP_OUT

HP_LOUT_AMP

HP_LOUT

SIDE_HP_MUTE

+3.3V_NORMAL

R610443K

1%

HP_OUT

R610333K

HP_OUT_MTK

C61021uF10V

HP_OUT

R61054.7K

H P

_ O U T

C61031uF10V

HP_OUT

HP_ROUT_MAIN

L6100120-ohm

H P

_ O U T

BLM18PG121SN1D

C6104180pF

HP_OUT_MTK

R610643K

1%

HP_OUT

C61070.1uF16V

HP_OUT

C6109180pF

HP_OUT_MTK

R610233K

HP_OUT_MTK

HP_ROUT_AMP

C6104-*118pF

HP_OUT_H13C6109-*118pF

HP_OUT_H13

C610810pF50V

HP_OUT

C610610pF50V

HP_OUT

IC6100TPA6138A2

HP_OUT

3OUTR

2-INR

4GND_1

1+INR

6VSS

5MUTE

7CN

8CP

9VDD

10GND_2

11UVP

12OUTL

13-INL

14+INL

R6103-*143K

1%

HP_OUT_H13 R6102-*143K

1%

HP_OUT_H13

EARPHONE AMP

p y r g e c r o n c s .n c .r g r e s elf o rt r a i n i na n ds e r v i c eu r o s e s

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L/DIM0_VS_PWR

L/DIM0_SCLK_PWR

R760110KL/DIM_OUT_8P

P760012507WR-08L

L/DIM_OUT_8P

1

2

3

4

5

6

7

8

9

L/DIM0_MOSI_PWR

R760233

L/DIM_OUT_8P

R760333

L/DIM_OUT_8PI2C_SCL1

I2C_SDA1

[To LED DRIVER]

LOCAL DIMMING

p y r g e c r o n c s .n c .r g r e s ef o rt r a i n i na n ds e r v i c eu r o s e s

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+24V_AMP

C545010uF35V

OPT

g h t $ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .


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R3706

10K

HP_LOUT

HP_ROUT

+3.3V_NORMAL

HP_DET

JK3700

PEJ034-01

6BT_TERMINAL2

7BB_TERMINAL2

5T_SPRING

4R_SPRING

3E_SPRING

R37051K

ZD3703

20VADUC 20S 02 010L

OPT

R 3

7 2 0

1 0 0

R S

2 3 2

C_

U S

R 3

7 2 1

1 0 0

R S

2 3 2

C_

U S

C37100.1uF

RS232C_US

C37130.1uF

RS232C_US

C37090.1uF

RS232C_US

+3.5V_ST

SOC_TX

ZD3702ADUC 20S 02 010L20V

OPT

C37080.1uF

RS232C_US

IC3700

MAX3232CDR

EAN41348201

RS232C_US

3C1-

2V+

4C2+

1C1+

6V-

5C2-

7DOUT2

8RIN2

9ROUT2

10DIN2

11 DIN1

12ROUT1

13RIN1

14DOUT1

15GND

16VCC

C37110.1uF

RS232C_US

SOC_RX

RS-232C Control INTERFACE(NORTH AMERICA)

Closed to Jack

t $ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .


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U S B

D O W N

S T R E A M

U S B

D O W N

S T R E A M

T H E R M A L

T H E R M A L

U S B

D O W N

S T R E A M


USB_CTL2

/USB_OCD2

/USB_OCD3

JK43023AU04S-305-ZC-(LG)

1

2

3

4

5

USB_DP3

USB_DP2

USB_DM2

USB_CTL3

R 4

3 0 1

1 0

K

+5V_USB_2

R 4

3 0 2

1 0

K

JK43003AU04S-305-ZC-(LG)

1

2

3

4

5

C43020.1uF16V

+5V_USB_3

USB_DM3

+5V_NORMAL

+5V_USB_2

+3.3V_NORMAL

+5V_USB_3

C430110uF

10V

C433710uF

10V

C4322

10uF10V

C4310

10uF10V

IC4306TPS2066CDGNR

USB2/3_OCP_TI

3EN1

2IN

4EN2

1GND

5FLT2

6OUT2

7OUT1

8FLT1

9

[EP]GND

IC4306-*1DIODES TAIWAN INC

USB2/3_OCP_DIODES

3EN1

2IN

4EN2

1GND

5FLG2

6OUT2

7OUT1

8FLG1

9

[EP]GND

R43032.2

USB_Serial_2.2ohm

R43042.2

USB_Serial_2.2ohm

R43052.2

USB_Serial_2.2ohm

R43062.2

USB_Serial_2.2ohm

C45000.1uF16V

R450010KOPT

+5V_USB_1

R450110K

IC4500AP2171DM8G

3IN_2

2IN_1

4EN

1GND

5FLG

6OUT_1

7OUT_2

8NC

JK45003AU04S-305-ZC-(LG)

1

2

3

4

5/USB_OCD1

USB_DP1

+5V_NORMAL

USB_CTL1

C4501

10uF10V

USB_DM1

+5V_USB_1

C450210uF10V

+3.3V_NORMAL

R45022.2

USB_Serial_2.2ohm

R45032.2

USB_Serial_2.2ohm

R4502-*10

USB_Serial_0ohm

R4503-*10

USB_Serial_0ohm

R4303-*10

USB_Serial_0ohm

R4304-*10

USB_Serial_0ohm

R4306-*10

USB_Serial_0ohm

R4305-*10

USB_Serial_0ohm

MAX 1.5AOCP USB2/3USB2

MAX 1.5AUSB3

OCP USB1USB1

MAX 1.5ADVR Ready

y r i g h t2 0 1 4LGEl e c t r o n i c s .I n c .Al lr i g h tr e s e ryf o rt r a i n i n ga n ds e r v i c ep u r p o s e s

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D5001

5.5VLAN_ESD

EPHY_TDN

D5003

5.5VLAN_ESD

D5000

5.5VLAN_ESD

D5002

5.5VLAN_ESD

EPHY_TDP

EPHY_RDN

EPHY_RDP

C50000.1uF

16V

C50010.01uF50V

JK5000

RJ45VT-01SN002

METAL_LAN_JACK

11

22

33

44

55

66

77

88

9

9

JK5000-*1

RV3-2032ADA3

MOLD_LAN_JACK

1TD+

2TCT

3TD-

4RD+

5RCT

6RD-

7R7

8GND

Ethernet Block

.n lf o rt r a i n i na n ds e r v i c eu r o s

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T U

_ G N D

_ B

T U

_ G N D

_ B

C6401

1000pF

630V

TU_TW/CO/BR

T U

_ G N D

_ A

C6402

1000pF630V

TU_TW/CO/BR/KR/US

T U

_ G N D

_ A

T U

_ G N D

_ A

R 6

4 0 2

0 T U

_ E U

/ A J

/ J A

T U

_ G N D

_ B

R 6

4 0 1

0 T U

_ E U

/ A J

/ J A

T U

_ G N D

_ A

TU6402-*3TDJM-G105D

DEV_TU_AJ_T2

1B1[+3.3V]

2NC_1

3AIF_AGC

4SCL_RF

5SDA_RF

6AIF[P]

7AIF[N]

8NC_2

9NC_3

10NC_4

11B2[+3.3V]

12ERROR

13GND_1

14MCLK

15SYNC

16VAILD

17D0

18D1

19D2

20D3

21D4

22D5

23D6

24D7

25RESET_DEMOD

26B3[+3.3V]

27SCL_DEMOD

28B4[+1.1V]

29F22_OUTPUT

30SDA_DEMOD

47

SHIELD

B1B1

A1A1

TDJH-G101D

TU6401-*1

DEV_TU_AJ_T

47

SHIELD

6IF[P]

7IF[N]

8NC_2

9NC_3

1B1[+3.3V]

2NC_1

3IF_AGC

4SCL

5SDA

A1A1

B1B1

TDJH-H101F

TU6401DEV_TU_KR_US

47

SHIELD

6IF[P]

7IF[N]

8NC_2

9 NC_3

1B1[+3.3V]

2NC_1

3IF_AGC

4SCL

5SDA

A1A1

B1B1

TU6402TDJM-H1

DEV_TU_KR_PIP

1B1[+3.3

2NC_1

3M_DIF_

4SCL_RF

5SDA_R

6M_DIF[

7M_DIF[

8S_SIF

9 S_CVB

10NC_2

11B2[+3.3

12S_ERRO

13GND_1

14S_MCL

15S_SYNC

16S_VALI

17S_DATA

18NC_3

19NC_4

20NC_5

21NC_6

22NC_7

23NC_8

24NC_9

25S_RESE

26B3[+3.3

27SCL_DE

28B4[+1.1

29NC_10

30SDA_D

47

SHIELD

B1B1

A1A1

TU6402-*2TDJM-K101F

DEV_TU_CO_T2

1B1[+3.3V]

2RF_SW_CTL

3AIF_AGC

4SCL_RF

5SDA_RF

6AIF[P]

7AIF[N]

8NC_1

9NC_2

10NC_3

11NC_4

12ERROR

13GND_1

14MCLK

15SYNC

16VAILD

17D0

18D1

19D2

20D3

21D4

22D5

23D6

24D7

25RESET_DEMOD

26B2[+3.3V]

27SCL_DEMOD

28B3[+1.1V]

29NC_5

30SDA_DEMOD

47

SHIELD

B1B1

A1A1

TU6402-*1TDJM-B101F

DEV_TU_BR

1B1[+3.3V]

2RF_SW_CTL

3AIF_AGC

4SCL_RF

5SDA_RF

6AIF[P]

7AIF[N]

8NC_1

9NC_2

10NC_3

11NC_4

12E RRO R

13G N D _1

14MCLK

15SYNC

16VA I L D

17D0

18D1

19D2

20D3

21D4

22D5

23D6

24D7

25RESET_DEMOD

26B2[+3.3V]

27SCL_DEMOD

28B3[+1.1V]

29NC_5

30SDA_DEMOD

47

SHIELD

B1B1

A1A1

TDJK-T101F

TU6403DEV_TU_TW

47

SHIELD

6IF[P]

7IF[N]

8NC_1

9 NC_2

1B1[+3.3V]

2RF_S/W_CTL

3IF_AGC

4SCL

5SDA

A1A1

B1B1

TU6402-*4TDJM-C301D

DEV_TU_HK

1B1[+3.3V]

2RF_SW_CTL

3NC_1

4SCL_RF

5SDA_RF

6NC_2

7NC_3

8SIF

9CVBS

10NC_4

11NC_5

12ERROR

13GND_1

14MCLK

15SYNC

16VAILD

17D0

18D1

19D2

20D3

21D4

22D5

23D6

24D7

25RESET_DEMOD

26B2[+3.3V]

27SCL_DEMOD

28B3[+1.1V]

29NC_6

30SDA_DEMOD

47

SHIELD

B1B1

A1A1

Global flag

g h t $ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .


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R 71 07 3 3

LGD_T-Con_Scanning

R 71 06 3 3

CP_BOX

TXB4N

TXA1P

TXA1N

TXB3P

2D/3D_CTL

TXC2N

TXA2N

TXCCLKP

TXC1P

+3.3V_NORMAL

OPC_EN

TXD4P

R710310KBIT_SEL_LOW

TXB4P

R 71 05 3 3

CP_BOX

TXBCLKP

R7108 33

OPC_EN

2D/3D_CTL

TXC4N

TXA0N

TXB1N

TXB2NTXC4P

TXACLKN

TXC1N

TXC0P

TXD0N

TXC0N

TXA3N

C71020.1uF50VOPT

PWM_DIM1

I2C_SDA1

R 7 10 4 3 3

AUO_2D/3D_CTRL

TXB3N

TXA0P

TXC3N

TXB2P

R7101

3.3K

LVDS_SEL_HIGH P7101FI-RE41S-HF-J-R1500

LVDS_41PIN

1NC

2NC

3NC

4NC

5NC

6NC

7NC

8NC

9GND

10RC0N

11RC0P

12RC1N

13RC1P

14RC2N

15RC2P

16GND

17RCCLKN

18RCCLKP

19GND

20RC3N

21RC3P

22RC4N

23RC4P

24GND

25GND

26RD0N

27RD0P

28RD1N

29RD1P

30RD2N

31RD2P

32GND

33RDCLKN

34RDCLKP

35GND

36RD3N

37RD3P

38RD4N

39RD4P

40GND

41GND

42

GND

TXB1P

R710210K

LVDS_SEL_LOW

TXD3P

TXC2P

TXB0P

TXCCLKN

TXD1N

TXDCLKP

TXC3P

C710010uF16VOPT

TXDCLKN

TXBCLKN

TXA4P

R 7 10 0 3 3

LGD_2D/3D_CTRL

TXD2N

TXA3P

L7100BLM18SG121TN1DLVDS_51PIN

PANEL_VCC

TXD2P

TXA2P

TXD3N

TXD4N

I2C_SCL1

TXA4N

TXB0N

TXACLKP

TXD1P

P7100

FI-RE51S-HF-J-R1500

LVDS_51PIN

1NC

2NC

3NC

4NC

5NC

6AUO_65_MIRROR

7 LVDS_SEL

8NC

9NC

10L/DIM_ENABLE

11GND

12RA0N

13RA0P

14RA1N

15RA1P

16RA2N

17RA2P

18GND

19RACLKN

20RACLKP

21GND

22RA3N

23RA3P

24RA4N

25RA4P

26GND

27BIT_SEL

28RB0N

29RB0P

30RB1N

31RB1P

32RB2N

33RB2P

34GND

35RBCLKN

36RBCLKP

37GND

38RB3N

39RB3P

40RB4N

41RB4P

42GND

43GND

44GND

45GND

46GND

47NC

48VLCD

49VLCD

50VLCD

51VLCD

52

GND

C71011000pF50VOPT

TXD0P

R71090

OPT

R7110 33

AUO_L/D_EN

R13.

OP

TXA3N

TXA1N

TXA2N

TXA0N

+3.3V_NORMTXA3P

TXA0P

TXACLKP

TXA2P

R110

OP

TXA1P

TXACLKN

P7102

10031HR-30

HD

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

19

20

21

22

23

24

25

26

27

28

29

30

31

BIT_SEL

LVDS

LVDS_SEL

[41Pin LVDS OUTPUT Connector][51Pin LVDS OUTPUT Connector]

RB-

RD-

NC

RD+

1

GND

2

RA+

GND

[30Pin HD 60Hz]

NC

NC

GND

RB+

GND

GND

5

8

6

VLCD

7

VLCD

9

14

GND

12

10

13

11

15

3

LVDS_HD

GND

16

GND

28

17

RCL+

GND

LVDS_SE

22

20

GND

T-CONPinAssign

25

VLCD

18

19RC+

21

27

RC-

Pin Assign is same asLN570B LVDS Cable(EAD62296501)

NC

26

RCLK-

30

29

23

24

VLCD

GND

RA-

LVDS SEL

4

$ 2 0 1 4 L G E l e c t r o n i c s . I n c . A l l r i g h t r e s e r v e d .


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