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MODELS:LN550/LN555

SERVICEMANUAL

P/NO : AFN30824822 AUGUST, 2007

PORTABLE NAVIGATIONSERVICE MANUAL

MODELS : LN550/LN555

INFORMATION

If you have other questions about the Navigation Device, please contact your supplier or

Technical Support:

Website http://biz.lgservice.com

Internal Use Only

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[CONTENTS]

SECTION 1. GENERAL

SAFETY PRECAUTIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2

SPECIFICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3 ACCESSORIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4

NAME OF EACH PART . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5

SUPPORT-HOTLINE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1-7

SOFTWARE UPGRADE METHOD (OS IMAGE) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8

SECTION 2. ELECTRICAL SECTION

BLOCK DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1

VOLTAGE SHEET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-6

SCHEMATIC DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-7

PRINTED CIRCUIT DIAGRAMS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-29

SECTION 3. EXPLODED VIEWS

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SAFETY PRECAUTIONS

Electrostatically Sensitive Devices (ESD)Some semiconductor (solid state) devices can be damaged easily by static electricity. Such componentscommonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integratedcircuits and some field-effect transistors and semiconductor chip components. The following techniques shouldbe used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off

any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear acommercially available discharging wrist strap device, which should be removed for potential shock reasonsprior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" cangenerate electrical charges sufficient to damage ESD devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESDdevices.

6. Do not remove a replacement ESD device from its protective package until immediately before you areready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together byconductive foam, aluminum foil or comparable conductive materials).

7. Immediately before removing the protective material from the leads of a replacement ESD device, touch theprotective material to the chassis or circuit assembly into which the device will by installed.

CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT AND OBSERVE ALL

SECTION 1. GENERAL

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SPECIFICATIONS

ITEM SPECIFICATION REMARK

OS Win CE 5.0

CPU Centrality Atlas-II ARM9

276 Mhz

MEMORY LN550 : 256 MB or 512MB External SD Card

LN555 : 1 GB External SD Card

DISPLAY 3.5 inch TFT LCD LG Philps LCD

Resolution 320 X 240

Backlight LED type

Touch Screen Analog resisitive type

AUDIO Mono, Internal Speaker Typical 1.0W (1EA)

GPS SiRF star III,

Internal Antenna

NAVI Europe(Eastern/Western/Russia) Voice Guidance

MAP Tele Atlas, Local Map

POWER DC 5.0 +/- 0.2V Vehicle PowerCigar-jack Input (12V)

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ACCESSORIES

Main SetSD Memory

Card

Suction-MountCradle

USBCable

Cigar LightAdapter

CarringCase

ACAdapter

(Optional)

GPS aerial(Optional)

Back upMap CD

(including PDFtype Manual)

Quick StartGuide

826

829 835

801

828 836830

825 827

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NAME OF EACH PART

Front panel

SRC

VOL

2

3

4

1

RESET

5

1. LCD

2. SRC (Source) button

Move to the main menu screen or theprevious screen.Power slee

4. Volume Down

Decrease the volume level.

5. RESET hole

If the unit fails to operate properly, press thereset button using a ball point pen or a similar

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Rear / Side panel

2

3

6

7

4

5

1

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SUPPORT-HOTLINE

LG Subsidiary Country Service Number

LG Electronics ESPANA S.A. SPAIN 902 500 234

LG Electronics U.K. Ltd U.K. / IRELAND 0870 873 5454

LG Electronics France FRANCE 0825-826-8220825-825-592

LG Electronics Deutschland GmbH GERMANY 01805 4737 84

LG Electronics Italia S.p.A ITALY 39 199600099

LG Electronics Hellas S.A GREECE +30-210-4800-564/8801 11 200 900

LG Electronics Benelux B.V BELGIUMLUXEMBOURG

070-233-55732 70 233 557

If you have other questions about the Navigation Device, please contact yoursupplier or Technical Support:

www.lge.com/support/software.jspFor questions on products please visit our

site or contact the Support Team.

Monday-Fridays : 09 : 00 am - 6 : 00 pm

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1. Execute Atlas Mgr 5.0

2. Press and hold the VOL- button, push up the slide switch and press OPEN button, then INPUT window isactivated. Keep pressing VOL- button until INPUT window is activated.

3. Input 1 on INPUT window and then press ENTER on keyboard.EBOOT is displayed on screen.

4.The log is created on USB Terminal and enter your selection is displayed, input u.Then press Update NK Image icon and file selection windows is displayed select chain lst file from OS

SOFTWARE UPGRADE METHOD (OS IMAGE)

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SECTION 2. ELECTRICAL SECTION

BLOCK DIAGRAM

SYSTEM BLOCK DIAGRAM

Atlas-II

ntralitySoC)

m9@276MHz)

System

Memory

NAND

Flash

MICOM

TFTLCD

3.5

UART

ForDebug

PWRCTRL

ADD

:X_

MA

DATA:X_M

D

/CS,CLK,CKE,/WE,

/CAS,/RAS

PWRKeyCTRL

Sleep/WakeupCTRL

ChargingCTRL

RGB(6:6:6),VDD,VCC,

LEDPWR,TOUCHX/Y

X_

TX0

X_

RX0

VDDPDN,VDDPRE

VPLA,VPHA,I/O

AD,CLE,ALE

WE,RE,RY_

BY

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ATLAS-IIPower

LDO1.2

VSSTL(1.8V,150mA)FollowSDRAMVoltage

USB_V

DDA(3.3V,10mA)

XVDDIO(3.3V,75mA)

IOVCC(3.3V,50mA)

USB_V

DDL((1.3V,?)

VDDPDN(1.3V,300mA)

VDD_P

RE(1.3V,50mA)

VPLD(1.2V,3mA)

VPLA(1.2V,1mA)

LoadS/W

SDRAM(1.8V,170mA)*Note2

NANDFlash(3,3V,60mA)

*Note3

SDCard(3,3V,70mA)*Note1

GPS(3,3V,90mA)

LCD(3,3V/5V,25mA)*N

ote4

MICOM(3,3V,20mA)

AudioAMP.,5V/200mA(Typical1W),

140mAmax

VPHA(3.3V2mA)

GPSbackup(3,3V,1mA)

[email protected]

BackLight(400mW,5V/80mA6LEDs)

LoadS/W

ATT3216(EN)

CODEC(3,3V,30mA)

SD_O

N

CC33_1

ON

(bymicom)

PA_O

N

GPS_O

NLCD50ON

X_P

WR_EN

PULLUP

LED(3.3V,80mA),Debug(3.3V,100mA)-SMC/Serial

BL_O

N

CODEC_O

N

LDO5V,AME8804adj

POWER BLOCK DIAGRAM

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SW BLOCK DIAGRAM

Navigation Program

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CPU CONNECTION DIAGRAM

AS-II(REV.D

)

276MHz

SDRAM

64Mby

te

IC300

,IC3001

K4S561633F-75

NANDFlash

32Mby

te

IC401

K9F5608U0M

SDcardconn

CN400

54-2

108-9-R

Fron

tbu

tton

Fron

tLED

SW801

,802

,8

03

LCD(3

.5)

+TOUCH

CN501

TCON

IC500

HS353163

Gamma

IC501

AD8511

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VOLTAGE SHEET

MAIN PCB

1. TEST VOLTAGE : DC 10.5~16V

2. CHECK METHOD : VR MIN(10.5V)/MAX(16V)

PART NAME SPEC 10.5V 16V

C518 10uF/50V 18.81 18.82

C519 10uF/16V 3.31 3.31

C616 10uF/16V 5.35 5.36C627 22uF/16V 5.06 5

C639 10uF/16V 3.35 3.35

C633 10uF/16V 5.03 5.01

C642 10uF/16V 5.03 5

C904 47uF/10V 5.17 5.17

C909 22uF/6.3V 5.16 5.17

C902 10uF/10V 5.4 5.41

C905 47uF/10V 4.18 4.18

C1004 10uF/16V 4.72 4.7

C1000 10uF/16V 1.81 1.8

C1011 10uF/16V 1.34 1.35

C1019 10uF/16V 3.27 3.28

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LGE Internal Use OnlyCopyright 2007 LG Electronics.Inc. All right reserved.Only for training and service purposes

2-7 2-8

SCHEMATIC DIAGRAMS

CPU I/O SCHEMATIC DIAGRAM

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Copyright 2007 LG Electronics.Inc. All right reserved.Only for training and service purposes

LGE Internal Use Only 2-9 2-10

CPU POWER & CONFIGURATION SCHEMATIC DIAGRAM

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2-11 2-12

SDRAM SCHEMATIC DIAGRAM

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NAND FLASH & SD CARD SCHEMATIC DIAGRAM

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2-15 2-16

GPS SCHEMATIC DIAGRAM

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2-19 2-20

CODEC & AMP SCHEMATIC DIAGRAM

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CONNECTOR SCHEMATIC DIAGRAM

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2-23 2-24

MICOM, KEY & LED SCHEMATIC DIAGRAM

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POWER RAIL SCHEMATIC DIAGRAM

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2-27 2-28

POWER SCHEMATIC DIAGRAM

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PRINTED CIRCUIT DIAGRAMS

MAIN P.C BOARD DIAGRAM (TOP SIDE)

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2-31 2-32

MAIN P.C BOARD DIAGRAM (BOTTOM SIDE)

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GPS P.C BOARD DIAGRAM (TOP SIDE)

GPS P.C BOARD DIAGRAM (BOTTOM SIDE)

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3-23-1

250

255

A46

A49

270

281

450

450

283

280

282

A40

A41

251

260

CABLE1

SECTION 3. EXPLODED VIEW

CABINET & MAIN FRAME SECTION

NOTE) Refer to SECTION 4 REPLACEMENT

PARTS LIST in order to look for thepart number of each part.

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