low capacitance test solution (proof-of-concept) · salland’slow capacitance measurement solution...
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Low capacitance test solution(Proof-of-Concept)
Armando Bonilla Fernandez
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Contents1. Introduction2. Motivation3. Design4. Specifications5. Results6. Improvements7. Conclusions & Future work
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1. Introduction
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More than Moore from an engineer’s perspective
Integrated circuits MEMS
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More than Moore from an engineer’s perspective
Integrated circuits
• Input: electrical signal.Output: electrical signal.
• Designer does not really has to care about fabrication technology.
• A default package usually does the job.
• Testing on an ATE.
MEMS
• Input: physical/chemical quantity.Output: physical/chemical quantity.
• Fabrication technology and device design are inextricably linked.
• Custom designed package needed for each specific MEMS design.
• Custom designed test solution.
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MEMS: Nano-g accelerometer
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• Electrostatically pull the mass.• Measure the capacitance.• Impulse response gives
information about electrical and mechanical behavior!
🕮 B. A. Boom et al., Nano-G accelerometer using geometric anti-springs, IEEE MEMS, 2017.
🕮 P. Kamp, Towards an Ultra Sensitive Seismic Accelerometer, MSc thesis, 2015.
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Capacitive microfabricated ultrasone tranducer (CMUT)
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• Membrane with an electrode.
• Operates as speaker when electrostatically actuated.
• Operates as microphone when capacitance is measured.
🕮 Philips Innovation Services.
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Capacitive Read-out
• The use of MEMS is growing.• One of the biggest applications:
Sensing.
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Temperature Coefficients Power Dissipation Noise Fabrication Cost
𝐶 =𝜀0𝐴
𝑑
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2. Motivation
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Our motivation
• Due to the advantages and widespread use of Capacitive read-out, we want to create a measurement system that is:
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▶Accurate
▶Repetitive
▶Small Footprint
▶ Suitable for ATE
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3. Design
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The design options• Multichip
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• Single chip
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Single Chip Design Overview
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Block diagram showing the main components of the single chip capacitance measurement system.
ΣΔ
Carrier Generator
Charge amplifier
ADC
DUT
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Multichip Design Overview
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Block diagram showing the main components of the multichip capacitance measurement system.
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Measurement concept: Lock in amplifier
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Chopper(Demodulator)
Low Pass Filter
Input signal
Reference signal
Demodulated signal
DC component
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PoC PCB
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• PCB with 2 single-chip channels, 2 multi-chip channels and a high voltage MEMS driver.
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4. Specifications
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Salland’s Low Capacitance Measurement solution
• Target to a 8 channel Low capacitance PXIe instrument▶ Range: sub pF (extendable to nF)▶ Accuracy: ≈ fF, Resolution: aF▶ Frequency up to 2MHz
• Suitable for high volume▶ High parallel => many channels, small =footprint, “immune for long wires’’▶ Efficient => Fast measurements and high Parallel efficiency
• Develop the technology to use it in several formats▶ PXIe (8 ch), Modules, ATE, etc. ▶ MEMS, IoT Market, etc.
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Target Specifications
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Salland specifications vs equipment available in the market
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Salland PoC Specifications Salland (Instrument Target spec) Keysight Solidus Target
Capacitance Range ±7.5pF ±5pF (0fF to 5000 fF diff.) 0 to 1pF ±4pF ±4pF
Settling time 3ms 3ms -
Accuracy ~4fF ~4fF 10fF 4fFResolution 18 bit (≈ 40 aF) 18 bit (≈ 40 aF) 24 bit -Carrier Frequency 100kHz to 300kHz 30kHz to 2MHz 1MHz 1MHz ≈2MHz
Carrier Waveform Square SquareCarrier Amplitude 1.8 V rms 0.5V, 1V, 1.5V, 2V (rms) 0 to 2V ±5V -Noise ±4fF ±4fF -V DC Bias External up to 75V ±15V +20V ±8V -No. of DC Bias Ch. 1 8 1 1 1Number of Meas. Ch. 2 8 16 4 ≥8Phase Angle Meas.* Not Supported Not Supported Yes Yes -Max. cable length Tested up to 1.6m 1.0m 0, 1, 2 or 4m 1.0m
*Resonance frequency and Q factor can be calculated with Amplitude vs Frequency.
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5. Results
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POC Results: Accuracy of low capacitance meter
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Measured Capacitance Single Chip Multichip Noise
Multichip
(fF)Ch1 (fF) Ch2 (fF) Ch1 (fF) Ch2 (fF)
0.0pF (Open circuit) 0.4 0.4 -2.35 -0.15 ±3
0.47 pF ± 0.25pF (N_Inv) - 529.29 - 527.37 ±2
0.56 pF ± 0.25pF (Inv) - -604.71 - -600.96 ±2
0.47pF - 0.56pF - -73.06 - -71.83 ±3
1pF ± 0.25pF (N_Inv) 1006.12 - 1007.30 - ±4
0.82pF ± 0.25pF (Inv) -821.42 - -816.93 - ±4
1pF-0.82pf 186.64 - 192.62 - ±3
0.47pF – 0.47 pF -2.21 - -1.99 - ±1
1.2pF ± 0.25pF (N_Inv) - - - 1153.12 ±4Measurements of known capacitance on DUT board.
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Accuracy of low capacitance meter
The expected capacitance is measured from capacitors with ±20% tolerance.
Measurements executed on 0, 90, 180, 470, 560, 680, 820, 1000 and 1200fF.
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Effect on measured capacitance from carrier frequency
These measurements where taken with the current hardware of the Low Capacitance POC.
The bandwidth of the system can be increased by changing some components.
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Temperature influence in capacitance measurement
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Influence of distance from DUT to readout circuit.
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The reason of the jump from 10 cm to 20 cm and
from 20cm to 60 cm is caused by using different
cable types,
=> Use good cabling and connectors so that length
can be compensated
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EMI influence in measurements
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Measurement setup with 1.6m cable between DUT and read-out circuit. DUT shielding with a rolled ESD bag.
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Gain compensation for measurements at long distances
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Capacitance measured through 1.6m coax cable without compensation and with gain compensation.
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Number of samples vs stability
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Improving quasi static measurements
Box plot showing that after 20 samples measurement there is no substantial difference in comparison with taking up to 400 samples to get an average measurement. We will consider 20 Samples = 1 point.
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Dynamic measurements
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MEMS actuated with square wave 50V at 40Hz.
MEMS Device used to test dynamicmeasurements of the low capacitancemeter.
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Mechanical resonance frequency
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Variation of amplitude depending on frequency of actuation signal.
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High Accuracy Measurements
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First measurements executed on designed MEMS device.
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6. Improvements
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Increasing bandwidth of charge amplifier (Multichip)
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Capacitance meter using current charge amplifier with 500 kHz carrier frequency.
Capacitance meter using new charge amplifier with 500 kHz carrier frequency.
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Simulation of improved hardware
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Measured Capacitance vs Carrier Frequency
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7. Conclusions & Future Work
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ConclusionsMultichip Single Chip
Measurement Range ≈2 fF to ≈5000fF 0pF to ±4pF
Dynamic Range 1:3500 1:100000
Noise ±0.05 % of range* ±1fF
Resolution 40aF 10aF
Advantage summary Flexibility in Carrier frequency Avoidance of crosstalk in multichannel
environment Possible to modify to have higher
capacitance ranges. Faster Measurement
Larger Dynamic range
Lower noise
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* In the worst case at ±5fF
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Timer measurement comparison
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Both solutions (PXIe) and equipment available in market
-20 0 20 40 60 80 100 120
E4980A Med (8Ch)
Single Chip Med (8Ch)
Multi Chip Med (8Ch)
E4980A Short (8Ch)
Single Chip Short (8Ch)
Multi Chip Short (8Ch)
Time (ms)
Measurement time 1 point in E4980 vs Salland's Solution
Settling time Carrier Amplitude Settling time Carrier Frequency Measurement Time DC Bias On Averaging * Data Transfer Time **
Single Chip solution only allows 1 carrier amplitude and 1 carrier frequency.
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Things to be done
• Production of an 8 Channel PXIeBoard is in progress, with the aimof:▶ Implement and test proposed hardware
improvements.▶ Finish characterization of known
capacitance MEMS devices with wider range of carrier frequencies.
▶ Test Multichip solution in a multi-channel implementation.
• Improve debug tools.
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Acknowledgements
• Salland Engineering.• Provincie Overijssel• MESA+ Institute for Nanotechnology, University of Twente.
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