macdermid enthone electronics solutionsfiles.interconti.cz/200000654-d9927da8e3/mechanism...
TRANSCRIPT
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OUTLINE
2
• Mechanism of Blackhole / Eclipse
• Blackhole / Eclipse process
- Sequence
- Process
• Equipment enhancement
• Performance test method
• Process Capability
- General
- Laminate types
• Latest Development - Eclipse LE
• Reliability data
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MECHANISM OF BLACKHOLE / ECLIPSEPRE ETCH - OPTIONAL
3
•“Nailhead” : The most common
type seen on small holes and flex
material
•“Nailhead” should be removed
after before Carbon process
• Etch rate needed is around 0,35μ
* Thickness of adsorption exaggerated for illustration
Nailheading
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MECHANISM OF BLACKHOLE / ECLIPSECONDITIONER
4
• Conditioner wets the holes
• Changes the surface charge
of the substrate
•Electrostatic adsorption onto
all surfaces of the panel
* Thickness of adsorption exaggerated for illustration
NN
NN
N
+
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MECHANISM OF BLACKHOLE / ECLIPSECARBON TREATMENT
5
* Thickness of adsorption exaggerated for illustration
• Dispersant makes carbon
particle miscible in
aqueous solution and
imparts a negative charge.
• Negatively charged
particles are
electrostatically adsorbed
onto conditioned surfaces.
HO
HO
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MECHANISM OF BLACKHOLE / ECLIPSEMICROCLEAN
6
* Thickness of adsorption exaggerated for illustration
Carbon particles removed
from all copper surfaces
only
Etch
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BLACKHOLE / ECLIPSE PROCESS SEQUENCE
7
Antitarnish
Cleaner / Conditioner
Rinse
Carbon treatment
Blow Off / Dry
Rinse
Rinse
Dry
Microclean
Pre- Etch
Repeat for
double pass
Video clip : Blackhole double pass running
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BLACKHOLE / ECLIPSE PROCESSPRE-ETCH
8
• H2SO4, H2O2 with G-5S or SPS
• Control : Etch rate, concentrations
• Dump : Every week
• Dwell time : 30~40 sec
• Temp varied to etch rate
• Immersion
• Etch rate : 0,35 μ
• 3X rinse rinses
• Auto dosing : optional
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BLACKHOLE / ECLIPSE PROCESSCLEANER
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• For standard process : – Blackhole Cleaner, Eclipse Cleaner,
Blackhole Cleaner-ESP
• For low etch process : – Eclipse Cleaner LE, Eclipse LE-ESP
• Dwell time : 30~60 sec
• Temp : 50~57℃
• Immersion (via flood recommended)
• Ultra sonic
• Control : pH, Normality
• Dump : 250SSF/gallon or pH below 9.6
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BLACKHOLE / ECLIPSE PROCESSCONDITIONER
10
• For double pass : – Blackhole AF Conditioner
• For single pass : – Blackhole Coditioner SP
• Dwell time : 30~60 sec
• Temp : 21~57℃
• Immersion (via flood recommended)
• Control : pH, Normality
• Dump : 250SSF/gallon or 3PSM
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BLACKHOLE / ECLIPSE PROCESSCARBON TREATMENT
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• For double pass : – Blackhole AF Starter,
– Blackhole AF Replenisher
• For single pass : – Blackhole SP Starter,
– Blackhole SP Replenisher
• Dwell time : 30~60 sec
• Temp : 32~35℃
• Immersion (via flood recommended)
• Control : pH, Normality, solid %
• Dump : 1 year recommended
• Sponge roller recommended
Sponge rollers
Inlet Outlet
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BLACKHOLE / ECLIPSE PROCESSBLOW OFF AND DRYER
12
• Contact time : 30 sec
• Temp : 75 +/- 5C
• Maintenance / Cleaning : Every month
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BLACKHOLE / ECLIPSE PROCESSMICROCLEAN
13
• H2SO4, H2O2 with G-5S
• SPS
• Dwell time : 30~60 sec
• Temp varied to etch rate
• Etch rate for standard process : 0,8~1,3μ
• Etch rate for LE process : 0,2~0,65μ
• Via flood and spray nozzles recommended
• Control : E/R, concentrations
• Auto dosing : recommended
• Dump : copper < 20g/L
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EQUIPMENT ENHANCEMENTIMMERSION FLOOD BAR TYPE COMPARISON
14
Fan Spray
Nozzle
Drilled Hole
pipe Slit type bar Slash type bar Via Fluid Head
Surface
treatmentGood Weak Best Uniformity Good Weak
Hole treatment Bad Reasonable Worst Good best
Pressure Highest High Lowest Low High
Flowrate Lowest Low Highest High High
Recommended
for micro vias
and small holes.
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EQUIPMENT ENHANCEMENTEFFECTIVE CARBON REMOVING IN MICROCLEAN
15
• High performance spray nozzle
• Spray (surface) +Immersion (Hole) +spray (uniform)
configuration (Recommended)
• Via head flood bar
% good microvia circuits (continuity)
75
80
85
90
95
100
105
6 mil 4 mil 3 mil 6 mil 4 mil 3 mil
Top Bottom
Flood pipe
Viaflood
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PERFORMANCE TEST METHODPROPAGATION RATE
16
• Hull cell sized test panels are processed through the Blackhole line
• These panels are electroplated in a Hull cell at 1 Amp for 10 minutes
• After each panel is processed the number of holes that have propagated is recorded
Result 2.5 ASD 1.0ASD
Excellent > 6 > 5
Good 5 to 5.5 4 to 4.5
Average 4 to 4.5 3 to 3.5
Below Average 3 to 3.5 2 to 2.5
Poor < 3 < 2
As Is After Blackhole After copper plating
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CAPABILITYGENERAL
17
• 10:1 and higher PTH capability
• Interconnect reliability equal to or exceeding electroless copper
• 1:1 and higher microvia capability
• 2:1 and higher controlled depth drill capability
• Thin copper foil capable - nailheading issues
• Passes IPC class 3 and Military 55110G specifications
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CAPABILITYLAMINATE TYPES
18
• BT
• Ceramic Filled
• Cyanate Ester
• Duroid
• FR-4
• FR-5
• Flex
– Acrylic Adhesive
– Epoxy Adhesive
– Adhesiveless
• Halogen free
– Hitachi MCL BE-67
• Pb Free
– Isola 410
– Polyclad 370 HR
• Polyimide
• PTFE
• Speed board
• Other exotic materials
6X SS BT
Duroid
Ceramic filled
Isola 406
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ECLIPSE LEECLIPSE CLEANER LE / ECLIPSE CLEANER LE-ESP
19
IR spectra of copper after Eclipse Cleaner LE
• Eclipse LE Cleaner / Ecipse Cleaner LE-ESP performs 3 functions :
• Cleans mild oils/dirt from the substrate
• Wets the holes
• Selectively coats the copper with a sacrificial coating
IR copper baseline
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ECLIPSE LEECLIPSE MICROCLEAN LE
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• H2SO4, H2O2 based etch
− Control etch rate (0.2~0.6um)
• Effectively removes carbon from the surface and inner-layers
• No equipment changes required
− No pre-dip required prior to etch
− No special rollers required
− No changes to micro-clean module configuration
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ECLIPSE LERELIABILITY
21
Standard process,
10μin (0.25um) etch
Eclipse LE,
10μin (0.25um) etch
Carbon Residues No carbon Residues
ICD (Carbon post) CD (Carbon on corners)
Defects % Defects %
16/308 5.2 4/28 14.3
ICD (Carbon post) CD (Carbon on corners)
Defects % Defects %
0/308 0 0/28 0
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Clean Inner Layer
IST 22 Layer 0.093 8:1 aspect ratio
1 oz
1/2 oz
All interconnects clean
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ECLIPSE LERELIABILITY
23
Eclipse LE process (10 μin, 0.25um) - 6 times solder shock @ 288°C
- 17 micron innerlayer foil – no negative etchback
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CLEAN CAPTURE PAD OF MICRO-VIA
Etch rate 0.3micron
Whole image of via holeCarbon
on glass fiber
Via bottom
- clean etched copper
Top View
SEM
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THROUGH HOLE IST DATA
• Precondition 6x @230ºC
• Cycled from ambient to 150ºC
• No difference between electroless copper (M-85) and Eclipse LE.
Coupon Pre - condition P% S% Cycles Failuer Mode
1 6x @260 0.417 0.264 500 N/A
2 6x @260 0.517 0.345 500 N/A
3 6x @260 0.352 0.261 500 N/A
4 6x @260 0.161 0.269 500 N/A
5 6x @260 0.294 0.211 500 N/A
6 6x @260 0.302 0 500 N/A
1 and 4 M85 @ Calumet
2 and 5 Eclipse LE plated@ Calumet
3 and 6 Eclipse LE plated @ CT
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• IST Coupon number : GP60001A
• Laminate type : Isola 370HR
• Coupon thickness : 0.125”
• Layer count : 12, 1-oz I/L in every hole
• Holes sizes : 15 mil & 10 mil
• All panels were drilled and De-smeared
at one account.
CARBON BASED TECHNOLOGIESIST RELIABILITY (THROUGH HOLES)
27
• All the IST coupons were pre-cycled at
240℃ three times to simulate the assembly
process.
• The IST equipment was set to cycle
between 25°C and 150°C (3 minutes
heating and 2 minutes cooling) and to run
to a 10% change in resistance or 1000
cycles whichever occurred first.
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CARBON BASED TECHNOLOGIESIST RELIABILITY (THROUGH HOLES)
28
• Carbon based process performs
as well as, or better than, the
electroless copper processes.
• Review and comparison of
historical IST data (N>11,000)
provided by PWB Interconnect
corroborate these findings.
• MacDermid Enthone has
hundreds of accounts running
carbon based direct metallization
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• Material: • 10 Layer Polyclad 370
• Blind Microvias: • 4x4, 5x4, 6x4
• Plating Baths:
• Via Plate, Via Fill, Pulse
• Test 1:
• Precondition 6X, 230C
• Cycle 1000X to 150C
• No failures
• Test 2:• No Precondition
• Cycle 500X to 210C
• Several barrel failures
No separation at target padDelamination of boardTest 2
CARBON BASED TECHNOLOGIESIST RELIABILITY (MICROVIAS)
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CONCLUSION
• Production Proven: over 220 accounts
– Over 200.000 m² processed per day
– Over 60.000 m² processed per day for Automotive
• Reliability equal to or surpasses conventional electroless copper
• High technology capable
• Confirmed reliability from independent testing